(cid:1)(cid:2)(cid:3)(cid:4)(cid:3)(cid:3) (cid:1)(cid:2)(cid:5)(cid:4)(cid:3)(cid:3) SLUS338A – JUNE 1993 – REVISED MAY 2001 (cid:7)(cid:1)(cid:8)(cid:9) (cid:10)(cid:2)(cid:11)(cid:12)(cid:13)(cid:13)(cid:14)(cid:15) (cid:9)(cid:16)(cid:12)(cid:9)(cid:17) (cid:8)(cid:18)(cid:18)(cid:8)(cid:15) FEATURES DESCRIPTION (cid:1) Matched, Four-Diode Monolithic Array This four-diode array is designed for general (cid:1) High Peak Current purpose use as individual diodes or as a (cid:1) Low-Cost MINIDIP Package high-speed, high-current bridge. It is particularly (cid:1) useful on the outputs of high-speed power Low-Forward Voltage MOSFET drivers where Schottky diodes are (cid:1) Parallelable for Lower V or Higher I F F needed to clamp any negative excursions caused (cid:1) Fast Recovery Time by ringing on the driven line.These diodes are also (cid:1) Military Temperature Range Available ideally suited for use as voltage clamps when driving inductive loads such as relays and solenoids, and to provide a path for current free-wheeling in motor drive applications.The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time.This single monolithic chip is fabricated in both hermetic CERDIP and copper-eaded plastic packages. The UC1611 in ceramic is designed for –55°C to 125°C environments but with reduced peak current capability: while the UC3611 in plastic has higher current rating over a 0°C to 70°C ambient temperature range. AVAILABLE OPTIONS Packaged Devices TTA = TTJ SOIC Wide (DW) DIL (J) DIL (N) –55°C to 125°C UC1611DW UC1611J UC1611N 0°C to 70°C UC3611DW UC3611J UC3611N (cid:19)(cid:18)(cid:12)(cid:9)(cid:1)(cid:2)(cid:13)(cid:16)(cid:12)(cid:20) (cid:9)(cid:8)(cid:13)(cid:8) (cid:21)(cid:22)(cid:23)(cid:24)(cid:25)(cid:26)(cid:27)(cid:28)(cid:21)(cid:24)(cid:22) (cid:21)(cid:29) (cid:30)(cid:31)(cid:25)(cid:25) (cid:22)(cid:28) (cid:27)(cid:29) (cid:24)(cid:23) !(cid:31)"#(cid:21)(cid:30)(cid:27)(cid:28)(cid:21)(cid:24)(cid:22) $(cid:27)(cid:28) % Copyright  2001, Texas Instruments Incorporated (cid:19)(cid:25)(cid:24)$(cid:31)(cid:30)(cid:28)(cid:29) (cid:30)(cid:24)(cid:22)(cid:23)(cid:24)(cid:25)(cid:26) (cid:28)(cid:24) (cid:29)! (cid:30)(cid:21)(cid:23)(cid:21)(cid:30)(cid:27)(cid:28)(cid:21)(cid:24)(cid:22)(cid:29) ! (cid:25) (cid:28)& (cid:28) (cid:25)(cid:26)(cid:29) (cid:24)(cid:23) (cid:13) ’(cid:27)(cid:29) (cid:16)(cid:22)(cid:29)(cid:28)(cid:25)(cid:31)(cid:26) (cid:22)(cid:28)(cid:29) (cid:29)(cid:28)(cid:27)(cid:22)$(cid:27)(cid:25)$ ((cid:27)(cid:25)(cid:25)(cid:27)(cid:22)(cid:28))% (cid:19)(cid:25)(cid:24)$(cid:31)(cid:30)(cid:28)(cid:21)(cid:24)(cid:22) !(cid:25)(cid:24)(cid:30) (cid:29)(cid:29)(cid:21)(cid:22)* $(cid:24) (cid:29) (cid:22)(cid:24)(cid:28) (cid:22) (cid:30) (cid:29)(cid:29)(cid:27)(cid:25)(cid:21)#) (cid:21)(cid:22)(cid:30)#(cid:31)$ (cid:28) (cid:29)(cid:28)(cid:21)(cid:22)* (cid:24)(cid:23) (cid:27)## !(cid:27)(cid:25)(cid:27)(cid:26) (cid:28) (cid:25)(cid:29)% www.ti.com 1

(cid:1)(cid:2)(cid:3)(cid:4)(cid:3)(cid:3) (cid:1)(cid:2)(cid:5)(cid:4)(cid:3)(cid:3) SLUS338A – JUNE 1993 – REVISED MAY 2001 J OR N PACKAGE DW PACKAGE (TOP VIEW) (TOP VIEW) absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Peak inverse voltage (per diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V Diode-to-diode voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 V Peak forward current UC1611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 A UC3611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 A Power dissipation at T = 70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W A Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C stg Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C †Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. ‡Please consult packaging section of data book for thermal limitations and considerations of package. electrical characteristics, all specifications apply to each individual diode, T = 25°C, T = T , J A J (except as noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNITS IF = 100 mA 0.3 0.4 0.7 V FFoorrwaarrdd voollttaaggee ddrroopp IF = 1 A 0.9 1.2 V VR = 40 V 0.01 0.1 mA LLeeaakkaaggee ccuurrrreenntt VR = 40 V, TJ = 100°C 0.1 1.0 mA Reverse recovery 0.5 A forward to 0.5 A reverse 20 ns Forward recovery 1 A forward to 1.1 V recovery 40 ns Junction capacitance VR = 5V 100 pF NOTE: At forward currents of greater than 1.0 A, a parasitic current of approximately 10 mA may be collected by adjacent diodes. 2 www.ti.com

(cid:1)(cid:2)(cid:3)(cid:4)(cid:3)(cid:3) (cid:1)(cid:2)(cid:5)(cid:4)(cid:3)(cid:3) SLUS338A – JUNE 1993 – REVISED MAY 2001 APPLICATION INFORMATION REVERSE CURRENT FORWARD CURRENT vs vs VOLTAGE VOLTAGE 1000 5.0 500 3.0 2.0 300 200 1.0 µ– A 100 TJ = 125 °C – A 00..35 nt nt 0.2 e 50 e urr urr 0.1 TJ = –55 °C C 30 C e d 0.05 g 20 r a a Leak 10 Forw00..0023 TJ = 25 °C 0.01 5 T = 75 °C TJ = 25 °C J 0.005 3 0.003 TJ = 125 °C 2 0.002 1 0.001 0 10 20 30 40 50 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Reverse Voltage – V Forward Voltage – V Figure 1 Figure 2 Figure 3. Clamp Diodes – PWMs and Drivers www.ti.com 3

(cid:1)(cid:2)(cid:3)(cid:4)(cid:3)(cid:3) (cid:1)(cid:2)(cid:5)(cid:4)(cid:3)(cid:3) SLUS338A – JUNE 1993 – REVISED MAY 2001 APPLICATION INFORMATION Figure 4. Transformer Coupled Drive Circuits Figure 5. Linear Regulations 4 www.ti.com

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 5962-90538012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 90538012A UC1611L/ 883B 5962-9053801PA ACTIVE CDIP JG 8 1 TBD Call TI N / A for Pkg Type -55 to 125 9053801PA UC1611 5962-9053801V2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 9053801V2A UC1611L QMLV 5962-9053801VPA ACTIVE CDIP JG 8 1 TBD Call TI N / A for Pkg Type -55 to 125 9053801VPA UC1611 UC1611J ACTIVE CDIP JG 8 1 TBD Call TI N / A for Pkg Type -55 to 125 UC1611J UC1611J883B ACTIVE CDIP JG 8 1 TBD Call TI N / A for Pkg Type -55 to 125 9053801PA UC1611 UC1611L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 90538012A UC1611L/ 883B UC3611DW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3611DW & no Sb/Br) UC3611J ACTIVE CDIP JG 8 1 TBD Call TI N / A for Pkg Type 0 to 70 UC3611J UC3611N ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 UC3611N & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF UC1611, UC1611-SP, UC3611, UC3611M : •Catalog: UC3611, UC1611, UC3611M, UC3611 •Military: UC1611, UC1611 •Space: UC1611-SP NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Military - QML certified for Military and Defense Applications •Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 2

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