TransFeed Automotive Series AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip GENERAL DESCRIPTION Schematic Diagram AVX has combined the best electrical characteristics of its TransGuard® Transient Voltage Suppressors (TVS) and its IN OUT Feedthru Capacitors into a single chip for state-of-the-art overvoltage circuit protection and EMI reduction over a broad range of frequencies. This unique combination of Electrical Model multilayer ceramic construction in a feedthru configuration gives the circuit designer a single 0805 chip that responds to transient events faster than any TVS device on the mar- IN LS LS OUT ket today, and provides significant EMI attenuation when in the off-state. RV C RP Automotive TransFeeds are designed for automotive appli- RON cations and are AEC-Q 200 qualified. The reduction in parallel inductance, typical of the feedthru LP chip construction when compared to the construction of standard TVS or ceramic capacitor chips, gives the TransFeed product two very important electrical advan- inductance, is the enhanced attenuation characteristics of tages: (1) faster “turn-on” time. Calculated response times the TransFeed product. Not only is there significantly of <200 pSec are not unusual with this device, and mea- greater attenuation at a higher self-resonance frequency, sured response times range from 200 – 250 pSec. The but the roll-off characteristic becomes much flatter, result- TransFeed “turn-on” characteristic is less than half that of ing in EMI filtering over a much broader frequency spec- an equivalent TransGuard® part — and TransGuards® trum. Typical applications include filtering/protection on clamp transient voltages faster than any other bipolar TVS Microcontroller I/O Lines, Interface I/O Lines, Power Line solution such as diodes; (2) the second electrical advantage Conditioning and Power Regulation. of lower parallel inductance, coupled with optimal series TYPICAL APPLICATIONS GENERAL FEATURES CHARACTERISTICS • Drive by Wire • Bi-directional TVS • Dimming Mirror Circuit • Operting Teperature: -55°C to +125°C • Narrow band, high • Filtering/protection on Microcontroller I/O lines • Working Voltage: 5.6Vdc - 26Vdc attenuation filter • Filtering/protection on Interface I/O lines • Case Size: 0805 • EMI Filtering over broader • Power Line Conditioning • Energy Rating: 0.05 - 0.3J frequency range • Power Regulation • Current: 20 - 120A • Fastest Response Time to • LCD Dashboard driver • Max Feedthru Current: 0.5 - 1A ESD Strikes • AEC-Q 200 Qualified Where designers are concerned with both tran- sient voltage protection and EMI attenuation, either due to the electrical performance of their circuits or due to required compliance to specif- ic EMC regulations, the TransFeed product is an ideal choice. 90 080216

TransFeed Automotive Series AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip HOW TO ORDER V 2 AF 1 05 A 150 Y 2 E D P Varistor Automotive Voltage Varistor DC Packaging Feedthru 05 =5.6VDC Clamping Resistance Code Capacitor 09 =9.0VDC Voltage 1 = 0.150 Ohms Pcs./Reel 14 = 14.0VDC 150 = 18V 2 = 0.200 Ohms D = 1,000 18 = 18.0VDC 200 = 22V 3 = 0.250 Ohms R = 4,000 26 = 26.0VDC 300 = 32V T = 10,000 400 = 42V 500 = 50V Chip Size No. of Energy 600 = 60V Capaci tance Feedthru Termination Finish 2 = 0805 Elements Rating Tolerance Current P = Ni/Sn (Plated) X = 0.05J Y = +100/-50% D = 500 mA A = 0.1J E = 750 mA C = 0.3J F = 1.0 Amp TRANSFEED ELECTRICAL SPECIFICATIONS AVX Working Working Breakdown Clamping Maximum Transient Peak Typical DC Maximum Jump Part Number Voltage Voltage Voltage Voltage Leakage Energy Current Cap Resistance Feedthru Start (DC) (AC) Current Rating Rating Current Voltage V2AF105A150Y2E _ _ 5.6 4.0 8.5±20% 18 35 0.10 30 800 0.200 0.75 – V2AF105C150Y1F _ _ 5.6 4.0 8.5±20% 18 35 0.30 120 2500 0.150 1.00 – V2AF109A200Y2E _ _ 9.0 6.4 12.7±15% 22 25 0.10 30 575 0.200 0.75 – V2AF109C200Y1F _ _ 9.0 6.4 12.7±15% 22 25 0.30 120 1800 0.150 1.00 – V2AF114A300Y2E _ _ 14.0 10.0 18.5±12% 32 15 0.10 30 300 0.200 0.75 27.5 V2AF114C300Y1F _ _ 14.0 10.0 18.5±12% 32 15 0.30 120 900 0.150 1.00 27.5 V2AF118A400Y2E _ _ 18.0 13.0 25.5±10% 42 10 0.10 30 200 0.200 0.75 27.5 V2AF118C400Y1F _ _ 18.0 13.0 25.5±10% 42 10 0.30 120 500 0.150 1.00 27.5 V2AF118X500Y3D _ _ 18.0 13.0 25.5±10% 50 10 0.05 20 75 0.250 0.50 27.5 V2AF126C600Y2E_ _ 26.0 18.0 34.5±10% 60 10 0.3 80 250 0.2 0.75 27.5 Termination Finish Code Packaging Code V (DC) DC Working Voltage (V) E Transient Energy Rating (J, 10x1000μS) W T V (AC) AC Working Voltage (V) I Peak Current Rating (A, 8x20μS) W P V Typical Breakdown Voltage (V @ 1mA ) Cap Typical Capacitance (pF) @ 1MHz and 0.5 V B DC V Tol V Tolerance is ± from Typical Value DCR DC Resistance (Ohms) B B V Clamping Voltage (V @ 1A 8x20μS) I Maximum Feedthru Current (A) C FT I Maximum Leakage Current at the Working Voltage (μA) V Jump Start Voltage (V, 5 min) L JUMP 080216 91

TransFeed Automotive Series AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip DIMENSIONS mm (inches) L W T BW BL EW X S 2.01 ± 0.20 1.25 ± 0.20 1.143 Max. 0.46 ± 0.10 0.18 + 0.25 -0.08 0.25 ± 0.13 1.02 ± 0.10 0.23 ± 0.05 0805 (0.079 ± 0.008) (0.049 ± 0.008) (0.045 Max.) (0.018 ± 0.004) (0.007 + 0.010 -0.003) (0.010 ± 0.005) (0.040 ± 0.004) (0.009 ± 0.002) L X S T BW CL BL W EW RECOMMENDED SOLDER PAD LAYOUT (Typical Dimensions) mm (inches) T P S W L C 0805 3.45 (0.136) 0.51 (0.020) 0.76 (0.030) 1.27 (0.050) 1.02 (0.040) 0.46 (0.018) 4 Pad Layout T P P S W INPUT OUTPUT C L 92 080216

TransFeed Automotive Series AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip PERFORMANCE CHARACTERISTICS FEEDTHRU VARISTORS AVX Multilayer Feedthru Varistors (MLVF) are an ideal choice The electrical model for a ZnO MLV and a ZnO Feedthru MLV for system designers with transient strike and broadband are shown below. The key difference in the model for EMI/RFI concerns. the Feedthru is a transformation in parallel to series induc- Feedthru Varistors utilize a ZnO varistor material and the tance. The added series inductance helps lower the injected electrode pattern of a feedthru capacitor. This combination transient peak current (by 2πfL) resulting in an additional ben- allows the package advantage of the feedthru and material efit of a lower clamping voltage. The lowered parallel induc- advantages of the ZnO dielectric to be optimized. tance decreases the turn on time for the varistor to <250ps. ZnO MLV Feedthrus exhibit electrical and physical advantages over standard ZnO MLVs. Among them are: 1. Faster Turn on Time 2. Broadband EMI attenuation 3. Small size (relative to discrete MLV and EMI filter schemes) Discrete MLV Model Discrete MLVF Model To Device To Device PCB Requiring Requiring Trace Protection Protection LS LS Solder Pad Solder Pad LP RV C RP RV C RP Ron Ron LP Solder Pad Solder Pad Where: Rv = Voltage Variable resistance Where: Rv = Voltage Variable resistance (per VI curve) (per VI curve) Rp ≥ 1012Ω Rp = Body IR C = defined by voltage rating and energy level C = defined by voltage rating and energy level Ron = turn on resistance Ron = turn on resistance Lp = parallel body inductance Lp = minimized parallel body inductance Ls = series body inductance 080216 93

TransFeed Automotive Series AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip PERFORMANCE CHARACTERISTICS APPLICATIONS MARKET SEGMENTS TYPICAL CIRCUITS REQUIRING • EMI Suppression • Computers TRANSIENT VOLTAGE • Broadband I/O Filtering • Automotive PROTECTION AND EMI FILTERING • Vcc Line Conditioning • Power Supplies • Multimedia Add-On Cards The following applications and schematic diagrams FEATURES • Bar Code Scanners show where TransFeed TVS/ EMI filtering devices might • Remote Terminals be used: • Small Size • Medical Instrumentation • System Board Level Interfaces: (Fig. 1) • Low ESR • Test Equipment Digital to RF • Ultra-fast Response Time • Transceivers Analog to Digital • Broad S21 Characteristics • Cellular Phones / Pagers Digital to Analog • Voltage Regulation (Fig. 2) • Power Conversion Circuits (Fig. 3) • GaAs FET Protection (Fig. 4) Fig. 1 – System Interface Fig. 2 – Voltage Regulators REGULATOR + Sensor/Keyboard/ Touchscreen Input DBIOGAIRTDAL(cid:31) RF BOARD By X Bus Fig. 3 – Power Conversion Circuits/Power Switching Circuits +3.3V MAIN(cid:31) POWER(cid:31) INTERFACE(cid:31) POWER MANAGE(cid:31)MENT(cid:31) +3.3V CARD Sensor Input ANALOG(cid:31) DIGITAL(cid:31) Display CHIP BOARD BOARD +5V +1.8V +12V Keyboard DIGITAL(cid:31) ANALOG(cid:31) ASIC BOARD BOARD Fig. 4 – GaAs FET Protection SPECIFICATION COMPARISON INPUT OUTPUT MLVF PARAMETER MLV 0805 0805 5ph Ls typical N/A <600nh Lp typical <1.5nh <0.025Ω Ron typical <0.1Ω Fig. 5 – Automotive TransFeed - Throttle by Wire 100pf to 2.5nf C typical 100pf to 5.5nf see VI curves Rv typical see VI curves THROTTLE >0.25 x 1012Ω Rp typical >1 x 1012Ω ACCELERATOR DRIVE SENSOR <250ps Typical turn on time <500ps ECU Typical frequency response A comparison table showing typical element parameters and resulting THROTTLE performance features for MLV and MLVF is shown above. SENSOR 94 080216

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: A VX: V2AF118A400Y2EDP V2AF105C150Y1FDP V2AF114C300Y1FDP V3AF418A400Y3GDP V2AF109C200Y1FDP V2AF118X500Y3DDP V2AF109A200Y2EDP V2AF118C400Y1FDP V2AF105A150Y2EDP V2AF114A300Y2EDP V3AF418X500Y3GDP V2AF118C400Y1FRP V2AF114C300Y1FRP V2AF114A300Y2ERP V2AF118C400Y1FTP V2AF105A150Y2ETP V2AF109C200Y1FTP V2AF118X500Y3DTP V2AF105C150Y1FTP V2AF109C200Y1FRP V2AF118A400Y2ETP V2AF118X500Y3DRP V2AF114C300Y1FTP V2AF105C150Y1FRP V2AF109A200Y2ETP V2AF114A300Y2ETP V3AF418A400Y3GRP V2AF105A150Y2ERP V3AF418X500Y3GTP V3AF418X500Y3GRP V3AF418A400Y3GTP V2AF109A200Y2ERP V2AF118A400Y2ERP V2AF126C600Y2EDP V2F126C600Y2ERP