ICGOO在线商城 > 集成电路(IC) > PMIC - 稳压器 - DC DC 切换控制器 > UC2524ADW
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UC2524ADW产品简介:
ICGOO电子元器件商城为您提供UC2524ADW由Texas Instruments设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 UC2524ADW价格参考¥6.08-¥13.76。Texas InstrumentsUC2524ADW封装/规格:PMIC - 稳压器 - DC DC 切换控制器, 升压,反激,正激转换器,全桥,半桥,推挽 稳压器 正 输出 升压,升压/降压 DC-DC 控制器 IC 16-SOIC。您可以下载UC2524ADW参考资料、Datasheet数据手册功能说明书,资料中有UC2524ADW 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | 集成电路 (IC)半导体 |
Cuk | 无 |
描述 | IC REG CTRLR BST FLYBK VM 16SOIC开关控制器 Advanced Regulating |
产品分类 | |
品牌 | Texas Instruments |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 电源管理 IC,开关控制器 ,Texas Instruments UC2524ADW- |
数据手册 | |
产品型号 | UC2524ADW |
PWM类型 | 电压模式 |
上升时间 | 120 ns |
下降时间 | 25 ns |
产品目录页面 | |
产品种类 | 开关控制器 |
倍增器 | 无 |
其它名称 | 296-11151-5 |
分频器 | 无 |
包装 | 管件 |
升压 | 是 |
单位重量 | 473.700 mg |
占空比 | 45% |
占空比-最大 | 50 % |
反向 | 无 |
反激式 | 是 |
同步管脚 | Yes |
商标 | Texas Instruments |
安装风格 | SMD/SMT |
封装 | Tube |
封装/外壳 | 16-SOIC(0.295",7.50mm 宽) |
封装/箱体 | SOIC-16 Wide |
工作温度 | -40°C ~ 85°C |
工厂包装数量 | 40 |
开关频率 | 450 kHz |
拓扑结构 | Boost, Flyback, Forward, Full-Bridge, Half-Bridge, Push-Pull |
最大工作温度 | + 85 C |
最小工作温度 | - 40 C |
标准包装 | 40 |
电压-电源 | 8 V ~ 40 V |
类型 | Voltage Mode PWM Controllers |
系列 | UC2524A |
输出数 | 2 |
输出电压 | 60 V |
输出电流 | 200 mA |
输出端数量 | 2 Output |
降压 | 无 |
隔离式 | 无 |
频率-最大值 | 500kHz |
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PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 5962-8764502EA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8764502EA UC1524AJ ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 UC1524AJ UC1524AJ883B ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 UC1524AJ/883B UC1524AL ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 UC1524AL UC1524AL883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 UC1524AL/ 883B UC2524ADW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2524ADW & no Sb/Br) UC2524ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2524ADW & no Sb/Br) UC2524ADWTR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2524ADW & no Sb/Br) UC2524AJ ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -40 to 85 UC2524AJ UC2524AN ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 UC2524AN & no Sb/Br) UC3524ADW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3524ADW & no Sb/Br) UC3524ADWTR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3524ADW & no Sb/Br) UC3524AJ ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type 0 to 70 UC3524AJ UC3524AN ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 UC3524AN & no Sb/Br) UC3524ANG4 ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 UC3524AN & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1
PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF UC1524A, UC2524A, UC2524AM, UC3524A, UC3524AM : •Catalog: UC3524A, UC2524A, UC3524AM, UC3524A •Military: UC2524AM, UC1524A, UC1524A NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Military - QML certified for Military and Defense Applications Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 24-Jun-2016 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) UC2524ADWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 UC3524ADWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 PackMaterials-Page1
PACKAGE MATERIALS INFORMATION www.ti.com 24-Jun-2016 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) UC2524ADWTR SOIC DW 16 2000 367.0 367.0 38.0 UC3524ADWTR SOIC DW 16 2000 367.0 367.0 38.0 PackMaterials-Page2
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GENERIC PACKAGE VIEW DW 16 SOIC - 2.65 mm max height 7.5 x 10.3, 1.27 mm pitch SMALL OUTLINE INTEGRATED CIRCUIT This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4224780/A www.ti.com
PACKAGE OUTLINE DW0016A SOIC - 2.65 mm max height SCALE 1.500 SOIC C 10.63 SEATING PLANE TYP 9.97 A PIN 1 ID 0.1 C AREA 14X 1.27 16 1 10.5 2X 10.1 8.89 NOTE 3 8 9 0.51 16X 0.31 7.6 B 7.4 0.25 C A B 2.65 MAX NOTE 4 0.33 TYP 0.10 SEE DETAIL A 0.25 GAGE PLANE 0.3 0 - 8 0.1 1.27 0.40 DETAIL A (1.4) TYPICAL 4220721/A 07/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side. 5. Reference JEDEC registration MS-013. www.ti.com
EXAMPLE BOARD LAYOUT DW0016A SOIC - 2.65 mm max height SOIC 16X (2) SEE SYMM DETAILS 1 16 16X (0.6) SYMM 14X (1.27) 8 9 R0.05 TYP (9.3) LAND PATTERN EXAMPLE SCALE:7X METAL SOLDER MASK SOLDER MASK METAL OPENING OPENING 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220721/A 07/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com
EXAMPLE STENCIL DESIGN DW0016A SOIC - 2.65 mm max height SOIC 16X (2) SYMM 1 16 16X (0.6) SYMM 14X (1.27) 8 9 R0.05 TYP (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:7X 4220721/A 07/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com
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