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UCC2808AD-1产品简介:

ICGOO电子元器件商城为您提供UCC2808AD-1由Texas Instruments设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 UCC2808AD-1价格参考¥3.29-¥3.29。Texas InstrumentsUCC2808AD-1封装/规格:PMIC - AC-DC 转换器,离线开关, Converter Offline Full-Bridge, Half-Bridge, Push-Pull Topology 1MHz 8-SOIC。您可以下载UCC2808AD-1参考资料、Datasheet数据手册功能说明书,资料中有UCC2808AD-1 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

集成电路 (IC)半导体

Cuk

描述

IC REG CTRLR ISO PWM CM 8-SOIC开关控制器 Low-Pwr Current-Mode Push-Pull PWM

产品分类

PMIC - 稳压器 - DC DC 切换控制器

品牌

Texas Instruments

产品手册

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产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

电源管理 IC,开关控制器 ,Texas Instruments UCC2808AD-1-

数据手册

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产品型号

UCC2808AD-1

PWM类型

电流模式

上升时间

25 ns

下降时间

25 ns

产品目录页面

点击此处下载产品Datasheet

产品种类

开关控制器

倍增器

其它名称

296-11395-5
UCC2808AD1

分频器

包装

管件

升压

单位重量

72.600 mg

占空比

50%

占空比-最大

50 %

反向

反激式

商标

Texas Instruments

安装风格

SMD/SMT

封装

Tube

封装/外壳

8-SOIC(0.154",3.90mm 宽)

封装/箱体

SOIC-8

工作温度

-40°C ~ 85°C

工厂包装数量

75

开关频率

1000 kHz

拓扑结构

Full-Bridge, Half-Bridge, Push-Pull

最大工作温度

+ 85 C

最小工作温度

- 40 C

标准包装

75

电压-电源

8.3 V ~ 15 V

类型

Current Mode PWM Controllers

系列

UCC2808A-1

输出数

2

输出电流

1000 mA

输出端数量

2 Output

降压

隔离式

频率-最大值

1MHz

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PDF Datasheet 数据手册内容提取

Product Order Technical Tools & Support & Reference Folder Now Documents Software Community Design UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 SLUS456F–APRIL1999–REVISEDJULY2018 UCCx808A Low-Power Current-Mode Push-Pull PWM 1 Features The UCCx808A dual-output drive stages are arranged in a push-pull configuration. Both outputs • Dual-OutputDriveStagesinPush-Pull 1 switch at half the oscillator frequency using a toggle Configuration flip-flop. The dead time between the two outputs is • Current-SenseDischargeTransistortoImprove typically 60 ns to 200 ns depending on the values of DynamicResponse the timing capacitor and resistors, thus limiting each outputstagedutycycletolessthan50%. • 130-μATypicalStartingCurrent • 1-mATypicalRunCurrent The UCCx808A family offers a variety of package options, temperature range options, and choice of • Operationto1MHz undervoltage lockout levels. The family has UVLO • InternalSoftStart thresholds and hysteresis options for off-line and • On-ChipErrorAmplifierWith2-MHzGain battery-poweredsystems. BandwidthProduct The UCCx808A is an enhanced version of the • On-ChipVDDClamping UCC3808 family. The significant difference is that the • OutputDriveStagesCapableof500-mAPeak- A versions feature an internal discharge transistor SourceCurrent,1-APeak-SinkCurrent from the CS pin to ground, which is activated each clock cycle during the oscillator dead time. The 2 Applications feature discharges any filter capacitance on the CS pin during each cycle and helps minimize filter • High-EfficiencySwitch-ModePowerSupplies capacitorvaluesandcurrentsensedelay. • TelecomDC-to-DCConverters DeviceInformation(1) • Point-of-LoadPowerModules PARTNUMBER PACKAGE BODYSIZE(NOM) • Low-CostPush-PullandHalf-BridgeApplications SOIC(8) 4.90mm×3.91mm UCC2808A-1, 3 Description UCC2808A-2, PDIP(8) 9.81mm×6.35mm UCC3808A-2 The UCCx808A devices are a family of BiCMOS TSSOP(8) 3.00mm×4.40mm push-pull, high-speed, low-power, pulse-width SOIC(8) 4.90mm×3.91mm UCC3808A-1 modulators.TheUCCx808Acontainsallofthecontrol PDIP(8) 9.81mm×6.35mm and drive circuitry required for off-line or DC-to-DC (1) For all available packages, see the orderable addendum at fixed frequency current-mode switching power theendofthedatasheet. supplieswithminimalexternalpartscount. SimplifiedApplication VOUT UCCx808A VIN VDD OUTA RC OUTB COMP CS FB GND Isolated Feedback 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 SLUS456F–APRIL1999–REVISEDJULY2018 www.ti.com Table of Contents 1 Features.................................................................. 1 8 ApplicationandImplementation........................ 12 2 Applications........................................................... 1 8.1 ApplicationInformation............................................12 3 Description............................................................. 1 8.2 TypicalApplication..................................................12 4 RevisionHistory..................................................... 2 9 PowerSupplyRecommendations...................... 14 5 PinConfigurationandFunctions......................... 3 10 Layout................................................................... 14 6 Specifications......................................................... 5 10.1 LayoutGuidelines.................................................14 6.1 AbsoluteMaximumRatings......................................5 10.2 LayoutExample....................................................14 6.2 ESDRatings..............................................................5 11 DeviceandDocumentationSupport................. 15 6.3 RecommendedOperatingConditions.......................5 11.1 DocumentationSupport........................................15 6.4 ThermalInformation..................................................5 11.2 RelatedLinks........................................................15 6.5 ElectricalCharacteristics...........................................6 11.3 ReceivingNotificationofDocumentationUpdates15 6.6 TypicalCharacteristics..............................................7 11.4 CommunityResources..........................................15 7 DetailedDescription.............................................. 9 11.5 Trademarks...........................................................15 7.1 Overview...................................................................9 11.6 ElectrostaticDischargeCaution............................15 7.2 FunctionalBlockDiagrams.......................................9 11.7 Glossary................................................................15 7.3 FeatureDescription.................................................10 12 Mechanical,Packaging,andOrderable Information........................................................... 16 7.4 DeviceFunctionalModes........................................11 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionE(December2016)toRevisionF Page • ChangedtheSimplifiedApplication........................................................................................................................................ 1 • ChangedreferencesofNpackagetoPpackage(PDIP)...................................................................................................... 5 • ChangedtheElectrostaticDischargeCautionstatement .................................................................................................... 15 ChangesfromRevisionD(August2002)toRevisionE Page • AddedESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection.................................................................................................. 1 • DeletedLeadtemperature,soldering(10s):300°Cmaximum.............................................................................................. 5 2 SubmitDocumentationFeedback Copyright©1999–2018,TexasInstrumentsIncorporated ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 www.ti.com SLUS456F–APRIL1999–REVISEDJULY2018 5 Pin Configuration and Functions UCCx808ADorPPackage UCC2808A-x,UCC3808A-2PWPackage 8-PinSOICorPDIP 8-PinTSSOP TopView TopView COMP 1 8 VDD OUTA 1 8 OUTB FB 2 7 OUTA VDD 2 7 GND CS 3 6 OUTB COMP 3 6 RC RC 4 5 GND FB 4 5 CS Not to scale Not to scale PinFunctions PIN TYPE(1) DESCRIPTION NAME SOIC,PDIP TSSOP COMPistheoutputoftheerroramplifierandtheinputofthePWMcomparator.The erroramplifierintheUCCx808Aisatruelow-outputimpedance,2-MHzoperational amplifier.Assuch,theCOMPpincanbothsourceandsinkcurrent.However,the COMP 1 3 O erroramplifierisinternallycurrentlimited,sothatzerodutycyclecanbeexternally forcedbypullingCOMPtoGND.TheUCCx808Afamilyfeaturesbuilt-infull-cyclesoft start.SoftstartisimplementedasaclamponthemaximumCOMPvoltage. TheinputtothePWM,peakcurrent,andovercurrentcomparators.Theovercurrent comparatorisonlyintendedforfaultsensing.Exceedingtheovercurrentthreshold CS 3 5 I causesasoft-startcycle.AninternalMOSFETdischargesthecurrentsensefilter capacitortoimprovedynamicperformanceofthepowerconverter. Theinvertinginputtotheerroramplifier.Forbeststability,keepFBleadlengthas FB 2 4 I shortaspossibleandFBstraycapacitanceassmallaspossible. Referencegroundandpowergroundforallfunctions.Becauseofhighcurrents,and GND 5 7 G high-frequencyoperationoftheUCC3808A,alowimpedancecircuitboardground planeishighlyrecommended. Alternatinghighcurrentoutputstages.Bothstagesarecapableofdrivingthegateofa powerMOSFET.Eachstageiscapableof500-mApeak-sourcecurrent,and1-A peak-sinkcurrent.Theoutputstagesswitchathalftheoscillatorfrequency,inapush- pullconfiguration.WhenthevoltageontheRCpinisrising,oneofthetwooutputsis high,butduringfalltime,bothoutputsareoff.Thisdeadtimebetweenthetwo OUTA 7 1 O outputs,alongwithasloweroutputrisetimethanfalltime,insuresthatthetwooutputs cannotbeonatthesametime.Thisdeadtimeistypically60nsto200nsand dependsuponthevaluesofthetimingcapacitorandresistor.Thehigh-current-output driversconsistofMOSFEToutputdevices,whichswitchfromVDDtoGND.Each outputstagealsoprovidesaverylowimpedancetoovershootandundershoot.This meansthatinmanycases,external-schottky-clampdiodesarenotrequired. Alternatinghighcurrentoutputstages.Bothstagesarecapableofdrivingthegateofa powerMOSFET.Eachstageiscapableof500-mApeak-sourcecurrent,and1-A peak-sinkcurrent.Theoutputstagesswitchathalftheoscillatorfrequency,inapush- pullconfiguration.WhenthevoltageontheRCpinisrising,oneofthetwooutputsis high,butduringfalltime,bothoutputsareoff.Thisdeadtimebetweenthetwo OUTB 6 8 O outputs,alongwithasloweroutputrisetimethanfalltime,insuresthatthetwooutputs cannotbeonatthesametime.Thisdeadtimeistypically60nsto200nsand dependsuponthevaluesofthetimingcapacitorandresistor.Thehigh-current-output driversconsistofMOSFEToutputdevices,whichswitchfromVDDtoGND.Each outputstagealsoprovidesaverylowimpedancetoovershootandundershoot.This meansthatinmanycases,external-schottky-clampdiodesarenotrequired. (1) P=Power,G=Ground,I=Input,O=Output Copyright©1999–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 SLUS456F–APRIL1999–REVISEDJULY2018 www.ti.com PinFunctions(continued) PIN TYPE(1) DESCRIPTION NAME SOIC,PDIP TSSOP Theoscillatorprogrammingpin.TheUCC3808A’soscillatortracksVDDandGND internally,sothatvariationsinpowersupplyrailsminimallyaffectfrequencystability. FunctionalBlockDiagramsshowstheoscillatorblockdiagram.Onlytwocomponents arerequiredtoprogramtheoscillator:aresistor(tiedtotheVDDandRC),anda capacitor(tiedtotheRCandGND).Theapproximateoscillatorfrequencyis determinedbythesimpleformulainEquation1. RC 4 6 O Therecommendedrangeoftimingresistorsisbetween10kΩand200kΩandrange oftimingcapacitorsisbetween100pFand1000pF.Timingresistorslessthan10kΩ mustbeavoided.Forbestperformance,keepthetimingcapacitorleadtoGNDas shortaspossible,thetimingresistorleadfromVDDasshortaspossible,andthe leadsbetweentimingcomponentsandRCasshortaspossible.Separategroundand VDDtracestotheexternaltimingnetworkareencouraged. Thepowerinputconnectionforthisdevice.AlthoughquiescentVDDcurrentisvery low,totalsupplycurrentishigher,dependingonOUTAandOUTBcurrent,andthe programmedoscillatorfrequency.TotalVDDcurrentisthesumofquiescentVDD currentandtheaverageOUTcurrent.Knowingtheoperatingfrequencyandthe VDD 8 2 P MOSFETgatecharge(Qg),averageOUTcurrentcanbecalculatedfromEquation2. Topreventnoiseproblems,bypassVDDtoGNDwithaceramiccapacitorascloseto thechipaspossiblealongwithanelectrolyticcapacitor.A1-µFdecouplingcapacitor isrecommended. 4 SubmitDocumentationFeedback Copyright©1999–2018,TexasInstrumentsIncorporated ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 www.ti.com SLUS456F–APRIL1999–REVISEDJULY2018 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1)(2) MIN MAX UNIT Supplyvoltage(IDD≤10mA) 15 V Supplycurrent 20 mA OUTA/OUTBsourcecurrent(peak) –0.5 A OUTA/OUTBsinkcurrent(peak) 1 A VDD+0.3 Analoginputs(FB,CS) –0.3 V (nottoexceed6) Ppackage 1 W PowerdissipationatT =25°C Dpackage 650 A mW PWpackage 400 Junctiontemperature,T –55 150 °C J Storagetemperature,T –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Currentsarepositiveinto,negativeoutofthespecifiedterminal.ConsultthepackagingsectionofthePowerSupplyControlProducts DataBookforthermallimitationsandconsiderationsofpackages. 6.2 ESD Ratings VALUE UNIT Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±1500 V Electrostaticdischarge V (ESD) Charged-devicemodel(CDM),perJEDECspecificationJESD22-C101(2) ±1500 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT UCCx808-1 13 14 V Supplyvoltage V DD UCCx808-2 5 14 UCC2808-x –40 85 T Junctiontemperature °C J UCC3808-x 0 70 6.4 Thermal Information UCC2808A-x UCCx808A UCC3808A-2 THERMALMETRIC(1) UNIT D(SOIC) P(PDIP) PW(TSSOP) 8PINS 8PINS 8PINS R Junction-to-ambientthermalresistance 105.4 57 151.9 °C/W θJA R Junction-to-case(top)thermalresistance 47.9 49.6 36.5 °C/W θJC(top) R Junction-to-boardthermalresistance 46.5 34.3 81.5 °C/W θJB ψ Junction-to-topcharacterizationparameter 8.7 19.5 1.7 °C/W JT ψ Junction-to-boardcharacterizationparameter 45.9 34.2 79.6 °C/W JB R Junction-to-case(bottom)thermalresistance — — — °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. Copyright©1999–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 SLUS456F–APRIL1999–REVISEDJULY2018 www.ti.com 6.5 Electrical Characteristics T =0°Cto70°CfortheUCC3808A-xand–40°Cto+85°CfortheUCC2808A-x,VDD=10V(1),1-µFcapacitorfromVDDto A GND,R=22kΩ,C=330pF,andT =T (unlessotherwisenoted) A J PARAMETER TESTCONDITIONS MIN TYP MAX UNIT OSCILLATOR Oscillatorfrequency 175 194 213 kHz Oscillatoramplitude/VDD(2) 0.44 0.5 0.56 V/V ERRORAMPLIFIER Inputvoltage COMP=2V 1.95 2 2.05 V Inputbiascurrent –1 1 µA Openloopvoltagegain 60 80 dB COMPsinkcurrent FB=2.2V,COMP=1V 0.3 2.5 mA COMPsourcecurrent FB=1.3V,COMP=3.5V –0.2 –0.5 mA PWM Maximumdutycycle MeasuredatOUTAorOUTB 48% 49% 50% Minimumdutycycle COMP=0V 0% CURRENTSENSE Gain(3) 1.9 2.2 2.5 V/V Maximuminputsignal COMP=5V(4) 0.45 0.5 0.55 V COMP=3.5V, CStooutputdelay 100 200 ns CSfrom0mVto600mV CSsourcecurrent –200 nA CSsinkcurrent CS=0.5V,RC=5.5V(5) 5 10 mA Overcurrentthreshold 0.7 0.75 0.8 V COMPtoCSoffset CS=0V 0.35 0.8 1.2 V OUTPUT OUTlowlevel I=100mA 0.5 1 V OUThighlevel I=–50mA,VDD–OUT 0.5 1 V Risetime C =1nF 25 60 ns L Falltime C =1nF 25 60 ns L UNDERVOLTAGELOCKOUT UCCx808A-1(1) 11.5 12.5 13.5 Startthreshold V UCCx808A-2 4.1 4.3 4.5 UCCx808A-1 7.6 8.3 9 Minimumoperatingvoltageafterstart V UCCx808A-2 3.9 4.1 4.3 UCCx808A-1 3.5 4.2 5.1 Hysteresis V UCCx808A-2 0.1 0.2 0.3 SOFTSTART COMPrisetime FB=1.8V,risefrom0.5Vto4V 3.5 20 ms OVERALL Start-upcurrent VDD<startthreshold 130 260 µA Operatingsupplycurrent FB=0V,CS=0V(1)(6) 1 2 mA VDDzenershuntvoltage IDD=10mA(7) 13 14 15 V (1) ForUCCx808A-1,setVDDabovethestartthresholdbeforesettingat10V. (2) MeasuredatRC.SignalamplitudetracksVDD. (3) Gainisdefinedby:A=ΔV /ΔV ,0V≤V ≤0.4V. COMP CS CS (4) ParametermeasuredattrippointoflatchwithFBat0V. (5) TheinternalcurrentsinkontheCSpinisdesignedtodischargeanexternalfiltercapacitor.ItisnotintendedtobeaDCsinkpath. (6) Doesnotincludecurrentintheexternaloscillatornetwork. (7) StartthresholdandZenershuntthresholdtrackoneanother. 6 SubmitDocumentationFeedback Copyright©1999–2018,TexasInstrumentsIncorporated ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 www.ti.com SLUS456F–APRIL1999–REVISEDJULY2018 6.6 Typical Characteristics 1000 14 C = 100 pF 12 VDD=10V,t=25°C Hz100 C = 220 pF C = 330 pF 10 with 1I DnDF load k - ency mA 8 u - Freq C = 1000 pF IDD 6 10 C = 820 pF 4 C = 560 pF IDD 2 withoutload 1 0 0 50 100 150 200 0 200 400 600 800 1000 1200 RT−TimingResistor−kΩ Oscillator Frequency−kHz Figure1.OscillatorFrequency Figure2.IDDvsOscillatorFrequency vsExternalRCValues 1.2 90 180 80 160 s 1.0 e e V 70 140 egr CS Offset - 00..68 Gain - dB 5600 Phase 110200 eMargin-D MP- 40 80 Phas O 0.4 C 30 60 20 40 0.2 10 Gain 20 0 0 0 −55 −35 −15 5 25 45 65 85 105 125 1 100 10000 1000000 Temperature-°C Frequency−Hz Figure3.COMPtoCSOffsetvsTemperature Figure4.ErrorAmplifierGainandPhaseResponse vsFrequency 300 400 C = 1000 pF 350 VDD = 5 V 250 300 VDD = 7.5 V s e-ns200 C = 820 pF C = 560 pF me-n 250 Tim C = 330 pF dTi 200 VDD = 10 V d a ea150 C = 220 pF De 150 D 100 100 50 C = 100 pF 50 0 50 100 150 200 250 −100 −50 0 50 100 150 RT−Timing Resistor−kΩ Temperature -°C Figure5.OutputDeadTimevsExternalRCValues Figure6.DeadTimevsTemperature Copyright©1999–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 SLUS456F–APRIL1999–REVISEDJULY2018 www.ti.com Typical Characteristics (continued) 300 120 250 100 VDD = 5 V 200 80 VDD = 5 V VDD = 7.5 V s s m hm150 Oh 60 O VDD = 7.5 V 100 40 VDD = 10 V VDD = 10 V 50 20 0 0 −100 −50 0 50 100 150 −100 −50 0 50 100 150 Temperature -°C Temperature -°C Figure7.RCRDS(on)vsTemperature Figure8.CSRDS(on)vsTemperature 8 SubmitDocumentationFeedback Copyright©1999–2018,TexasInstrumentsIncorporated ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 www.ti.com SLUS456F–APRIL1999–REVISEDJULY2018 7 Detailed Description 7.1 Overview The UCCx808A-x device is a highly integrated, low-power current mode push-pull PWM controller. The controller employs low starting current and an internal control algorithm that offers accurate output voltage regulation in the presence of line and load variations. The UCCx808A-x family of parts has UVLO thresholds and hysteresis optionsforoff-lineandbattery-poweredsystems. Table1.UndervoltageLockoutLevels TURNON TURNOFF PARTNUMBER THRESHOLD THRESHOLD UCCx808A-1 12.5 8.3 UCCx808A-1 4.3 4.1 7.2 Functional Block Diagrams FB COMP CS 2 1 3 8 VDD OVERCURRENT 22 kΩ PEAKCURRENT COMPARATOR COMPARATOR 14 V 0.75 V 2.0 V 0.5 V 2.2 V 7 OUTA VDD OK OSCILLATOR S Q PWM R LATCH VDD−1 V S 1.2R S T Q Q Q Q R R PWM COMPARATOR VDD 0.5 V R SOFTSTART 6 OUTB VOLTAGE REFERENCE SLOPE = 1 V/ms 5 GND 4 Note:PinoutshownisforSOICandPDIPpackages.TSSOPpinoutisdifferent. RC Copyright © 2016,Texas Instruments Incorporated TheoscillatorgeneratesasawtoothwaveformonRC.DuringtheRCrisetime,theoutputstagesalternateontime, butbothstagesareoffduringtheRCfalltime.Theoutputstagesswitcha1/2theoscillatorfrequency,withensured dutycycleof<50%forbothoutputs. Figure9. BlockDiagram Copyright©1999–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 SLUS456F–APRIL1999–REVISEDJULY2018 www.ti.com Functional Block Diagrams (continued) RC 4 1.41 FREQUENCY= VDD RC 2 (APPROXIMATE S Q FREQUENCY) OSCILLATOR OUTPUT R 0.2 V Copyright © 2016,Texas Instruments Incorporated Figure10. BlockDiagramofOscillator 7.3 Feature Description 7.3.1 PinDescriptions 7.3.1.1 COMP TheCOMPpinistheoutputoftheerroramplifierandtheinputofthePWMcomparator.Theerroramplifierinthe UCC3808 is a true low-output impedance, 2-MHz operational amplifier. As such, the COMP pin can both source and sink current. However, the error amplifier is internally current limited, so that zero duty cycle can be externallyforcedbypullingCOMPtoGND. The UCC3808 family features built-in full cycle soft start. Soft start is implemented as a clamp on the maximum COMPvoltage. 7.3.1.2 CS The input to the PWM, peak current, and overcurrent comparators. The overcurrent comparator is only intended forfaultsensing.Exceedingtheovercurrentthresholdcausesasoft-startcycle. 7.3.1.3 FB Theinvertinginputtotheerroramplifier.Forbeststability,keepFBleadlengthasshortaspossibleandFBstray capacitanceassmallaspossible. 7.3.1.4 GND Reference ground and power ground for all functions. Because of high currents, and high-frequency operation of theUCC3808,alow-impedanceprinted-circuitboardgroundplaneishighlyrecommended. 7.3.1.5 OUTAandOUTB Alternating high current output stages. Both stages are capable of driving the gate of a power MOSFET. Each stageiscapableof500-mApeaksourcecurrent,and1-Apeaksinkcurrent. The output stages switch at half the oscillator frequency, in a push-pull configuration. When the voltage on the RC pin is rising, one of the two outputs is high, but during fall time, both outputs are off. This dead time between the two outputs, along with a slower output rise time than fall time, insures that the two outputs can not be on at the same time. This dead time is typically 60 ns to 200 ns and depends upon the values of the timing capacitor andresistor. The high-current output drivers consist of MOSFET output devices, which switch from VDD to GND. Each output stagealsoprovidesaverylowimpedancetoovershootandundershoot.Thismeansthatinmanycases,external Schottkyclampdiodesarenotrequired. 10 SubmitDocumentationFeedback Copyright©1999–2018,TexasInstrumentsIncorporated ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 www.ti.com SLUS456F–APRIL1999–REVISEDJULY2018 Feature Description (continued) 7.3.1.6 RC The oscillator programming pin. The oscillator of the UCC3808-x tracks VDD and GND internally, so that variationsinpowersupplyrailsminimallyaffectfrequencystability.Figure10showstheoscillatorblockdiagram. Only two components are required to program the oscillator: a resistor (tied to the VDD and RC), and a capacitor (tiedtotheRCandGND).TheapproximateoscillatorfrequencyisdeterminedbyEquation1. 1.41 f = OSCILLATOR RC where • frequencyisinHz • resistanceinΩ • capacitanceinFarads (1) The recommended range of timing resistors is between 10 kΩ and 200 kΩ and range of timing capacitors is between100pFand1000pF.Timingresistorslessthan10kΩmustbeavoided. For best performance, keep the timing capacitor lead to GND as short as possible, the timing resistor lead from VDD as short as possible, and the leads between timing components and RC as short as possible. Separate groundandVDDtracestotheexternaltimingnetworkareencouraged. 7.3.1.7 VDD The power input connection for this device. Although quiescent VDD current is very low, total supply current is higher, depending on OUTA and OUTB current, and the programmed oscillator frequency. Total VDD current is the sum of quiescent VDD current and the average OUT current. Knowing the operating frequency and the MOSFETgatecharge(Qg),averageOUTcurrentcanbecalculatedwithEquation2. I =Q ×F OUT g where • Fisfrequency (2) To prevent noise problems, bypass VDD to GND with a ceramic capacitor as close to the chip as possible along withanelectrolyticcapacitor.TIrecommendsa1-µFdecouplingcapacitor. 7.4 Device Functional Modes 7.4.1 VCC When VCC rises above 12.5 V (for the UCCx808A-1) or above 4.3 V (for the UCCx808-2) the device is enabled. When any fault conditions are cleared, a soft-start condition is initiated and the gate driver outputs begin switching. When VCC drops below 8.3 V (for the UCCx808-1) or 4.1 V (for the UCCx808-2) the device enters the UVLO protectionmodeandbothgatedriversareactivelypulledlow. 7.4.2 Push-PullorHalf-BridgeFunction Because the device provides alternate 180° out-of-phase gate drive signals (OUTA and OUTB), it may be used asacontrollerforthepush-pullorhalf-bridgetopologies.Forthehalf-bridgetopologytheUCCx808A-xrequiresa anexternalhighsidegatedriverorpulsetransformerononeorbothoftheOUTAandOUTBsignals. Copyright©1999–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 SLUS456F–APRIL1999–REVISEDJULY2018 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 8.1 Application Information A 200-kHz push-pull application circuit with a full-wave rectifier is shown in Figure 11. The output, V , provides O 5Vat50Wmaximumandiselectricallyisolatedfromtheinput.BecausetheUCC3808Aisapeak-current-mode controllerthe2N2907emitterfollowingamplifier(bufferstheCTwaveform)providesslopecompensationwhichis necessary for duty ratios greater than 50%. Capacitor decoupling is very important with a single ground IC controller, and a 1 μF is suggested as close to the IC as possible. The controller supply is a series RC for start- up,paralleledwithabiaswindingontheoutputinductorusedinsteady-stateoperation. Isolation is provided by an optocoupler with regulation done on the secondary side using the TL431 adjustable precision shunt regulator. Small signal compensation with tight voltage regulation is achieved using this part on the secondary side. Many choices exist for the output inductor depending on cost, volume, and mechanical strength. Several design options are iron powder, molypermalloy (MPP), or a ferrite core with an air gap as shown here. The main power transformer has a Magnetics Inc. ER28 size core made of P material for efficient operationatthisfrequencyandtemperature.Theinputvoltagemayrangefrom36Vdcto72Vdc. 8.2 Typical Application E8R:228 32CTQ030 5 VV 5O0 W + NP2 NS1 EF25 7µH 680µF 0.01µF − + LOOPB 36VVTION72V 4700µF 0.47µF 2B8−Y2V00 62Ω 62Ω 2B8−Y2V00 NP1 NS2 200Ω 1000pF 1000pF LOOPA − 51 kΩ COMP 1/4 W 19.1 kΩ IRF640 IRF640 12 4700pF 20 kΩ 10Ω 470pF 2.2Ω DF02SGICT 2.2Ω 1mH 3 1TL431 0.1µF 2 10µF 0.1µF 19.1 kΩ 2 kΩ 0.2Ω 20 kΩ VDD OUTA OUTB GND 330pF 8 7 6 5 PRIMARY GROUND UCC3808AD−1 1 2 3 4 240Ω COMP FB CS RC RC 4.99 kΩ CURRENT 2.80 kΩ 86.6 kΩ SENSE 4.99 kΩ H11A1 2K12907 4 U3 3 20 kΩ 5 2 330pF 432Ω 0.1µF 6 1 0.01µF 1kV Copyright © 2016,Texas Instruments Incorporated Figure11. TypicalApplicationDiagram:48-Vin,5-V,50-WOutput 12 SubmitDocumentationFeedback Copyright©1999–2018,TexasInstrumentsIncorporated ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 www.ti.com SLUS456F–APRIL1999–REVISEDJULY2018 Typical Application (continued) 8.2.1 DesignRequirements Table2liststhedesignparametersfortheUCC3808A-x. Table2.DesignParameters PARAMETER VALUE Outputvoltage 5V Ratedoutputpower 50W InputDCvoltagerange 36Vto72V Switchingfrequency 210kHz 8.2.2 DetailedDesignProcedure The output, VO, provides 5 V at 50 W maximum and is electrically isolated from the input. Because the UCC3808A is a peak current mode controller, the 2N2907 emitter follower amplifier buffers the oscillator waveform (RC pin) and provides slope compensation to the current sense (CS) input. This is necessary for duty cycleratiosofgreaterthan50%. Capacitor decoupling is provided on the VDD pin. TI recommends using a minimum decoupling capacitance of 10-µF electrolytic and 0.1-µF ceramic. The ceramic capacitor must be as close to the VDD pin as possible. The UCC3808A is initially powered up from the 36-V to 72-V input supply . Once the power supply has started, the biassupplyisprovidedbyanauxiliarywindingonthemainpowertransformer. Isolation is provided by an optocoupler with regulation done on the secondary side using the TL431 precision programmable reference. The internal error amplifier of the UCC3808A is set up as a unity gain amplifier and the compensationnetworkisprovidedonthesecondaryside. Many choices exist for the output inductor depending on cost and size constraints. Design options are powdered iron, molypermalloy or the ferrite core option used in this design. The power transformer is a low profile design, EFD25 size, using the Magnetics Inc. P material. This material is a good choice for low power loss at high switchingfrequency. Theswitchingfrequencyissetat210kHzwiththeRCnetworkontheRCpin. 8.2.3 ApplicationCurves 90 180 120 80 160 CT=1000pF 100 70 140 CT=820pF s e e 80 GaindB456000 Phase 81100200 Margin-Degr adTi–nsme 60 CT=560pF e e D 30 60 Phas 40 CT=100pF CT=220pF CT=330pF 20 40 20 10 Gain 20 0 0 0 1 100 10000 1000000 0 20 40 60 80 100 Frequency–Hz RT–TimingResistor–kΩ Figure12.ErrorAmplifierGainandPhaseResponse Figure13.DeadTimevsTimingResistor vsFrequency Copyright©1999–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 SLUS456F–APRIL1999–REVISEDJULY2018 www.ti.com 9 Power Supply Recommendations The VDD power terminal for the device requires the placement of electrolytic capacitor as energy storage capacitor because of the 1-A drive capability of the UCCx808A-x controller. Also a low-ESR noise decoupling capacitor is required and it must be placed as close as possible to the VDD and GND pins. Ceramic capacitors with stable dielectric characteristics over temperature are recommended. X7R is a suitable dielectric material for usehere. TIrecommendsa10-µF,25-Velectrolyticcapacitorpart. 10 Layout 10.1 Layout Guidelines 1. Place the VDD capacitor as close as possible between the VDD pin and GND of the UCCx808A-x, tracked directlytobothpins. 2. A small, external filter capacitor is recommended on the CS pin. Track the filter capacitor as directly as possiblefromtheCStoGNDpins. 3. The tracking and layout of the FB pin and connecting components is critical to minimizing noise pickup and interference.ReducethetotalsurfaceareaoftracesontheFBnettoaminimum. 4. The OUTA and OUTB pins have a high-current source and sink capability. An external gate resistor is recommended to damp oscillations. A value of around a few Ohms is recommended. A pulldown resistor on the gate to source is recommended to prevent the MOSFET gate from floating on if there is an open-circuit faultinthegatedrivepath. 10.2 Layout Example SOIC-8 PDIP-8 TOP VIEW 1 COMP VDD 8 2 FB OUTA 7 3 CS OUTB 6 4 RC GND 5 Figure14. RecommendedLayout 14 SubmitDocumentationFeedback Copyright©1999–2018,TexasInstrumentsIncorporated ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 www.ti.com SLUS456F–APRIL1999–REVISEDJULY2018 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 RelatedDocumentation Forrelateddocumentation,seethefollowing: PowerSupplyControlProductsDataBook 11.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table3.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER ORDERNOW DOCUMENTS SOFTWARE COMMUNITY UCC2808A-1 Clickhere Clickhere Clickhere Clickhere Clickhere UCC2808A-2 Clickhere Clickhere Clickhere Clickhere Clickhere UCC3808A-1 Clickhere Clickhere Clickhere Clickhere Clickhere UCC3808A-2 Clickhere Clickhere Clickhere Clickhere Clickhere 11.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed.Forchangedetails,reviewtherevisionhistoryincludedinanyreviseddocument. 11.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 11.5 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 11.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. 11.7 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. Copyright©1999–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

UCC2808A-1,UCC2808A-2,UCC3808A-1,UCC3808A-2 SLUS456F–APRIL1999–REVISEDJULY2018 www.ti.com 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 16 SubmitDocumentationFeedback Copyright©1999–2018,TexasInstrumentsIncorporated ProductFolderLinks:UCC2808A-1 UCC2808A-2 UCC3808A-1 UCC3808A-2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) UCC2808AD-1 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2808A-1 & no Sb/Br) UCC2808AD-2 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2808A-2 & no Sb/Br) UCC2808AD-2G4 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2808A-2 & no Sb/Br) UCC2808ADTR-1 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2808A-1 & no Sb/Br) UCC2808ADTR-1G4 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2808A-1 & no Sb/Br) UCC2808ADTR-2 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2808A-2 & no Sb/Br) UCC2808ADTR-2G4 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2808A-2 & no Sb/Br) UCC2808AN-1 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 UCC2808A & no Sb/Br) N-1 UCC2808AN-2 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 UCC2808A & no Sb/Br) N-2 UCC2808AN-2G4 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 UCC2808A & no Sb/Br) N-2 UCC2808APW-1 ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 2808A1 & no Sb/Br) UCC2808APW-1G4 ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 2808A1 & no Sb/Br) UCC2808APW-2 ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 2808A2 & no Sb/Br) UCC2808APWTR-2 ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 2808A2 & no Sb/Br) UCC3808AD-1 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 3808A-1 & no Sb/Br) UCC3808AD-1G4 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 3808A-1 & no Sb/Br) UCC3808AD-2 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 3808A-2 & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) UCC3808ADTR-1 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 3808A-1 & no Sb/Br) UCC3808ADTR-1G4 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 3808A-1 & no Sb/Br) UCC3808ADTR-2 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 3808A-2 & no Sb/Br) UCC3808AN-1 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 UCC3808A & no Sb/Br) N-1 UCC3808AN-1G4 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 UCC3808A & no Sb/Br) N-1 UCC3808AN-2 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 UCC3808A & no Sb/Br) N-2 UCC3808APW-2 ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 3808A2 & no Sb/Br) UCC3808APWTR-2 ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 3808A2 & no Sb/Br) UCC3808APWTR-2G4 ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 3808A2 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 3-Aug-2017 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) UCC2808ADTR-1 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2808ADTR-2 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2808APWTR-2 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 UCC3808ADTR-1 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC3808ADTR-2 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC3808APWTR-2 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 3-Aug-2017 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) UCC2808ADTR-1 SOIC D 8 2500 340.5 338.1 20.6 UCC2808ADTR-2 SOIC D 8 2500 340.5 338.1 20.6 UCC2808APWTR-2 TSSOP PW 8 2000 367.0 367.0 35.0 UCC3808ADTR-1 SOIC D 8 2500 340.5 338.1 20.6 UCC3808ADTR-2 SOIC D 8 2500 340.5 338.1 20.6 UCC3808APWTR-2 TSSOP PW 8 2000 367.0 367.0 35.0 PackMaterials-Page2

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