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  • 型号: W3L16C225MAT1A
  • 制造商: AVX
  • 库位|库存: xxxx|xxxx
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W3L16C225MAT1A产品简介:

ICGOO电子元器件商城为您提供W3L16C225MAT1A由AVX设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 W3L16C225MAT1A价格参考。AVXW3L16C225MAT1A封装/规格:陶瓷电容器, 2.2µF ±20% 6.3V 陶瓷电容器 X7R 0612(1632 公制)。您可以下载W3L16C225MAT1A参考资料、Datasheet数据手册功能说明书,资料中有W3L16C225MAT1A 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

电容器

描述

CAP CER 2.2UF 6.3V 20% X7R 0612电容器阵列与网络 6.3volt X7R 2.2uF 0612 ESL=60pF

产品分类

陶瓷电容器

品牌

AVX Corporation

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

陶瓷电容器,电容器阵列与网络,AVX W3L16C225MAT1AIDC

数据手册

点击此处下载产品Datasheet点击此处下载产品Datasheet

产品型号

W3L16C225MAT1A

产品培训模块

http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=21795

产品目录绘图

产品目录页面

点击此处下载产品Datasheet

产品种类

电容器阵列与网络

其它名称

478-4940-2
W3L16C225MAT1A/2K

包装

带卷 (TR)

厚度(最大值)

0.037"(0.95mm)

商标

AVX

外壳宽度

1.6 mm

外壳长度

3.2 mm

外壳高度

0.95 mm

大小/尺寸

0.063" 长 x 0.126" 宽(1.60mm x 3.20mm)

安装类型

表面贴装,MLCC

容差

±20%

封装

Reel

封装/外壳

0612(1632 公制)

工作温度

-55°C ~ 125°C

工作温度范围

- 55 C to + 125 C

工厂包装数量

2000

应用

旁通,去耦

引线形式

-

引线间距

-

损耗因数DF

6.5

标准包装

2,000

温度系数

X7R

特性

低 ESL 型(多端子)

电压-额定

6.3V

电压额定值

6.3 V

电容

2.2µF

端接类型

SMD/SMT

等级

-

类型

Low Inductance Capacitors

系列

WxL

高度-安装(最大值)

-

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PDF Datasheet 数据手册内容提取

IDC Low Inductance Capacitors (RoHS) IDC (InterDigitated Capacitors) 0306/0612/0508 GENERAL DESCRIPTION Inter-Digitated Capacitors (IDCs) are used for both semiconductor package and board level decoupling. The equivalent series inductance (ESL) of a single capacitor or an array of capacitors in parallel determines the response time of 0612 a Power Delivery Network (PDN). The lower the ESL of a PDN, the faster the response time. A designer can use many standard MLCCs in parallel to reduce + – + – ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC devices are available in versions with a maximum height of 0.95mm or 0.55mm. IDCs are typically used on packages of semiconductor products with power levels of 15 watts or greater. Inter-Digitated Capacitors are used on CPU, GPU, ASIC, and ASSP devices produced on 0.13μ, 90nm, 65nm, and 45nm processes. 0508 IDC devices are used on both ceramic and organic package substrates. These – + – + low ESL surface mount capacitors can be placed on the bottom side or the top side of a package substrate. The low profile 0.55mm maximum height IDCs can easily be used on the bottom side of BGA packages or on the die side of packages under a heat spreader. 0306 IDCs are used for board level decoupling of systems with speeds of 300MHz or greater. Low ESL IDCs free up valuable board space by reducing the number of capacitors required versus standard MLCCs. There are additional benefits to TYPICAL IMPEDANCE reducing the number of capacitors beyond saving board space including higher reliability from a reduction in the number of components and lower placement 10 costs based on the need for fewer capacitors. ms) MLCC_1206 The Inter-Digitated Capacitor (IDC) technology was developed by AVX. This is Oh 1 the second family of Low Inductance MLCC products created by AVX. IDCs are e ( LICC_0612 a cost effective alternative to AVX’s first generation low ESL family for high- nc 0.1 reliability applications known as LICA (Low Inductance Chip Array). eda IDC_0612 p m 0.01 AVX IDC products are available with a lead-free finish of plated Nickel/Tin. I 0.001 1 10 100 1000 Frequency (MHz) HOW TO ORDER W 3 L 1 6 D 225 M A T 3 A Style IDC Low Number Voltage Dielectric Capacitance Capacitance Failure Termination Packaging Thickness Case Inductance of 4 = 4V C = X7R Code (In pF) Tolerance Rate T = Plated Ni Available Max. Thickness Size Terminals 6 = 6.3V D = X5R 2 Sig. Digits + M = ±20% A = N/A and Sn 1=7" Reel mm (in) 2 = 0508 1 = 8 Terminals Z = 10V Z = X7S Number of 3=13" Reel A=Standard 3 = 0612 Y = 16V Zeros S=0.55 (0.022) 4 = 0306 3 = 25V NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. PERFORMANCE CHARACTERISTICS Capacitance Tolerance ±20% Preferred No problems observed after 2.5 x RVDC Dissipation Factor X7R = -55°C to +125°C for 5 seconds at 50mA max current Operation X5R = -55°C to +85°C Temperature Range CTE (ppm/C) 12.0 X7S = -55°C to +125°C Temperature Thermal Conductivity 4-5W/M K ±15% (0VDC), ±22% (X7S) Coefficient Terminations Voltage Ratings 4, 6.3, 10, 16, 25 VDC Available Plated Nickel and Solder ≤ 6.3V = 6.5% max; Dissipation Factor 10V = 5.0% max; ≥ 16V = 3.5% max Insulation Resistance 100,000MΩ min, or 1,000MΩ per μF (@+25°C, RVDC) min.,whichever is less 80

IDC Low Inductance Capacitors (RoHS) IDC (InterDigitated Capacitors) 0306/0612/0508 SIZE W4 = 0306 W2 = Thin 0508 W2 = 0508 W3= Thin 0612 W3 = 0612 W3 = THICK 0612 Max. mm 0.55 0.55. 0.95 0.55 0.95 1.22 Thickness (in.) (0.022) (0.022) (0.037) (0.022) (0.037) (0.048) WVDC 4 6.3 4 6.3 10 16 25 4 6.3 10 16 25 4 6.3 10 16 4 6.3 10 16 25 4 6.3 10 16 Cap 0.010 (μF) 0.022 0.033 0.047 0.068 0.10 0.22 0.33 0.47 0.68 1.0 1.5 2.2 3.3 Consult factory for PHYSICAL DIMENSIONS AND PAD LAYOUT additional requirements = X7R = X5R = X7S PAD LAYOUT PHYSICAL CHIP DIMENSIONS MILLIMETERS (INCHES) DIMENSIONS SIZE W L BW BL P SIZE A B C D E 1.60 ± 0.20 0.82 ± 0.10 0.25 ± 0.10 0.20 ± 0.10 0.40 ± 0.05 0.38 0.89 1.27 0.20 0.40 0306 0306 (0.063 ± 0.008) (0.032 ± 0.006 (0.010 ± 0.004) (0.008± 0.004) (0.015 ± 0.002) (0.015)(0.035) (0.050) (0.008) (0.015) 0508 (0.20.8003 ±± 00..02008) (0.10.5207 ±± 00..02008) (0.00.1320 ±± 00..01004) (00.0.2150 ±± 00..01056) (0.00.2500 ±± 00..00052) 0508 (00.0.6245)(01.0.2570) (01.0.9715) (00.0.2181) (00.0.5200) 3.20 ± 0.20 1.60 ± 0.20 0.50 ± 0.10 0.25 ± 0.15 0.80 ± 0.10 0612 0.89 1.65 2.54 0.45 0.80 (0.126 ± 0.008) (0.063 ± 0.008) (0.020 ± 0.004) (0.010 ± 0.006) (0.031 ± 0.004) 0612 (0.035)(0.065) (0.010) (0.018) (0.031) 81