application UC1706 INFO UC2706 available UC3706 Dual Output Driver FEATURES DESCRIPTION • Dual, 1.5A Totem Pole Outputs The UC1706 family of output drivers are made with a high-speed Schottky process to interface between low-level control functions and • 40nsec Rise and Fall into 1000pF high-power switching devices - particularly power MOSFET's.These de- • Parallel or Push-Pull Operation vices implement three generalized functions as outlined below. • Single-Ended to Push-Pull Conversion First:Theyacceptasingle-ended,low-currentdigitalinputofeitherpolar- ity and process it to activate a pair of high-current, totem pole outputs • High-Speed, PowerMOSFET which can source or sink up to 1.5A each. Compatible Second: They provide an optional single-ended to push-pull conversion • Low Cross-Conduction Current Spike through the use of an internal flip-flop driven by double-pulse- • Analog, Latched Shutdown suppression logic.With the flip-flop disabled, the outputs work in parallel for 3.0A capability. • InternalDeadbandInhibit Circuit Third: Protection functions are also included for pulse-by-pulse current • Low Quiescent Current limiting, automaticdeadbandcontrol, and thermal shutdown. • 5 to 40V Operation These devices are available in a two-watt plastic “bat-wing” DIP for op- eration over a 0°C to 70°C temperature range and, with reduced power, • Thermal Shutdown Protection in a hermetically sealed cerdip for -55°C to +125°C operation.Also avail- • 16-Pin Dual-In-Line Package able in surface mount Q and L packages. • 20-Pin Surface Mount Package TRUTH TABLE INV N.I OUT OUT =INVand N.I. H H L OUT=INVorN.I. L H H H L L L L L BLOCK DIAGRAM SLUS200A - OCTOBER 1998 - REVISED APRIL 2001

UC1706 UC2706 UC3706 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . N--Pkg. . . . . . . . . . . . . . . J--Pkg Supply Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . .40V. . . . . . . . . . . . . . . . . .40V Collector Supply Voltage, VC. . . . . . . . . . . . . . . . . .40V. . . . . . . . . . . . . . . . . .40V Output Current (Each Output, Source or Sink) Steady--State . . . . . . . . . . . . . . . . . . . . . . . . . .±500mA. . . . . . . . . . . . . . .±500mA Peak Transient . . . . . . . . . . . . . . . . . . . . . . . . . .±1.5A. . . . . . . . . . . . . . . . .±1.0A Capacitive Discharge Energy . . . . . . . . . . . . . . .20µ.J . . . . . . . . . . . . . . . . . .15µJ Digital Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5.5V . . . . . . . . . . . . . . . . .5.5V Analog Stop Inputs. . . . . . . . . . . . . . . . . . . . . . . . . .VI.N . . . . . . . . . . . . . . . . . . .VIN Power Dissipation at TA= 25°C (See Note). . . . . . .2W . . . . . . . . . . . . . . . . . .1W Power Dissipation at T (Leads/Case) = 25°C. . . . . .5W. . . . . . . . . . . . . . . . . . .2 (See Note) Operating Temperature Range. . . . . . . . . . . . . . . . . . . . . .--55°C to +125°C Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .--65°C to +150°C Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . . . . . . .300°C Note:All voltages are with respect to the four ground pins which must be connected together.All currents are positive into, negative out of the specifiedtrerminal.Consult Packaging sections of theDatabookfor thermal limitations and considerations of package. CONNECTION DIAGRAMS DIL-16,SOIC-16 (TOP VIEW) PLCC-20,LCC-20(TOP VIEW) J or N Package,DW Package Q,L Packages N/C BINHIBIT AINHIBIT BINHIBIT 1 16 AINHIBIT INVINPUT INHIBITREF INV.INPUT 2 15 INHIBITREF 3 2 1 20 19 N.I.INPUT 3 14 VIN N.I.INPUT 4 18 VIN GROUND 5 17 GROUND GROUND 4 13 GROUND N/C 6 16 N/C GROUND 5 12 GROUND GROUND 7 15 GROUND AOUTPUT 6 11 BOUTPUT AOUTPUT 8 14 BOUTPUT 9 10 11 12 13 FLIP/FLOP 7 10 STOPNON-INV. FLIP/FLOP STOPINV. VC STOPNON-INV. VC 8 9 STOPINV. N/C Note:All four ground pins must be connected to a common ground. ELECTRICAL CHARACTERISTICS:Unless otherwise stated, these specifications apply for TA= –55°C to +125°C for the UC1706, –25°C to +85°C for the UC2706 and 0°C to +70°C for the UC3706; VIN= VC= 20V. TA=TJ. PARAMETERS TEST CONDITIONS MIN TYP MAX UNITS VINSupply Current VIN= 40V 8 10 mA VCSupply Current VC= 40V, Outputs Low 4 5 mA VCLeakage Current VIN= 0, VC= 30V, No Load .05 0.1 mA Digital Input Low Level 0.8 V Digital Input High Level 2.2 V Input Current VI= 0 –0.6 –1.0 mA Input Leakage VI= 5V .05 0.1 mA 2

UC1706 UC2706 UC3706 ELECTRICAL CHARACTERISTICS:Unless otherwise stated, these specifications apply for TA= –55°C to +125°C for the UC1706, –25°C to +85°C for the UC2706 and 0°C to +70°C for the UC3706; VIN= VC= 20V. TA=TJ. PARAMETERS TEST CONDITIONS MIN TYP MAX UNITS Output High Sat., VC-VO IO= -50mA 2.0 V Output Low Sat., VO IO= 50mA 0.4 V IO= 500mA 2.5 V Inhibit Threshold VREF= 0.5V 0.4 0.6 V VREF= 3.5V 3.3 3.7 V Inhibit Input Current VREF= 0 –10 –20 µA Analog Threshold VCM= 0 to 15V, for the UC2706 and UC3706 100 130 160 mV VCM= 0 to 15V, for the UC1706 80 130 160 mV Input Bias Current VCM= 0 –10 –20 µA Thermal Shutdown 155 °C TYPICAL SWITCHING CHARACTERISTICS:VIN= VC= 20V, TA= 25°C. Delays measured to 10% output change. PARAMETERS TEST CONDITIONS OUTPUT CL= UNITS From Inv. Input to Output: open 1.0 2.2 nF Rise Time Delay 110 130 140 ns 10% to 90% Rise 20 40 60 ns Fall Time Delay 80 90 110 ns 90% to 10% Fall 25 30 50 ns From N. I. Input to Output: Rise Time Delay 120 130 140 ns 10% to 90% Rise 20 40 60 ns Fall Time Delay 100 120 130 ns 90% to 10% Fall 25 30 50 ns VCCross-Conduction Current Spike Duration Output Rise 25 ns Output Fall 0 ns Inhibit Delay Inhibit Ref. = 1V, Inhibit Inv. = 0.5 to 1.5V 250 ns Analog Shutdown Delay Stop Non-Inv. = 0V, Stop Inv. = 0 to 0.5V 180 ns CIRCUIT DESCRIPTION Outputs Digital Inputs The totem-pole outputs have been designed to minimize With both an inverting and non-inverting input available, cross-conduction current spikes while maximizing fast, either active-high or active-low signals may be accepted. high-current rise and fall times. Current limiting can be These are true TTL compatible inputs—the threshold is done externally either at the outputs or at the common approximately 1.2V with no hysteresis;and external pull- VC pin. The output diodes included have slow recovery up resistors are not required. and should be shunted with high-speed external diodes Inhibit Circuit when driving high-frequency inductive loads. Althoughitmayhaveotheruses,thiscircuitisincludedto Flip/Flop eliminate the need for deadband control when driving Grounding pin 7 activates the internal flip-flop to alter- relatively slow bipolar power transistors. A diode from nate the two outputs. With pin 7 open, the two outputs each inhibit input to the opposite power switch collector operate simultaneously and can be paralleled for higher will keep one output from turning-on until the other has current operation. Since the flip-flop is triggered by the turned-off. Thethresholdisdeterminedbythevoltageon digital input, an off-time of at last 200nsec must be pro- pin 15 which can be set from 0.5 to 3.5V. When this cir- videdtoallowtheflip/floptochangestates. Notethatthe cuit is not used, ground pin 15 and leave 1 and 16 open. circuit logic is configured such that the “OFF” state is de- fined as the outputs low. 3

UC1706 UC2706 CIRCUIT DESCRIPTION (cont.) UC3706 Analog Shutdown use with a 7 to 40V supply; however, with some slight re- Thiscircuitisincludedtogetalatchedshutdownasclose sponse time degradation, it can also be driven from 5V. to the outputs as possible, from a time standpoint. With When VIN is low, the entire circuit is disabled and no cur- an internal 130mV threshold, this comparator has a rent is drawn from VC. When combined with a UC1840 common-mode range from ground to (VIN – 3V). When PWM,theDriverBiasswitchcanbeusedtosupplyVINto not used, both inputs should be grounded. The time re- the UC1706. VIN switching should be fast as if VC is quired for this circuit to latch is inversely proportional to high, undefined operation of the outputs may occur with the amount of overdrive but reaches a minimum of VINless than 5V. 180nsec. Aswiththeflip-flop,aninputoff-timeofatleast Thermal Considerations 200nsec is required to reset the latch between pulses. Should the chip temperature reach approximately 155°C, Supply Voltage a parallel, non--inverting input is activated driving both With an internal 5V regulator, this circuit is optimized for outputs to the low state. APPLICATIONS D1, D2;UC3611SchottkyDiodes D1, D2;UC3611SchottkyDiodes PowerMOSFETDrive Circuit PowerMOSFETDrive Circuit Using Negative Bias Voltage and Level Shifting to Ground ReferencedPWMs D1, D2:UC3611SchottkyDiodes Transformer CoupledMOSFETDrive Circuit Charge Pump Circuits 4

UC1706 UC2706 APPLICATIONS (cont'd) UC3706 D1, D2:UC3611SchottkyDiodes D1, D2:UC3611SchottkyDiodes Power Bipolar Drive Circuit Transformer Coupled Push-PullMOSFETDrive Circuit UC3706 Converts Single OutputPWMsto High Current Push-Pull Configuration UNITRODECORPORATION 7 CONTINENTALBLVD.(cid:127) MERRIMACK, NH 03054 TEL.(603) 424-2410 (cid:127) FAX (603) 424-3460 5

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 5962-89611012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 89611012A 5962-8961101EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8961101EA UC1706J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 UC1706J UC1706J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 UC1706J/883B UC1706L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 UC1706L UC2706DW ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2706DW & no Sb/Br) UC2706J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -40 to 85 UC2706J UC2706N ACTIVE PDIP N 16 25 Green (RoHS CU NIPDAU | Call TI N / A for Pkg Type -40 to 85 UC2706N & no Sb/Br) UC3706DW ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3706DW & no Sb/Br) UC3706DWTR ACTIVE SOIC DW 16 2000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3706DW & no Sb/Br) UC3706N ACTIVE PDIP N 16 25 Green (RoHS CU NIPDAU | Call TI N / A for Pkg Type 0 to 70 UC3706N & no Sb/Br) UC3706NG4 ACTIVE PDIP N 16 25 Green (RoHS Call TI N / A for Pkg Type 0 to 70 UC3706N & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF UC1706, UC2706, UC2706M, UC3706 : •Catalog: UC3706, UC2706 •Military: UC2706M, UC1706 NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Military - QML certified for Military and Defense Applications Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 15-Jan-2014 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) UC3706DWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 15-Jan-2014 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) UC3706DWTR SOIC DW 16 2000 367.0 367.0 38.0 PackMaterials-Page2

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