uClamp0504A µ ClampTM 4-Line ESD protection Array PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS - MicroClampTM Description Features The µClampTM series of TVS arrays are designed to pro- (cid:139) Transient protection for data lines to tect sensitive electronics from damage or latch-up due IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) to ESD. They are designed for use in applications where IEC 61000-4-4 (EFT) 40A (5/50ns) board space is at a premium. Each device requires less (cid:139) Protects four I/O lines than 2.9mm2 of PCB area and will protect up to four (cid:139) Ultra-small SC-89 package (11111.....77777 xxxxx 11111.....77777 xxxxx 00000.....66666mmmmmmmmmm) lines. They are unidirectional devices and may be used requires less than 2.9mm2 of PCB area on lines where the signal polarities are above ground. (cid:139) Working voltage: 5V TVS diodes are solid-state devices designed specifically (cid:139) Low leakage current for transient suppression. They feature large cross-sec- (cid:139) Low operating and clamping voltages tional area junctions for conducting high transient cur- (cid:139) Solid-state silicon-avalanche technology rents. They offer desirable characteristics for board level protection including fast response time, low operating Mechanical Characteristics and clamping voltage, and no device degradation. (cid:139) SC-89 (SOT-666) package The uClampTM0504A may be used to meet the immunity (cid:139) Molding compound flammability rating: UL 94V-0 requirements of IEC 61000-4-2, level 4. The small SC- (cid:139) Marking : Marking Code 89 package makes them ideal for use in portable elec- (cid:139) Weight: 2.9mg (typical) tronics such as cell phones, PDA’s, notebook comput- (cid:139) Lead Finish: Matte Tin ers, and digital cameras. These devices feature a lead- (cid:139) Packaging : Tape and Reel per EIA 481 free, matte tin lead finish. They are compatible with both lead free and SnPb assembly techniques. Applications (cid:139) Cellular Handsets & Accessories (cid:139) Cordless Phones (cid:139) Personal Digital Assistants (PDA’s) (cid:139) Notebooks & Handhelds (cid:139) Portable Instrumentation (cid:139) Digital Cameras (cid:139) Peripherals (cid:139) MP3 Players Dimensions Schematic & PIN Configuration 1.70 0.50 1.25 1.70 0.30 0.60 Maximum Dimensions (mm) SC-89 (Top View) Revision 11/30/2004 1 www.semtech.com

uClamp0504A PROTECTION PRODUCTS Absolute Maximum Rating Rating Symbol Value Units PeakPulsePower(tp =8/20µs) P 100 Watts pk MaximumPeakPulseCurrent ( tp =8/20µs) I 7 Amps pp ESDperIEC61000-4-2 (Air) V +/- 20 kV PP ESDperIEC61000-4-2 (Contact) +/- 12 Lead Soldering Temperature T 260(10sec.) °C L Operating Temperature T -55to+125 °C J StorageTemperature T -55to+150 °C STG Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Typical Maximum Units ReverseStand-Off Voltage V 5 V RWM ReverseBreakdown Voltage V I =1mA 6 V BR t ReverseLeakageCurrent I V =5V, T=25°C 1 µA R RWM ReverseLeakageCurrent I V =3V, T=25°C 0.500 µA R RWM Forward Voltage V I =10mA 0.80 V F F Clamping Voltage V I =1A, t =8/20µs 9 V C PP p Clamping Voltage V I =7A, t =8/20µs 12 V C PP p Junction Capacitance C Between I/OPinsand 60 75 pF j Gnd V =0V, f =1MHz R  2004 Semtech Corp. 2 www.semtech.com

uClamp0504A PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 100 W) 90 wer - P (kPP 1 Power or IPP 678000 ak Pulse Po 0.1 % of Rated 345000 e 20 P 10 0.01 0 0.1 1 10 100 1000 0 25 50 75 100 125 150 Pulse Duration - tp (µs) Ambient Temperature - TA (oC) Clamping Voltage vs. Peak Pulse Current Forward Voltage vs. Forward Current 12 8 10 Vc (V) 8 V (V)F6 Voltage - 6 Voltage - 4 Clamping 4 PWaraavmefeotremrs: Forward 2 PWaraavmefeotremrs: 2 tr = 8us tr = 8us td = 20us td = 20us 0 0 0 1 2 3 4 5 6 7 8 0 5 10 15 Peak Pulse Current - Ipp (A) Forward Current - IF (A) Junction Capacitance vs. Reverse Voltage Insertion Loss S21 60 CH1 S21 LOG 6 dB / REF 0 dB 50 F) p C (j ce - 40 n a cit a p a C30 20 0 1 2 3 4 5 Reverse Voltage - V (V) R START . 030 MHz STOP 3 000. 0000 00 MHz  2004 Semtech Corp. 3 www.semtech.com

uClamp0504A PROTECTION PRODUCTS Typical Characteristics (Con’t.) ESD Clamping ESD Clamping (8kV Contact per IEC 61000-4-2) (-8kV Contact per IEC 61000-4-2) ESD Clamping ESD Clamping (15kV air per IEC 61000-4-2) (-15kV air per IEC 61000-4-2)  2004 Semtech Corp. 4 www.semtech.com

uClamp0504A PROTECTION PRODUCTS Applications Information Device Connection for Protection of Four Data Lines Circuit Diagram These devices are designed to protect up to four unidirectional data lines. The device is connected as 1 3 4 6 follows: 1. Unidirectional protection of four I/O lines is achieved by connecting pins 1, 3, 4, and 6 to the data lines. Pins 2 and 5 are connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. 2, 5 Circuit Board Layout Recommendations for Suppres- sion of ESD. Protection of Four Unidirectional Lines Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: (cid:122) Place the TVS near the input terminals or connec- tors to restrict transient coupling. (cid:122) Minimize the path length between the TVS and the protected line. (cid:122) Minimize all conductive loops including power and ground loops. (cid:122) The ESD transient return path to ground should be kept as short as possible. (cid:122) Never run critical signals near board edges. (cid:122) Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.  2004 Semtech Corp. 5 www.semtech.com

uClamp0504A PROTECTION PRODUCTS Typical Applications uClamp0504A  2004 Semtech Corp. 6 www.semtech.com

uClamp0504A PROTECTION PRODUCTS Outline Drawing - SC-89 (SOT-666) D A D N E/2 E1 E L 1 2 e c Nxb B aaa C A-B D DIMENSIONS A INCHES MILLIMETERS DIM MINNOMMAX MINNOMMAX A .019 - .024 0.50 - 0.60 C b .005 - .012 0.15 - 0.30 c .003 - .007 0.10 - 0.18 L1 D .059 .063 .067 1.50 1.60 1.70 E .061 .063 .067 1.55 1.60 1.70 E1 .043 .047 .049 1.10 1.20 1.25 e .020 BSC 0.50 BSC L .003 .008 .012 0.10 0.20 0.30 L1 .003 .006 .008 0.10 0.15 0.20 N 6 6 aaa .004 0.10 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern - SC-89 (SOT-666) X DIMENSIONS Y DIM INCHES MILLIMETERS C (.057) (1.45) C P .020 0.50 Z G G .024 0.60 X .012 0.30 Y .033 0.85 Y Z .090 2.30 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.  2004 Semtech Corp. 7 www.semtech.com

uClamp0504A PROTECTION PRODUCTS Marking Code Ordering Information Working Device Qtyper Reel Part Number Voltage Marking Reel Size uClamp0504A.TCT 5V H 3,000 7Inch H MicroClamp, uClamp and µClamp are marks of Semtech Corporation Note: (1) Device is symmetrical so there is no pin 1 identifier. Tape and Reel Specification H H H Tape Specification and Device Orientation Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2004 Semtech Corp. 8 www.semtech.com