TRSF3223E www.ti.com SLLS824A–AUGUST2007–REVISEDSEPTEMBER2011 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION CheckforSamples:TRSF3223E FEATURES 1 DB, DW, OR PW PACKAGE • ESDProtectionforRS-232BusPins (TOPVIEW) – ±15-kVHuman-BodyModel(HBM) – ±8-kVIEC61000-4-2,ContactDischarge EENN 11 20 FORCEOFF – ±15-kVIEC61000-4-2,Air-GapDischarge CC11++ 22 19 VCC VV++ 33 18 GND • MeetsorExceedstheRequirementsof CC11−− 44 17 DOUT1 TIA/EIA-232-FandITUv.28Standards C2+ 5 16 RIN1 • OperatesWith3-Vto5.5-VV Supply CC C2− 6 15 ROUT1 • Operatesupto1000kbit/s V− 7 14 FORCEON • TwoDriversandTwoReceivers DOUT2 8 13 DIN1 • LowStandbyCurrent...1μATyp RIN2 9 12 DIN2 ROUT2 10 11 INVALID • ExternalCapacitors...4×0.1μF • Accepts5-VLogicInputWith3.3-VSupply APPLICATIONS RGW PACKAGE • Battery-PoweredSystems (TOPVIEW) • PDAs F • Notebooks OF E • Laptops C R D • PalmtopPCs +NO CCN VEFVG • Hand-HeldEquipment 2019181716 C1+ 11 115 DOUT1 DESCRIPTION/ C1− 22 14 RIN1 ORDERING INFORMATION C2+ 33 13 ROUT1 The TRSF3223E consists of two line drivers, two line C2− 44 12 FORCEON receivers,andadualcharge-pumpcircuitwith±15-kV V− 5 11 DIN1 ESD protection pin to pin (serial-port connection pins, including GND). This device meets the requirements 6 7 8 9 10 of TIA/EIA-232-F and provides the electrical interface 222D2 baentdwteheensaenriaal-spyonrcthcroonnnoeucstocr.omThmeunchicaartgioenpcuomnptroalnledr OUTRINOUTVALIDIN D RN four small external capacitors allow operation from a I single 3-V to 5.5-V supply. The TRSF3223E operates attypicaldatasignalingratesupto1000kbit/s. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. UNLESS OTHERWISE NOTED this document contains Copyright©2007–2011,TexasInstrumentsIncorporated PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

TRSF3223E SLLS824A–AUGUST2007–REVISEDSEPTEMBER2011 www.ti.com Flexible control options for power management are available when the serial port is inactive. The auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is set low and EN is high, both drivers and receivers are shut off, and the supply current is reduced to 1 mA. Disconnecting the serial port or turning off the peripheral drivers causes auto-powerdown to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled, the device is automatically activated when a valid signal is applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less than 30 μs. INVALID is low (invalid data) if the receiver input voltage is between –0.3 V and 0.3 V for more than 30μs.RefertoFigure4forreceiverinputlevels. Table1. ORDERINGINFORMATION T PACKAGE(1) (2) ORDERABLEPARTNUMBER TOP-SIDEMARKING A Tubeof25 TRSF3223ECDW SOIC–DW TRSF3223EC Reelof2000 TRSF3223ECDWR Tubeof70 TRSF3223ECDB 0°Cto70°C SSOP–DB RT23EC Reelof2000 TRSF3223ECDBR Tubeof70 TRSF3223ECPW TSSOP–PW RT23EC Reelof2000 TRSF3223ECPWR Tubeof25 TRSF3223EIDW SOIC–DW TRSF3223EI Reelof2000 TRSF3223EIDWR Tubeof70 TRSF3223EIDB SSOP–DB RT23EI –40°Cto85°C Reelof2000 TRSF3223EIDBR Tubeof70 TRSF3223EIPW TSSOP–PW RT23EI Reelof2000 TRSF3223EIPWR QFN–RGW Reelof3000 TRSF3223EIRGWR RT23EI (1) Packagedrawings,thermaldata,andsymbolizationareavailableatwww.ti.com/packaging. (2) Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTI websiteatwww.ti.com. FUNCTIONTABLES ABC EachDriver(1) INPUTS OUTPUT DIN FORCEON FORCEOFF VALIDRIN DOUT DRIVERSTATUS RS-232LEVEL X X L X Z Poweredoff L H H X H Normaloperationwith H H H X L auto-powerdowndisabled L L H Yes H Normaloperationwith H L H Yes L auto-powerdownenabled L L H No Z Poweredoffby H L H No Z auto-powerdownfeature (1) H=highlevel,L=lowlevel,X=irrelevant,Z=highimpedance 2 SubmitDocumentationFeedback Copyright©2007–2011,TexasInstrumentsIncorporated ProductFolderLink(s):TRSF3223E

TRSF3223E www.ti.com SLLS824A–AUGUST2007–REVISEDSEPTEMBER2011 EachReceiver(1) INPUTS OUTPUT RIN EN VALIDRIN ROUT RS-232LEVEL L L X H H L X L X H X Z Open L No H (1) H=highlevel,L=lowlevel,X=irrelevant, Z=highimpedance(off), Open=inputdisconnectedorconnecteddriveroff LOGICDIAGRAM(POSITIVELOGIC) 13 17 DIN1 DOUT1 12 8 DIN2 DOUT2 20 FORCEOFF 11 14 Powerdown INVALID FORCEON 1 EN 15 16 ROUT1 RIN1 10 9 ROUT2 RIN2 PinnumbersarefortheDB,DW,andPWpackages. Copyright©2007–2011,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TRSF3223E

TRSF3223E SLLS824A–AUGUST2007–REVISEDSEPTEMBER2011 www.ti.com Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange –0.3 6 V CC V+ Positive-outputsupplyvoltagerange(2) –0.3 7 V V– Negative-outputsupplyvoltagerange(2) 0.3 –7 V V+–V– Supplyvoltagedifference(2) 13 V Driver(FORCEOFF,FORCEON,EN) –0.3 6 V Inputvoltagerange V I Receiver –25 25 Driver –13.2 13.2 V Outputvoltagerange V O Receiver(INVALID) –0.3 V +0.3 CC DBpackage 70 θ Packagethermalimpedance(3) (4) DWpackage 58 °C/W JA PWpackage 83 T Operatingvirtualjunctiontemperature 150 °C J T Storagetemperaturerange –65 150 °C stg (1) Stressesbeyondthoselistedunder"absolutemaximumratings"maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder"recommendedoperating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagesarewithrespecttonetworkGND. (3) MaximumpowerdissipationisafunctionofT(max),θ ,andT .Themaximumallowablepowerdissipationatanyallowableambient J JA A temperatureisP =(T(max)–T )/θ .OperatingattheabsolutemaximumT of150°Ccanaffectreliability. D J A JA J (4) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. Recommended Operating Conditions(1) SeeFigure6 MIN NOM MAX UNIT V =3.3V 3 3.3 3.6 CC Supplyvoltage V V =5V 4.5 5 5.5 CC Driverandcontrol VCC=3.3V 2 V DIN,EN,FORCEOFF,FORCEON V IH high-levelinputvoltage V =5V 2.4 CC Driverandcontrol V DIN,EN,FORCEOFF,FORCEON 0.8 V IL low-levelinputvoltage Driverandcontrolinputvoltage DIN,EN,FORCEOFF,FORCEON 0 5.5 V V I Receiverinputvoltage –25 25 TRSF3223EC 0 70 T Operatingfree-airtemperature °C A TRSF3223EI –40 85 (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC Electrical Characteristics(1) overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(seeFigure5) PARAMETER TESTCONDITIONS MIN TYP(2) MAX UNIT Inputleakage EN,FORCEOFF, I ±0.01 ±1 μA I current FORCEON V =3.3Vor5V,T =25°C, Auto-powerdowndisabled CC A 0.3 1 mA Noload,FORCEOFFandFORCEONatV CC I Supplycurrent Poweredoff Noload,FORCEOFFatGND 1 10 CC Noload,FORCEOFFatV ,FORCEONatGND, μA Auto-powerdownenabled CC 1 10 AllRINareopenorgrounded (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC (2) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A 4 SubmitDocumentationFeedback Copyright©2007–2011,TexasInstrumentsIncorporated ProductFolderLink(s):TRSF3223E

TRSF3223E www.ti.com SLLS824A–AUGUST2007–REVISEDSEPTEMBER2011 DRIVER SECTION Electrical Characteristics(1) overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(seeFigure5) PARAMETER TESTCONDITIONS MIN TYP(2) MAX UNIT V High-leveloutputvoltage DOUTatR =3kΩtoGND 5 5.4 V OH L V Low-leveloutputvoltage DOUTatR =3kΩtoGND –5 –5.4 V OL L I High-levelinputcurrent V =V ±0.01 ±1 μA IH I CC I Low-levelinputcurrent V atGND ±0.01 ±1 μA IL I V =3.6V,V =0V I Short-circuitoutputcurrent(3) CC O ±35 ±60 mA OS V =5.5V,V =0V CC O r Outputresistance V ,V+,andV–=0V,V =±2V 300 10M Ω o CC O FORCEOFF=GND,V =3Vto3.6V,V =±12V ±25 CC O I Outputleakagecurrent μA OZ FORCEOFF=GND,V =4.5Vto5.5V,V =±12V ±25 CC O (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC (2) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A (3) Short-circuitdurationsshouldbecontrolledtopreventexceedingthedeviceabsolutepowerdissipationratings,andnotmorethanone outputshouldbeshortedatatime. Switching Characteristics(1) overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(seeFigure5) PARAMETER TESTCONDITIONS MIN TYP(2) MAX UNIT C =1000pF 250 Maximum L R =3kΩ, datarate L C =250pF, V =3Vto4.5V 1000 kbit/s OneDOUTswitching L CC (seeFigure1) C =1000pF, V =4.5Vto5.5V 1000 L CC t Pulseskew(3) C =150pFto2500pF, R =3kΩto7kΩ, SeeFigure2 300 ns sk(p) L L R =7kΩ, C =150pFto1000pF 8 90 Slewrate, L L SR(tr) transitionregion C =1000pF 12 60 V/μs L (seeFigure1) RL=3kΩ C =150pFto250pF 24 150 L (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC (2) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A (3) Pulseskewisdefinedas|t –t |ofeachchannelofthesamedevice. PLH PHL Copyright©2007–2011,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TRSF3223E

TRSF3223E SLLS824A–AUGUST2007–REVISEDSEPTEMBER2011 www.ti.com RECEIVER SECTION Electrical Characteristics(1) overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(seeFigure6) PARAMETER TESTCONDITIONS MIN TYP(2) MAX UNIT V High-leveloutputvoltage I =–1mA V –0.6 V –0.1 V OH OH CC CC V Low-leveloutputvoltage I =1.6mA 0.4 V OL OL V =3.3V 1.6 2.4 CC V Positive-goinginputthresholdvoltage V IT+ V =5V 1.9 2.4 CC V =3.3V 0.6 1.1 CC V Negative-goinginputthresholdvoltage V IT– V =5V 0.6 1.4 CC V Inputhysteresis(V –V ) 0.5 V hys IT+ IT– I Outputleakagecurrent EN=V ±0.05 μA OZ CC r Inputresistance V =±3Vto±25V 3 5 kΩ i I (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC (2) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A Switching Characteristics(1) overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted) PARAMETER TESTCONDITIONS TYP(2) UNIT t Propagationdelaytime,low-tohigh-leveloutput C =150pF,SeeFigure3 150 ns PLH L t Propagationdelaytime,high-tolow-leveloutput C =150pF,SeeFigure3 150 ns PHL L t Outputenabletime C =150pF,R =3kΩ,SeeFigure4 200 ns en L L t Outputdisabletime C =150pF,R =3kΩ,SeeFigure4 200 ns dis L L t Pulseskew(3) SeeFigure3 50 ns sk(p) (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC (2) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A (3) Pulseskewisdefinedas|t –t |ofeachchannelofthesamedevice. PLH PHL 6 SubmitDocumentationFeedback Copyright©2007–2011,TexasInstrumentsIncorporated ProductFolderLink(s):TRSF3223E

TRSF3223E www.ti.com SLLS824A–AUGUST2007–REVISEDSEPTEMBER2011 AUTO-POWERDOWN SECTION Electrical Characteristics overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(seeFigure5) PARAMETER TESTCONDITIONS MIN MAX UNIT Receiverinputthresholdfor V FORCEON=GND, FORCEOFF=V 2.7 V T+(valid) INVALIDhigh-leveloutputvoltage CC Receiverinputthresholdfor V FORCEON=GND, FORCEOFF=V –2.7 V T–(valid) INVALIDhigh-leveloutputvoltage CC Receiverinputthresholdfor V FORCEON=GND, FORCEOFF=V –0.3 0.3 V T(invalid) INVALIDlow-leveloutputvoltage CC I =1mA, FORCEON=GND, V INVALIDhigh-leveloutputvoltage OH V –0.6 V OH FORCEOFF=V CC CC I =1.6mA, FORCEON=GND, V INVALIDlow-leveloutputvoltage OL 0.4 V OL FORCEOFF=V CC Switching Characteristics overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(seeFigure5) PARAMETER TYP(1) UNIT t Propagationdelaytime,low-tohigh-leveloutput 1 μs valid t Propagationdelaytime,high-tolow-leveloutput 30 μs invalid t Supplyenabletime 100 μs en (1) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A Copyright©2007–2011,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TRSF3223E

TRSF3223E SLLS824A–AUGUST2007–REVISEDSEPTEMBER2011 www.ti.com PARAMETER MEASUREMENT INFORMATION A. C includesprobeandjigcapacitance. L B. Thepulsegeneratorhasthefollowingcharacteristics:PRR=250kbit/s,Z =50Ω,50%dutycycle,t ≤10ns, O r t ≤10ns. f 3 V Input 1.5 V 1.5 V RS-232 0 V Generator Output (see Note B) 50 W CL RL (see Note A) tTHL tTLH FOR3C VEOFF Output 3 V 3 V VOH −3 V −3 V VOL TEST CIRCUIT VOLTAGE WAVEFORMS SR(tr)(cid:1) 6V t ort THL TLH Figure1.DriverSlewRate A. C includesprobeandjigcapacitance. L B. Thepulsegeneratorhasthefollowingcharacteristics:PRR=250kbit/s,Z =50Ω,50%dutycycle,t ≤10ns, O r t ≤10ns. f 3 V RS-232 Input 1.5 V 1.5 V Output 0 V Generator 50 W (see Note B) RL C(sLe e Note A) tPHL tPLH VOH 3 V Output 50% 50% FORCEOFF VOL TEST CIRCUIT VOLTAGE WAVEFORMS Figure2.DriverPulseSkew A. C includesprobeandjigcapacitance. L B. Thepulsegeneratorhasthefollowingcharacteristics:Z =50Ω,50%dutycycle,t ≤10ns,t ≤10ns. O r f EN 3 V 0 V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 W tPHL tPLH CL (see Note A) VOH Output 50% 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS Figure3.ReceiverPropagationDelayTimes A. C includesprobeandjigcapacitance. L B. Thepulsegeneratorhasthefollowingcharacteristics:Z =50Ω,50%dutycycle,t ≤10ns,t ≤10ns. O r f 8 SubmitDocumentationFeedback Copyright©2007–2011,TexasInstrumentsIncorporated ProductFolderLink(s):TRSF3223E

TRSF3223E www.ti.com SLLS824A–AUGUST2007–REVISEDSEPTEMBER2011 PARAMETER MEASUREMENT INFORMATION (continued) VCC GND 3 V Input 1.5V 1.5V S1 0 V RL tPHZ tPZH (S1 at GND) (S1 at GND) 3 V or 0 V Output VOH CL Output 50% EN (see Note A) 0.3 V tPLZ Generator 50 W (S1 at VCC) (see Note B) 0.3 V Output 50% VOL tPZL TEST CIRCUIT (S1 at VCC) VOLTAGE WAVEFORMS Figure4.ReceiverEnableandDisableTimes A. C includesprobeandjigcapacitance. L B. Thepulsegeneratorhasthefollowingcharacteristics:PRR=250kbit/s,Z =50Ω,50%dutycycle,t ≤10ns, O r t ≤10ns. f Copyright©2007–2011,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TRSF3223E

TRSF3223E SLLS824A–AUGUST2007–REVISEDSEPTEMBER2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 3 V 2.7 V 2.7 V EN Receiver 0 V Input 0 V ROUT −2.7 V 2.7 V −3 V Generator 50 W (see Note B) tinvalid tvalid VCC INVALID 50% VCC 50% VCC Output 0 V Auto- INVALID ten Powerdown CL = 30 pF V+ ≈V+ (see Note A) 0.3 V Supply VCC FORCEOFF Voltages 0 V 0.3 V DIN DOUT FORCEON V− ≈V− TEST CIRCUIT VOLTAGE WAVEFORMS ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉVÉalid ÉRS-2É32 LÉeveÉl, INÉVALÉID HÉighÉÉ 2.7 V ÉÉÉÉÉÉÉÉÉÉÉÉ Indeterminate ÉÉÉÉÉÉÉÉÉÉÉÉ 0.3 V ÉÉÉÉIf SÉÉignaÉÉl ReÉÉmaiÉÉns WÉÉithinÉÉ ThÉÉis RÉÉegioÉÉn ÉÉ 0 V for More Than 30(cid:1)s, INVALID Is Low† ÉÉÉÉÉÉÉÉÉÉÉÉ 0.3 V ÉÉÉÉÉIndeÉtermÉinatÉe ÉÉÉÉ 2.7 ÉV ÉÉÉÉÉÉÉÉÉÉÉ Valid RS-232 Level, INVALID High ÉÉÉÉÉÉÉÉÉÉÉÉ †Auto-powerdown disables drivers and reduces supply current to 1 m A Figure5. INVALIDPropagationDelayTimesandSupplyEnablingTime 10 SubmitDocumentationFeedback Copyright©2007–2011,TexasInstrumentsIncorporated ProductFolderLink(s):TRSF3223E

TRSF3223E www.ti.com SLLS824A–AUGUST2007–REVISEDSEPTEMBER2011 APPLICATION INFORMATION 1 Auto- 20 EN Powerdown FORCEOFF 2 19 C1+ VCC CBYPASS = 0.1(cid:1)F + 3 18 C1 V+ GND C3† 4 C1 17 DOUT1 5 16 C2+ RIN1 + C2 6 15 C2 ROUT1 5 kW 7 14 V FORCEON C4 + 8 13 DOUT2 DIN1 9 12 RIN2 DIN2 10 11 ROUT2 INVALID 5 kW †C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC C1 C2, C3, and C4 3.3 V (cid:1) 0.3 V 0.1 m F 0.1 m F 5 V (cid:1) 0.5 V 0.047 m F 0.33 m F 3 V to 5.5 V 0.1 m F 0.47 m F Figure6.TypicalOperatingCircuitandCapacitorValues Copyright©2007–2011,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLink(s):TRSF3223E

TRSF3223E SLLS824A–AUGUST2007–REVISEDSEPTEMBER2011 www.ti.com REVISION HISTORY ChangesfromOriginal(August2007)toRevisionA Page • AddedRGWpackagetodatasheet. ..................................................................................................................................... 1 • DeletedRHLpackagefromdatasheet.................................................................................................................................. 1 12 SubmitDocumentationFeedback Copyright©2007–2011,TexasInstrumentsIncorporated ProductFolderLink(s):TRSF3223E

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TRSF3223ECDBR ACTIVE SSOP DB 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 RT23EC & no Sb/Br) TRSF3223ECPWR ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 RT23EC & no Sb/Br) TRSF3223EIDBR ACTIVE SSOP DB 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 RT23EI & no Sb/Br) TRSF3223EIDWR ACTIVE SOIC DW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TRSF3223EI & no Sb/Br) TRSF3223EIPW ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 RT23EI & no Sb/Br) TRSF3223EIPWR ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 RT23EI & no Sb/Br) TRSF3223EIRGWR ACTIVE VQFN RGW 20 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 RT23EI & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TRSF3223ECDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 TRSF3223ECPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 TRSF3223EIDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 TRSF3223EIDWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 TRSF3223EIPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 TRSF3223EIRGWR VQFN RGW 20 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TRSF3223ECDBR SSOP DB 20 2000 367.0 367.0 38.0 TRSF3223ECPWR TSSOP PW 20 2000 367.0 367.0 38.0 TRSF3223EIDBR SSOP DB 20 2000 367.0 367.0 38.0 TRSF3223EIDWR SOIC DW 20 2000 367.0 367.0 45.0 TRSF3223EIPWR TSSOP PW 20 2000 367.0 367.0 38.0 TRSF3223EIRGWR VQFN RGW 20 3000 367.0 367.0 35.0 PackMaterials-Page2

PACKAGE OUTLINE DB0020A SSOP - 2 mm max height SCALE 2.000 SMALL OUTLINE PACKAGE C 8.2 TYP 7.4 A 0.1 C PIN 1 INDEX AREA SEATING PLANE 18X 0.65 20 1 2X 7.5 5.85 6.9 NOTE 3 10 11 0.38 20X 0.22 5.6 B 0.1 C A B 5.0 NOTE 4 2 MAX (0.15) TYP 0.25 SEE DETAIL A GAGE PLANE 0 -8 0.95 0.05 MIN 0.55 DETA 15AIL A TYPICAL 4214851/B 08/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-150. www.ti.com

EXAMPLE BOARD LAYOUT DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20X (0.45) 20 SYMM 18X (0.65) 10 11 (7) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDE15.000 R MASK DETAILS 4214851/B 08/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20X (0.45) 20 SYMM 18X (0.65) 10 11 (7) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4214851/B 08/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 SEATING PLANE TYP 9.97 A PIN 1 ID 0.1 C AREA 18X 1.27 20 1 13.0 2X 12.6 11.43 NOTE 3 10 11 0.51 20X 7.6 0.31 2.65 MAX B 7.4 0.25 C A B NOTE 4 0.33 TYP 0.10 0.25 SEE DETAIL A GAGE PLANE 0.3 1.27 0 - 8 0.1 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com

EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 10 11 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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