VN751S High-side driver Datasheet - production data Description The VN751S is a monolithic device developed using STMicroelectronics' VIPower technology, intended to drive any kind of load with one side connected to ground. Active V pin voltage CC clamp protects the device against low energy spikes. Active current limitation combined with (cid:52)(cid:48)(cid:14)(cid:25) thermal shutdown and automatic restart protect the device against overload. The device automatically turns off in case of ground pin Features disconnection. This device is especially suitable for industrial applications in conformity with IEC  R : 60 m 61131-2 programmable controller international DS(on) standard.  I : 2.5 A OUT  VCC: 36 V Table 1. Device summary  CMOS compatible input Order code Package Packing  Thermal shutdown VN751S Tube  Shorted load protection SO-8 VN751STR Tape and reel  Undervoltage and overvoltage shutdown  Protection against loss of ground  Very low standby current  Compliance to 61000-4-4 IEC test up to 4 kV  Open drain status output  Fast demagnetization of inductive loads May 2018 DocID12320 Rev 9 1/22 This is information on a product in full production. www.st.com

Contents VN751S Contents 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 Switching time waveforms and truth table . . . . . . . . . . . . . . . . . . . . . . 11 7 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8 Reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 9 Active VDS clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 10 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 10.1 SO-8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 10.2 SO-8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2/22 DocID12320 Rev 9

VN751S List of tables List of tables Table 1. Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 3. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 4. Power section. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 5. Switching (V = 24 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 CC Table 6. Input pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 7. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 8. Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 9. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 10. SO-8 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 11. SO-8 tape and reel mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 12. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 DocID12320 Rev 9 3/22 22

List of figures VN751S List of figures Figure 1. Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Connection diagram (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 4. Peak short-circuit current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 5. Avalanche energy test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 6. Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 7. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 8. Application schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 9. Reverse polarity protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 10. Active clamp equivalent principle schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 11. Fast demagnetization waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 12. Typical demagnetization energy (single pulse) at V = 24 V and T = 125 °C . . . . . . 17 CC AMB Figure 13. SO-8 package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 14. SO-8 package recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 15. SO-8 tape and reel dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4/22 DocID12320 Rev 9

VN751S Block diagram 1 Block diagram Figure 1. Block diagram (cid:34)(cid:46)(cid:17)(cid:21)(cid:17)(cid:20)(cid:22)(cid:23) DocID12320 Rev 9 5/22 22

Pin connection VN751S 2 Pin connection Figure 2. Connection diagram (top view) (cid:34)(cid:46)(cid:17)(cid:21)(cid:17)(cid:20)(cid:22)(cid:24) Figure 3. Current and voltage conventions (cid:34)(cid:46)(cid:17)(cid:21)(cid:17)(cid:20)(cid:22)(cid:25) 6/22 DocID12320 Rev 9

VN751S Maximum ratings 3 Maximum ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit V DC supply voltage 45 V CC -V Reverse DC supply voltage -0.3 V CC -I DC reverse ground pin current -200 mA GND I DC output current Internally limited A OUT -I Reverse DC output current -5 A OUT I DC input current -1 to +10 mA IN I DC status current -1 to +10 mA STAT V Electrostatic discharge (R = 1.5 k; C = 100 pF) 5000 V ESD Single pulse avalanche energy E 650 mJ AS (T = 125 °C, V = 24 V, I = 2.0 A) amb CC load P Power dissipation at T = 25 °C Internally limited W TOT C T Junction operating temperature Internally limited °C J T Case operating temperature -40 to 150 °C C T Storage temperature -55 to 150 °C STG Table 3. Thermal data Symbol Parameter Value Unit R Thermal resistance junction-case Max. 15 °C/W th(JC) 93(1) R Thermal resistance junction-ambient Max. °C/W th(JA) 82(2) 1. When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 m) thick connected to all VCC pins. Horizontal mounting and no artificial air flow. 2. When mounted on a standard single-sided FR-4 board with 2 cm2 of Cu (at least 35 m) thick connected to all VCC pins. Horizontal mounting and no artificial air flow. DocID12320 Rev 9 7/22 22

Electrical characteristics VN751S 4 Electrical characteristics 8 V < V < 36 V; -40 °C < T < 125 °C; unless otherwise specified. CC J Table 4. Power section Symbol Parameter Test conditions Min. Typ. Max. Unit V Supply voltage - 5.5 - 36 V CC I = 2 A at T = 25 °C - 60 - OUT J R On-state resistance m DS(on) I = 2 A - - 180 OUT Off-state, V = 24 V, T = 25 °C - 10 20 µA CC J I (1) Supply current On-state, V = 24 V, T = 25 °C - 3.5 - mA S CC J On-state, V = 24 V, T = 100 °C - - 3.8 mA CC J V Undervoltage shutdown - 3 4 5.5 V USD V Overvoltage shutdown - 36 - - V OV I Off-state output current V = V = 0 V 0 - 10 µA L(off) IN OUT 1. Status: floating. Table 5. Switching (V = 24 V) CC Symbol Parameter Test conditions Min. Typ. Max. Unit R = 12  from V rising edge t Turn-on delay time L IN - 12 - µs d(ON) to V = 2.4 V OUT Turn-off delay time R = 12  from V falling edge t L IN - 35 - µs d(OFF) of output current to V = 21.6 V OUT Turn -on voltage R = 12  from V = 2.4 V d /dt L OUT - 0.80 - VOUT (on) slope to V = 19.2 V OUT V/µs Turn -off voltage R = 12 from V = 21.6 V dV /dt L OUT - 0.30 - OUT (off) slope to V = 2.4 V OUT Table 6. Input pin Symbol Parameter Test conditions Min. Typ. Max. Unit V Input low level - - - 1.25 V IL I Low level input current V = 1.25 V 1 - - µA IL IN V Input high level - 3.25 - - V IH I High level input current V = 3.25 V - - 10 µA IH IN V Input hysteresis voltage - 0.5 - V hyst I Input current V = V = 5 V - - 10 µA IN IN CC I = 1 mA 6 6.8 8 IN V Input clamp voltage V ICL I = -1 mA - -0.7 - IN 8/22 DocID12320 Rev 9

VN751S Electrical characteristics Table 7. Status pin Symbol Parameter Test conditions Min. Typ. Max. Unit V Status low output voltage I = 1.6 mA - - 0.5 V STAT STAT I Status leakage current Normal operation; V = 5 V - - 10 µA LSTAT STAT C Status pin input capacitance Normal operation; V = 5 V - - 100 V STAT STAT I High level input current V = 3.25 V - - 10 µA IH IN I = 1 mA 6 6.8 8 STAT V Status clamp voltage V SCL I = -1 mA - -0.7 - STAT Table 8. Protection Symbol Parameter Test conditions Min. Typ. Max. Unit Turn-off output clamp V R =12 ; L = 6 mH V -47 V -52 V -57 V demag voltage L CC CC CC T Shutdown temperature - 150 175 200 °C TSD V = 24 V; R = 10 m, I Current limitation CC LOAD 2.7 - 6.0 A lim t = 0.4 ms T Thermal hysteresis - 7 20 - °C hyst T Reset temperature - 135 - - °C R DocID12320 Rev 9 9/22 22

Test circuits VN751S 5 Test circuits Figure 4. Peak short-circuit current Figure 5. Avalanche energy test circuit 10/22 DocID12320 Rev 9

VN751S Switching time waveforms and truth table 6 Switching time waveforms and truth table Figure 6. Switching time waveforms (cid:34)(cid:46)(cid:17)(cid:21)(cid:17)(cid:20)(cid:22)(cid:26) Table 9. Truth table Conditions Input Output Status L L H Normal operation H H H L L H Current limitation H X (T < T ) H J TSD H X (T > T ) L J TSD L L H Overtemperature H L L L L X Undervoltage H L X L L H Overvoltage H L H DocID12320 Rev 9 11/22 22

Switching time waveforms and truth table VN751S Figure 7. Waveforms (cid:34)(cid:46)(cid:17)(cid:21)(cid:17)(cid:20)(cid:23)(cid:17) 12/22 DocID12320 Rev 9

VN751S Application schematic 7 Application schematic Figure 8. Application schematic DocID12320 Rev 9 13/22 22

Reverse polarity protection VN751S 8 Reverse polarity protection A schematic solution to protect the IC against a reverse polarity condition is proposed. This schematic is effective with any type of load connected to the outputs of the IC. The R resistor value can be selected according to the following conditions: GND Equation 1 R  600 mV / (I in ON-state max.) GND S Equation 2 R  (-V ) / (-I ) GND CC GND where -I is the DC reverse ground pin current and can be found in Section3: Maximum GND ratings on page7. The power dissipation associated to R during reverse polarity condition is: GND Equation 3 P = (-V )2 / R D CC GND This resistor can be shared by several different ICs. In such case I value in Equation 1 is the sum of the maximum ON-state currents of the S different devices. Please note that if the microprocessor ground and the device ground are separated, the voltage drop across the R (given by I in ON-state max. * R ) GND S GND produces a difference between the generated input level and the IC input signal level. This voltage drop varies depending on how many devices are ON in case of several high-side switches sharing the same R . GND Figure 9. Reverse polarity protection (cid:34)(cid:46)(cid:17)(cid:21)(cid:17)(cid:20)(cid:23)(cid:18) 14/22 DocID12320 Rev 9

VN751S Active VDS clamp 9 Active VDS clamp The active clamp is also known as the fast demagnetization of inductive loads or fast current decay. When a high-side driver turns off an inductance, an undervoltage is detected on the output. The OUT pin is pulled down to V . The conduction state is modulated by internal demag circuitry in order to keep the OUT pin voltage at about V until the load energy has been demag dissipated. The energy is dissipated both in the IC internal switch and in load resistance. Figure 10. Active clamp equivalent principle schematic (cid:34)(cid:49)(cid:49)(cid:45)(cid:42)(cid:36)(cid:34)(cid:53)(cid:42)(cid:48)(cid:47)(cid:1)(cid:35)(cid:1)(cid:48)(cid:34)(cid:51)(cid:37) (cid:52)(cid:54)(cid:49)(cid:49)(cid:45)(cid:58)(cid:1)(cid:51)(cid:1)(cid:34)(cid:42)(cid:45) (cid:55)(cid:36)(cid:36) (cid:36)(cid:45)(cid:34)(cid:46)(cid:49) (cid:68)(cid:74)(cid:83)(cid:68)(cid:86)(cid:74)(cid:85)(cid:83)(cid:90) (cid:48)(cid:54)(cid:53) (cid:55)(cid:47)(cid:24)(cid:22)(cid:18)(cid:49)(cid:53) (cid:40)(cid:47)(cid:37) (cid:40)(cid:51)(cid:48)(cid:54)(cid:47)(cid:37)(cid:1)(cid:49)(cid:1)(cid:45)(cid:34)(cid:47)(cid:38) (cid:34)(cid:46)(cid:17)(cid:21)(cid:17)(cid:20)(cid:23)(cid:20) DocID12320 Rev 9 15/22 22

Active VDS clamp VN751S Figure 11. Fast demagnetization waveforms (cid:42) (cid:48)(cid:54)(cid:53) (cid:85)(cid:48)(cid:47) (cid:85)(cid:37)(cid:38)(cid:46)(cid:34)(cid:40) (cid:42) (cid:45)(cid:48)(cid:34)(cid:37) (cid:95) (cid:55) (cid:85) (cid:48)(cid:54)(cid:53) (cid:55) (cid:95) (cid:36)(cid:36) (cid:85) (cid:55) (cid:14)(cid:55) (cid:36)(cid:36) (cid:37)(cid:38)(cid:46)(cid:34)(cid:40) (cid:55) (cid:42)(cid:47) (cid:95) (cid:85) (cid:34)(cid:46)(cid:17)(cid:21)(cid:17)(cid:20)(cid:23)(cid:21) The demagnetization of the inductive load causes a huge electrical and thermal stress to the IC. The curve plotted in Figure12 shows the maximum demagnetization energy that the IC can support in a single demagnetization pulse with V = 24 V and T = 125 °C. If higher CC AMB demagnetization energy is required then an external free-wheeling Schottky diode has to be connected between OUT (cathode) and GND (anode) pins. Note that in this case the fast demagnetization is inhibited. 16/22 DocID12320 Rev 9

VN751S Active VDS clamp Figure 12. Typical demagnetization energy (single pulse) at V = 24 V and T = 125 °C CC AMB (cid:23)(cid:17)(cid:17)(cid:17) (cid:22)(cid:17)(cid:17)(cid:17) (cid:21)(cid:17)(cid:17)(cid:17) (cid:20)(cid:17)(cid:17)(cid:17) (cid:19)(cid:17)(cid:17)(cid:17) (cid:18)(cid:17)(cid:17)(cid:17) (cid:17) (cid:17)(cid:15)(cid:22) (cid:17)(cid:15)(cid:24) (cid:17)(cid:15)(cid:26) (cid:18)(cid:15)(cid:18) (cid:18)(cid:15)(cid:20) (cid:18)(cid:15)(cid:22) (cid:18)(cid:15)(cid:24) (cid:18)(cid:15)(cid:26) (cid:19)(cid:15)(cid:18) (cid:19)(cid:15)(cid:20) (cid:19)(cid:15)(cid:22) (cid:42) (cid:60)(cid:34)(cid:62) (cid:45)(cid:48)(cid:34)(cid:37) (cid:34)(cid:46)(cid:17)(cid:21)(cid:17)(cid:20)(cid:23)(cid:22) DocID12320 Rev 9 17/22 22

Package information VN751S 10 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 10.1 SO-8 package information Figure 13. SO-8 package outline 18/22 DocID12320 Rev 9

VN751S Package information Table 10. SO-8 package mechanical data Dimensions (mm) Symbol Min. Typ. Max. A - - 1.75 A1 0.10 - 0.25 A2 1.25 - - b 0.28 - 0.48 c 0.17 - 0.23 D 4.80 4.90 5.00 E 5.80 6.00 6.20 E1 3.80 3.90 4.00 e - 1.27 - h 0.25 - 0.50 L 0.40 - 1.27 L1 - 1.04 - k 0° - 8° ccc - - 0.10 Figure 14. SO-8 package recommended footprint (cid:34)(cid:46)(cid:17)(cid:21)(cid:17)(cid:20)(cid:23)(cid:19) DocID12320 Rev 9 19/22 22

Package information VN751S 10.2 SO-8 packing information Figure 15. SO-8 tape and reel dimensions Table 11. SO-8 tape and reel mechanical data Dimensions (mm) Symbol Min. Typ. Max. A - 330 C 12.8 13.2 D 20.2 - N 60 - T - 22.4 - Ao 8.1 8.5 Bo 5.5 5.9 Ko 2.1 2.3 Po 3.9 4.1 P 7.9 8.1 20/22 DocID12320 Rev 9

VN751S Revision history 11 Revision history Table 12. Document revision history Date Revision Changes 18-Sep-2006 1 Initial release. 12-Mar-2007 2 Document reformatted, typo in table 3, updated P value in table 2. tot 15-Mar-2007 3 Typo in table 1 V . ESD 18-Sep-2007 4 Added I value in table 1. STAT 11-Oct-2007 5 Updated table 2. 08-Jul-2008 6 Added section 7. 30-Nov-2009 7 Updated cover page and section 6. 12-Jul-2016 8 Updated Table 4: “Power section”. Updated Section: Features on page1 (added “Fast demagnetization of inductive loads”). Updated Table2 on page7 (Updated E parameter and value). AS 09-May-2018 9 Updated Figure8 on page13 [removed “Nominal 2A LOAD and 270mH (SO8) 400mH (PPAK)”]. Added Section9 on page 15. Minor modifications throughout document. DocID12320 Rev 9 21/22 22

VN751S IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved 22/22 DocID12320 Rev 9