Product Sample & Technical Tools & Support & Folder Buy Documents Software Community UCC2808-1,UCC2808-2,UCC3808-1,UCC3808-2 SLUS168E–APR1999–REVISEDAUGUST2015 UCCx808-x Low Power Current Mode Push-Pull PWM 1 Features 3 Description • DualOutputDriveStagesinPush-Pull The UCCx808-x is a family of BiCMOS push-pull, 1 high-speed, low-power, pulse-width modulators. The Configuration UCCx808containsallofthecontrolanddrivecircuitry • 130-μATypicalStartingCurrent required for offline or DC-to-DC fixed frequency • 1-mATypicalRunCurrent current-mode switching power supplies with minimal • Operationto1-MHz externalpartscount. • InternalSoft-Start The UCCx808-x dual output drive stages are arranged in a push-pull configuration. Both outputs • On-ChipErrorAmplifierWith2-MHzGain switch at half the oscillator frequency using a toggle BandwidthProduct flip-flop. The dead time between the two outputs is • On-ChipVDDClamping typically 60 ns to 200 ns depending on the values of • OutputDriveStagesCapableOf500-mAPeak the timing capacitor and resistors, thus limiting each SourceCurrent,1-APeakSinkCurrent outputstagedutycycletolessthan50%. 2 Applications DeviceInformation(1) PARTNUMBER PACKAGE BODYSIZE(NOM) • ServerandDesktopPowerSupplies UCC2808-1 SOIC(8) 4.90mm×3.91mm • TelecomPowerSupplies UCC2808-2 • DC-DCConverters UCC3808-1 PDIP(8) 9.81mm×6.35mm UCC3808-2 • Switched-ModePowerSupplies (1) For all available packages, see the orderable addendum at theendofthedatasheet. SimplifiedSchematic E8R:228 32CTQ030 5VV5O0W + NP2 NS1 EF25 7µH 680µF 0.01µF – + LOOPB 36VVTION72V 4700µF 0.47µF 2B8–Y2V00 62Ω 62Ω 2B8–Y2V00 NP1 NS2 200(cid:3)Ω 1000pF 1000pF LOOPA – 51 kΩ COMP 1/4 W 19.1 kΩ IRF640 IRF640 12 4700pF 20 kΩ 10Ω 470pF 2.2Ω DF02SGICT 2.2Ω 1mH 3 1TL431 0.1µF 2 10µF 0.1µF 19.1 kΩ 2 kΩ 0.2Ω 20 kΩ VDD OUTA OUTB GND 330pF 8 7 6 5 PRIMARY GROUND UCC3808D-1 1 2 3 4 240Ω COMP FB CS RC RC 4.99 kΩ CURRENT 2.80 kΩ 86.6 kΩ SENSE 4.99 kΩ H11A1 2N2907 4 U3 3 20 kΩ 5 2 330pF 432Ω 0.1µF 6 1 0.01µF 1kV 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

UCC2808-1,UCC2808-2,UCC3808-1,UCC3808-2 SLUS168E–APR1999–REVISEDAUGUST2015 www.ti.com Table of Contents 1 Features.................................................................. 1 8 ApplicationandImplementation........................ 10 2 Applications........................................................... 1 8.1 ApplicationInformation............................................10 3 Description............................................................. 1 8.2 TypicalApplication .................................................10 4 RevisionHistory..................................................... 2 9 PowerSupplyRecommendations...................... 11 5 PinConfigurationandFunctions......................... 3 10 Layout................................................................... 12 6 Specifications......................................................... 4 10.1 LayoutGuidelines.................................................12 6.1 AbsoluteMaximumRatings......................................4 10.2 LayoutExample....................................................12 6.2 ESDRatings..............................................................4 11 DeviceandDocumentationSupport................. 13 6.3 RecommendedOperatingConditions.......................4 11.1 RelatedLinks........................................................13 6.4 ElectricalCharacteristics...........................................4 11.2 DocumentationSupport .......................................13 6.5 TypicalCharacteristics..............................................6 11.3 CommunityResources..........................................13 7 DetailedDescription.............................................. 7 11.4 Trademarks...........................................................13 7.1 Overview...................................................................7 11.5 ElectrostaticDischargeCaution............................13 7.2 FunctionalBlockDiagram.........................................7 11.6 Glossary................................................................13 7.3 FeatureDescription...................................................8 12 Mechanical,Packaging,andOrderable Information........................................................... 13 7.4 DeviceFunctionalModes..........................................9 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionD(August2002)toRevisionE Page • RemovedreferencestotheTSSOPpackaging .................................................................................................................... 1 • AddedESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection. ................................................................................................ 1 2 SubmitDocumentationFeedback Copyright©1999–2015,TexasInstrumentsIncorporated ProductFolderLinks:UCC2808-1 UCC2808-2 UCC3808-1 UCC3808-2

UCC2808-1,UCC2808-2,UCC3808-1,UCC3808-2 www.ti.com SLUS168E–APR1999–REVISEDAUGUST2015 5 Pin Configuration and Functions DPackage 8-PinSOIC TopView COMP 1 8 VDD FB 2 7 OUTA CS 3 6 OUTB RC 4 5 GND PPackage 8-PinPDIP TopView OUTA 1 8 OUTB VDD 2 7 GND COMP 3 6 RC FB 4 5 CS PinFunctions PIN I/O DESCRIPTION NAME NO. COMP 1 I/O OutputoftheerroramplifierandtheinputofthePWMcomparator. CS 3 I InputtothePWM,peakcurrent,andovercurrentcomparators. FB 2 I Invertinginputtotheerroramplifier. GND 5 — Referencegroundandpowergroundforallfunctions. OUTA 7 O Alternatinghighcurrentoutputstage. OUTB 6 O Alternatinghighcurrentoutputstage. RC 4 I Oscillatorprogrammingpin. VDD 8 — Powerinputconnectionforthisdevice. Copyright©1999–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:UCC2808-1 UCC2808-2 UCC3808-1 UCC3808-2

UCC2808-1,UCC2808-2,UCC3808-1,UCC3808-2 SLUS168E–APR1999–REVISEDAUGUST2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT Supplyvoltage(IDD≤10mA) 15 V Supplycurrent 20 mA OUTA/OUTBsourcecurrent(peak)(2) –0.5 A OUTA/OUTBsinkcurrent(peak)(2) 1.0 A Analoginputs(FB,CS)–0.3VtoVDD+0.3V 6 V PowerdissipationatT =25°C(NPackage) 1 W A PowerdissipationatTA=25°C(DPackage) 650 mW PowerdissipationatTA=25°C(PWPackage) 400 mW T Junctiontemperature –55 150 °C J Leadtemperature(soldering,10sec.) 300 °C T Storagetemperature –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Currentsarepositiveinto,negativeoutofthespecifiedterminal.ConsultPackagingSectionofthePowerSupplyControlDataBook (SLUD003)forthermallimitationsandconsiderationsofpackages. 6.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±2500 V(ESD) Electrostaticdischarge Charged-devicemodel(CDM),perJEDECspecificationJESD22- V C101(2) ±1500 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT UCCx808-1 13 14 V SupplyVoltage V DD UCCx808-2 5 14 UCC2808-x –40 85 T JunctionTemperature °C J UCC3808-x 0 70 6.4 Electrical Characteristics T =0°Cto70°CfortheUCC3808-x,–40°Cto85°CfortheUCC2808-xand–55°Cto125°CfortheUCC1808-x,VDD=10 A V(1),1-μFcapacitorfromVDDtoGND,R=22kΩ,C=330pF,T =T ,(unlessotherwisespecified) A J PARAMETER TESTCONDITIONS MIN TYP MAX UNIT OSCILLATORSECTION Oscillatorfrequency 175 194 213 kHz Oscillatoramplitude/VDD(2) 0.44 0.5 0.56 V/V ERRORAMPLIFIERSECTION Inputvoltage COMP=2V 1.95 2 2.05 V Inputbiascurrent –1 1 μA Open-loopvoltagegain 60 80 dB COMPsinkcurrent FB=2.2V,COMP=1V 0.3 2.5 mA (1) Doesnotincludecurrentintheexternaloscillatornetwork. (2) MeasuredatRC.SignalamplitudetracksVDD. 4 SubmitDocumentationFeedback Copyright©1999–2015,TexasInstrumentsIncorporated ProductFolderLinks:UCC2808-1 UCC2808-2 UCC3808-1 UCC3808-2

UCC2808-1,UCC2808-2,UCC3808-1,UCC3808-2 www.ti.com SLUS168E–APR1999–REVISEDAUGUST2015 Electrical Characteristics (continued) T =0°Cto70°CfortheUCC3808-x,–40°Cto85°CfortheUCC2808-xand–55°Cto125°CfortheUCC1808-x,VDD=10 A V(1),1-μFcapacitorfromVDDtoGND,R=22kΩ,C=330pF,T =T ,(unlessotherwisespecified) A J PARAMETER TESTCONDITIONS MIN TYP MAX UNIT COMPsourcecurrent FB=1.3V,COMP=3.5V –0.25 –0.5 mA PWMSECTION Maximumdutycycle MeasuredatOUTAorOUTB 48% 49% 50% Minimumdutycycle COMP=0V 0% CURRENTSENSESECTION Gain(3) 1.9 2.2 2.5 V/V Maximuminputsignal COMP=5V (4) 0.45 0.5 0.55 V COMP=3.5V,CSfrom0to600 CStooutputdelay 100 200 ns mV CSsourcecurrent –200 nA Overcurrentthreshold 0.7 0.75 0.8 V COMPtoCSoffset CS=0V 0.35 0.8 1.2 V OUTPUTSECTION OUTlowlevel I=100mA 0.5 1 V OUThighlevel I=–50mA,VDD–OUT 0.5 1 V Risetime C =1nF 25 60 ns L Falltime C =1nF 25 60 ns L UNDERVOLTAGELOCKOUTSECTION UCCx808-1 (1) 11.5 12.5 13.5 Startthreshold V UCCx808-2 4.1 4.3 4.5 Minimumoperatingvoltageafter UCCx808-1 7.6 8.3 9 V start UCCx808-2 3.9 4.1 4.3 UCCx808-1 3.5 4.2 5.1 Hysteresis V UCCx808-2 0.1 0.2 0.3 SOFT-STARTSECTION COMPrisetime FB=1.8V,risefrom0.5Vto4V 3.5 20 ms OVERALLSECTION Start-upcurrent VDD<startthreshold 130 260 µA Operatingsupplycurrent FB=0V,CS=0V (5) (1) 1 2 mA VDDzenershuntvoltage IDD=10mA (6) 13 14 15 V DV A = COMP,0£V £0.4V DV CS (3) Gainisdefinedby: CS 0vV v0.4V CS (4) ParametermeasuredattrippointoflatchwithFBat0V. (5) ForUCCx808–1,setVDDabovethestartthresholdbeforesettingat10V (6) StartthresholdandZenershuntthresholdtrackoneanother. Copyright©1999–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:UCC2808-1 UCC2808-2 UCC3808-1 UCC3808-2

UCC2808-1,UCC2808-2,UCC3808-1,UCC3808-2 SLUS168E–APR1999–REVISEDAUGUST2015 www.ti.com 6.5 Typical Characteristics 1000 14 VDD=10V,T=25°C 12 CT=330pF CT=100pF 10 IDD With 1 nF kHz100 A Load – CT=220pF m 8 ncy D– e D qu I 6 e Fr 10 CT=1000pF 4 CT=820pF IDDWithout CT=560pF Load 2 0 0 0 50 100 150 200 250 0 200 400 600 800 1000 1200 RT–TimingResistor–kΩ OscillatorFrequency–kHz Figure1.FrequencyvsTimingResistor Figure2.IDDvsOscillatorFrequency 1.2 1.0 V – 0.8 et s Off S 0.6 C – P M 0.4 O C 0.2 0 –55 –35 –15 5 25 45 65 85 105 125 Temperature–°C Figure3.CSOffsetvsTemperature 6 SubmitDocumentationFeedback Copyright©1999–2015,TexasInstrumentsIncorporated ProductFolderLinks:UCC2808-1 UCC2808-2 UCC3808-1 UCC3808-2

UCC2808-1,UCC2808-2,UCC3808-1,UCC3808-2 www.ti.com SLUS168E–APR1999–REVISEDAUGUST2015 7 Detailed Description 7.1 Overview The UCCx808-x device is a highly-integrated, low power current mode push-pull PWM controller. The controller employs low starting current, and employs an internal control algorithm that offers accurate static output voltage regulation against line and load. The UCCx808-x family offers a variety of package temperature range options, and choice of undervoltage lockout levels. The family has UVLO thresholds and hysteresis options for offline and battery-poweredsystem. Table1.UndervoltageLockoutLevels PARTNUMBER TURNONTHRESHOLD TURNOFFTHRESHOLD UCCx808-1 12.5V 8.3V UCCx808-2 4.3V 4.1V Table2.UndervoltageLockoutOptions PACKAGEDDEVICES T =T A J UVLOOPTION SOIC(D) PDIP(N) 12.5V/8.3V UCC2808D-1 UCC2808N-1 –40°Cto85°C 4.3V/4.1V UCC2808D-2 UCC2808N-2 12.5V/8.3V UCC3808D-1 UCC3808N-1 0°Cto70°C 4.3V/4.1V UCC3808D-2 UCC3808N-2 7.2 Functional Block Diagram FB COMP CS 2 1 3 8 VDD OVERCURRENT 22kΩ PEAKCURRENT COMPARATOR COMPARATOR 14 V 0.75V 2.0 V 0.5 V 2.2 V 7 OUTA VDD OK OSCILLATOR S Q PWM R LATCH 1.2R S Q VDD–1V S T Q Q Q R R PWM COMPARATOR 0.5 V VDD R SOFTSTART 6 OUTB VOLTAGE REFERENCE SLOPE=1V/ms 5 GND 4 RC PinoutshownisforSOICandPDIPpackages. Figure4. FunctionalBlockDiagram Copyright©1999–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:UCC2808-1 UCC2808-2 UCC3808-1 UCC3808-2

UCC2808-1,UCC2808-2,UCC3808-1,UCC3808-2 SLUS168E–APR1999–REVISEDAUGUST2015 www.ti.com Functional Block Diagram (continued) TheoscillatorgeneratesasawtoothwaveformonRC.DuringtheRCrisetime,theoutputstagesalternateontime, butbothstagesareoffduringtheRCfalltime.Theoutputstagesswitchat½theoscillatorfrequency,with guaranteeddutycycleof<50%forbothoutputs. Figure5. BlockDiagramforOscillator 7.3 Feature Description 7.3.1 PinDescriptions COMP:COMPistheoutputoftheerroramplifierandtheinputofthePWMcomparator.Theerroramplifierinthe UCC3808 is a true low-output impedance, 2-MHz operational amplifier. As such, the COMP pin can both source and sink current. However, the error amplifier is internally current limited, so that zero duty cycle can be externallyforcedbypullingCOMPtoGND. The UCC3808 family features built-in full cycle soft-start. Soft-start is implemented as a clamp on the maximum COMPvoltage. CS: The input to the PWM, peak current, and overcurrent comparators. The overcurrent comparator is only intendedforfaultsensing.Exceedingtheovercurrentthresholdwillcauseasoft-startcycle. FB: The inverting input to the error amplifier. For best stability, keep FB lead length as short as possible and FB straycapacitanceassmallaspossible. GND: Reference ground and power ground for all functions. Due to high currents, and high frequency operation oftheUCC3808,alowimpedancecircuitboardgroundplaneishighlyrecommended. OUTA and OUTB: Alternating high current output stages. Both stages are capable of driving the gate of a power MOSFET.Eachstageiscapableof500-mApeaksourcecurrent,and1-Apeaksinkcurrent. The output stages switch at half the oscillator frequency, in a push/pull configuration. When the voltage on the RC pin is rising, one of the two outputs is high, but during fall time, both outputs are off. This dead time between the two outputs, along with a slower output rise time than fall time, insures that the two outputs can not be on at the same time. This dead time is typically 60 ns to 200 ns and depends upon the values of the timing capacitor andresistor. The high-current output drivers consist of MOSFET output devices, which switch from VDD to GND. Each output stagealsoprovidesaverylowimpedancetoovershootandundershoot.Thismeansthatinmanycases,external schottkyclampdiodesarenotrequired. RC: The oscillator programming pin. The oscillator of the UCC3808-x tracks VDD and GND internally, so that variationsinpowersupplyrailsminimallyaffectfrequencystability.Figure5 showstheoscillatorblockdiagram. Only two components are required to program the oscillator: a resistor (tied to the VDD and RC), and a capacitor (tiedtotheRCandGND).Theapproximateoscillatorfrequencyisdeterminedbythesimpleformula: 8 SubmitDocumentationFeedback Copyright©1999–2015,TexasInstrumentsIncorporated ProductFolderLinks:UCC2808-1 UCC2808-2 UCC3808-1 UCC3808-2

UCC2808-1,UCC2808-2,UCC3808-1,UCC3808-2 www.ti.com SLUS168E–APR1999–REVISEDAUGUST2015 Feature Description (continued) 1.41 f = OSCILLATOR RC where • frequencyisinhertz,resistanceinohms,andcapacitanceinfarads. (1) The recommended range of timing resistors is between 10 kΩ and 200 kΩ and range of timing capacitors is between100pFand1000pF.Timingresistorslessthan10kΩ mustbeavoided. For best performance, keep the timing capacitor lead to GND as short as possible, the timing resistor lead from VDD as short as possible, and the leads between timing components and RC as short as possible. Separate groundandVDDtracestotheexternaltimingnetworkareencouraged. VDD: The power input connection for this device. Although quiescent VDD current is very low, total supply current will be higher, depending on OUTA and OUTB current, and the programmed oscillator frequency. Total VDD current is the sum of quiescent VDD current and the average OUT current. Knowing the operating frequencyandtheMOSFETgatecharge(Qg),averageOUTcurrentcanbecalculatedfrom: I =Q F OUT g where • FisfrequencyTopreventnoiseproblems,bypassVDDtoGNDwithaceramiccapacitorasclosetothechip aspossiblealongwithanelectrolyticcapacitor. (2) A1-μFdecouplingcapacitorisrecommended. 7.4 Device Functional Modes 7.4.1 VCC When VCC becomes above 12.5 V (for UCCx808-1) or 4.3 V (for UCCx808-2), the device is enable, and after all fault conditions are cleared, the gate driver starts with soft-start. When VCC drops below 8.3 V (for UCCx808-1) or 4.1 V (for UCCx808-2), the device enters the UVLO protection mode and both gate drivers are actively pulled low. Copyright©1999–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:UCC2808-1 UCC2808-2 UCC3808-1 UCC3808-2

UCC2808-1,UCC2808-2,UCC3808-1,UCC3808-2 SLUS168E–APR1999–REVISEDAUGUST2015 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 8.1 Application Information The UCCx808-x PWM controller contains all of the features needed to implement push-pull topology, using current-mode control in a small 8-pin package. The UCCx808-x is designed for current-mode control push-pull topology.UCCx808-xemploysadvantagesofcurrent-modecontrol,peakcurrentsense,overcurrentprotection. 8.2 Typical Application A200-kHzpush-pullapplicationcircuitwithafullwaverectifierisshowninFigure6. E8R:228 32CTQ030 5VV5O0W + NP2 NS1 EF25 7µH 680µF 0.01µF – + LOOPB 36VVTION72V 4700µF 0.47µF 2B8–Y2V00 62Ω 62Ω 2B8–Y2V00 NP1 NS2 200(cid:3)Ω 1000pF 1000pF LOOPA – 51 kΩ COMP 1/4 W 19.1 kΩ IRF640 IRF640 12 4700pF 20 kΩ 10Ω 470pF 2.2Ω DF02SGICT 2.2Ω 1mH 3 1TL431 0.1µF 2 10µF 0.1µF 19.1 kΩ 2 kΩ 0.2Ω 20 kΩ VDD OUTA OUTB GND 330pF 8 7 6 5 PRIMARY GROUND UCC3808D-1 1 2 3 4 240Ω COMP FB CS RC RC 4.99 kΩ CURRENT 2.80 kΩ 86.6 kΩ SENSE 4.99 kΩ H11A1 2N2907 4 U3 3 20 kΩ 5 2 330pF 432Ω 0.1µF 6 1 0.01µF 1kV Figure6. TypicalApplicationDiagram:48-VIn,5-V,50-WOutput 8.2.1 DesignRequirements Table3liststhedesignparametersoftheUCC3808-x. Table3.DesignParameters DESIGNPARAMETER TARGETVALUE Outputvoltage 5V Ratedoutputpower 50W InputDCvoltagerange 36Vto72V Switchingfrequency 210kHz 10 SubmitDocumentationFeedback Copyright©1999–2015,TexasInstrumentsIncorporated ProductFolderLinks:UCC2808-1 UCC2808-2 UCC3808-1 UCC3808-2

UCC2808-1,UCC2808-2,UCC3808-1,UCC3808-2 www.ti.com SLUS168E–APR1999–REVISEDAUGUST2015 8.2.2 DetailedDesignProcedure The output, VO, provides 5 V at 75 W maximum and is electrically isolated from the input. Since the UCC3808 is a peak current mode controller the 2N2222A emitter following amplifier (buffers the CT waveform) provides slope compensation which is necessary for duty ratios greater than 50%. Capacitor decoupling is very important with a single ground IC controller, and a 1 μF is suggested as close to the IC as possible. The controller supply is a seriesRCforstart-up,paralleledwithabiaswindingontheoutputinductorusedinsteadystateoperation. Isolation is provided by an optocoupler with regulation done on the secondary side using the UC3965 Precision Reference with Low Offset Error Amplifier. Small signal compensation with tight voltage regulation is achieved using this part on the secondary side. Many choices exist for the output inductor depending on cost, volume, and mechanical strength. Several design options are iron powder, molypermalloy (MPP), or a ferrite core with an air gap as shown here. The main power transformer is a low profile design, EFD size 25, using Magnetics Inc. P materialwhichisagoodchoiceatthisfrequencyandtemperature.Theinputvoltagemayrangefrom36VDCto 72VDC. 8.2.3 ApplicationCurves 90 180 120 80 160 CT=1000pF 100 70 140 CT=820pF s e e 80 GaindB456000 Phase 81100200 Margin-Degr adTi–nsme 60 CT=560pF e e D 30 60 Phas 40 CT=100pF CT=220pF CT=330pF 20 40 20 10 Gain 20 0 0 0 1 100 10000 1000000 0 20 40 60 80 100 Frequency–Hz RT–TimingResistor–kΩ Figure7.ErrorAmplifierGainandPhaseResponsevs Figure8.DeadTimevsTimingResistor Frequency 9 Power Supply Recommendations The VDD power terminal for the device requires the placement of electrolytic capacitor as energy storage capacitor, because of UCCx808-x is controller with 1-A driver capability. And requires the placement of low-ESR noise-decoupling capacitance as directly as possible from the VDD terminal to the GND terminal, ceramic capacitors with stable dielectric characteristics over temperature are recommended, such as X7R or better. The recommendedelectrolyticcapacitorisa10-µFor25-Vcapacitor. Therecommendeddecouplingcapacitorsarea0.1-µF0603-sized25-VX7Rcapacitor. Copyright©1999–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:UCC2808-1 UCC2808-2 UCC3808-1 UCC3808-2

UCC2808-1,UCC2808-2,UCC3808-1,UCC3808-2 SLUS168E–APR1999–REVISEDAUGUST2015 www.ti.com 10 Layout 10.1 Layout Guidelines 1. Locate the VDD capacitor as close as possible between the VDD terminal and GND of the UCCx808-x, trackeddirectlytobothterminals. 2. A small, external filter capacitor is recommended on the CS terminal. Track the filter capacitor as directly as possiblefromtheCStoGNDterminal. 3. The tracking and layout of the FB terminal and connecting components is critical to minimizing noise pick-up and interference in the magnetic sensing block. Reduce the total surface area of trances on the FB net to a minimum. 4. The OUTA/OUTB terminal has high internal sink/source current capability. An external gate resistor is recommended. The value depends on the choice of power MOSFET, efficiency and EMI considerations. A pulldown resistor on the gate of the external MOSFET is recommended to prevent the MOSFET gate from floatingonifthereisanopen-circuiterrorinthegatedrivepath. 10.2 Layout Example SOIC-8 PDIP-8 TOP VIEW 1 COMP VDD 8 2 FB OUTA 7 OUTB 3 CS 6 4 RC GND 5 Figure9. LayoutExample 12 SubmitDocumentationFeedback Copyright©1999–2015,TexasInstrumentsIncorporated ProductFolderLinks:UCC2808-1 UCC2808-2 UCC3808-1 UCC3808-2

UCC2808-1,UCC2808-2,UCC3808-1,UCC3808-2 www.ti.com SLUS168E–APR1999–REVISEDAUGUST2015 11 Device and Documentation Support 11.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table4.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY UCC2808-1 Clickhere Clickhere Clickhere Clickhere Clickhere UCC2808-2 Clickhere Clickhere Clickhere Clickhere Clickhere UCC3808-1 Clickhere Clickhere Clickhere Clickhere Clickhere UCC3808-2 Clickhere Clickhere Clickhere Clickhere Clickhere 11.2 Documentation Support 11.2.1 RelatedDocumentation Forrelateddocumentation,seethefollowing: PowerSupplyControlDataBook(SLUD003) 11.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 11.4 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 11.5 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 11.6 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©1999–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:UCC2808-1 UCC2808-2 UCC3808-1 UCC3808-2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) UCC2808D-1 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2808-1 & no Sb/Br) UCC2808D-1G4 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2808-1 & no Sb/Br) UCC2808D-2 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2808-2 & no Sb/Br) UCC2808D-2G4 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2808-2 & no Sb/Br) UCC2808DTR-1 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2808-1 & no Sb/Br) UCC2808DTR-2 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2808-2 & no Sb/Br) UCC2808DTR-2G4 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2808-2 & no Sb/Br) UCC2808N-1 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 UCC2808N-1 & no Sb/Br) UCC2808N-2 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 UCC2808N-2 & no Sb/Br) UCC3808D-1 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 3808-1 & no Sb/Br) UCC3808D-2 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 3808-2 & no Sb/Br) UCC3808DTR-1 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 (3808-1, UCC3808) & no Sb/Br) D-1 UCC3808DTR-2 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 3808-2 & no Sb/Br) UCC3808DTR-2G4 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 3808-2 & no Sb/Br) UCC3808N-1 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 UCC3808N-1 & no Sb/Br) UCC3808N-2 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 UCC3808N-2 & no Sb/Br) UCC3808N-2G4 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 UCC3808N-2 & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 14-Apr-2015 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) UCC2808DTR-1 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2808DTR-2 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC3808DTR-1 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC3808DTR-2 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 14-Apr-2015 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) UCC2808DTR-1 SOIC D 8 2500 340.5 338.1 20.6 UCC2808DTR-2 SOIC D 8 2500 340.5 338.1 20.6 UCC3808DTR-1 SOIC D 8 2500 340.5 338.1 20.6 UCC3808DTR-2 SOIC D 8 2500 340.5 338.1 20.6 PackMaterials-Page2

PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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