(cid:1)(cid:2)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6) (cid:1)(cid:2)(cid:2)(cid:7)(cid:4)(cid:5)(cid:6) SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007 (cid:8)(cid:9)(cid:2)(cid:10)(cid:11)(cid:12)(cid:10)(cid:11)(cid:2)(cid:13)(cid:14)(cid:14)(cid:11)(cid:10) (cid:14)(cid:1)(cid:12)(cid:13)(cid:10)(cid:15)(cid:9)(cid:14)(cid:11)(cid:10) (cid:16)(cid:9)(cid:17)(cid:18) (cid:16)(cid:19)(cid:17)(cid:2)(cid:18)(cid:20)(cid:11)(cid:21) (cid:17)(cid:9)(cid:8)(cid:13)(cid:10) FEATURES (cid:1) Fully Programmable Reset Threshold The UCCx946 is also resistant to glitches on the (cid:1) Fully Programmable Reset Period VDD line. Once RES has been deasserted, any (cid:1) Fully Programmable Watchdog Period drops below the threshold voltage need to be of (cid:1) certain time duration and voltage magnitude to 2% Accurate Reset Threshold (cid:1) generate a reset signal. These values are shown Input Voltage Down to 2 V in Figure 1. An I/O line of the microprocessor may (cid:1) Input 18-µA Maximum Input Current be tied to the watchdog input (WDI) for watchdog (cid:1) Reset Valid Down to 1 V functions. If the I/O line is not toggled within a set watchdog period, programmable by the user, DESCRIPTION WDO is asserted. The watchdog function is disabled during reset conditions. The UCCx946 is designed to provide accurate The UCCx946 is available in 8-pin SOIC(D), 8-pin microprocessor supervision, including reset and PDIP (N) and 8-pin TSSOP(PW) packages to watchdog functions. During power up, the device optimize board space. asserts a reset signal RES with VDD as low as 1 V. The reset signal remains asserted until the VDD voltage rises and remains above the reset threshold for the reset period. Both reset threshold and reset period are programmable by the user. VDD 8 POWER TO 400 nA CIRCUITRY RP 4 + S Q 3 RES POWER ON RESET + 1.235 V R Q Q S + Q R RTH 2 400 nA 8−BIT COUNTER WP 6 + A3 S Q + A2 5 WDO 100 mV CLR A1 R Q + A0 WATCHDOG 1.235 V + CLK TIMING EDGE DETECT WDI 7 1 GND UDG−02192 (cid:12)(cid:10)(cid:11)(cid:20)(cid:1)(cid:2)(cid:17)(cid:9)(cid:11)(cid:22) (cid:20)(cid:19)(cid:17)(cid:19) (cid:23)(cid:24)(cid:25)(cid:26)(cid:27)(cid:28)(cid:29)(cid:30)(cid:23)(cid:26)(cid:24) (cid:23)(cid:31) !"(cid:27)(cid:27)#(cid:24)(cid:30) (cid:29)(cid:31) (cid:26)(cid:25) $"%&(cid:23)!(cid:29)(cid:30)(cid:23)(cid:26)(cid:24) ’(cid:29)(cid:30)#( Copyright  2007, Texas Instruments Incorporated (cid:12)(cid:27)(cid:26)’"!(cid:30)(cid:31) !(cid:26)(cid:24)(cid:25)(cid:26)(cid:27)(cid:28) (cid:30)(cid:26) (cid:31)$#!(cid:23)(cid:25)(cid:23)!(cid:29)(cid:30)(cid:23)(cid:26)(cid:24)(cid:31) $#(cid:27) (cid:30))# (cid:30)#(cid:27)(cid:28)(cid:31) (cid:26)(cid:25) (cid:17)#*(cid:29)(cid:31) (cid:9)(cid:24)(cid:31)(cid:30)(cid:27)"(cid:28)#(cid:24)(cid:30)(cid:31) (cid:31)(cid:30)(cid:29)(cid:24)’(cid:29)(cid:27)’ +(cid:29)(cid:27)(cid:27)(cid:29)(cid:24)(cid:30),( (cid:12)(cid:27)(cid:26)’"!(cid:30)(cid:23)(cid:26)(cid:24) $(cid:27)(cid:26)!#(cid:31)(cid:31)(cid:23)(cid:24)- ’(cid:26)#(cid:31) (cid:24)(cid:26)(cid:30) (cid:24)#!#(cid:31)(cid:31)(cid:29)(cid:27)(cid:23)&, (cid:23)(cid:24)!&"’# (cid:30)#(cid:31)(cid:30)(cid:23)(cid:24)- (cid:26)(cid:25) (cid:29)&& $(cid:29)(cid:27)(cid:29)(cid:28)#(cid:30)#(cid:27)(cid:31)( www.ti.com 1

(cid:1)(cid:2)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6) (cid:1)(cid:2)(cid:2)(cid:7)(cid:4)(cid:5)(cid:6) SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007 ORDERING INFORMATION PACKAGED DEVICES(3) TTAA (D) (N) (PW) −40°C to 95°C UCC2946D UCC2946N UCC2946PW 0°C to 70°C UCC3946D UCC3946N UCC3946PW (1)The D and PW packages are also available taped and reeled. Add an R suffix to the device type (i.e., UCC2946DR) for quantities of 3,000 devices per reel. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) UCC2946 UNIT UCC3946 Input voltage range, VIN 10 V Junction temperature range, TJ −55 to 150 Storage temperature, Tstg −65 to 150 °CC Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 (1)Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Voltages are with respect to GND. Currents are positive into, and negative out of the specified terminal. D PACKAGE (TOP VIEW) GND 1 8 VDD RTH 2 7 WDI RES 3 6 WP RP 4 5 WDO TERMINAL FUNCTIONS TERMINAL II//OO DDEESSCCRRIIPPTTIIOONN NAME NO. GND 1 − Ground reference for the device This pin is high only if the voltage on the RTH has risen above 1.235 V. Once RTH rises above the threshold, this RES 3 O pin remains low for the reset period. This pin asserts low and remains low if the RTH voltage dips below 1.235 V for an amount of time determined by Figure 1. This input compares its voltage to an internal 1.25-V reference. By using external resistors, a user can program any RTH 2 I desired reset threshold. RP 4 I This pin allows the user to program the reset period by adjusting an external capacitor. VDD 8 I Supply voltage for the device. This pin is the input to the watchdog timer. If this pin is not toggled or strobed within the watchdog period, WDO is WDI 7 I asserted. This pin is the watchdog output. This pin is asserted low if the WDI pin is not strobed or toggled within the watchdog WDO 5 O period. WP 6 I This pin allows the user to program the watchdog period by adjusting an external capacitor. 2 www.ti.com

(cid:1)(cid:2)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6) (cid:1)(cid:2)(cid:2)(cid:7)(cid:4)(cid:5)(cid:6) SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007 ELECTRICAL CHARACTERISTICS TA = 0°C to 70°C and 2.0 V ≤ VDD ≤ 5.5 V for the UCC3946, TA = −40°C to 95°C and 2.1 V ≤ VDD ≤ 5.5 V for the UCC2946, (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT REFERENCE UCC2946 2.1 5.5 VVDDDD OOppeerraattiinngg vvoollttaaggee VV UCC3946 2.0 5.5 UCC2946 12 18 IIDDDD SSuuppppllyy ccuurrrreenntt µAA UCC3946 10 18 UCC2946 1.1 VVDDDD((mmiinn)) MMiinniimmuumm ooppeerraattiinngg vvoollttaaggee((11)) VV UCC3946 1.0 RESET SECTION UCC2946 1.170 1.235 1.260 RReesseett tthhrreesshhoolldd vvoollttaaggee VVDDDD rriissiinngg VV UCC3946 1.190 1.235 1.260 Threshold hysteresis 15 mV ILEAK Input leakage current 5 nA VOH High-level output voltage ISOURCE = 2 mA VDD−0.3 ISINK = 2 mA 0.1 VV VVOOLL UCC2946 0.4 LLooww--lleevveell oouuttppuutt vvoollttaaggee IISSIINNKK == 2200 µAA,, VVDDDD == 11 VV UCC3946 0.2 VDD-to-output delay time VDD = −1 mV/µs 120 µs UCC2946 140 200 320 RReesseett ppeerriioodd CCRRPP == 6644 nnFF mmss UCC3946 160 200 260 WATCHDOG SECTION VIH High-level input voltage, WDI 0.7×VDD VV VIL Low-level input voltage, WDI 0.3×VDD UCC2946 0.96 1.60 2.56 WWaattcchhddoogg ppeerriioodd CCRRPP == 6644 nnFF ss UCC3946 1.12 1.60 2.08 Watchdog pulse width 50 ns VOH High-level output voltage ISOURCE = 2 mA VDD−0.3 VV VOL Low-level output voltage ISINK = 2 mA 0.1 (1) Minimum supply voltage where RES is considered valid. www.ti.com 3

(cid:1)(cid:2)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6) (cid:1)(cid:2)(cid:2)(cid:7)(cid:4)(cid:5)(cid:6) SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007 APPLICATION INFORMATION The UCCx946 supervisory circuit provides accurate reset and watchdog functions for a variety of microprocessor applications. The reset circuit prevents the microprocessor from executing code during undervoltage conditions, typically during power-up and power-down. In order to prevent erratic operation in the presence of noise, voltage glitches where voltage amplitude and time duration are less than the values specified in Figure 1 are ignored. OVERDRIVE VOLTAGE WITH RESPECT TO RESET THRESHOLD vs DELAY TO OUTPUT LOW ON R ESB 200 180 160 V m 140 − e g 120 a olt V 100 e v ri d 80 r e Ov RT Senses Glitch, − 60 RES Goes Low for Reset Period H T 40 Glitches V Ignored, RESB 20 Remains High 0 100 110 120 130 140 150 160 170 180 TDELAY − Delay Time − µs Figure 1. The watchdog circuit monitors the microprocessor’s activity, if the microprocessor does not toggle WDI during the programmable watchdog period WDO goes low, alerting the microprocessor’s interrupt of a fault. The WDO pin is typically connected to the non-maskable input of the microprocessor so that an error recovery routine can be executed. 4 www.ti.com

(cid:1)(cid:2)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6) (cid:1)(cid:2)(cid:2)(cid:7)(cid:4)(cid:5)(cid:6) SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007 APPLICATION INFORMATION PROGRAMMING THE RESET VOLTAGE AND RESET PERIOD The UCCx946 allows the reset trip voltage to be programmed with two external resistors. In most applications VDD is monitored by the reset circuit, however, the design allows voltages other than VDD to be monitored. Referring to Figure 2, the voltage below which reset is asserted is determined by: (cid:3) (cid:5) V (cid:1)1.235(cid:2) R1(cid:4)R2 RESET R2 (1) In order to keep quiescent currents low, resistor values in the megaohm range can be used for R1 and R2. A manual reset can be easily implemented by connecting a momentary push switch in parallel with R2. RES is ensured to be low with VDD voltages as low as 1 V. VDD 8 POWER TO CIRCUITRY RP 400 nA 4 + S Q 1.235 V − CRP + R Q RES RESET 3 + VDD − R1 RTH POWER uP 2 ON RESET Q S R2 I/O 8−BIT Q R COUNTER WP 400 nA 6 − A3 S Q WDO + + A2 5 R Q NMI CWP 100 mV CLR A1 A0 CLK + +− 1.235 V WATCHDOG TIMING WDI 7 EDGE DETECT GND 1 UDG−98002 Figure 2. Typical Application Diagram www.ti.com 5

(cid:1)(cid:2)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6) (cid:1)(cid:2)(cid:2)(cid:7)(cid:4)(cid:5)(cid:6) SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007 APPLICATION INFORMATION Once VDD rises above the programmed threshold, RES remains low for the reset period defined by: T (cid:1)3.125(cid:2)C RP RP (2) where T is time in milliseconds and C is capacitance in nanofarads. C is charged with a precision current RP RP RP source of 400 nA, a high-quality, low-leakage capacitor (such as an NPO ceramic) should be used to maintain timing tolerances. Figure 3 illustrates the voltage levels and timings associated with the reset circuit. UDG−97067 t1: VDD > 1 V, RES is ensured low. t2: VDD > programmed threshold, RES remains low for TRP. t3: TRP expires, RES pulls high. t4: Voltage glitch occurs, but is filtered at the RTH pin, RES remains high. t5: Voltage glitch occurs whose magnitude and duration is greater than the RTH filter, RES is asserted for TRP. t6: On completion of the TRP pulse the RTH voltage has returned and RES is pulled high. t7: VDD dips below threshold (minus hysteresis), RES is asserted. Figure 3. Reset Circuit Timings 6 www.ti.com

(cid:1)(cid:2)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6) (cid:1)(cid:2)(cid:2)(cid:7)(cid:4)(cid:5)(cid:6) SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007 APPLICATION INFORMATION PROGRAMMING THE WATCHDOG PERIOD The watchdog period is programmed with C as follows: WP T (cid:1)25(cid:2)C WP WP (3) where T is in milliseconds and C is in nanofarads. A high-quality, low-leakage capacitor should be used WP WP for C . The watchdog input WDI must be toggled with a high-to-low or low-to-high transition within the WP watchdog period to prevent WDO from assuming a logic level low. WDO maintains the low logic level until WDI is toggled or RES is asserted. If at any time RES is asserted, WDO assumes a high logic state and the watchdog period be reinitiated. Figure 4 illustrates the timings associated with the watchdog circuit. TRP VDD RESET 0V TWP VDD WDI 0V VDD WDO 0V t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 UDG−98007 t1: Microprocessor is reset. t2: WDI is toggled some time after reset, but before TWP expires. t3: WDI is toggled before TWP expires. t4: WDI is toggled before TWP expires. t5: WDI is not toggled before TWP expires and WDO asserts low, triggering the microprocessor to enter an error recovery routine. t6: The microprocessor’s error recovery routine is executed and WDI is toggled, reinitiating the watchdog timer. t7: WDI is toggled before TWP expires. t8: WDI is toggled before TWP expires. t9: RES is momentarily triggered, RES is asserted low for TRP. t10: Microprocessor is reset, RES pulls high. t11: WDI is toggled some time after reset, but before TWP expires. t12: WDI is toggled before TWP expires. t13: WDI is toggled before TWP expires. t14: VDD dips below the reset threshold, RES is asserted. Figure 4. Watchdog Circuit Timings www.ti.com 7

(cid:1)(cid:2)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6) (cid:1)(cid:2)(cid:2)(cid:7)(cid:4)(cid:5)(cid:6) SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007 APPLICATION INFORMATION CONNECTING WDO TO RES In order to provide design flexibility, the reset and watchdog circuits in the UCCx946 have separate outputs. Each output independently drives high or low, depending on circuit conditions explained previously. In some applications, it may be desirable for either the RES or WDO to reset the microprocessor. This can be done by connecting WDO to RES. If the pins try to drive to different output levels, the low output level dominates. Additional current flows from VDD to GND during these states. If the application cannot support additional current (during fault conditions), RES and WDO can be connected to the inputs of an OR gate whose output is connected to the microprocessor’s reset pin. LAYOUT CONSIDERATIONS A 0.1-µF capacitor connected from VDD to GND is recommended to decouple the UCCx946 from switching transients on the VDD supply rail. Since RP and WP are precision current sources, capacitors C and C should be connected to these pins RP WP with minimal trace length to reduce board capacitance. Care should be taken to route any traces with high voltage potential or high speed digital signals away from these capacitors. Resistors R1 and R2 generally have a high ohmic value, traces associated with these parts should be kept short in order to prevent any transient producing signals from coupling into the high impedance RTH pin. TYPICAL CHARACTERISTICS INPUT CURRENT THRESHOLD RESISTANCE vs vs INPUT VOLTAGE AMBIENT TEMPERATURE 12.0 1.26 VDD = 5 V 11.5 V 1.25 − e c an A 11.0 Resist 1.24 µent − hold 1.23 Curr 10.5 es ut r p h n − TH 1.22 − ID 10.0 T D R I V 9.5 1.21 9.0 1.20 2 3 4 5 6 −55 −35 −15 5 25 45 65 85 105 125 VDD − Input Voltage − V TA − Ambient Temperature − °C Figure 5. Figure 6. 8 www.ti.com

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) UCC2946D ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UCC2946 & no Sb/Br) UCC2946DG4 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UCC2946 & no Sb/Br) UCC2946DTR ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UCC2946 & no Sb/Br) UCC2946DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UCC2946 & no Sb/Br) UCC2946PW ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 2946 & no Sb/Br) UCC2946PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 2946 & no Sb/Br) UCC2946PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 2946 & no Sb/Br) UCC2946PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 2946 & no Sb/Br) UCC3946D ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3946 & no Sb/Br) UCC3946DTR ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3946 & no Sb/Br) UCC3946PW ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 3946 & no Sb/Br) UCC3946PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 3946 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF UCC2946 : •Automotive: UCC2946-Q1 NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 3-Aug-2017 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) UCC2946DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2946PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 UCC3946DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC3946PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 3-Aug-2017 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) UCC2946DTR SOIC D 8 2500 367.0 367.0 35.0 UCC2946PWTR TSSOP PW 8 2000 367.0 367.0 35.0 UCC3946DTR SOIC D 8 2500 367.0 367.0 35.0 UCC3946PWTR TSSOP PW 8 2000 367.0 367.0 35.0 PackMaterials-Page2

PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

PACKAGE OUTLINE PW0008A TSSOP - 1.2 mm max height SCALE 2.800 SMALL OUTLINE PACKAGE C 6.6 TYP SEATING PLANE 6.2 PIN 1 ID A 0.1 C AREA 6X 0.65 8 1 3.1 2X 2.9 NOTE 3 1.95 4 5 0.30 8X 0.19 4.5 1.2 MAX B 0.1 C A B 4.3 NOTE 4 (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15 0.75 0 - 8 0.05 0.50 DETAIL A TYPICAL 4221848/A 02/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) 8X (0.45) SYMM (R0.05) 1 TYP 8 SYMM 6X (0.65) 5 4 (5.8) LAND PATTERN EXAMPLE SCALE:10X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS NOT TO SCALE 4221848/A 02/2015 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) SYMM (R0.05) TYP 8X (0.45) 1 8 SYMM 6X (0.65) 5 4 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X 4221848/A 02/2015 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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