Product Order Technical Tools & Support & Reference Folder Now Documents Software Community Design TS3A24159 SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 TS3A24159 0.3-Ω 2-channel SPDT Bidirectional Analog Switch Dual-channel 2:1 Multiplexer and Demultiplexer 1 Features 3 Description • Specifiedbreak-before-makeswitching The TS3A24159 is a 2-channel single-pole double- 1 throw (SPDT) bidirectional analog switch that is • LowON-stateresistance(0.3Ω max) designedtooperatefrom1.65 V to 3.6 V. It offers low • Lowchargeinjection ON-state resistance and excellent ON-state • ExcellentON-stateresistancematching resistance matching with the break-before-make feature, to prevent signal distortion during the • Lowtotalharmonicdistortion(THD) transferring of a signal from one channel to another. • 1.65-Vto3.6-VSingle-supplyoperation The device has excellent total harmonic distortion • Controlinputsare1.8-Vlogiccompatible (THD) performance, low ON-state resistence, and consumes very low power. These are some of the • Latch-upperformanceexceeds100mAperJESD features that make this device suitable for a variety of 78,classII marketsandmanydifferentapplications. • ESDPerformancetestedperJESD22 – 2000-VHuman-bodymodel DeviceInformation(1) (A114-B,ClassII) PARTNUMBER PACKAGE BODYSIZE(NOM) – 1000-VCharged-devicemodel(C101) VSSOP(10) 3.00mm×3.00mm TS3A24159 VSON(10) 3.00mm×3.00mm 2 Applications DSBGA(10) 1.86mm×1.35mm • Cellphones (1) For all available packages, see the orderable addendum at • Personaldigitalassistant(PDAs) theendofthedatasheet. • Portableinstrumentation • Audioandvideosignalrouting • Low-voltagedata-acquisitionsystems • Communicationcircuits • Modems • Harddrives • Computerperipherals • Wirelessterminalsandperipherals FunctionalBlockDiagram SPDT NC1 COM1 NO1 IN1 Logic Control SPDT NC2 COM2 NO2 IN2 Logic Control 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

TS3A24159 SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 www.ti.com Table of Contents 1 Features.................................................................. 1 8.1 Overview.................................................................17 2 Applications........................................................... 1 8.2 FunctionalBlockDiagram.......................................17 3 Description............................................................. 1 8.3 FeatureDescription.................................................17 8.4 DeviceFunctionalModes........................................17 4 RevisionHistory..................................................... 2 9 ApplicationandImplementation........................ 18 5 PinConfigurationandFunctions......................... 3 9.1 ApplicationInformation............................................18 6 Specifications......................................................... 5 9.2 TypicalApplication .................................................18 6.1 AbsoluteMaximumRatings .....................................5 10 PowerSupplyRecommendations..................... 20 6.2 ESDRatings..............................................................5 11 Layout................................................................... 20 6.3 RecommendedOperatingConditions.......................5 6.4 ThermalInformation..................................................6 11.1 LayoutGuidelines.................................................20 6.5 ElectricalCharacteristicsfor3-VSupply..................6 11.2 LayoutExample....................................................20 6.6 ElectricalCharacteristicsfor2.5-VSupply...............7 12 DeviceandDocumentationSupport................. 21 6.7 ElectricalCharacteristicsfor1.8-VSupply...............8 12.1 DocumentationSupport........................................21 6.8 SwitchingCharacteristicsfora3-VSupply.............10 12.2 CommunityResources..........................................21 6.9 SwitchingCharacteristicsfora2.5-VSupply..........10 12.3 Trademarks...........................................................21 6.10 SwitchingCharacteristicsfora1.8-VSupply........10 12.4 ElectrostaticDischargeCaution............................21 6.11 TypicalCharacteristics..........................................11 12.5 Glossary................................................................21 7 ParameterMeasurementInformation................13 13 Mechanical,Packaging,andOrderable Information........................................................... 21 8 DetailedDescription............................................ 17 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionE(March2019)toRevisionF Page • ChangedtheYZPpackageimageviewFrom:Top-ThroughViewTo:BottomView............................................................ 4 ChangesfromRevisionD(July2015)toRevisionE Page • ChangedtheYZPPackageimageanddeletedtheYZPPackageTerminalAssignmentstable.......................................... 4 • ChangedTurnontimeV (Full)valueFrom:2.3Vto2.7VTo:2.7Vto3.6VinSwitchingCharacteristicsfora3-V CC Supply................................................................................................................................................................................... 10 • ChangedTurnontimeV (Full)valueFrom:2.3Vto2.7VTo:2.7Vto3.6VinSwitchingCharacteristicsfora2.5- CC VSupply............................................................................................................................................................................... 10 ChangesfromRevisionC(February2008)toRevisionD Page • AddedPinConfigurationandFunctionssection,ESDRatingstable,FeatureDescriptionsection,DeviceFunctional Modes,ApplicationandImplementationsection,PowerSupplyRecommendationssection,Layoutsection,Device andDocumentationSupportsection,andMechanical,Packaging,andOrderableInformationsection .............................. 1 • ChangedV+toV throughoutthedocumenttomeetJEDECstandards............................................................................ 1 CC 2 SubmitDocumentationFeedback Copyright©2007–2019,TexasInstrumentsIncorporated ProductFolderLinks:TS3A24159

TS3A24159 www.ti.com SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 5 Pin Configuration and Functions DGSPackage DRCPackage 10-PinVSSOP 10-PinVSON TopView TopView V 1 10 NO2 V 1 10 NO2 CC CC NO1 2 9 COM2 NO1 2 9 COM2 COM1 3 8 IN2 COM1 3 8 IN2 IN1 4 7 NC2 IN1 4 7 NC2 NC1 5 6 GND NC1 5 6 GND PinFunctions-VSSOPandVSON PIN I/O DESCRIPTION NO. NAME 1 V — PowerSupply CC 2 NO1 I/O NormallyOpenSignalPath 3 COM1 I/O CommonSignalPath 4 IN1 I DigitalControltoConnectCOMtoNOorNC 5 NC1 I/O NormallyClosedSignalPath 6 GND — Ground 7 NC2 I/O NormallyClosedSignalPath 8 IN2 I DigitalControltoConnectCOMtoNOorNC 9 COM2 I/O CommonSignalPath 10 NO2 I/O NormallyOpenSignalPath Copyright©2007–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:TS3A24159

TS3A24159 SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 www.ti.com YZPPackage 10-PinDSBGA BottomView 1 2 3 A NC1 GND NC2 B IN1 IN2 C COM1 COM2 D NO1 VCC NO2 Not to scale PinFunctions-DSBGA PIN I/O DESCRIPTION NO. NAME A1 NC1 I/O NormallyClosedSignalPath A2 GND — Ground A3 NC2 I/O NormallyClosedSignalPath B1 IN1 I DigitalControltoConnectCOMtoNOorNC B3 IN2 I DigitalControltoConnectCOMtoNOorNC C1 COM1 I/O CommonSignalPath C3 COM2 I/O CommonSignalPath D1 NO1 I/O NormallyOpenSignalPath D2 V — PowerSupply CC D3 NO2 I/O NormallyOpenSignalPath 4 SubmitDocumentationFeedback Copyright©2007–2019,TexasInstrumentsIncorporated ProductFolderLinks:TS3A24159

TS3A24159 www.ti.com SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted) (1) (2) MIN MAX UNIT V Supplyvoltage(3) –0.5 3.6 V CC V NC V Signalvoltage(3)(4) –0.5 V +0.5 V NO CC V COM I Analogportdiodecurrent V ,V ,V <0 –50 50 mA I/OK NC NO COM I ON-stateswitchcurrent –300 300 NC I V ,V ,V =0toV mA INO ON-statepeakswitchcurrent(5) NC NO COM CC –500 500 COM V Digitalinputvoltage –0.5 3.6 V IN I Digitalinputclampcurrent(3) V <0 –50 mA IK I I ContinuouscurrentthroughV 100 mA CC CC I ContinuouscurrentthroughGND –100 mA GND T Storagetemperature –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Thealgebraicconvention,wherebythemostnegativevalueisaminimumandthemostpositivevalueisamaximum (3) Allvoltagesarewithrespecttoground,unlessotherwisespecified. (4) Thisvalueislimitedto5.5Vmaximum. (5) Pulseat1-msduration<10%dutycycle 6.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) 2000 V(ESD) Electrostaticdischarge Charged-devicemodel(CDM),perJEDECspecificationJESD22-C101or V ANSI/ESDA/JEDECJS-002(2) 1000 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V SupplyVoltage 1.65 3.6 V CC V NC V SignalVoltage 0 V V NO CC V COM V DigitalInputVoltage 0 V V IN CC Copyright©2007–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:TS3A24159

TS3A24159 SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 www.ti.com 6.4 Thermal Information TS3A24159 THERMALMETRIC(1) DGS(VSSOP) DRC(VSON) YZP(DSBGA) UNIT 10PINS 10PINS 10PINS R Junction-to-ambientthermalresistance 154 49.4 90.9 °C/W θJA R Junction-to-case(top)thermalresistance 37.9 71.2 0.3 °C/W θJC(top) R Junction-to-boardthermalresistance 83.6 23.8 8.3 °C/W θJB ψ Junction-to-topcharacterizationparameter 1.4 2.2 3.2 °C/W JT ψ Junction-to-boardcharacterizationparameter 82.2 23.8 8.3 °C/W JB R Junction-to-case(bottom)thermalresistance N/A 6.1 N/A °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. 6.5 Electrical Characteristics for 3-V Supply V =2.7Vto3.6V,T =–40°Cto85°C(unlessotherwisenoted) (1) CC A PARAMETER TESTCONDITIONS T V MIN TYP MAX UNIT A CC ANALOGSWITCH Analogsignal V ,V , COM NO 0 V V range V CC NC PeakON 0≤(V orV )≤V , SwitchON, 25°C 0.2 0.3 r NO NC CC 2.7V Ω resistance peak ICOM=–100mA, SeeFigure10 Full 0.35 ON-state V orV =2V, SwitchON, 25°C 0.26 0.3 r NO NC 2.7V Ω resistance on ICOM=–100mA, SeeFigure10 Full 0.34 ON-state 25°C 0.01 0.05 V orV =2V,0.8V, SwitchON, resistancematch Δr NO NC 2.7V Ω betweenchannels on ICOM=–100mA, SeeFigure10 Full 0.05 0≤(V orV )≤V , SwitchON, NO NC CC 25°C 0.13 Ω I =–100mA, SeeFigure10 ON-state COM r 2.7V resistanceflatness on(flat) V orV =2V,0.8V, SwitchON, 25°C 0.01 0.04 NO NC Ω ICOM=–100mA, SeeFigure10 Full 0.05 NC,NO V orV =1V,V =3V, 25°C –10 10 I , NC NO COM SwitchOFF, OFFleakage NC(OFF) or 3.6V nA current INO(OFF) V orV =3V,V =1V, SeeFigure11 Full –50 50 NC NO COM NC,NO V orV =1V,V =Open, 25°C –10 10 I , NC NO COM SwitchON, ONleakage NC(ON) or 3.6V nA current INO(ON) V orV =3V,V =Open, SeeFigure12 Full –100 100 NC NO COM COM V orV =Open,V =1V, 25°C –10 10 NC NO COM SwitchON, ONleakage I or 3.6V nA current COM(ON) V orV =Open,V =3V, SeeFigure12 Full –100 100 NC NO COM DIGITALCONTROLINPUTS(IN1,IN2)(2) Inputlogichigh V Full 1.4 V IH Inputlogiclow V Full 0.5 V IL Inputleakage 25°C –40 5 40 I ,I V =3.6Vor0 3.6V nA current IH IL I Full –50 50 (1) Thealgebraicconvention,wherebythemostnegativevalueisaminimumandthemostpositivevalueisamaximum (2) AllunuseddigitalinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. 6 SubmitDocumentationFeedback Copyright©2007–2019,TexasInstrumentsIncorporated ProductFolderLinks:TS3A24159

TS3A24159 www.ti.com SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 Electrical Characteristics for 3-V Supply (continued) V =2.7Vto3.6V,T =–40°Cto85°C(unlessotherwisenoted)(1) CC A PARAMETER TESTCONDITIONS T V MIN TYP MAX UNIT A CC DYNAMIC V =0, C =1nF, Chargeinjection Q GEN L 25°C 3V 9 pC C R =0, SeeFigure19 GEN NC,NO C , V orV =V orGND, NC(OFF) NC NO CC SeeFigure13 25°C 3V 90 pF OFFcapacitance C SwitchOFF, NO(OFF) NC,NO C , V orV =V orGND, NC(ON) NC NO CC SeeFigure13 25°C 3V 224 pF ONcapacitance C SwitchON, NO(ON) COM V =V orGND, C COM CC SeeFigure13 25°C 3V 250 pF ONcapacitance COM(ON) SwitchON, Digitalinput C V =V orGND, SeeFigure13 25°C 3V 2 pF capacitance I IN CC R =50Ω, Bandwidth BW L SeeFigure16 25°C 3V 23 MHz SwitchON, R =50Ω, OFFisolation O L SeeFigure17 25°C 3V –72 dB ISO f=1MHz, R =50Ω, Crosstalk X L SeeFigure18 25°C 3V –96 dB TALK f=1MHz, f=20Hzto Totalharmonic R =600Ω, THD L 20kHz, 25°C 3V 0.003% distortion C =50pF, L SeeFigure20 SUPPLY Positivesupply 25°C 3.6V 15 100 nA I V =V orGND current CC IN CC Full 1 μA 6.6 Electrical Characteristics for 2.5-V Supply V =2.3Vto2.7V,T =–40°Cto85°C(unlessotherwisenoted) (1) CC A PARAMETER TESTCONDITIONS T V MIN TYP MAX UNIT A CC ANALOGSWITCH Analogsignal V ,V , COM NO 0 V V range V CC NC SwitchON, 25°C 0.35 PeakON 0≤(V orV )≤V , r NO NC CC See 2.3V Ω resistance peak ICOM=–8mA, Figure10 Full 0.45 SwitchON, 25°C ON-state V orV =1.8V, r NO NC See 2.3V Ω resistance on ICOM=–8mA, Figure10 Full 0.4 ON-state SwitchON, 25°C 0.01 0.05 V orV =1.8V,0.8V, resistancematch Δr NO NC See 2.3V Ω betweenchannels on ICOM=–8mA, Figure10 Full 0.05 0.05 SwitchON, 0≤(V orV )≤V , NO NC CC See 25°C 0.05 I =–8mA, ON-state COM Figure10 r 2.3V Ω resistanceflatness on(flat) SwitchON, 25°C 0.03 0.08 V orV =0.8V,1.8V, NO NC See ICOM=–8mA, Figure10 Full 0.1 NC,NO V orV =0.5V,V =2.2V, SwitchOFF, 25°C –10 10 I , NC NO COM OFFleakage NC(OFF) or See 2.7V nA current INO(OFF) V orV =2.2V,V =0.5V, Figure11 Full –50 50 NC NO COM NC,NO V orV =0.5V,V =Open, SwitchON, 25°C –10 10 I , NC NO COM ONleakage NC(ON) or See 2.7V nA current INO(ON) V orV =2.2V,V =Open, Figure12 Full –100 100 NC NO COM (1) Thealgebraicconvention,wherebythemostnegativevalueisaminimumandthemostpositivevalueisamaximum. Copyright©2007–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:TS3A24159

TS3A24159 SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 www.ti.com Electrical Characteristics for 2.5-V Supply (continued) V =2.3Vto2.7V,T =–40°Cto85°C(unlessotherwisenoted)(1) CC A PARAMETER TESTCONDITIONS T V MIN TYP MAX UNIT A CC ANALOGSWITCH(continued) COM V orV =Open,V =0.5V, SwitchON, 25°C –10 10 NC NO COM ONleakage I or See 2.7V nA COM(ON) current V orV =Open,V =2.2V, Figure12 Full –100 100 NC NO COM DIGITALCONTROLINPUTS(IN1,IN2)(2) Inputlogichigh V Full 1.25 V IH Inputlogiclow V Full 0.5 V IL Inputleakage 25°C –40 5 40 I ,I V =2.7Vor0 2.7V nA current IH IL I Full –50 50 DYNAMIC C =1nF, V =0, L Chargeinjection Q GEN See 25°C 2.5V 8 pC C R =0, GEN Figure19 NC,NO C , V orV =V orGND, See NC(OFF) NC NO CC 25°C 2.5V 90 pF OFFcapacitance C SwitchOFF, Figure13 NO(OFF) NC,NO C , V orV =V orGND, See NC(ON) NC NO CC 25°C 2.5V 250 pF ONcapacitance C SwitchON, Figure13 NO(ON) COM V =V orGND, See C COM CC 25°C 2.5V 250 pF ONcapacitance COM(ON) SwitchON, Figure13 Digitalinput See C V =V orGND, 25°C 2.5V 2 pF capacitance I I CC Figure13 R =50Ω, See Bandwidth BW L 25°C 2.5V 23 MHz SwitchON, Figure16 R =50Ω, See OFFisolation O L 25°C 2.5V –72 dB ISO f=1MHz, Figure17 R =50Ω, See Crosstalk X L 25°C 2.5V –96 dB TALK f=1MHz, Figure18 f=20Hzto Totalharmonic R =600Ω, 20kHz, THD L 25°C 2.5V 0.003% distortion C =50pF, See L Figure20 SUPPLY Positivesupply 25°C 10 100 I V =V orGND 2.7V nA current CC I CC Full 700 (2) AllunuseddigitalinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. 6.7 Electrical Characteristics for 1.8-V Supply V =1.65Vto1.95V,T =–40°Cto85°C(unlessotherwisenoted) (1) CC A PARAMETER TESTCONDITIONS T V MIN TYP MAX UNIT A CC ANALOGSWITCH Analogsignal V ,V , COM NO 0 V V range V CC NC PeakON 0≤(V orV )≤V , SwitchON, 25°C 0.4 0.7 r NO NC CC 1.65V Ω resistance peak ICOM=–2mA, SeeFigure10 Full 0.8 ON-state V orV =1.5V, SwitchON, 25°C 0.3 0.45 r NO NC 1.65V Ω resistance on ICOM=–2mA, SeeFigure10 Full 0.5 (1) Thealgebraicconvention,wherebythemostnegativevalueisaminimumandthemostpositivevalueisamaximum 8 SubmitDocumentationFeedback Copyright©2007–2019,TexasInstrumentsIncorporated ProductFolderLinks:TS3A24159

TS3A24159 www.ti.com SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 Electrical Characteristics for 1.8-V Supply (continued) V =1.65Vto1.95V,T =–40°Cto85°C(unlessotherwisenoted)(1) CC A PARAMETER TESTCONDITIONS T V MIN TYP MAX UNIT A CC ANALOGSWITCH(continued) ON-state 25°C 0.02 0.04 resistancematch V orV =0.6V,1.5V, SwitchON, Δr NO NC 1.65V Ω between on ICOM=–2mA, SeeFigure10 Full 0.05 channels 0≤(V orV )≤V , SwitchON, NO NC CC 25°C 0.13 ON-state I =–2mA, SeeFigure10 COM resistance r 1.65V Ω flatness on(flat) VNOorVNC=0.6V,1.5V, SwitchON, 25°C 0.08 0.15 ICOM=–8mA, SeeFigure10 Full 0.2 NC,NO V orV =0.3V,V =1.65V, 25°C –10 10 I , NC NO COM SwitchOFF, OFFleakage NC(OFF) or 1.95 nA current INO(OFF) V orV =1.65V,V =0.3V, SeeFigure11 Full –50 50 NC NO COM NC,NO V orV =0.3V,V =Open, 25°C –10 10 I , NC NO COM SwitchON, ONleakage NC(ON) or 1.95V nA current INO(ON) V orV =1.65V,V =Open, SeeFigure12 Full –100 100 NC NO COM COM V orV =Open,V =0.3V, 25°C –10 10 NC NO COM SwitchON, ONleakage I or 1.95V nA current COM(ON) V orV =Open,V =1.65V, SeeFigure12 Full –100 100 NC NO COM DIGITALCONTROLINPUTS(IN1,IN2)(2) Inputlogichigh V Full 1 V IH Inputlogiclow V Full 0.4 V IL Inputleakage 25°C –40 5 40 I ,I V =1.95Vor0 1.95V nA current IH IL I Full –50 50 DYNAMIC V =0, C =1nF, Chargeinjection Q GEN L 25°C 1.8V 5 pC C R =0, SeeFigure19 GEN NC,NO C , V orV =V orGND, NC(OFF) NC NO CC SeeFigure13 25°C 1.8V 90 pF OFFcapacitance C SwitchOFF, NO(OFF) NC,NO C , V orV =V orGND, NC(ON) NC NO CC SeeFigure13 25°C 1.8V 250 pF ONcapacitance C SwitchON, NO(ON) COM V =V orGND, C COM CC SeeFigure13 25°C 1.8V 250 pF ONcapacitance COM(ON) SwitchON, Digitalinput C V =V orGND, SeeFigure13 25°C 1.8V 2 pF capacitance IN I CC R =50Ω, Bandwidth BW L SeeFigure16 25°C 1.8V 23 MHz SwitchON, R =50Ω, OFFisolation O L SeeFigure17 25°C 1.8V –73 dB ISO f=1MHz, R =50Ω, Crosstalk X L SeeFigure18 25°C 1.8V –97 dB TALK f=1MHz, f=20Hzto20 Totalharmonic R =600Ω, THD L kHz, 25°C 1.8V 0.005% distortion C =50pF, L SeeFigure20 SUPPLY Positivesupply 25°C 100 50 I V =V orGND 1.95V nA current CC I CC Full 700 (2) AllunuseddigitalinputsofthedevicemustbeheldatVCCorGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. Copyright©2007–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:TS3A24159

TS3A24159 SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 www.ti.com 6.8 Switching Characteristics for a 3-V Supply V =2.7Vto3.6V,T =–40°Cto85°C(unlessotherwisenoted)(1) CC A PARAMETER TESTCONDITIONS T V MIN TYP MAX UNIT A CC Dynamic 25°C 3.0V 20 35 Turnontime t VCOM=VCC, CL=35pF, 2.7V ns ON RL=50Ω SeeFigure14 Full to 40 3.6V 25°C 3.0V 12 25 Turnofftime t VCOM=VCC, CL=35pF, 2.7V ns OFF RL=50Ω SeeFigure14 Full to 30 3.6V 25°C 3.0V 1 10 25 Break-before- t VNC=VNO=VCC, CL=35pF, 2.7V ns maketime BBM RL=50Ω SeeFigure15 Full to 0.5 30 3.6V (1) Thealgebraicconvention,wherebythemostnegativevalueisaminimumandthemostpositivevalueisamaximum 6.9 Switching Characteristics for a 2.5-V Supply V =2.3Vto2.7V,T =–40°Cto85°C(unlessotherwisenoted) (1) CC A PARAMETER TESTCONDITIONS T V MIN TYP MAX UNIT A CC Dynamic 25°C 2.5V 23 45 Turnontime t VCOM=VCC, CL=35pF, 2.3V ns ON RL=50Ω SeeFigure14 Full to 50 2.7V 25°C 2.5V 17 27 Turnofftime t VCOM=VCC, CL=35pF, 2.3V ns OFF RL=50Ω SeeFigure14 Full to 30 2.7V 25°C 2.5V 2 14 30 Break-before- t VNC=VNO=VCC, CL=35pF, 2.3V ns maketime BBM RL=50Ω SeeFigure15 Full to 1 35 2.7V (1) Thealgebraicconvention,wherebythemostnegativevalueisaminimumandthemostpositivevalueisamaximum 6.10 Switching Characteristics for a 1.8-V Supply V =1.65Vto1.95V,T =–40°Cto85°C(unlessotherwisenoted) (1) CC A PARAMETER TESTCONDITIONS T V MIN TYP MAX UNIT A CC Dynamic 25°C 1.8V 53 75 Turnontime t VCOM=VCC, CL=35pF, 1.65V ns ON RL=50Ω SeeFigure14 Full to 80 1.96V 25°C 1.8V 24 35 Turnofftime t VCOM=VCC, CL=35pF, 1.65V ns OFF RL=50Ω SeeFigure14 Full to 40 1.96V 25°C 1.8V 2 30 40 Break-before- t VNC=VNO=VCC, CL=35pF, 1.65V ns maketime BBM RL=50Ω SeeFigure15 Full to 1 50 1.96V (1) Thealgebraicconvention,wherebythemostnegativevalueisaminimumandthemostpositivevalueisamaximum 10 SubmitDocumentationFeedback Copyright©2007–2019,TexasInstrumentsIncorporated ProductFolderLinks:TS3A24159

TS3A24159 www.ti.com SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 6.11 Typical Characteristics 0.500 0.400 0.450 0.350 0.400 0.300 0.350 0.250 0.300 Ω) Ωr()on00..220500 r(on00..125000 0.150 –40°C 0.100 –40°C 0.100 25°C 25°C 0.050 85°C 0.050 85°C 0.000 0.000 0 0 0 0 0 0 9 9 9 9 9 9 9 9 9 9 8 0 4 8 1 5 9 3 7 0 4 8 2 6 9 3 7 1 0 1 2 3 4 5 5 6 7 8 9 0 1 2 3 4 5 0 1 2 4 5 6 8 9 1 2 3 5 6 7 9 0 2 0. 0. 0. 0. 0. 0. 0. 0. 0. 0. 0. 1. 1. 1. 1. 1. 1. 0. 0. 0. 0. 0. 0. 0. 0. 1. 1. 1. 1. 1. 1. 1. 2. 2. VCOM(V) VCOM(V) Figure1.ronvsVCOM Figure2.ronvsVCOM (VCC=1.65V) (VCC=2.3V) 0.350 50 1.8 V 0.300 0 2.5 V 3 V 0.250 -50 0.200 C) –100 Ωr()on0.150 Q(pC –150 0.100 –40°C –200 25°C 0.050 85°C –250 0.000 0 6 2 9 5 1 7 3 0 6 2 8 4 1 7 3 9 –300 0.0 0.1 0.3 0.4 0.6 0.8 0.9 1.1 1.3 1.4 1.6 1.7 1.9 2.1 2.2 2.4 2.5 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.5 2.7 3.0 V (V) V (V) COM COM Figure4.ChargeInjection(Q )vsV Figure3.r vsV C COM on COM (T =25°C) (V =2.7V) A CC 35 0 3.0 V tON –2 30 tOFF –4 25 –6 s) 20 B) –8 /t(nNOFF 15 Gain(d ––1102 O t 10 –14 –16 5 –18 0 –20 1.65 1.8 1.95 2.3 2.5 2.7 3 3.3 3.6 1E+04 1E+05 1E+06 1E+07 1E+08 1E+09 Frequency (Hz) Supply Voltage (V ) CC Figure6.Bandwidth Figure5.t andt vsSupplyVoltage ON OFF (T =25°C) A Copyright©2007–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:TS3A24159

TS3A24159 SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 www.ti.com Typical Characteristics (continued) 0 0 –10 –20 –20 B) –30 n (d –40 –40 Attenuatio ––6500 ation (dB) –60 u –70 1.8 V en –80 –80 2.5 V Att –90 3.0 V –100 12..85VV 1E+04 1E+05 1E+06 1E+07 1E+08 1E+09 3.0V Frequency (Hz) –120 1E+04 1E+05 1E+06 1E+07 1E+08 1E+09 Frequency (Hz) Figure8.Crosstalk Figure7.OFFIsolation 0.009 0.008 0.007 0.006 %) 0.005 ( D TH 0.004 0.003 0.002 1.8 V 2.5 V 0.001 3.0 V 0.000 1E+00 1E+01 1E+02 1E+03 1E+04 1E+05 Frequency (Hz) Figure9.TotalHarmonicDistortionvsFrequency 12 SubmitDocumentationFeedback Copyright©2007–2019,TexasInstrumentsIncorporated ProductFolderLinks:TS3A24159

TS3A24159 www.ti.com SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 7 Parameter Measurement Information V CC VNC NC COM V COM + ChannelON V NO NO V –V orV ron= COM I NO NC Ω COM VI IN ICOM V =V orV I IH IL + GND Figure10. ON-StateResistance V CC VNC NC COM VCOM + VNO NO + OFF-StateLeakageCurrent Channel OFF IN VI=VIHorVIL VI + GND Figure11. OFF-StateLeakageCurrent (I ,I ,I ,I ,I ,I ) NC(OFF) NC(PWROFF) NO(OFF) NO(PWROFF) COM(OFF) COM(PWROFF) V CC VNC NC COM + VCOM VNO NO ON-StateLeakageCurrent Channel ON VI IN VI=VIHorVIL + GND Figure12. ON-StateLeakageCurrent(I ,I ,I ) COM(ON) NC(ON) NO(ON) Copyright©2007–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:TS3A24159

TS3A24159 SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 www.ti.com VCC VNO NO Capacitance Meter VBIAS= VCCor GND and VIN= VIHor VIL Capacitance is measured at NO, COM COM COM, and IN inputs during ON BIAS and OFF conditions. IN Figure13. CapacitanceC,C ,C ,C ,C ) I NC(OFF) NO(OFF) NC(ON) NO(ON) V CC TEST RL CL VCOM NC or NO VNCorVNO tON 50W 35pF VCC COM VCOM NC or NO CL(2) RL tOFF 50W 35pF VCC IN VI Logic VCC CL(2) RL Input 50% 50% (1) GND (VI) 0 tON tOFF 90% 90% (VNCorVNO) (1) Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR≤10MHz,Z =50Ω,t <5ns, O r t <5ns. f (2) C includesprobeandjigcapacitance. L Figure14. Turn-On(t )andTurn-OffTime(t ) ON OFF V CC VNCorVNO LInopguict 50% VCC NC or NO VCOM (VI) 0 COM NC or NO 90% 90% CL(2) RL IN (VCOM) VI tBBM Logic GND VNCorVNO= VCC Input(1) RL= 50Ω CL= 35 pF (1) Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR≤10MHz,Z =50Ω,t <5ns, O r t <5ns. f (2) C includesprobeandjigcapacitance. L Figure15. Break-Before-MakeTime(t ) BBM 14 SubmitDocumentationFeedback Copyright©2007–2019,TexasInstrumentsIncorporated ProductFolderLinks:TS3A24159

TS3A24159 www.ti.com SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 V CC NetworkAnalyzer 50W VNC NC ChannelON:NCtoCOM COM VCOM VI=VCCorGND Source NO Signal NetworkAnalyzerSetup 50W VI IN Source Power = 0 dBm (632-mV P-Pat 50-Wload) + GND DCBias=350mV Figure16. Bandwidth(BW) V CC NetworkAnalyzer 50W Channel OFF: NC to COM VNC NC VI=VCCor GND COM VCOM Source 50W NO Signal NetworkAnalyzerSetup IN VI Source Power = 0 dBm 50W (632-mVP-Pat 50-Wload) + GND DCBias=350mV Figure17. OFFIsolation(O ) ISO V NetworkAnalyzer CC ChannelON:NCtoCOM 50W VNC NC ChannelOFF:NOtoCOM VCOM VIN=VCCorGND Source Signal VNO NO 50W NetworkAnalyzerSetup VIN IN 50W + Source Power = 0 dBm GND (632-mVP-Pat 50-Wload) DCBias=350mV Figure18. Crosstalk(X ) TALK Copyright©2007–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:TS3A24159

TS3A24159 SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 www.ti.com VCC Logic VIH Input OFF ON OFF RGEN (VI) VIL NC or NO + COM VCOM VCOM DVCOM VGEN NC or NO CL(2) VI IN VGEN=0toVCC RGEN=0 Logic CL=1nF Input(1) GND QC=CL´(cid:3)DVCOM VI=VIHorVIL A. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR≤10MHz,Z =50Ω,t <5ns, O r t <5ns. f B. C includesprobeandjigcapacitance. L Figure19. ChargeInjection(Q ) C ChannelON:COMtoNO VI=VIHorVIL RL= 600W VSOURCE= VCCP-P SourceSignal=20Hzto20kHz CL= 50 pF V+/2 V CC AudioAnalyzer RL 10 µF NO 10 µF Source COM Signal 600W CL(1) 600W VI IN GND 600W A. C includesprobeandjigcapacitance. L Figure20. TotalHarmonicDistortion(THD) 16 SubmitDocumentationFeedback Copyright©2007–2019,TexasInstrumentsIncorporated ProductFolderLinks:TS3A24159

TS3A24159 www.ti.com SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 8 Detailed Description 8.1 Overview The TS3A24159 is a 2-channel single-pole double-throw (SPDT) bidirectional analog switch that is designed to operate from 1.65 V to 3.6 V. It offers low ON-state resistance and excellent ON-state resistance matching with the break-before-make feature, to prevent signal distortion during the transferring of a signal from one channel to another. The device has excellent total harmonic distortion (THD) performance, low ON-state resistence, and consumesvery low power. These are some of the features make this device suitable for a variety of markets and manydifferentapplications. 8.2 Functional Block Diagram SPDT NC1 COM1 NO1 IN1 Logic Control SPDT NC2 COM2 NO2 IN2 Logic Control 8.3 Feature Description The TS3A24159 device is bidirectional with two single-pole, double-throw switches. Each of the two switches are controlledindependentlybytwodigitalsignals. 8.4 Device Functional Modes Table1.FunctionTable NCTOCOM, NOTOCOM, IN COMTONC COMTONO L ON OFF H OFF ON Copyright©2007–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:TS3A24159

TS3A24159 SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 9.1 Application Information The switch of the TS3A23159 device is bidirectional. Hence, NO, NC and COM pins can be used as both inputs oroutputs. 9.2 Typical Application 3.3 V 0.1 PF 0.1 PF VCC System TS3A24159 Controller IN1 Switch IN2 NO1 Device 1 Control COM1 NC1 Device 2 Logic Signal Path NO2 Device 3 COM2 NC2 Device 4 GND COM4 9.2.1 DesignRequirements Ensure that all of the signals passing through the switch are with in the specified ranges to ensure proper performance. Table2.DesignParameters MIN MAX UNIT V SupplyVoltage 1.65 3.6 V CC V NC V SignalVoltage 0 V V NO CC V COM V DigitalInputVoltage 0 V V IN CC 18 SubmitDocumentationFeedback Copyright©2007–2019,TexasInstrumentsIncorporated ProductFolderLinks:TS3A24159

TS3A24159 www.ti.com SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 9.2.2 DetailedDesignProcedure TheTS3A23159device can be properly operated without any external components. However, it is recommended that unused pins must be connected to ground through a 50-Ω resistor to prevent signal reflections back into the device.Itisalsorecommendedthat the digital control pins (IN1 and IN2) be pulled up to VCC or down to GND to avoidundesiredswitchpositionsthatcouldresultfromthefloatingpin. Select the appropriate supply voltage to cover the entire voltage swing of the signal passing through the switch because the TS3A23159 input/output signal swing through NO and COM are dependant of the supply voltage VCC. 9.2.3 ApplicationCurve 0.350 0.300 0.250 0.200 Ω) ( n0.150 o r 0.100 –40°C 25°C 0.050 85°C 0.000 0 6 2 9 5 1 7 3 0 6 2 8 4 1 7 3 9 0 1 3 4 6 8 9 1 3 4 6 7 9 1 2 4 5 . . . . . . . . . . . . . . . . . 0 0 0 0 0 0 0 1 1 1 1 1 1 2 2 2 2 V (V) COM Figure21. r vsV ON COM Copyright©2007–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLinks:TS3A24159

TS3A24159 SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 www.ti.com 10 Power Supply Recommendations • Properpower-supplysequencingisrecommendedforallCMOSdevices. • Do not exceed the absolute maximum ratings, because stresses beyond the listed ratings can cause permanentdamagetothedevice. • AlwayssequenceVCConfirst,followedbyNOorCOM. • Although it is not required, power-supply bypassing improves noise margin and prevents switching noise propagationfromtheVCCsupplytoothercomponents. • A0.1-μFcapacitor,connectedfromVCCtoGND,isadequateformostapplications. 11 Layout 11.1 Layout Guidelines To ensure reliability of the device, following common printed-circuit board layout guidelines is recommended. Bypass capacitors must be used on power supplies. Short trace lengths should be used to avoid excessive loading. 11.2 Layout Example C C V = VIAto GND Plane 0603 Cap To Device 3 VCC NTOo2 Device 3 To Device 1 To Device 3 or 4 To DevicNeO 13 COTMo2 Device 3 To Device 1 or 2 To System TS3A24159 To DeviCcOeM 31 ITN2o Device 3 To System To Device 4 To DevicIeN1 3 NTCo2 Device 3 To Device 2 To DevicNeC 13 GTNoD Device 3 Figure22. LayoutExample 20 SubmitDocumentationFeedback Copyright©2007–2019,TexasInstrumentsIncorporated ProductFolderLinks:TS3A24159

TS3A24159 www.ti.com SCDS238F–MARCH2007–REVISEDSEPTEMBER2019 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 RelatedDocumentation Forrelateddocumentationseethefollowing: ImplicationsofSloworFloatingCMOSInputs,SCBA004 12.2 Community Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight fromtheexperts.Searchexistinganswersoraskyourownquestiontogetthequickdesignhelpyouneed. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do notnecessarilyreflectTI'sviews;seeTI'sTermsofUse. 12.3 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 12.4 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 12.5 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©2007–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 21 ProductFolderLinks:TS3A24159

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TS3A24159DGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 (L8Q, L8R) & no Sb/Br) TS3A24159DGSRG4 ACTIVE VSSOP DGS 10 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 (L8Q, L8R) & no Sb/Br) TS3A24159DRCR ACTIVE VSON DRC 10 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 ZWS & no Sb/Br) TS3A24159DRCRG4 ACTIVE VSON DRC 10 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 ZWS & no Sb/Br) TS3A24159YZPR ACTIVE DSBGA YZP 10 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 L87 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 18-Jan-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TS3A24159DGSR VSSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TS3A24159DRCR VSON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TS3A24159YZPR DSBGA YZP 10 3000 178.0 9.2 1.49 1.99 0.63 4.0 8.0 Q2 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 18-Jan-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TS3A24159DGSR VSSOP DGS 10 2500 358.0 335.0 35.0 TS3A24159DRCR VSON DRC 10 3000 367.0 367.0 35.0 TS3A24159YZPR DSBGA YZP 10 3000 220.0 220.0 35.0 PackMaterials-Page2

PACKAGE OUTLINE DGS0010A VSSOP - 1.1 mm max height SCALE 3.200 SMALL OUTLINE PACKAGE C 5.05 4.75 TYP SEATING PLANE A PIN 1 ID 0.1 C AREA 8X 0.5 10 1 3.1 2X 2.9 NOTE 3 2 5 6 0.27 10X 0.17 B 3.1 0.1 C A B 1.1 MAX 2.9 NOTE 4 0.23 TYP SEE DETAIL A 0.13 0.25 GAGE PLANE 0.15 0.7 0 - 8 0.05 0.4 DETAIL A TYPICAL 4221984/A 05/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-187, variation BA. www.ti.com

EXAMPLE BOARD LAYOUT DGS0010A VSSOP - 1.1 mm max height SMALL OUTLINE PACKAGE 10X (1.45) 10X (0.3) SYMM (R0.05) TYP 1 10 SYMM 8X (0.5) 5 6 (4.4) LAND PATTERN EXAMPLE SCALE:10X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS NOT TO SCALE 4221984/A 05/2015 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DGS0010A VSSOP - 1.1 mm max height SMALL OUTLINE PACKAGE 10X (1.45) SYMM (R0.05) TYP 10X (0.3) 1 10 SYMM 8X (0.5) 5 6 (4.4) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X 4221984/A 05/2015 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

GENERIC PACKAGE VIEW DRC 10 VSON - 1 mm max height PLASTIC SMALL OUTLINE - NO LEAD Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4204102-3/M

PACKAGE OUTLINE DRC0010J VSON - 1 mm max height SCALE 4.000 PLASTIC SMALL OUTLINE - NO LEAD 3.1 B A 2.9 PIN 1 INDEX AREA 3.1 2.9 1.0 C 0.8 SEATING PLANE 0.05 0.00 0.08 C 1.65 0.1 2X (0.5) (0.2) TYP EXPOSED 4X (0.25) THERMAL PAD 5 6 2X 11 SYMM 2 2.4 0.1 10 1 8X 0.5 0.30 10X 0.18 PIN 1 ID SYMM 0.1 C A B (OPTIONAL) 0.5 0.05 C 10X 0.3 4218878/B 07/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. www.ti.com

EXAMPLE BOARD LAYOUT DRC0010J VSON - 1 mm max height PLASTIC SMALL OUTLINE - NO LEAD (1.65) (0.5) 10X (0.6) 1 10 10X (0.24) 11 SYMM (2.4) (3.4) (0.95) 8X (0.5) 6 5 (R0.05) TYP ( 0.2) VIA TYP (0.25) (0.575) SYMM (2.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:20X 0.07 MIN 0.07 MAX EXPOSED METAL ALL AROUND ALL AROUND EXPOSED METAL SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4218878/B 07/2018 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com

EXAMPLE STENCIL DESIGN DRC0010J VSON - 1 mm max height PLASTIC SMALL OUTLINE - NO LEAD 2X (1.5) (0.5) SYMM EXPOSED METAL 11 TYP 10X (0.6) 1 10 (1.53) 10X (0.24) 2X (1.06) SYMM (0.63) 8X (0.5) 6 5 (R0.05) TYP 4X (0.34) 4X (0.25) (2.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 11: 80% PRINTED SOLDER COVERAGE BY AREA SCALE:25X 4218878/B 07/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

PACKAGE OUTLINE YZP0010 DSBGA - 0.5 mm max height SCALE 8.000 DIE SIZE BALL GRID ARRAY B E A BALL A3 CORNER D C 0.5 MAX SEATING PLANE 0.19 BALL TYP 0.015 C 0.15 1 TYP SYMM D C SYMM 1.5 TYP D: Max = 1.89 mm, Min = 1.83 mm B E: Max = 1.39 mm, Min = 1.33 mm 0.5 TYP A 1 2 3 0.25 10X 0.21 0.5 TYP 0.015 C A B 4219350/B 11/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com

EXAMPLE BOARD LAYOUT YZP0010 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 10X ( 0.225) A (0.5) TYP B SYMM C D 1 2 3 SYMM LAND PATTERN EXAMPLE SCALE:30X ( 0.225) 0.05 MAX 0.05 MIN METAL METAL UNDER MASK SOLDER MASK ( 0.225) OPENING SOLDER MASK OPENING NON-SOLDER MASK DEFINED SOLDER MASK (PREFERRED) DEFINED SOLDER MASK DETAILS NOT TO SCALE 4219350/B 11/2017 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017). www.ti.com

EXAMPLE STENCIL DESIGN YZP0010 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP (R0.05) TYP 10X ( 0.25) A (0.5) TYP B SYMM METAL TYP C D 1 2 3 SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:30X 4219350/B 11/2017 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com

IMPORTANTNOTICEANDDISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2020, Texas Instruments Incorporated