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W3L1ZC105MAT1A产品简介:
ICGOO电子元器件商城为您提供W3L1ZC105MAT1A由AVX设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供W3L1ZC105MAT1A价格参考以及AVXW3L1ZC105MAT1A封装/规格参数等产品信息。 你可以下载W3L1ZC105MAT1A参考资料、Datasheet数据手册功能说明书, 资料中有W3L1ZC105MAT1A详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | CAP CER 1UF 10V 20% X7R 0612电容器阵列与网络 0612 1uF 10volts X7R 20% |
产品分类 | |
品牌 | AVX |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 陶瓷电容器,电容器阵列与网络,AVX W3L1ZC105MAT1AIDC |
数据手册 | |
产品型号 | W3L1ZC105MAT1A |
产品培训模块 | http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=21795 |
产品目录绘图 | |
产品目录页面 | |
产品种类 | 电容器阵列与网络 |
其它名称 | 478-2129-6 |
包装 | Digi-Reel® |
厚度(最大值) | 0.037"(0.95mm) |
商标 | AVX |
外壳宽度 | 1.6 mm |
外壳长度 | 3.2 mm |
外壳高度 | 0.95 mm |
大小/尺寸 | 0.063" 长 x 0.126" 宽(1.60mm x 3.20mm) |
安装类型 | 表面贴装,MLCC |
容差 | 20 % |
封装 | Reel |
封装/外壳 | 0612(1632 公制) |
工作温度 | -55°C ~ 125°C |
工作温度范围 | - 55 C to + 125 C |
工厂包装数量 | 2000 |
应用 | 旁通,去耦 |
引线形式 | - |
引线间距 | - |
损耗因数DF | 5 |
标准包装 | 1 |
温度系数 | X7R |
特性 | 低 ESL 型(多端子) |
电压-额定 | 10V |
电压额定值 | 10 V |
电容 | 1 uF |
端接类型 | SMD/SMT |
等级 | - |
类型 | SMD/SMT |
系列 | WxL |
高度-安装(最大值) | - |
IDC Low Inductance Capacitors (RoHS) IDC (InterDigitated Capacitors) 0306/0612/0508 GENERAL DESCRIPTION Inter-Digitated Capacitors (IDCs) are used for both semiconductor package and board level decoupling. The equivalent series inductance (ESL) of a single capacitor or an array of capacitors in parallel determines the response time of a Power Delivery Network (PDN). The lower the ESL of a PDN, the faster the response time. A 0612 designer can use many standard MLCCs in parallel to reduce ESL or a low ESL Inter- + – + – Digitated Capacitor (IDC) device. These IDC devices are available in versions with a maximum height of 0.95mm or 0.55mm. IDCs are typically used on packages of semiconductor products with power levels of 15 watts or greater. Inter-Digitated Capacitors are used on CPU, GPU, ASIC, and ASSP devices produced on 0.13μ, 90nm, 65nm, and 45nm processes. IDC devices 0508 are used on both ceramic and organic package substrates. These low ESL surface mount capacitors can be placed on the bottom side or the top side of a package – + – + substrate. The low profile 0.55mm maximum height IDCs can easily be used on the bottom side of BGA packages or on the die side of packages under a heat spreader. IDCs are used for board level decoupling of systems with speeds of 300MHz or greater. Low ESL IDCs free up valuable board space by reducing the number of 0306 capacitors required versus standard MLCCs. There are additional benefits to reducing the number of capacitors beyond saving board space including higher reliability from a reduction in the number of components and lower placement costs TYPICAL IMPEDANCE based on the need for fewer capacitors. The Inter-Digitated Capacitor (IDC) technology was developed by AVX. This is the 10 second family of Low Inductance MLCC products created by AVX. IDCs are a cost ms) MLCC_1206 effective alternative to AVX’s first generation low ESL family for high-reliability h 1 O applications known as LICA (Low Inductance Chip Array). e ( LICC_0612 AVX IDC products are available with a lead-free finish of plated Nickel/Tin. nc 0.1 da IDC_0612 e p m 0.01 I 0.001 1 10 100 1000 Frequency (MHz) HOW TO ORDER W 3 L 1 6 D 225 M A T 3 A Style IDC Case Low Number of Voltage Dielectric Capacitance Capacitance Failure Termination Packaging Thickness Size Inductance Terminals 4 = 4V C = X7R Code (In pF) Tolerance Rate T =Plated Ni Available Max. Thickness 2 = 0508 1 = 8 Termi- 6 = 6.3V D = X5R 2 Sig. Digits + M = ±20% A = N/A and Sn 1=7" Reel mm (in) 3 = 0612 nals Z = 10V Z = X7S Number of 3=13" Reel A=Standard 4 = 0306 Y = 16V Zeros S=0.55 (0.022) 3 = 25V NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. PERFORMANCE CHARACTERISTICS Capacitance Tolerance ±20% Preferred No problems observed after 2.5 x RVDC for 5 Dissipation Factor X7R = -55°C to +125°C seconds at 50mA max current Operation X5R = -55°C to +85°C Temperature Range CTE (ppm/C) 12.0 X7S = -55°C to +125°C Temperature Thermal Conductivity 4-5W/M K ±15% (0VDC), ±22% (X7S) Coefficient Terminations Voltage Ratings 4, 6.3, 10, 16, 25 VDC Available Plated Nickel and Solder ≤ 6.3V = 6.5% max; Dissipation Factor 10V = 5.0% max; ≥ 16V = 3.5% max Insulation Resistance 100,000MΩ min, or 1,000MΩ per μF (@+25°C, RVDC) min.,whichever is less The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or 80 available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
IDC Low Inductance Capacitors (RoHS) IDC (InterDigitated Capacitors) 0306/0612/0508 SIZE W4 = 0306 W2 = Thin 0508 W2 = 0508 W3= Thin 0612 W3 = 0612 W3 = THICK 0612 Max. mm 0.55 0.55. 0.95 0.55 0.95 1.22 Thickness (in.) (0.022) (0.022) (0.037) (0.022) (0.037) (0.048) WVDC 4 6.3 4 6.3 10 16 25 4 6.3 10 16 25 4 6.3 10 16 4 6.3 10 16 25 4 6.3 10 16 Cap (μF) 0.010 0.022 0.033 0.047 0.068 0.10 0.22 0.33 0.47 0.68 1.0 1.5 2.2 3.3 Consult factory for PHYSICAL DIMENSIONS AND PAD LAYOUT additional requirements = X7R = X5R = X7S PAD LAYOUT PHYSICAL CHIP DIMENSIONS MILLIMETERS (INCHES) DIMENSIONS SIZE W L BW BL P SIZE A B C D E 1.60 ± 0.20 0.82 ± 0.10 0.25 ± 0.10 0.20 ± 0.10 0.40 ± 0.05 0.38 0.89 1.27 0.20 0.40 0306 0306 (0.063 ± 0.008) (0.032 ± 0.006 (0.010 ± 0.004) (0.008± 0.004) (0.015 ± 0.002) (0.015)(0.035) (0.050) (0.008) (0.015) 0508 (0.20.8003 ±± 00..02008) (0.10.5207 ±± 00..02008) (0.00.1320 ±± 00..01004) (00.0.2150 ±± 00..01056) (0.00.2500 ±± 00..00052) 0508 (00.0.6245)(01.0.2570) (01.0.9715) (00.0.2181) (00.0.5200) 3.20 ± 0.20 1.60 ± 0.20 0.50 ± 0.10 0.25 ± 0.15 0.80 ± 0.10 0612 0.89 1.65 2.54 0.45 0.80 (0.126 ± 0.008) (0.063 ± 0.008) (0.020 ± 0.004) (0.010 ± 0.006) (0.031 ± 0.004) 0612 (0.035)(0.065) (0.010) (0.018) (0.031) The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 81