Effective May 2017 Technical Data 4321 Supersedes March 2010 3216TD HALOGEN HF Pb Time-delay Chip™ surface mount fuse FREE Environmental data • Operating temperature range: -55 °C to +125 °C with proper derating • Vibration: MIL-STD-202, Method 204 Condition D • Solderability: ANSI/J-STD-002C, Test B Soldering method • Wave immersion: 260°C, 10 Sec. max. Product features • Infrared reflow: 260°C, 30 Sec. max. • Hand solder: 350°C, 3 Sec. max. • Time-delay, surface mount fuse • RoHS compliant, lead-free and halogen-free Ordering • High inrush withstand capability • Wire-in-Air performance • Specify packaging and product code • Compatible with leaded and lead-free reflow and (i.e., TR/3216TD1-R) wave solder Electrical Characteristics Agency information % of Amp Rating Opening Time • cURus Recognition File number: E19180 100% 4 Hours Minimum 200% 1 Sec. Minimum, 120 Sec. Maximum 300% 0.05 Sec. Minimum, 3 Sec. Maximum 800% 0.002 Sec. Minimum, 0.05 Sec. Maximum Specifications Current Interrupting Typical Typical Typical Product Code Rating Voltage Rating Rating (Amps)* Resistance Melt I2t† Voltage Amps Vaacc Vdc ACC DC (Ω)** DC Drop (mV)‡ 3216TD6.3-R 6.3 32 32 3355 3 5 0.006 10.54 56 3216TD7-R 7 32 32 3355 3 5 0.006 12.03 64 3216TD8-R 8 32 32 3355 3 5 0.0055 16.03 65 3216TD10-R 10 32 32 3355 3 5 0.0045 42.71 72 3216TD12-R 12 32 32 3355 3 5 0.00425 45.56 79 * AC Interrupting Rating (Measured at rated voltage with a unity power factor); DC Interrupting Rating (Measured at rated voltage,time constant of less than 50 microseconds,battery source) ** DC Cold Resistance (Measured at 10% of rated current) † Typical Melting2 tI (Measured with a battery bank at rated DC voltage,10x-rated current at 1 microsecond,not to exceed IR. Above 7A uses 70 micron thickness copper layer test board of IEC 60127-3 Others uses 35 micron thickness copper layer. ‡ Typical Voltage Drop (Measured at rated current after temperature stabilizes) Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended,with further derating required at elevated ambient temperatu

Technical Data 4321 3216TD Effective May 2017 Time-delay Chip™ surface mount fuse Dimensions - mm (in) Drawing Not to Scale Time-Current Curves Recommended Pad Layout - mm (in) ds n o ec S n e I m Ti Current In Amps Packaging Packaging Code Prefix Description TR 2500 fuses on 12mm tape-and-reel on a 180mm reel per EIA-481-A & IEC286-3 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4321 BU-SB10214 All other trademarks are property May 2017 of their respective owners.