Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > MHS Series MHS Varistor Series RoHS Description The Multilayer High–Speed MHS Series is a very-low capacitance extension to the Littelfuse ML family of transient voltage surge suppression devices available in an 0402 and 0603–size surface mount chip. The MHS Series provides protection from ESD and EFT in high–speed data line and other high frequency applications. The low capacitance of the MHS Series permits usage in analog or digital circuits where it will not attenuate or distort the desired signal or data. Their small size is ideal for high–density printed circuit boards, being typically applied to protect intergrated Size Table circuits and other sensitive components. They are particularly well suited to suppress ESD events including Metric EIA those specified in IEC 61000-4-2 or other standards used 1005 0402 for Electromagnetic Compliance (EMC) testing. 1608 0603 The MHS Series is manufactured from semiconducting ceramics and is supplied in a leadless, surface mount Additional Information package. The MHS Series is also compatible with modern reflow and wave soldering prcesses. Littelfuse Inc. manufactures other multilayer varistor series products, see the ML, MLE, MLN and AUML Series data Datasheet Resources Samples sheets. Applications Features • Data, Diagnostic • Mobile • Halogen-Free and 61000-4-2 (Level 4) I/O Ports Communications RoHS compliant • EFT/B rated to IEC • Universal Serial • Computer/DSP • 3pF, 12pF, and 22pF 61000-4-4 (Level 4) Bus (USB) Products capacitance versions • Low leakage currents suitable for high–speed • Video & Audio Ports • Industrial Instruments data rate lines • -40ºC to 125ºC Including Medical • Portable/Hand- operating temp. range • ESD rated to IEC Held Products • Inherently bi-directional Absolute Maximum Ratings • For ratings of individual members of a series, see device ratings and specifications table. Continuous MHS Series Units Steady State Applied Voltage: DC Voltage Range (V ) : V0402/0603MHS03 ≤ 42 V M(DC) V0402/0603MHS12 ≤ 18 V V0402/0603MHS22 ≤ 09 V Operating Ambient Temperature Range (T) -40 to +125 OC A Storage Temperature Range (T ) -40 to +150 OC STG © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/21/20

Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > MHS Series Device Ratings and Specifications Performance Specifications (25 ºC) Typical Typical Inductance Maximum ESD Clamp Typical Leakage Current Maximum Capacitance at (from Impedance Voltage (Note 1) at Specified DC Voltage Part Clamping 1MHz (1V p-p) Analysis) Number Voltage At 1A 8kV Contact (Note 2) 15kV AIR (Note 3) 3.5V 5.5V C (Note 4) (8X20µs) L Clamp Clamp P I MIN MAX L (V) (V) (V) (µA) (µA) (pF) (pF) (nH) c V0402MHS03N (Note 5) 135 <300 <400 0.5 1.00 2 5 <1.0 V0402MHS03F (Note 7) 135 <300 <400 0.5 1.00 2 5 <1.0 V0603MHS03N (Note 5) 135 <300 <400 0.5 1.00 1 6 <1.0 V0603MHS03F (Note 7) 135 <300 <400 0.5 1.00 1 6 <1.0 V0402MHS12N (Note 5) 55 <125 <160 0.5 1.00 8 16 <1.0 V0402MHS12F (Note 7) 55 <125 <160 0.5 1.00 8 16 <1.0 V0603MHS12N (Note 5) 55 <125 <160 0.5 1.00 8 16 <1.0 V0603MHS12F (Note 7) 55 <125 <160 0.5 1.00 8 16 <1.0 V0402MHS22N (Note 5) 30 <125 <160 0.5 1.00 15 29 <1.0 V0402MHS22F (Note 7) 30 <125 <160 0.5 1.00 15 29 <1.0 V0603MHS22N (Note 5) 30 <65 <100 0.5 1.00 15 29 <1.0 V0603MHS22F (Note 7) 30 <65 <100 0.5 1.00 15 29 <1.0 NOTES: 1. Tested to IEC-61000-4-2 Human Body Model (HBM) discharge test circuit. 2. Direct discharge to device terminals (IEC preferred test method). 3. Corona discharge through air (represents actual ESD event). 4. Capacitance may be customized, contact your Littelfuse Sales Representative. 5. V0402MHSxxx (0402 size devices) available as "R" packaging option only. Example: V0402MHS03NR. See Packaging and Tape and Reel sections (last page) for additional information. 6. The typical capacitance rating is discrete component test result. 7. Items are lead free and antimony free, available as "R" packing option only. Peak Current and Energy Derating Curve Standby Current at Normalized Varistor Voltage and Temperature For applications exceeding 125ºC ambient temperature, the peak surge current and energy ratings must be reduced as shown below. 1.2 V) 100 GE ( 1.0 A E LT U O L 80 V 0.8 T OF RATED VA 6400 ZED VARISTOR 00..64 2855OO PERCEN 20 NORMALI 0.2 125O 0 0.0 -55 50 60 70 80 90 100 110 120 130 140 150 0.0001 0.001 0.01 0.1 1 Figure 1 AMBIENT TEMPERATURE (oC) CURRENT (mA) Figure 2 FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE FIGURE 2. STANDBY CURRENT AT NORMALIZED VARISTOR VOLTAGE AND TEMPERATURE © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/21/20

Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > MHS Series Nominal Voltage Stability to Multiple ESD Impulses Insertion Loss (S21) Characteristics (8kV Contact Discharges per IEC 61000-4-2) 60 0 DC 50 VV00460023MMHHSS0033 A AL VOLTAGE AT 1m 3400 VV00460023MMHHSS1122 TION LOSS (dB) -10 VV00460023MMHHSS11VV2200460023MMHHSS0033 N R NOMI 20 V0402MHS22 INSE -20 VV00460023MMHHSS2222 V0603MHS22 10 -30 0 1 10 100 1000 10000 10 100 1000 10000 Figure 3 Number of Pulses Figure 4 FREQUENCY (MHz) FIGURE 4. INSERTION LOSS (S21) CHARACTERISTICS FIGURE 3. NOMINAL VOLTAGE STABILITY TO MULTIPLE ESD IMPULSES (8KV CONTACT DISCHARGES Device Characteri s tPiEcRs IEC 61000-4-2) Speed of Response At low current levels, the V-I curve of the multilayer The Multilayer Suppressor is a leadless device. Its response transient voltage suppressor approaches a linear (ohmic) time is not limited by the parasitic lead inductances found relationship and shows a temperature dependent effect. in other surface mount packages. The response time of the At or below the maximum working voltage, the suppressor Z O dielectric material is less than 1ns and the MLE can N is in a high resistance model (approaching 106Ω at its clamp very fast dV/dT events such as ESD. Additionally, maximum rated working voltage). Leakage currents at in “real world” applications, the associated circuit wiring maximum rated voltage are below 100µA, typically 25µA; is often the greatest factor effecting speed of response. for 0402 size below 20µA, typically 5µA. Therefore, transient suppressor placement within a circuit can be considered important in certain instances. Typical Temperature Dependance of the Characteristic Curve in the Leakage Region Multilayer Internal Construction 100% NT OF FIREDDI ECLEERCATMRIICC GE IN PERCEoAT 25C (%) ESSOR VOLTA VALUE VNOM TEMRMETINAAL TEINODN MELEETCATLRODES PR DEPLETION P REGION SU 25o 50o 75o 100o 125oC 10% 1E-9 1E-8 1E-7 1E-6 1E-5 1E-4 1E-3 1E-2 DEPRLEEGTIIOONN Figure 5 SUPPRESSOR CURRENT (ADC) Figure 6 GRAINS FIGURE 10. TYPICAL TEMPERATURE DEPENDANCE OF THE CHARACTERISTIC CURVE IN THE LEAKAGE REGION FIGURE 11. MULTILAYER INTERNAL CONSTRUCTION Lead (Pb) Soldering Recommendations The principal techniques used for the soldering of Reflow Solder Profile components in surface mount technology are IR Re-flow and Wave soldering. Typical profiles are shown on the right. The recommended solder for the MHS suppressor is 230 a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder flux. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. Figure 7 5. © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/21/20 6. MAXIMUM TEMPERATURE 260˚C 20 - 40 SECONDS WITHIN 5˚C RAMP RATE <3˚C/s 60 - 150 SEC > 217˚C PREHEAT ZONE 5.0 6.0 7.0 FIGURE 7. LEAD-FREE RE-FLOW PROFILE

230 Metal-Oxide Varistors (MOVs) 230 Surface Mount Multilayer Varistors (MLVs) > MHS Series Lead–free (Pb-free) Soldering Recommendations When using a reflow process, care should be taken to 5. ensure that the MHS chip is not subjected to a thermal Wave Solder Profile5. gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50ºC before cleaning. Figure 8 Littelfuse offers the Nickel Barrier Termination finish for the 6. 6. optimum Lead–free solder performance. Lead–free Re-flow Profile The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA flux, but there is a wide selection of pastes and fluxes MAXIMUM TEMPERATURE 260˚C M20A -X 4IM0 USMEC TOENMDPSE RWAITTHUIRNE 5 2˚C60˚C available with which the Nickel Barrier parts should be 20 - 40 SECONDS WITHIN 5˚C compatible. RAMP RATE R<3A˚MCP/s RATE 60 - 150 SEC <3˚C/s 60 -> 1 25107 S˚CEC The reflow profile must be constrained by the maximums > 217˚C in the Lead–free Reflow Profile. For Lead–free wave soldering, the Wave Solder Profile still applies. PREHEAT ZONE PREHEAT ZONE Note: the Lead–free paste, flux and profile were used for evaluation purposes by Littelfuse, based upon industry 5.0 6.0 7.0 standards and practices. There are multiple choices of all 5.0 6.0 7.0 three available, it is advised that the customer explores the Figure 10 FIGURE 7. LEAD-FREE RE-FLOW PROFILE optimum combination for their process as processes vary FIGURE 7. LEAD-FREE RE-FLOW PROFILE considerably from site to site. Product Dimensions (mm) PAD LAYOUT DEMENSIONS CHIP LAYOUT DIMENSIONS E D L W 0402 Size 0603 Size NoteN:o Atevo: Aidv omide tmale rtualn rsu inns tihni sth aisre aar,e ap,a prtasr tasr ear neo ntot Dimension recormecmoemnmdeendd feodr fuosre u isne ainp palpicpalitciaotniso nuss uinsgin sgi lSvielvr er (Ag) IN MM IN MM epoxy paste. (Ag) expoxy paste. A 0.067 1.700 0.100 2.540 B 0.020 0.510 0.030 0.760 TABLE 1: PAD LAYOUT DIMENSIONS C 0.024 0.610 0.035 0.890 DIMENSION A B C D (max.) 0.024 0.600 0.040 1.000 E 0.01 +/- 0.006 0.25 +/- 0.15 0.015 +/- 0.008 0.4 +/- 0.2 mm in mm in mm in L 0.039 +/- 0.004 1.00 +/- 0.10 0.063 +/- 0.006 1.6 +/- 0.15 0402 1.70 0.067 0.510 0.020 0.610 0.024 W 0.020 +/- 0.004 0.50 +/- 0.10 0.032 +/- 0.006 0.8 +/- 0.15 0603 2.54 0.100 0.760 0.030 0.890 0.035 © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/21/20

Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > MHS Series Part Numbering System V 0402 MHS 03 N R Device Family Packing Options (See quantities in Packaging section) Littelfuse TVSS Device T = (0603 device only)13in (330mm) Diameter Reel, Plastic Carrier Tape H = (0603 device only) 7in (178mm) Diameter Reel, Plastic Carrier Tape Device Size R = (available for 0402 and 0603 devices) 7in (178mm) Diameter Reel, Paper Carrier Tape 0402 = .04 inch x .02 inch (1.0 mm x 0.5 mm) End Termination Option 0603 = .063 inch x .031 inch Nickel Barrier(Ni/Sn) (1.6 mm x 0.8 mm) N letter: lead free F letter: lead free and antimony free Series Designator MHS = Multilayer Hi-Speed Capacitance Designation 03 = 3pF 12 = 12pF 22 = 22pF Packaging* Tape and Reel Specifications Quantity T D0 P0 13 Inch Reel 7 Inch Reel 7 Inch Reel P2 Device Size ("T" Option) ("H" Option) ("R" Option) E 0603 10,000 2,500 4,000 0402 not available not available 10,000 F W *(Packaging) It is recommended that parts be kept in the sealed bag provided and that K0 B0 parts be used as soon as possible when removed from bags. P1 A0 T1 D1 Dimensions in Millimeters Symbol Description 0402 Size 0603 Size A Width of Cavity Dependent on Chip Size to Minimize Rotation. 0 B Length of Cavity Dependent on Chip Size to Minimize Rotation. 0 K Depth of Cavity Dependent on Chip Size to Minimize Rotation. 0 W Width of Tape 8 -/+ 0.2 8 -/+ 0.3 F Distance Between Drive Hole Centers and Cavity Centers 3.5 -/+.05 3.5 -/+.05 E Distance Between Drive Hole Centers and Tape Edge 1.75 -/+ 0.1 1.75 -/+ 0.1 P Distance Between Cavity Centers 2 -/+ 0.05 4 -/+ 0.1 1 P Axial Drive Distance Between Drive Hole Centers & Cavity Centers 2 -/+ 0.1 2 -/+ 0.1 2 P Axial Drive Distance Between Drive Hole Centers 4 -/+ 0.1 4 -/+ 0.1 0 D Drive Hole Diameter 1.55 -/+ 0.05 1.55 -/+ 0.05 0 D Diameter of Cavity Piercing N/A 1.05 -/+ 0.05 1 T Top Tape Thickness 0.1 Max 0.1 Max 1 T Nominal Carrier Tape Thickness 1.1 1.1 Notes: • Conforms to EIA-481-1, Revision A • Can be supplied to IEC publication 286-3 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/21/20