UC1823A, UC2823A, UC2823B, UC3823A, UC3823B, UC1825A, UC2825A, UC2825B, UC3825A, UC3825B www.ti.com SLUS334E − AUGUST 1995 − REVISED SEPTEMBER 2010 HIGH-SPEED PWM CONTROLLER FEATURES DESCRIPTION (cid:2) Improved Versions of the UC3823/UC3825 The UC3823A and UC3823B and the UC3825A and PWMs UC3825B family of PWM controllers are improved (cid:2) Compatible with Voltage-Mode or versions of the standard UC3823 and UC3825 family. Current-Mode Control Methods Performance enhancements have been made to several (cid:2) of the circuit blocks. Error amplifier gain bandwidth product Practical Operation at Switching Frequencies is 12 MHz, while input offset voltage is 2 mV. Current limit to 1 MHz threshold is assured to a tolerance of 5%. Oscillator (cid:2) 50-ns Propagation Delay to Output discharge current is specified at 10 mA for accurate dead (cid:2) High-Current Dual Totem Pole Outputs time control. Frequency accuracy is improved to 6%. (2-A Peak) Startup supply current, typically 100 μA, is ideal for off-line (cid:2) applications. The output drivers are redesigned to actively Trimmed Oscillator Discharge Current sink current during UVLO at no expense to the startup (cid:2) Low 100-μA Startup Current current specification. In addition each output is capable of (cid:2) Pulse-by-Pulse Current Limiting Comparator 2-A peak currents during transitions. (cid:2) Latched Overcurrent Comparator With Full Cycle Restart BLOCK DIAGRAM CLK/LEB 4 (60%) 13 VC RT 5 * 11 OUTA OSC CT 6 R T RAMP 7 SD 1.25 V 14 OUTB EAOUT 3 PWM COMPARATOR LPAWTCMH 12 PGND NI 2 E/A INV 1 9(cid:2)A SOFT−START COMPLETE CURRENT RESTART LIMIT 5 V DELAY 250(cid:2)A SS 8 1.0 V OVER CURRENT LATCH ILIM 9 SD S 1.2 V RESTART R R DELAY FAULT LATCH 0.2 V UVLO VCC 15 ”B” 16V/10V INTERNAL ”A” 9.2V/8.4V VREF BIAS GND 10 O5N./1O VFF 4 V VREF GOOD 16 5.1 VREF UDG−02091 * On the UC1823A version, toggles Q and Q are always low. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products Copyright © 2004 −2008, Texas Instruments Incorporated conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

UC1823A, UC2823A, UC2823B, UC3823A, UC3823B, UC1825A, UC2825A, UC2825B, UC3825A, UC3825B www.ti.com SLUS334E − AUGUST 1995 − REVISED SEPTEMBER 2010 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION (CONTINUED) Functional improvements have also been implemented in this family. The UC3825 shutdown comparator is now a high-speed overcurrent comparator with a threshold of 1.2 V. The overcurrent comparator sets a latch that ensures full discharge of the soft-start capacitor before allowing a restart. While the fault latch is set, the outputs are in the low state. In the event of continuous faults, the soft-start capacitor is fully charged before discharge to insure that the fault frequency does not exceed the designed soft start period. The UC3825 CLOCK pin has become CLK/LEB. This pin combines the functions of clock output and leading edge blanking adjustment and has been buffered for easier interfacing. The UC3825A and UC3825B have dual alternating outputs and the same pin configuration of the UC3825. The UC3823A and UC3823B outputs operate in phase with duty cycles from zero to less than 100%. The pin configuration of the UC3823A and UC3823B is the same as the UC3823 except pin 11 is now an output pin instead of the reference pin to the current limit comparator. “A” version parts have UVLO thresholds identical to the original UC3823 and UC3825. The “B” versions have UVLO thresholds of 16 V and 10 V, intended for ease of use in off-line applications. Consult the application note, The UC3823A,B and UC3825A,B Enhanced Generation of PWM Controllers, (SLUA125) for detailed technical and applications information. ORDERING INFORMATION UVLO MMAAXXIIMMUUMM 9.2 V / 8.4 V 16 V / 10 V TTAA DUTY CYCLE SOIC−16(1) PDIP−16 PLCC−20(1) SOIC−16 PDIP−16 PLCC−20(1) (DW) (N) (Q) (DW) (N) (Q) < 100% UC2823ADW UC2823AN UC2823AQ UC2823BDW UC2823BN − −4400°°CC ttoo 8855°°CC < 50% UC2825ADW UC2825AN UC2825AQ UC2825BDW UC2825BN − < 100% UC3823ADW UC3823AN UC3823AQ UC3823BDW UC3823BN − −00°°CC ttoo 7700°°CC < 50% UC3825ADW UC3825AN UC3825AQ UC3825BDW UC3825BN UC3825BQ (1) The DW and Q packages are also available taped and reeled. Add TR suffix to the device type (i.e., UC2823ADWR). To order quantities of 1000 devices per reel for the Q package and 2000 devices per reel for the DW package. UVLO MMAAXXIIMMUUMM 9.2 V / 8.4 V TTAA DUTY CYCLE CDIP−16 LCCC−20 (J) (L) < 100% UC1823AJ, UC1823AJ883B, UC1823AJQMLV UC1823AL, UC1823AL883B −5555°°CC ttoo 112255°°CC < 50% UC1825AJ, UC1825AJ883B, UC1825AJQMLV UC1825AL, UC1825AL883B, UC1825ALQMLV PIN ASSIGNMENTS DW, J, OR N PACKAGES Q OR L PACKAGES (TOP VIEW) (TOP VIEW) F E C INV 1 16 VREF NI NV NCVR VC NI 2 15 VCC I EAOUT 3 14 OUTB 3 2 1 20 19 EAOUT 4 18 OUTB CLK/LEB 4 13 VC CLK/LEB 5 17 VC RT 5 12 PGND NC 6 16 NC CT 6 11 OUTA RT 7 15 PGND RAMP 7 10 GND CT 8 14 OUTA SS 8 9 ILIM 9 10 11 12 13 P S CM D AM S NILI GN R NC = no connection 2

UC1823A, UC2823A, UC2823B, UC3823A, UC3823B, UC1825A, UC2825A, UC2825B, UC3825A, UC3825B www.ti.com SLUS334E − AUGUST 1995 − REVISED SEPTEMBER 2010 TERMINAL FUNCTIONS TERMINAL NO. II//OO DDEESSCCRRIIPPTTIIOONN NNAAMMEE J or DW Q or L CLK/LEB 4 5 O Output of the internal oscillator Timing capacitor connection pin for oscillator frequency programming. The timing capacitor should CT 6 8 I be connected to the device ground using minimal trace length. EAOUT 3 4 O Output of the error amplifier for compensation GND 10 13 − Analog ground return pin ILIM 9 12 I Input to the current limit comparator INV 1 2 I Inverting input to the error amplifier NI 2 3 I Non-inverting input to the error amplifier OUTA 11 14 O High current totem pole output A of the on-chip drive stage. OUTB 14 18 O High current totem pole output B of the on-chip drive stage. PGND 12 15 − Ground return pin for the output driver stage Non-inverting input to the PWM comparator with 1.25-V internal input offset. In voltage mode RAMP 7 9 I operation, this serves as the input voltage feed-forward function by using the CT ramp. In peak current mode operation, this serves as the slope compensation input. RT 5 7 I Timing resistor connection pin for oscillator frequency programming SS 8 10 I Soft-start input pin which also doubles as the maximum duty cycle clamp. Power supply pin for the output stage. This pin should be bypassed with a 0.1-μF monolithic ceramic VC 13 17 − low ESL capacitor with minimal trace lengths. Power supply pin for the device. This pin should be bypassed with a 0.1-μF monolithic ceramic low VCC 15 19 − ESL capacitor with minimal trace lengths 5.1-V reference. For stability, the reference should be bypassed with a 0.1-μF monolithic ceramic VREF 16 20 O low ESL capacitor and minimal trace length to the ground plane. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) UNIT VIN Supply voltage, VC, VCC 22 V IO Source or sink current, DC OUTA, OUTB 0.5 A IO Source or sink current, pulse (0.5 μs) OUTA, OUTB 2.2 A INV, NI, RAMP −0.3 V to 7 V AAnnaalloogg iinnppuuttss ILIM, SS −0.3 V to 6 V Power ground PGND ±0.2 V Outputs OUTA, OUTB limits PGND −0.3 V to VC +0.3 V ICLK Clock output current CLK/LEB −5 mA IO(EA) Error amplifier output current EAOUT 5 mA ISS Soft-start sink current SS 20 mA IOSC Oscillator charging current RT −5 mA TJ Operating virtual junction temperature range −55°C to 150°C Tstg Storage temperature −65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds −55C°C to 150°C tSTG Storage temperature −65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from cases for 10 seconds 300°C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 3

UC1823A, UC2823A, UC2823B, UC3823A, UC3823B, UC1825A, UC2825A, UC2825B, UC3825A, UC3825B www.ti.com SLUS334E − AUGUST 1995 − REVISED SEPTEMBER 2010 ELECTRICAL CHARACTERISTICS TA = −55°C to 125°C for the UC1823A/UC1825A, TA = −40°C to 85°C for the UC2823x/UC2825x, TA = 0°C to 70°C for the UC3823x/UC3825x, RT = 3.65 kΩ, CT = 1 nF, VCC = 12 V, TA = TJ (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT REFERENCE, VREF VO Ouput voltage range TJ = 25°C, IO = 1 mA 5.05 5.1 5.15 V Line regulation 12 V ≤ VCC ≤ 20 V 2 15 mmVV Load regulation 1 mA ≤ IO ≤ 10 mA 5 20 Total output variation Line, load, temperature 5.03 5.17 V Temperature stability(1) T(min) < TA < T(max) 0.2 0.4 mV/°C Output noise voltage(1) 10 Hz < f < 10 kHz 50 μVRMS Long term stability(1) TJ = 125°C, 1000 hours 5 25 mV Short circuit current VREF = 0 V 30 60 90 mA OSCILLATOR TJ = 25°C 375 400 425 kHz ffOSC IInniittiiaall aaccccuurraaccyy((11)) RT = 6.6 kΩ, CT = 220 pF, TA = 25°C 0.9 1 1.1 MHz Line, temperature 350 450 kHz TToottaall vvaarriiaattiioonn((11)) RT = 6.6 kΩ, CT = 220 pF, 0.85 1.15 MHz Voltage stability 12 V < VCC < 20 V 1% Temperature stability(1) T(min) < TA < T(max) +/− 5% High-level output voltage, clock 3.7 4 Low-level output voltage, clock 0 0.2 Ramp peak 2.6 2.8 3 VV Ramp valley 0.7 1 1.25 Ramp valley-to-peak 1.6 1.8 2 IOSC Oscillator discharge current RT = OPEN, VCT = 2 V 9 10 11 mA ERROR AMPLIFIER Input offset voltage 2 10 mV Input bias current 0.6 3 μAA Input offset current 0.1 1 Open loop gain 1 V < VO < 4 V 60 95 CMRR Common mode rejection ratio 1.5 V < VCM < 5.5 V 75 95 ddBB PSRR Power supply rejection ratio 12 V < VCC < 20 V 85 110 IO(sink) Output sink current VEAOUT = 1 V 1 2.5 mmAA IO(src) Output source current VEAOUT = 4 V −1.3 −0.5 High-level output voltage IEAOUT = −0.5 mA 4.5 4.7 5 VV Low-level output voltage IEAOUT = −1 mA 0 0.5 1 Gain bandwidth product f = 200 kHz 6 12 Mhz Slew rate(1) 6 9 V/μs (1) Ensured by design. Not production tested. 4

UC1823A, UC2823A, UC2823B, UC3823A, UC3823B, UC1825A, UC2825A, UC2825B, UC3825A, UC3825B www.ti.com SLUS334E − AUGUST 1995 − REVISED SEPTEMBER 2010 ELECTRICAL CHARACTERISTICS TA = −55°C to 125°C for the UC1823A/UC1825A, TA = −40°C to 85°C for the UC2823x/UC2825x, TA = 0°C to 70°C for the UC3823x/UC3825x, RT = 3.65 kΩ, CT = 1 nF, VCC = 12 V, TA = TJ (unless otherwise noted) PWM COMPARATOR IBIAS Bias current, RAMP VRAMP = 0 V −1 −8 μA Minimum duty cycle 0% Maximum duty cycle 85% tLEB Leading edge blanking time RLEB = 2 kΩ, CLEB = 470 pF 300 375 450 ns RLEB Leading edge blanking resistance VCLK/LEB = 3 V 8.5 10.0 11.5 kΩ VZDC Zero dc threshold voltage, EAOUT VRAMP = 0 V 1.10 1.25 1.4 V tDELAY Delay-to-output time(1) VEAOUT = 2.1 V, VILIM = 0 V to 2 V step 50 80 ns CURRENT LIMIT / START SEQUENCE / FAULT ISS Soft-start charge current VSS= 2.5 V 8 14 20 μA VSS Full soft-start threshold voltage 4.3 5 V IDSCH Restart discharge current VSS= 2.5 V 100 250 350 μA ISS Restart threshold voltage 0.3 0.5 V IBIAS ILIM bias current VILIM = 0 V to 2 V step 15 μA ICL Current limit threshold voltage 0.95 1 1.05 VV Overcurrent threshold voltage 1.14 1.2 1.26 td Delay-to-output time, ILIM(1) VILIM = 0 V to 2 V step 50 80 ns OUTPUT IOUT = 20 mA 0.25 0.4 LLooww-lleevveell oouuttppuutt ssaattuurraattiioonn vvoollttaaggee IOUT = 200 mA 1.2 2.2 VV IOUT = 20 mA 1.9 2.9 HHiigghh-lleevveell oouuttppuutt ssaattuurraattiioonn vvoollttaaggee IOUT = 200 mA 2 3 ttrf, Rise/fall time(1) CL = 1 nF 20 45 ns UNDERVOLTAGE LOCKOUT (UVLO) UC2823B, UC2825B, UC3825B, UC3825B 16 17 Start threshold voltage UC1823A, UC1825A, UC2823A, UC2825A 8.4 9.2 9.6 UC3825A, UC3825A Stop threshold voltage UC2823B, UC2825B, UC3825B, UC3825B 9 10 VV UC1823A, UC1825A, UC2823A, UC2825A 0.4 0.8 1.2 OOVVLLOO hhyysstteerreessiiss UC3825A, UC3825A UC2823B, UC2825B, UC3825B, UC3825B 5 6 7 SUPPLY CURRENT Isu Startup current VC = VCC = VTH(start) − 0.5 V 100 300 μA ICC Input current 28 36 mA (1) Ensured by design. Not production tested. 5

UC1823A, UC2823A, UC2823B, UC3823A, UC3823B, UC1825A, UC2825A, UC2825B, UC3825A, UC3825B www.ti.com SLUS334E − AUGUST 1995 − REVISED SEPTEMBER 2010 APPLICATION INFORMATION The oscillator of the UC3823A, UC3823B, UC3825A, and UC3825B is a saw tooth. The rising edge is governed by a current controlled by the RT pin and value of capacitance at the CT pin (C ). The falling edge of the sawtooth sets dead time for CT the outputs. Selection of RT should be done first, based on desired maximum duty cycle. CT can then be chosen based on the desired frequency (RT) and D . The design equations are: MAX (cid:4) (cid:6) 1.6(cid:3)D RT(cid:2)(10mA)(cid:3)3(cid:4)V1(cid:5)D (cid:6) CT(cid:2) (cid:4)R (cid:3)Mf(cid:6)AX MAX T (1) Recommended values for R range from 1 kΩ to 100 kΩ. Control of D less than 70% is not recommended. T MAX UDG−95102 Figure 1. Oscillator OSCILLATOR FREQUENCY MAXIMUM DUTY CYCLE vs vs TIMING RESISTANCE TIMING RESISTANCE 10 M 100 95 % y − Hz 1 M ycle − 90 c C en y 85 equ Dut Fr m f− 100 k mu 80 xi a M − AX 75 M D 10 k 70 1 k 10 k 100 k 1 k 10 k 100 k RT − Timing Resistance − (cid:3) RT − Timing Resistance − (cid:3) Figure 2 Figure 3 6

UC1823A, UC2823A, UC2823B, UC3823A, UC3823B, UC1825A, UC2825A, UC2825B, UC3825A, UC3825B www.ti.com SLUS334E − AUGUST 1995 − REVISED SEPTEMBER 2010 LEADING EDGE BLANKING The UC3823A, UC2823B, UC3825A, and UC3825B perform fixed frequency pulse width modulation control. The UC3823A, and UC3823B outputs operate together at the switching frequency and can vary from zero to some value less than 100%. The UC3825A and UC3825B outputs are alternately controlled. During every other cycle, one output is off. Each output then switches at one-half the oscillator frequency, varying in duty cycle from 0 to less than 50%. To limit maximum duty cycle, the internal clock pulse blanks both outputs low during the discharge time of the oscillator. On the falling edge of the clock, the appropriate output(s) is driven high. The end of the pulse is controlled by the PWM comparator, current limit comparator, or the overcurrent comparator. Normally the PWM comparator senses a ramp crossing a control voltage (error amplifier output) and terminates the pulse. Leading edge blanking (LEB) causes the PWM comparator to be ignored for a fixed amount of time after the start of the pulse. This allows noise inherent with switched mode power conversion to be rejected. The PWM ramp input may not require any filtering as result of leading edge blanking. To program a leading edge blanking (LEB) period, connect a capacitor, C, to CLK/LEB. The discharge time set by C and the internal 10-kΩ resistor determines the blanked interval. The 10-kΩ resistor has a 10% tolerance. For more accuracy, an external 2-kΩ 1% resistor (R) can be added, resulting in an equivalent resistance of 1.66 kΩ with a tolerance of 2.4%. The design equation is: t (cid:2)0.5(cid:3)(cid:4)R(cid:7)10k(cid:2)(cid:6)(cid:3)C LEB (2) Values of R less than 2 kΩ should not be used. Leading edge blanking is also applied to the current limit comparator. After LEB, if the ILIM pin exceeds the 1-V threshold, the pulse is terminated. The overcurrent comparator, however, is not blanked. It catches catastrophic overcurrent faults without a blanking delay. Any time the ILIM pin exceeds 1.2 V, the fault latch is set and the outputs driven low. For this reason, some noise filtering may be required on the ILIM pin. UDG−95105 Figure 4. Leading Edge Blanking Operational Waveforms 7

UC1823A, UC2823A, UC2823B, UC3823A, UC3823B, UC1825A, UC2825A, UC2825B, UC3825A, UC3825B www.ti.com SLUS334E − AUGUST 1995 − REVISED SEPTEMBER 2010 UVLO, SOFT-START AND FAULT MANAGEMENT Soft-start is programmed by a capacitor on the SS pin. At power up, SS is discharged. When SS is low, the error amplifier output is also forced low. While the internal 9-μA source charges the SS pin, the error amplifier output follows until closed loop regulation takes over. Anytime ILIM exceeds 1.2 V, the fault latch is set and the output pins are driven low. The soft-start cap is then discharged by a 250-μA current sink. No more output pulses are allowed until soft-start is fully discharged and ILIM is below 1.2 V. At this point the fault latch resets and the chip executes a soft-start. Should the fault latch get set during soft-start, the outputs are immediately terminated, but the soft-start capacitor does not discharge until it has been fully charged first. This results in a controlled hiccup interval for continuous fault conditions. UDG−95106 Figure 5. Soft-Start and Fault Waveforms ACTIVE LOW OUTPUTS DURING UVLO The UVLO function forces the outputs to be low and considers both VCC and VREF before allowing the chip to operate. UDG−95108 UDG−95106 Figure 6. Output Voltage vs Output Current Figure 7. Output V and I During UVLO 8

UC1823A, UC2823A, UC2823B, UC3823A, UC3823B, UC1825A, UC2825A, UC2825B, UC3825A, UC3825B www.ti.com SLUS334E − AUGUST 1995 − REVISED SEPTEMBER 2010 CONTROL METHODS Current Mode Voltage Mode UDG−95110 UDG−95109 . Figure 8. Control Methods SYNCHRONIZATION The oscillator can be synchronized by an external pulse inserted in series with the timing capacitor. Program the free running frequency of the oscillator to be 10% to 15% slower than the desired synchronous frequency. The pulse width should be greater than 10 ns and less than half the discharge time of the oscillator. The rising edge of the CLK/LEB pin can be used to generate a synchronizing pulse for other chips. Note that the CLK/LEB pin no longer accepts an incoming synchronizing signal. UDG−95111 UDG−95113 Figure 9. General Oscillator Synchronization Figure 10. Two Unit Interface UDG−95112 Figure 11. Operational Waveforms 9

UC1823A, UC2823A, UC2823B, UC3823A, UC3823B, UC1825A, UC2825A, UC2825B, UC3825A, UC3825B www.ti.com SLUS334E − AUGUST 1995 − REVISED SEPTEMBER 2010 HIGH CURRENT OUTPUTS Each totem pole output of the UC3823A and UC3823AB, UC3825A, and UC3825B can deliver a 2-A peak current into a capacitive load. The output can slew a 1000-pF capacitor by 15 V in approximately 20 ns. Separate collector supply (VC) and power ground (PGND) pins help decouple the device’s analog circuitry from the high-power gate drive noise. The use of 3-A Schottky diodes (1N5120, USD245, or equivalent) as shown in the Figure 13 from each output to both VC and PGND are recommended. The diodes clamp the output swing to the supply rails, necessary with any type of inductive/capacitive load, typical of a MOSFET gate. Schottky diodes must be used because a low forward voltage drop is required. DO NOT USE standard silicon diodes. Although they are single-ended devices, two output drivers are available on the UC3823A and UC3823B devices. These can be paralleled by the use of a 0.5 Ω (noninductive) resistor connected in series with each output for a combined peak current of 4 A. UDG−95114 Figure 12. Power MOSFET Drive Circuit GROUND PLANES Each output driver of these devices is capable of 2-A peak currents. Careful layout is essential for correct operation of the chip. A ground plane must be employed. A unique section of the ground plane must be designated for high di/dt currents associated with the output stages. This point is the power ground to which the PGND pin is connected. Power ground can be separated from the rest of the ground plane and connected at a single point, although this is not necessary if the high di/dt paths are well understood and accounted for. VCC should be bypassed directly to power ground with a good high frequency capacitor. The sources of the power MOSFET should connect to power ground as should the return connection for input power to the system and the bulk input capacitor. The output should be clamped with a high current Schottky diode to both VCC and PGND. Nothing else should be connected to power ground. VREF should be bypassed directly to the signal portion of the ground plane with a good high frequency capacitor. Low ESR/ESL ceramic 1-mF capacitors are recommended for both VCC and VREF. All analog circuitry should likewise be bypassed to the signal ground plane. 10

UC1823A, UC2823A, UC2823B, UC3823A, UC3823B, UC1825A, UC2825A, UC2825B, UC3825A, UC3825B www.ti.com SLUS334E − AUGUST 1995 − REVISED SEPTEMBER 2010 UDG−95115 Figure 13. Ground Planes Diagram OPEN LOOP TEST CIRCUIT This test fixture is useful for exercising many functions of this device family and measuring their specifications. As with any wideband circuit, careful grounding and bypass procedures should be followed. The use of a ground plane is highly recommended. UDG−95116 Figure 14. Open Loop Test Circuit Schematic 11

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 5962-87681022A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 87681022A UC1825AL/ 883B 5962-8768102EA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8768102EA UC1825AJ/883B 5962-89905022A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 89905022A UC1823AL/ 883B 5962-8990502EA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8990502EA UC1823AJ/883B 5962-8990502VEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8990502VE A UC1823AJQMLV UC1823AJ ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 UC1823AJ UC1823AJ883B ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8990502EA UC1823AJ/883B UC1823AL ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 UC1823AL UC1823AL883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 89905022A UC1823AL/ 883B UC1825AJ ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 UC1825AJ UC1825AJ883B ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8768102EA UC1825AJ/883B UC1825AL ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 UC1825AL UC1825AL883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 87681022A UC1825AL/ 883B UC2823ADW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2823ADW & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) UC2823ADWTR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2823ADW & no Sb/Br) UC2823AN ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 UC2823AN & no Sb/Br) UC2823BDW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2823BDW & no Sb/Br) UC2825ADW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2825ADW & no Sb/Br) UC2825ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2825ADW & no Sb/Br) UC2825ADWTR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2825ADW & no Sb/Br) UC2825ADWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2825ADW & no Sb/Br) UC2825AN ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 UC2825AN & no Sb/Br) UC2825ANG4 ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 UC2825AN & no Sb/Br) UC2825BDW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2825BDW & no Sb/Br) UC2825BDWG4 ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2825BDW & no Sb/Br) UC2825BN ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 UC2825BN & no Sb/Br) UC3823ADW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3823ADW & no Sb/Br) UC3823ADWTR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3823ADW & no Sb/Br) UC3823AN ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 UC3823AN & no Sb/Br) UC3823BDW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3823BDW & no Sb/Br) UC3823BDWTR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3823BDW & no Sb/Br) UC3825ADW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3825ADW & no Sb/Br) Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) UC3825ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3825ADW & no Sb/Br) UC3825ADWTR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3825ADW & no Sb/Br) UC3825ADWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3825ADW & no Sb/Br) UC3825AN ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 UC3825AN & no Sb/Br) UC3825ANG4 ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 UC3825AN & no Sb/Br) UC3825BDW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3825BDW & no Sb/Br) UC3825BDWTR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3825BDW & no Sb/Br) UC3825BN ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 UC3825BN & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF UC1823A, UC1823A-SP, UC1825A, UC2825A, UC3823A, UC3825A : •Catalog: UC3823A, UC1823A, UC3825A •Automotive: UC2825A-Q1 •Enhanced Product: UC2825A-EP •Military: UC1823A, UC1825A •Space: UC1823A-SP, UC1825A-SP NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects •Enhanced Product - Supports Defense, Aerospace and Medical Applications •Military - QML certified for Military and Defense Applications •Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2013 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) UC2823ADWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 UC2825ADWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 UC3823ADWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 UC3823BDWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 UC3825ADWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 UC3825BDWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2013 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) UC2823ADWTR SOIC DW 16 2000 367.0 367.0 38.0 UC2825ADWTR SOIC DW 16 2000 367.0 367.0 38.0 UC3823ADWTR SOIC DW 16 2000 367.0 367.0 38.0 UC3823BDWTR SOIC DW 16 2000 367.0 367.0 38.0 UC3825ADWTR SOIC DW 16 2000 367.0 367.0 38.0 UC3825BDWTR SOIC DW 16 2000 367.0 367.0 38.0 PackMaterials-Page2

IMPORTANTNOTICEANDDISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2020, Texas Instruments Incorporated