CMOS INTEGRATED CIRCUIT PD5713TK 6 WIDE BAND SPDT SWITCH T M DESCRIPTION U 4 The PD5713TK is a CMOS MMIC for wide band SPDT (Single Pole Double Throw) switch whic1h were developed for mobile communications, wireless communications and another general-purpose RF switching application. 2 This device can operate frequency from 0.05 to 2.5 GHz, having the low insertion loss and high isolation. O This device is housed in a 6-pin lead-less minimold (1511) package. And this package is able to high-density 2 surface mounting. G FEATURES • Supply voltage : VDD = 1.8 to 3.6 V (2.8 V TYP.) C - • Switch control voltage : Vcont (H) = 1.8 to 3.6 V (2.8 V TYP.) : Vcont (L) = 0.2 to +0.E4 V (0 V TYP.) : • Low insertion loss : Lins1 = 0.6 dB TYP. @ f = 0.05 to 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V t : Lins2 = 0.8 dB TYP. @ f = 1.0 to 2.0 GnHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V : Lins3 = 0.95 dB TYP. @ f = 2.0 to 2.5 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V • High isolation : ISL1 = 32S.5 dB TYP. @ f = 0.05 toe 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V : ISL2 = 25 dB TYP. @ f = 1.0 tmo 2.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V : ISL3 = 22.5 dB TYP. @ f = 2.0 to 2.5 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V • Handling power : Pin (1 dB) = +21.0 dBm TYP. @ f = 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V e A : Pin (0.1 dB) = +17.0 dBm TYP. @ f = 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V • High-density surface mounting : 6-pin lead-less mcinimold package (1.5  1.1  0.55 mm) a APPLICATIONS l • Mobile communicHations p • Wireless communications • Another general-purpose RF switcheing applications ORDERING INFORMATION R P Part Number Order Nuember Package Marking Supplying Form PD5713TK-E2 PD5713TK-E2-A 6-pin lead-less minimold C3Q Embossed tape 8 mm wide l b (1511) (Pb-Free) Pin 1, 6 face the perforation side of the tape Qty 5 kpcs/reel i Remark To osrder evaluation samples, contact your nearby sales office. Psart number for sample order: PD5713TK-A o P Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge Document No. PU10627EJ01V0DS (1st edition) Date Published September 2006 NS CP(K)

PD5713TK PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. Pin Name 1 OUTPUT1 6 T 2 GND M 3 OUTPUT2 U 4 4Vcont 5 INPUT 1 6 VDD 2 TRUTH TABLE O 2 Vcont INPUTOUTPUT1 INPUTOUTPUT2 G Low OFF ON C High ON OFF - E ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwis:e specified) t Parameter Symbol Ratings n Unit Supply Voltage VDDS 0.5 to +4.6 e V Switch Control Voltage Vcont 0.5 to +4m.6 V Voltage Difference Vcont (H) +0.5 V  VDD e A Input Power Pin +23 dBm c Operating Ambient Temperature TA 45 to +85 C a Storage Temperature Tstg 55 to +150 C l H p RECOMMENDED OPERATING RANGE (TA = +25C, unless otherwise specified) e Parameter Symbol MIN. TYP. MAX. Unit R Supply VPoltage VDD +1.8 +2.8 +3.6 V Switch Control Voltage (H) e Vcont (H) +1.8 +2.8 +3.6 V Switch Control Voltage (L) Vcont (L) 0.2 0 +0.4 V l b Remark VDD  0.4 V  Vcont (H)  VDD + 0.2 V i s s o P 2 Data Sheet PU10627EJ01V0DS

PD5713TK ELECTRICAL CHARACTERISTICS (TA = +25C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, DC cut capacitors = 1 000 pF, unless otherwise specified) 6 Parameter Symbol Test Conditions MIN. TTYP. MAX. Unit Insertion Loss 1 Lins1 f = 0.05 to 1.0 GHz  0.6 0.8 MdB Insertion Loss 2 Lins2 f = 1.0 to 2.0 GHz  0.8 1.0 dB Insertion Loss 3 Lins3 f = 2.0 to 2.5 GHz U 0.95 1.42 dB Isolation 1 ISL1 f = 0.05 to 1.0 GHz 30 32.5  dB 1 Isolation 2 ISL2 f = 1.0 to 2.0 GHz 22 25  dB 2 Isolation 3 ISL3 f = 2.0 to 2.5 GHz 20 22.5  dB O Input Return Loss RLin f = 0.05 to 2.5 GHz 13 217  dB Output Return Loss RLout f = 0.05 to 2.5 GHz 13G 17  dB 0.1 dB Loss Compression Pin (0.1 dB) f = 1.0 GHz +13.0 +17.0  dBm Input Power Note 1 - C 1 dB Loss Compression Pin (1 dB) f = 1.0 GHz  +21.0  dBm Input Power Note 2 E : t Supply Current IDD VDD = Vcont = 2.8 V, RF off  0.01 1.0 A n Switch Control Current Icont VDD = Vcont = 2.8 V, RF off  0.01 1.0 A Switch Control Speed tSWS f = 1.0 GHz e  30 100 ns m Notes 1. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. e A 2. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear c range. a Caution This device is used it is necessary to use DC cut capacitors. l H The value of DC cut capacitoprs should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. e R P e l b i s s o P 3 Data Sheet PU10627EJ01V0DS

PD5713TK EVALUATION CIRCUIT 6 T M U 4 1 2 O 2 G C - E : t n Remark C0 = 1 000 pF S e m Caution This IC has pull down resistance between RF line and GND, witch fixes electric potential of RF line to 0 V, then the IC cannot be used for DC switching. e A The application circuits and their parameters arce for reference only and are not intended for use in actual design-ins. a l H p e R P e l b i s s o P 4 Data Sheet PU10627EJ01V0DS

PD5713TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD 6 T M U 4 1 2 O 2 G C - E : t n S e m e A c a l H p e USING THE EVALUATION BOARD R P Symbol Values e C1, C2, C3 1 000 pF l C4, C5 1b 000 pF i s s o P 5 Data Sheet PU10627EJ01V0DS

PD5713TK TYPICAL CHARACTERISTICS (TA = +25C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, Pin = 0 dBm, DC cut capacitors = 1 000 pF, unless otherwise specified) 6 T M U 4 1 2 O 2 G C - E : t n S e m e A c a l H p e R P e l b i s s o P Remark The graphs indicate nominal characteristics. 6 Data Sheet PU10627EJ01V0DS

PD5713TK 6 T M U 4 1 2 O 2 G C - E : t n S e m e A c a l H p Remark The graphs indicate nominal characteristics. e R P e l b i s s o P 7 Data Sheet PU10627EJ01V0DS

PD5713TK MOUNTING PAD DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) 6 T M U 4 1 2 O 2 G C - Remark The mounting pad layouts in this document are for referenc e only. E : t n S e m e A c a l H p e R P e l b i s s o P 8 Data Sheet PU10627EJ01V0DS

PD5713TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) 6 T M U 4 1 2 O 2 G C - E : t n S e m e A c a l H p e R P e l b i s s o P 9 Data Sheet PU10627EJ01V0DS

PD5713TK RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. 6 Soldering Method Soldering Conditions TCondition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260C or below IR260M Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12U030 seconds 4 Maximum number of reflow processes : 3 times 1 Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Wave Soldering Peak temperature (molten solder temperature) : 260C or below 2 WS260 Time at peak temperature O: 10 seconds or less Preheating temperature (package surface temperature) : 120C or below2 Maximum number of flow processes : 1 time G Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Partial Heating Peak temperature (terminal temperature) : 350C or below HS350 C Soldering time (per side of device)- : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below E : Caution Do not use different soldering methods together (exceptt for partial heating). n S e m e A c a l H p e R P e l b i s s o P 10 Data Sheet PU10627EJ01V0DS

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