TRS3386E www.ti.com SLLS829C–APRIL2007–REVISEDMARCH2011 RS-232 TRANSCEIVER WITH SPLIT SUPPLY PIN FOR LOGIC SIDE CheckforSamples:TRS3386E FEATURES APPLICATIONS 1 • V PinforCompatibilityWithMixed-Voltage • Hand-HeldEquipment L SystemsDownto2.5VonLogicSide • PDAs • EnhancedESDProtectiononRINInputsand • CellPhones DOUTOutputs • Battery-PoweredEquipment – ±15-kVHuman-BodyModel • DataCables – ±15-kVIEC61000-4-2,Air-GapDischarge – ±8-kVIEC61000-4-2,ContactDischarge PW OR DW PACKAGE TOP VIEW • Low300-μASupplyCurrent • Specified250-kbpsDataRate C1+ 1 20 PWRDOWN • 1-μALow-PowerShutdown V+ 2 19 VCC • MeetsEIA/TIA-232SpecificationsDown C1− 3 18 GND to3V C2+ 4 17 DOUT1 • DesignedtobeInterchangeableWithIndustry C2− 5 16 DOUT2 Standard'3386Devices V− 6 15 DOUT3 DIN1 7 14 RIN1 DIN2 8 13 RIN2 DIN3 9 12 VL ROUT2 10 11 ROUT1 DESCRIPTION/ORDERING INFORMATION The TRS3386E is a three-driver and two-receiver RS-232 interface device, with split supply pins for mixed-signal operations. All RS-232 inputs and outputs are protected to ±15 kV using the IEC 61000-4-2 Air-Gap Discharge method,±8kVusingtheIEC61000-4-2ContactDischargemethod,and±15kVusingtheHuman-BodyModel. The charge pump requires only four small 0.1-μF capacitors for operation from a 3.3-V supply. The TRS3386E is capableofrunningatdataratesupto250kbps,whilemaintainingRS-232-compliantoutputlevels. The TRS3386E has a unique V pin that allows operation in mixed-logic voltage systems. Both driver in (DIN) L and receiver out (ROUT) logic levels are pin programmable through the V pin. The TRS3386E is available in a L space-savingthinshrinksmall-outlinepackage(TSSOP). ORDERINGINFORMATION T PACKAGE(1) (2) ORDERABLEPARTNUMBER TOP-SIDEMARKING A TSSOP–PW TRS3386ECPWR RV86EC 0°Cto70°C SOIC–DW TRS3386ECDWR TRS3386EC TSSOP–PW TRS3386EIPWR RV86EI –40°Cto85°C SOIC–DW TRS3386EIDWR TRS3386EI (1) Packagedrawings,thermaldata,andsymbolizationareavailableatwww.ti.com/packaging. (2) Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTI websiteatwww.ti.com. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2007–2011,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

TRS3386E SLLS829C–APRIL2007–REVISEDMARCH2011 www.ti.com Table1.TRUTHTABLE(SHUTDOWNFUNCTION) DRIVER PWRDWN RECEIVEROUTPUTS CHARGEPUMP OUTPUTS L High-Z High-Z Inactive H Active Active Active FUNCTIONALBLOCKDIAGRAM 7 17 DIN1 DOUT1 8 16 DIN1 DOUT2 9 15 DIN2 DOUT3 20 PWRDOWN Powerdown 11 14 ROUT1 RIN1 5 K 10 13 ROUT2 RIN2 5 K 2 SubmitDocumentationFeedback Copyright©2007–2011,TexasInstrumentsIncorporated ProductFolderLink(s):TRS3386E

TRS3386E www.ti.com SLLS829C–APRIL2007–REVISEDMARCH2011 TERMINALFUNCTIONS TERMINAL DESCRIPTION NAME NO. C1+ 1 Positiveterminalofthevoltage-doublercharge-pumpcapacitor V+ 2 5.5-Vsupplygeneratedbythechargepump C1– 3 Negativeterminalofthevoltage-doublercharge-pumpcapacitor C2+ 4 Positiveterminaloftheinvertingcharge-pumpcapacitor C2– 5 Negativeterminaloftheinvertingcharge-pumpcapacitor V– 6 –5.5-Vsupplygeneratedbythechargepump DIN1 7 DIN2 8 Driverinputs DIN3 9 ROUT2 10 Receiveroutputs.Swingbetween0andV . ROUT1 11 L V 12 Logic-levelsupply.AllCMOSinputsandoutputsarereferencedtothissupply. L RIN2 13 RS-232receiverinputs RIN1 14 DOUT3 15 DOUT2 16 RS-232driveroutputs DOUT1 17 GND 18 Ground V 19 3-Vto5.5-Vsupplyvoltage CC Powerdowninput PWRDWN 20 L=Powerdown H=Normaloperation Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V toGND –0.3 6 V CC V toGND –0.3 V +0.3 V L CC V+toGND –0.3 7 V V–toGND 0.3 –7 V V++|V–|(2) 13 V DIN,PWRDWNtoGND –0.3 6 V Inputvoltage V I RINtoGND ±25 DOUTtoGND ±13.2 V Outputvoltage V O ROUT –0.3 V +0.3 L Short-circuitdurationDOUTtoGND Continuous T =70°C,20-pinTSSOP Continuouspowerdissipation A 559 mW (derate7mW/°Cabove70°C) T Junctiontemperature 150 °C J T Storagetemperaturerange –65 150 °C stg Leadtemperature(soldering,10s) 300 °C (1) Stressesbeyondthoselistedunder“absolutemaximumratings”maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedintheoperationalsectionsofthe specificationsisnotimplied.Exposuretoabsolutemaximumratingconditionsforextendedperiodsmayaffectdevicereliability. (2) V+andV–canhavemaximummagnitudesof7V,buttheirabsolutedifferencecannotexceed13V. Copyright©2007–2011,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TRS3386E

TRS3386E SLLS829C–APRIL2007–REVISEDMARCH2011 www.ti.com Recommended Operating Conditions MIN MAX UNIT V Supplyvoltage 3 5.5 V CC V Supplyvoltage 2.25 V V L CC V =3Vor5.5V 0.8 L Inputlogicthresholdlow DIN,PWRDWN V V =2.3V 0.6 L V =5.5V 2.4 L Inputlogicthresholdhigh DIN,PWRDWN V =3V 2.0 V L V =2.7V 1.4 L TRS3386ECPWR 0 70 Operatingtemperature °C TRS3386EIPWR –40 85 Receiverinputvoltage –25 25 V Electrical Characteristics overoperatingfree-airtemperaturerange,V =V =3Vto5.5V,C1–C4=0.1μF(testedat3.3V±10%),C1=0.047μF, CC L C2–C4=0.33μF(testedat5V±10%)(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP(1) MAX UNIT DCCharacteristics(V =3.3Vor5V,T =25°C) CC A Powerdownsupplycurrent PWRDWN=GND,AllinputsatV orGND 1 10 μA CC Supplycurrent PWRDWN=V ,Noload 0.3 1 mA CC (1) TypicalvaluesareatV =V =3.3V,T =25°C. CC L A ESD Protection PARAMETER TESTCONDITIONS TYP UNIT Human-BodyModel ±15 RIN,DOUT IEC61000-4-2Air-GapDischarge ±15 kV IEC61000-4-2ContactDischarge ±8 4 SubmitDocumentationFeedback Copyright©2007–2011,TexasInstrumentsIncorporated ProductFolderLink(s):TRS3386E

TRS3386E www.ti.com SLLS829C–APRIL2007–REVISEDMARCH2011 RECEIVER SECTION Electrical Characteristics overoperatingfree-airtemperaturerange,V =V =3Vto5.5V,C1–C4=0.1μF(testedat3.3V±10%),C1=0.047μF, CC L C2–C4=0.33μF(testedat5V±10%),T =T toT (unlessotherwisenoted) A MIN MAX PARAMETER TESTCONDITIONS MIN TYP(1) MAX UNIT I Outputleakagecurrent ROUT,receiversdisabled ±0.05 ±10 μA off V Outputvoltagelow I =1.6mA 0.4 V OL OUT V Outputvoltagehigh I =–1mA V –0.6 V –0.1 V OH OUT L L V =5V 0.8 1.2 L V Inputthresholdlow T =25°C V IT– A V =3.3V 0.6 1.5 L V =5V 1.8 2.4 L V Inputthresholdhigh T =25°C V IT+ A V =3.3V 1.5 2.4 L V Inputhysteresis 0.5 V hys Inputresistance T =25°C 3 5 7 kΩ A (1) TypicalvaluesareatV =V =3.3V,T =25°C CC L A Switching Characteristics overoperatingfree-airtemperaturerange,V =V =3Vto5.5V,C1–C4=0.1μF(testedat3.3V±10%),C1=0.047μF, CC L C2–C4=0.33μF(testedat5V±10%),T =T toT (unlessotherwisenoted) A MIN MAX PARAMETER TESTCONDITIONS TYP(1) UNIT t 0.15 PHL Receiverpropagationdelay Receiverinputtoreceiveroutput,C =150pF μs L t 0.15 PLH t –t Receiverskew 50 ns PHL PLH t Receiveroutputenabletime FromPWRDWN 200 ns en t Receiveroutputdisabletime FromPWRDWN 200 ns dis (1) TypicalvaluesareatV =V =3.3V,T =25°C. CC L A Copyright©2007–2011,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TRS3386E

TRS3386E SLLS829C–APRIL2007–REVISEDMARCH2011 www.ti.com DRIVER SECTION Electrical Characteristics overoperatingfree-airtemperaturerange,V =V =3Vto5.5V,C1–C4=0.1μF(testedat3.3V±10%),C1=0.047μF, CC L C2–C4=0.33μF(testedat5V±10%),T =T toT (unlessotherwisenoted) A MIN MAX PARAMETER TESTCONDITIONS MIN TYP(1) MAX UNIT V Outputvoltageswing Alldriveroutputsloadedwith3kΩtoground ±5 ±5.4 V OH r Outputresistance V =V+=V– =0,Driveroutput=±2V 300 10M Ω O CC I Outputshort-circuitcurrent V =0 ±60 mA OS T_OUT V =±12V,Driverdisabled, I Outputleakagecurrent T_OUT ±25 μA OZ V =0or3Vto5.5V CC Driverinputhysteresis 0.5 V Inputleakagecurrent DIN,PWRDWN ±0.01 ±1 μA (1) TypicalvaluesareatV =V =3.3V,T =25°C CC L A Timing Requirements overoperatingfree-airtemperaturerange,V =V =3Vto5.5V,C1–C4=0.1μF(testedat3.3V±10%),C1=0.047μF, CC L C2–C4=0.33μF(testedat5V±10%),T =T toT (unlessotherwisenoted) A MIN MAX PARAMETER MIN TYP(1) MAX UNIT Maximumdatarate R =3kΩ,C =1000pF,Onedriverswitching 250 kbps L L Time-to-exitpowerdown |V |>3.7V 100 μs T_OUT |t –t | Driverskew(2) 100 ns PHL PLH V =3.3V, C =150pFto1000pF 6 30 CC L T =25°C, Transition-region A R =3kΩto7kΩ, V/μs slewrate MLeasuredfrom3V CL=150pFto2500pF 4 30 to–3Vor–3Vto3V (1) TypicalvaluesareatV =V =3.3V,T =25°C. CC L A (2) Driverskewismeasuredatthedriverzerocrosspoint. ESD Protection PARAMETER TESTCONDITIONS TYP UNIT Human-BodyModel ±15 RIN,DOUT IEC61000-4-2Air-GapDischarge ±15 kV IEC61000-4-2ContactDischarge ±8 6 SubmitDocumentationFeedback Copyright©2007–2011,TexasInstrumentsIncorporated ProductFolderLink(s):TRS3386E

TRS3386E www.ti.com SLLS829C–APRIL2007–REVISEDMARCH2011 APPLICATION INFORMATION 3.3 V CBYPASS 20 19 12 C1 1 C1P+WRDWNVCC VLV+ 2 0.1(cid:1)F 3 C3 C1− 0.1m F 4 6 C2 C2+ V− 0.1(cid:1)F 5 C2− C0.41m F 7 DIN1 DOUT1 17 TTL/CMOS DIN2 DOUT2 16 Inputs DIN3 DOUT3 15 VL 11 ROUT1 RIN1 14 TTL/CMOS 5kW Outputs VL 10 ROUT2 RIN2 13 5kW GND 18 Copyright©2007–2011,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TRS3386E

TRS3386E SLLS829C–APRIL2007–REVISEDMARCH2011 www.ti.com PARAMETER MEASUREMENT INFORMATION 3 V Input 1.5 V 1.5 V RS-232 0 V Generator Output (see Note B) 50 W CL RL (see Note A) tTHL tTLH PW3R DVWN Output 3 V 3 V VOH −3 V −3 V VOL TEST CIRCUIT VOLTAGE WAVEFORMS SR(tr)(cid:1) 6V t ort THL TLH NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 W , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure1. DriverSlewRate 3 V RS-232 Input 1.5 V 1.5 V Output 0 V Generator 50 W (see Note B) RL C(sLe e Note A) tPHL tPLH VOH 3 V Output 50% 50% PWRDWN VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 W , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure2. DriverPulseSkew PWRDWN 3 V 3 V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 W tPHL tPLH CL (see Note A) VOH Output 50% 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 W , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure3. ReceiverPropagationDelayTimes 8 SubmitDocumentationFeedback Copyright©2007–2011,TexasInstrumentsIncorporated ProductFolderLink(s):TRS3386E

TRS3386E www.ti.com SLLS829C–APRIL2007–REVISEDMARCH2011 PARAMETER MEASUREMENT INFORMATION (Continued) VCC GND 3 V Input 1.5V 1.5V S1 0 V RL tPHZ tPZH S1 at GND) (S1 at GND) 3 V or 0 V Output VOH CL Output 50% PWRDWN (see Note A) 0.3 V tPLZ Generator 50 W (S1 at VCC) (see Note B) 0.3 V Output 50% VOL tPZL TEST CIRCUIT (S1 at VCC) VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 W , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure4. ReceiverEnableandDisableTimes Copyright©2007–2011,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TRS3386E

TRS3386E SLLS829C–APRIL2007–REVISEDMARCH2011 www.ti.com REVISION HISTORY ChangesfromRevisionB(April2009)toRevisionC Page • ChangedV PinforCompatibilityWithMixed-VoltageSystemsDownto2.5V(originally1.8V)ontheLogicSide. ......... 1 L • ChangedV SupplyMINvaluefrom1.65Vto2.25V. ......................................................................................................... 4 L • DeletedV =1.65VparameterfromInputlogicthresholdlow.............................................................................................. 4 L • DeletedV =1.95VparameterfromInputlogicthresholdhigh. ........................................................................................... 4 L 10 SubmitDocumentationFeedback Copyright©2007–2011,TexasInstrumentsIncorporated ProductFolderLink(s):TRS3386E

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TRS3386ECDWR ACTIVE SOIC DW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 TRS3386EC & no Sb/Br) TRS3386ECPW ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 RV86EC & no Sb/Br) TRS3386ECPWR ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 RV86EC & no Sb/Br) TRS3386ECPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 RV86EC & no Sb/Br) TRS3386EIDWR ACTIVE SOIC DW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TRS3386EI & no Sb/Br) TRS3386EIPW ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 RV86EI & no Sb/Br) TRS3386EIPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 RV86EI & no Sb/Br) TRS3386EIPWR ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 RV86EI & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 2-Oct-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TRS3386ECDWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 TRS3386ECPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.0 1.4 8.0 16.0 Q1 TRS3386EIDWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 TRS3386EIPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 2-Oct-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TRS3386ECDWR SOIC DW 20 2000 367.0 367.0 45.0 TRS3386ECPWR TSSOP PW 20 2000 367.0 367.0 38.0 TRS3386EIDWR SOIC DW 20 2000 367.0 367.0 45.0 TRS3386EIPWR TSSOP PW 20 2000 367.0 367.0 38.0 PackMaterials-Page2

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PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 SEATING PLANE TYP 9.97 A PIN 1 ID 0.1 C AREA 18X 1.27 20 1 13.0 2X 12.6 11.43 NOTE 3 10 11 0.51 20X 7.6 0.31 2.65 MAX B 7.4 0.25 C A B NOTE 4 0.33 TYP 0.10 0.25 SEE DETAIL A GAGE PLANE 0.3 1.27 0 - 8 0.1 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com

EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 10 11 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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