T e c h n i c a Pb Free l D a t a S h e Specification e t UR101 SSC Customer Drawn Approval Approval RReevv.. 0022 JJaannuuaarryy 22001122 WWWWWW..SSEEOOUULLSSEEMMIICCOONN..CCOOMM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)

T e c h n i c a l D a t a [ Contents ] S h e e t 1. Description 2. Absolute maximum ratings 3. Electro-Optical characteristics 4. Characteristic diagrams 5. Reliability result 6. Rank 7. Outline Dimension 8. Material 9. Reel Structure 10. Packing 11. Soldering profile 12. Precaution for Use RReevv.. 0022 JJaannuuaarryy 22001122 WWWWWW..SSEEOOUULLSSEEMMIICCOONN..CCOOMM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)

T e c h n i c a l D UR101 UR101 a t a S h 1. Description Features e e t - Small size suitable for compact • 1.6 X 0.8 X 0.8 mm appliances. • Untinted, Diffused flat - Surface-mounted chip LED mold device. • Peak Wavelength : 660nm - Pb-free and RoHS complaint component. - High brightness, High efficiency - Tape and Reel packing. Applications - Increases the life time of battery. (cid:1) Cellular phone’s keypad lightning (cid:1) Information Boards RReevv.. 0022 JJaannuuaarryy 22001122 WWWWWW..SSEEOOUULLSSEEMMIICCOONN..CCOOMM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)

T e c h n i c a l 2. Absolute maximum ratings D a (Ta=25℃℃℃℃) t a Parameter Symbol Value Unit S h e Power Dissipation P 61.5 mW d e t Forward Current I 30 mA F Peak Forward Current I *1 100 mA FM Reverse Voltage V 5 V R Operating Temperature T -40 ~ 85 ℃ opr. Storage Temperature T -40 ~ 100 ℃ stg. *1 I conditions: Pulse width Tw≤1msec and Duty ratio≤1/10. FM 3. Electro-Optical Characteristics (Ta=25℃℃℃℃) Parameter Symbol Condition Min Typ Max Unit Forward Voltage V I =20㎃ 1.7 1.9 2.05 V F F Reverse Current I V =5V - - 10 uA R R Luminous Intensity*2 Iv I =20㎃ 45 85 125 mcd F Wavelength λ I =20㎃ 650 660 668 nm p F Spectral Bandwidth Δλ I =20㎃ - 20 - nm F Viewing Angle*3 (Y) 2θ I =20㎃ - 156 - ˚ 1/2 F *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All measurements were made under the standardized environment of SSC. (Tolerance : I ±10 %, λ ±2 nm, V ±0.1 V) v d F RReevv.. 0022 JJaannuuaarryy 22001122 WWWWWW..SSEEOOUULLSSEEMMIICCOONN..CCOOMM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)

T e c h n i c a l 4. Characteristic Diagrams D a Ta = 25o t a S h Forward Current vs. Relative Luminous Intensity vs. e Forward Voltage Forward Current e t 30 1.6 1.4 25 u.] a. mA] 20 nsity [ 1.2 nt [ nte 1.0 Curre 15 nous I 0.8 d mi ar u 0.6 w 10 L or e F ativ 0.4 5 Rel 0.2 0 0.0 1.6 1.7 1.8 1.9 2.0 0 5 10 15 20 25 30 Forward Voltage [V] Forward Current [mA] Forward Current vs. Spectrum Ambient Temperature 35 1.0 30 u.] a. mA] 25 sity [ 0.8 ent [ 20 nten 0.6 Curr 15 on I d ssi 0.4 ar mi rw 10 E Fo e 0.2 v 5 ati el R 0.0 400 500 600 700 0 -25 0 25 50 75 100 Ambient Temperature [℃] Wavelength [nm] RReevv.. 0022 JJaannuuaarryy 22001122 WWWWWW..SSEEOOUULLSSEEMMIICCOONN..CCOOMM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)

T e c h n i c a l D Radiation Diagram a Ta = 25o t a 90 S h 120 60 e e t 150 30 180 0 X Y RReevv.. 0022 JJaannuuaarryy 22001122 WWWWWW..SSEEOOUULLSSEEMMIICCOONN..CCOOMM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)

T e c h n i c a l 5. Reliability Test D a t a S Duration Number Of Item Test Conditions h / Cycle Damaged e e t Operating at Room 20mA, @25℃ 500 hrs 0/22 temperature Operating at High 20mA, @85℃ 500 hrs 0/22 temperature Operating at High temperature 20mA, @60℃,90% 500 hrs 0/22 / High humidity Thermal shock test -40~85℃ Shift (2hr/cycle) 100 cycle 0/22 85℃, 85% 24hrs (cid:2) Reflow 3 times Thermal resistance (Max 260℃ 10sec) (cid:2) Thermal shock 1 time 0/22 Test 30 cycle MSL : 2a (30℃, 60% : 4 weeks) *Criterion OK Iv > Initial value * 0.5 V Initial value ± 0.1V F RReevv.. 0022 JJaannuuaarryy 22001122 WWWWWW..SSEEOOUULLSSEEMMIICCOONN..CCOOMM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)

T e c h n i c a l 6. Rank D a I = 20mA F t a BIN I [mcd] V [V] W [nm] S V F P h e A 45-85 1.7-2.05 650-668 e t B 85-125 1.7-2.05 650-668 RReevv.. 0022 JJaannuuaarryy 22001122 WWWWWW..SSEEOOUULLSSEEMMIICCOONN..CCOOMM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)

T e c h n i c a l 7. Outline Dimension D a t Tolerance ±0.1, Unit : ㎜ a S h e 0.18 3 e 0. Polarity Mark t Resin Polarity Mark Cathode 6 2 1 1. 1. 1. PCB Anode 0.8 0.4±0.05 3 0. 8 4 . . 0 2 0.8 [Recommended Solder Pattern] 8. Material Item Substrate chip wire Encapsulate Electrode Material BT-Resin PCB AlGaAs Gold Epoxy Au Plated RReevv.. 0022 JJaannuuaarryy 22001122 WWWWWW..SSEEOOUULLSSEEMMIICCOONN..CCOOMM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)

T e c h n i c a l 9. Reel Structure D a t a S h e e t (1) Quantity : 4000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10℃ angle to be the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package RReevv.. 0022 JJaannuuaarryy 22001122 WWWWWW..SSEEOOUULLSSEEMMIICCOONN..CCOOMM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)

T e c h n i c a l 10. Packing D a t Reel a S RANK: h XXX e e QUANTITY : XXXX t LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR #### Aluminum Vinyl Bag ### DESI PAK ### ### RANK: ####### XXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure 1 SIDE RANK: QUANTITY : XXXX c LOT NUMBER : XXXXXXXXXX 1 PART NUMBER : XXXXXX 2 SEOUL SEMICONDUCTOR CO., LTD. RoHS b 2 SIDE a LOT NUMBER Rank QTY Material : Paper(SW3B(B)) SIZE (mm) TYPE a b c 7inch 245 220 142 SEOUL SEMICONDUCTOR CO., LTD. RReevv.. 0022 JJaannuuaarryy 22001122 WWWWWW..SSEEOOUULLSSEEMMIICCOONN..CCOOMM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)

T e c h n i c a l 11. Soldering profile D a t a S (1) Lead Solder h e e t Lead Solder Lead Solder Pre-heat 120~150℃℃℃℃ 2.5~5 o C / sec. 240 oC Max. 10 sec. Max. Pre-heat time 120 sec. Max. Pre-heating o 60sec. Max. 120~150 C 2.5~5 C / sec. o Peak-Temperature 240℃℃℃℃ Max. Above 200 C Soldering time 10 sec. Max. 120sec. Max. Condition (2) Lead-Free Solder Lead Free Solder Lead-frame Solder Pre-heat 150~200℃℃℃℃ 1~5 o C / sec. 260 oC Max. 10 sec. Max. Pre-heat time 120 sec. Max. Pre-heating 1~5 o C / sec. 150~200 oC 60sec. Maxo. Peak-Temperature 260℃℃℃℃ Max. Above 220 C Soldering time 10 sec. Max. 120sec. Max. Condition (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 280ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. RReevv.. 0022 JJaannuuaarryy 22001122 WWWWWW..SSEEOOUULLSSEEMMIICCOONN..CCOOMM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)

T e c h n i c a l 12. Precaution for Use D a (1) Storage t LEDs must be stored at clean atmosphere. If the LEDs are stored for 3 months or more a after shipment from SSC, storage in a sealed container with a nitrogen atmosphere is S recommended. To avoid absorption of moisture, it is recommended to store in a dry box h e (or a desiccator) with a desiccant. e * Shelf Life : 12 months at < 40ºC and 90%RH t (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. After opened and mounted the soldering shall be quickly. * Within 672 hours at factory conditions of equal to or less than 30ºC/60%RH, or Stored at < 10% RH (3) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (4) In the case of change color of indicator on desiccant, components shall be dried 10-12hr at 60±5ºC. (5) When the LED is operating, the driving current should be determined after considering the maximum ambient temperature requirements. (6) When using multiple LEDs, It is recommended to connect a resistor on each LED. Otherwise, LEDs may vary due to variation in forward voltage of the LEDs. (7) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage (8) Any mechanical force or excessive vibration should be avoided during temperature cooling process to normal temperature after reflow. (9) Rapid cooling shall be avoided. (10) LED should not be placed on a flexible area on the PCB. (11) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (12) Anti radioactive ray design is not considered for the products. (13) Damage prevention from ESD or Surge. It is highly recommended to use the wrist-band or anti electrostatic gloves when handling the LED’s All devices, equipments and machines mush be properly grounded (14) The appearance and specifications of the product may be modified for improvement without notice. RReevv.. 0022 JJaannuuaarryy 22001122 WWWWWW..SSEEOOUULLSSEEMMIICCOONN..CCOOMM 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: S eoul Semiconductor: UR101