UCC5617 18-Line SCSI Terminator (Reverse Disconnect) FEATURES DESCRIPTION • Complies with SCSI, SCSI-2, SCSI-3, The UCC5617 provides 18 lines of active termination for a SCSI (Small SPIand FAST-20 Standards Computers Systems Interface) parallel bus. The SCSI standard recom- mends and Fast-20 (Ultra) requires active termination at both ends of the • 2pF Channel Capacitance During cable. Disconnect Pin for pin compatible with the UC5609, the UCC5617 is ideal for high per- • 50mA Supply Current in Disconnect formance 5V SCSI systems, Termpwr 4.0-5.25V. During disconnect the Mode supply current is only 50 A typical, which makes the IC attractive for lower • 110 Termination powered systems. • SCSI Hot Plugging Compliant, 10nA The UCC5617 is designed with a low channel capacitance of 2pF, which Typical eliminates effects on signal integrity from disconnected terminators at in- terim points on the bus. • +400mA Sinking Current for Active Negation The power amplifier output stage allows the UCC5617 to source full termi- nation current and sink active negation current when all termination lines • –650mA Sourcing Current for are actively negated. Termination TheUCC5617,aswithallUnitrodeterminators,iscompletelyhotpluggable • Trimmed Impedance to 5% and appears as high impedance at the terminating channels with • Thermal Shutdown TRMPWR= 0V or open. • Current Limit Internal circuit trimming is utilized, first to trim the 110 impedance, and then most importantly, to trim the output current as close to the maximum SCSI-3 specification as possible, which maximizes noise margin in fast SCSI operation. This device is offered in low thermal resistance versions of the industry standard 28 pin wide bodySOIC. BLOCK DIAGRAM Patented Circuit Design UDG-96073 SLUS351A - APRIL 1997 - REVISED AUGUST 2002

UCC5617 ABSOLUTE MAXIMUM RATINGS CONNECTION DIAGRAMS TEMPWR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+7V SOIC-28(Top View) Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . . .0V to +7V DWPPackage Regulator Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . .1A Storage Temperature. . . . . . . . . . . . . . . . . . .–65°C to +150°C Operating Junction Temperature . . . . . . . . . .–55°C to +150°C Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . .300°C All currents are positive into, negative out of the specified terminal.Consult Packaging Section ofDatabookfor thermal limitations and considerations of packages. *DWPpackage pin 28 serves as signal ground;pins 7, 8, 9, 20, 21, 22 serve asheatsink/ground. 2

UCC5617 ELECTRICAL CHARACTERISTICS:Unless otherwise stated these specifications apply for T = 0°C to 70°C, A TRMPWR= 4.75V,DISCNCT= 0V, T =T . A J PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Supply Current Section TERMPWRSupply Current All Termination Lines = Open 1 2 mA All Termination Lines = 0.2V 420 440 mA Power Down Mode DISCNCT= 0V 50 100 A Output Section (Termination Lines) Termination Impedance (Note 3) 104.5 110 115.5 Output High Voltage V = 4V (Note 1) 2.6 2.8 3 V TRMPWR Max Output Current V = 0.2V,T = 25°C –22.1 –23.3 –24 mA LINE J V = 0.2V –20.7 –23.3 –24 mA LINE V = 0.2V,TERMPWR= 4V,T = 25°C –21 –23.3 –24 mA LINE J (Note 1) V = 0.2V,TRMPWR= 4V (Note 1) –20 –23 –24 mA LINE V = 0.5V –22.4 mA LINE Output Leakage DISCNCT= 2.4V,TRMPWR= 0V to 5.25V, 10 400 nA REG = 0.2V,V = 5.25V LINE Output Capacitance DISCNCT= 2.4V (Note 2) 2 3.5 pF Regulator Section Regulator Output Voltage 2.6 2.8 3 V Drop Out Voltage All Termination Lines = 0.2V 0.4 0.8 V Short Circuit Current V = 0V –475 –650 –850 mA REG Sinking Current Capability V = 3.5V 200 400 800 mA REG Thermal Shutdown 170 °C Thermal ShutdownHysteresis 10 °C Disconnect Section Disconnect Threshold 0.8 1.5 2 V Input Current DISCNCT= 0V –10 –30 A Note 1:Measuring each termination line while other 17 are low (0.2V). Note 2:Guaranteed by design.Not 100% tested in production. V N.L.–0.2V Note 3:Tested by measuringIOUTwithVOUT= 0.2V andVOUTwith no load, then calculating:Z= OUT I at0.2V OUT PIN DESCRIPTIONS DISCNCT:Taking this pin low causes the 18 channels to GND:Ground reference for the IC. become high impedance and the chip to go into LINE1–LINE18:110 termination channels. low-power mode; a high or open state allows the channels to provide normal termination. REG:Output of the internal 2.8V regulator. TRMPWR:Power for the IC. 3

UCC5617 APPLICATION INFORMATION Procedure: 1) MeasureV N.L. REG 2) SetV = 0.2V L 3) MeasureI at 0.2V MAX V N.L.–0.2V REG 4) Impedance = I MAX UDG-96108 Figure 1.TermlineImpedance Measurement Circuit UDG-96074 4

PACKAGE OPTION ADDENDUM www.ti.com 17-May-2014 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) UCC5617DWP LIFEBUY SOIC DW 28 TBD Call TI Call TI 0 to 70 UCC5617DWP UCC5617DWPG4 LIFEBUY SOIC DW 28 TBD Call TI Call TI 0 to 70 UCC5617DWP UCC5617DWPTR LIFEBUY SOIC DW 28 TBD Call TI Call TI 0 to 70 UCC5617DWP UCC5617DWPTRG4 LIFEBUY SOIC DW 28 TBD Call TI Call TI 0 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 17-May-2014 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

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