None

None

None

None

PACKAGE OPTION ADDENDUM www.ti.com 3-Jun-2009 PACKAGING INFORMATION OrderableDevice Status(1) Package Package Pins Package EcoPlan(2) Lead/BallFinish MSLPeakTemp(3) Type Drawing Qty UC19432J OBSOLETE CDIP JG 8 TBD CallTI CallTI UC19432J883B OBSOLETE CDIP JG 8 TBD CallTI CallTI UC29432D ACTIVE SOIC D 8 75 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC29432DG4 ACTIVE SOIC D 8 75 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC29432DTR NRND SOIC D 8 2500 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC29432DTRG4 NRND SOIC D 8 2500 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC29432N ACTIVE PDIP P 8 50 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC29432NG4 ACTIVE PDIP P 8 50 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC39432BD ACTIVE SOIC D 8 75 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC39432BDG4 ACTIVE SOIC D 8 75 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC39432BDTR ACTIVE SOIC D 8 2500 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC39432BDTRG4 ACTIVE SOIC D 8 2500 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC39432BN ACTIVE PDIP P 8 50 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC39432BNG4 ACTIVE PDIP P 8 50 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC39432D ACTIVE SOIC D 8 75 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC39432DG4 ACTIVE SOIC D 8 75 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC39432N ACTIVE PDIP P 8 50 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC39432NG4 ACTIVE PDIP P 8 50 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) (1)Themarketingstatusvaluesaredefinedasfollows: ACTIVE:Productdevicerecommendedfornewdesigns. LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect. NRND:Notrecommendedfornewdesigns.Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartin anewdesign. PREVIEW:Devicehasbeenannouncedbutisnotinproduction.Samplesmayormaynotbeavailable. OBSOLETE:TIhasdiscontinuedtheproductionofthedevice. (2)EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheck http://www.ti.com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails. TBD:ThePb-Free/Greenconversionplanhasnotbeendefined. Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirements forall6substances,includingtherequirementthatleadnotexceed0.1%byweightinhomogeneousmaterials.Wheredesignedtobesoldered athightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses. Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieand package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible)asdefinedabove. Addendum-Page1

PACKAGE OPTION ADDENDUM www.ti.com 3-Jun-2009 Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflame retardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incomingmaterialsandchemicals.TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimited informationmaynotbeavailableforrelease. InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTI toCustomeronanannualbasis. Addendum-Page2

PACKAGE MATERIALS INFORMATION www.ti.com 6-Apr-2009 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0(mm) B0(mm) K0(mm) P1 W Pin1 Type Drawing Diameter Width (mm) (mm) Quadrant (mm) W1(mm) UC29432DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UC39432BDTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 6-Apr-2009 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) UC29432DTR SOIC D 8 2500 346.0 346.0 29.0 UC39432BDTR SOIC D 8 2500 346.0 346.0 29.0 PackMaterials-Page2

IMPORTANTNOTICE TexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,modifications,enhancements,improvements, andotherchangestoitsproductsandservicesatanytimeandtodiscontinueanyproductorservicewithoutnotice.Customersshould obtainthelatestrelevantinformationbeforeplacingordersandshouldverifythatsuchinformationiscurrentandcomplete.Allproductsare soldsubjecttoTI’stermsandconditionsofsalesuppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitshardwareproductstothespecificationsapplicableatthetimeofsaleinaccordancewithTI’sstandard warranty.TestingandotherqualitycontroltechniquesareusedtotheextentTIdeemsnecessarytosupportthiswarranty.Exceptwhere mandatedbygovernmentrequirements,testingofallparametersofeachproductisnotnecessarilyperformed. TIassumesnoliabilityforapplicationsassistanceorcustomerproductdesign.Customersareresponsiblefortheirproductsand applicationsusingTIcomponents.Tominimizetherisksassociatedwithcustomerproductsandapplications,customersshouldprovide adequatedesignandoperatingsafeguards. TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanyTIpatentright,copyright,maskworkright, orotherTIintellectualpropertyrightrelatingtoanycombination,machine,orprocessinwhichTIproductsorservicesareused.Information publishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensefromTItousesuchproductsorservicesora warrantyorendorsementthereof.Useofsuchinformationmayrequirealicensefromathirdpartyunderthepatentsorotherintellectual propertyofthethirdparty,oralicensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofTIinformationinTIdatabooksordatasheetsispermissibleonlyifreproductioniswithoutalterationandisaccompanied byallassociatedwarranties,conditions,limitations,andnotices.Reproductionofthisinformationwithalterationisanunfairanddeceptive businesspractice.TIisnotresponsibleorliableforsuchaltereddocumentation.Informationofthirdpartiesmaybesubjecttoadditional restrictions. ResaleofTIproductsorserviceswithstatementsdifferentfromorbeyondtheparametersstatedbyTIforthatproductorservicevoidsall expressandanyimpliedwarrantiesfortheassociatedTIproductorserviceandisanunfairanddeceptivebusinesspractice.TIisnot responsibleorliableforanysuchstatements. TIproductsarenotauthorizedforuseinsafety-criticalapplications(suchaslifesupport)whereafailureoftheTIproductwouldreasonably beexpectedtocauseseverepersonalinjuryordeath,unlessofficersofthepartieshaveexecutedanagreementspecificallygoverning suchuse.Buyersrepresentthattheyhaveallnecessaryexpertiseinthesafetyandregulatoryramificationsoftheirapplications,and acknowledgeandagreethattheyaresolelyresponsibleforalllegal,regulatoryandsafety-relatedrequirementsconcerningtheirproducts andanyuseofTIproductsinsuchsafety-criticalapplications,notwithstandinganyapplications-relatedinformationorsupportthatmaybe providedbyTI.Further,BuyersmustfullyindemnifyTIanditsrepresentativesagainstanydamagesarisingoutoftheuseofTIproductsin suchsafety-criticalapplications. TIproductsareneitherdesignednorintendedforuseinmilitary/aerospaceapplicationsorenvironmentsunlesstheTIproductsare specificallydesignatedbyTIasmilitary-gradeor"enhancedplastic."OnlyproductsdesignatedbyTIasmilitary-grademeetmilitary specifications.BuyersacknowledgeandagreethatanysuchuseofTIproductswhichTIhasnotdesignatedasmilitary-gradeissolelyat theBuyer'srisk,andthattheyaresolelyresponsibleforcompliancewithalllegalandregulatoryrequirementsinconnectionwithsuchuse. TIproductsareneitherdesignednorintendedforuseinautomotiveapplicationsorenvironmentsunlessthespecificTIproductsare designatedbyTIascompliantwithISO/TS16949requirements.Buyersacknowledgeandagreethat,iftheyuseanynon-designated productsinautomotiveapplications,TIwillnotberesponsibleforanyfailuretomeetsuchrequirements. FollowingareURLswhereyoucanobtaininformationonotherTexasInstrumentsproductsandapplicationsolutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio DataConverters dataconverter.ti.com Automotive www.ti.com/automotive DLP®Products www.dlp.com Broadband www.ti.com/broadband DSP dsp.ti.com DigitalControl www.ti.com/digitalcontrol ClocksandTimers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Military www.ti.com/military Logic logic.ti.com OpticalNetworking www.ti.com/opticalnetwork PowerMgmt power.ti.com Security www.ti.com/security Microcontrollers microcontroller.ti.com Telephony www.ti.com/telephony RFID www.ti-rfid.com Video&Imaging www.ti.com/video RF/IFandZigBee®Solutions www.ti.com/lprf Wireless www.ti.com/wireless MailingAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265 Copyright©2009,TexasInstrumentsIncorporated