TPS79301-EP,, TPS79318-EP,, TPS79325-EP,, TPS79328-EP TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP www.ti.com SGLS163B–APRIL2003–REVISEDNOVEMBER2006 ULTRALOW-NOISE, HIGH-PSRR, FAST RF 200-mA LOW-DROPOUT LINEAR REGULATORS FEATURES DBV PACKAGE • ControlledBaseline (TOP VIEW) – OneAssembly/TestSite,OneFabrication IN 1 5 OUT Site • EnhancedDiminishingManufacturingSources GND 2 (DMS)Support EN 3 4 BYPASS • EnhancedProduct-ChangeNotification Fixed Option • QualificationPedigree (1) DBV PACKAGE • 200-mALow-DropoutRegulatorWithEN (TOP VIEW) • Availablein1.8V,2.5V,2.8V,2.85V,3V, IN 1 6 OUT 3.3V,4.75V,andAdjustable • HighPSRR(70dBat10kHz) GND 2 5 FB • UltralowNoise(32m V) EN 3 4 BYPASS • FastStart-UpTime(50m s) Adjustable Option • StableWitha2.2-m FCeramicCapacitor • ExcellentLoad/LineTransient DESCRIPTION • VeryLowDropoutVoltage The TPS793xx family of low-dropout (LDO) (112mVatFullLoad,TPS79330) low-power linear voltage regulators features high • 5-PinSOT23(DBV)Package power-supply rejection ratio (PSRR), ultralow noise, fast start-up, and excellent line and load transient responses in a small-outline SOT23 package. Each APPLICATIONS device in the family is stable, with a small 2.2-m F • VCOs ceramic capacitor on the output. The TPS793xx • RF family uses an advanced, proprietary, BiCMOS • Bluetooth™,WirelessLAN fabrication process to yield extremely low dropout voltages (e.g., 112 mV at 200 mA, TPS79330). Each device achieves fast start-up times (approximately 50 m s with a 0.001-m F bypass capacitor), while consuming very low quiescent current (170 m A typical). Moreover, when the device is placed in standby mode, the supply current is reduced to less (1) ComponentqualificationinaccordancewithJEDECand than 1 m A. The TPS79328 exhibits approximately industrystandardstoensurereliableoperationoverspecified temperaturerange.Thisincludes,butisnotlimitedto,Highly 32 m VRMS of output voltage noise with a 0.1-m F AcceleratedStressTest(HAST)orbiased85/85,temperature bypass capacitor. Applications with analog cycle,autoclaveorunbiasedHAST,electromigration,bond components that are noise sensitive, such as intermetalliclife,andmoldcompoundlife.Suchqualification portable RF electronics, benefit from the high PSRR testingshouldnotbeviewedasjustifyinguseofthis and low-noise features, as well as the fast response componentbeyondspecifiedperformanceandenvironmental limits. time. Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. BluetoothisatrademarkofBluetoothSIG,Inc. PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2003–2006,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

TPS79301-EP,, TPS79318-EP,, TPS79325-EP,, TPS79328-EP TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP www.ti.com SGLS163B–APRIL2003–REVISEDNOVEMBER2006 TPS79328 TPS79328 RIPPLE REJECTION OUTPUT SPECTRAL NOISE DENSITY vs vs FREQUENCY FREQUENCY 100 0.3 90 IO = 200 mA V/Hz 0.25 VCIo == 32..82 Vm F − dB 8700 my − 0.2 C(byp) = 0.1 m F Ripple Rejection 45360000 IO = 10 mA ectral Noise Densit 0.01.51 IO =I O2 0=0 1 m mAA 20 VI = 3.8 V Sp 0.05 100 CCo(b y=p 1) 0= m0F.01 m F Output 0 10 100 1 k 10 k 100 k 1 M 10 M 100 1 k 10 k 100 k f − Frequency − Hz f − Frequency − Hz AVAILABLEOPTIONS T VOLTAGE PACKAGE PARTNUMBER SYMBOL J 1.2to5.5V TPS79301DBVREP(1) PGVE 1.8V TPS79318DBVREP(1) PHHE 2.5V TPS79325DBVREP(1) PGWE 2.8V TPS79328DBVREP(1)(2) PGXE –40(cid:176) Cto125(cid:176) C SOT23 2.85V TPS793285DBVREP(1)(2) PHIE (DBV) 3V TPS79330DBVREP(1)(2) PGYE 3.3V TPS793333DBVREP(1) PHUE 4.75V TPS793475DBVREP(1) PHJE –55(cid:176) Cto125(cid:176) C 1.2to5.5V TPS79301MDBVREP(1) PMBM (1) TheDBVRindicatestapeandreelof3000parts. (2) Productpreview 2 SubmitDocumentationFeedback

TPS79301-EP,, TPS79318-EP,, TPS79325-EP,, TPS79328-EP TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP www.ti.com SGLS163B–APRIL2003–REVISEDNOVEMBER2006 ABSOLUTE MAXIMUM RATINGS(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT Inputvoltagerange(2) –0.3 6 V VoltagerangeatEN V + V –0.3 I 0.3 VoltageonOUT –0.3 6 V Peakoutputcurrent Internallylimited Human-BodyModel(HBM) 2 kV ESDrating Changed-DeviceModel(CDM) 500 V SeeDissipation Continuoustotalpowerdissipation RatingTable T Operatingvirtualjunctiontemperaturerange –55 125 (cid:176) C J T Storagetemperaturerange –65 150 (cid:176) C stg (1) Stressesbeyondthoselistedunder"absolutemaximumratings"maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder"recommendedoperating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Allvoltagevaluesarewithrespecttonetworkgroundterminal Dissipation Ratings DERATING T £ 25(cid:176) C T =70(cid:176) C T =85(cid:176) C A A A BOARD PACKAGE Rq JC Rq JA FACTORABOVE POWER POWER POWER T =25(cid:176) C RATING RATING RATING A LowK(1) DBV 63.75(cid:176) C/W 256(cid:176) C/W 3.906mW/(cid:176) C 391mW 215mW 156mW HighK(2) DBV 63.75(cid:176) C/W 178.3(cid:176) C/W 5.609mW/(cid:176) C 561mW 308mW 224mW (1) TheJEDEClowK(1s)boarddesignusedtoderivethisdatawasa3-in· 3-in,twolayerboardwith2-ozcoppertracesontopofthe board. (2) TheJEDEChighK(2s2p)boarddesignusedtoderivethisdatawasa3-in· 3-in,multilayerboardwith1-ozinternalpowerandground planesand2-ozcoppertracesontopandbottomoftheboard. SubmitDocumentationFeedback 3

TPS79301-EP,, TPS79318-EP,, TPS79325-EP,, TPS79328-EP TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP www.ti.com SGLS163B–APRIL2003–REVISEDNOVEMBER2006 ELECTRICAL CHARACTERISTICS overrecommendedoperatingfree-airtemperaturerange,EN=V,T =–55to125(cid:176) CandT =–40to125(cid:176) C,V =V + I J J I O(typ) 1V,I =1mA,C =10m F,C =0.01m F(unlessotherwisenoted) O o (byp) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V Inputvoltage(1) 2.7 5.5 V I I Continuousoutputcurrent(2) 0 200 mA O T Operatingjunctiontemperature –55 125 (cid:176) C J 0m A<I <200mA, T =–40to125(cid:176) C, 1.22V£OV £ 5.2V (3) J 0.98Vo 1.02Vo O TPS79301 0m A<I <200mA, T =–55to125(cid:176) C, 1.025 1.22V£OV £ 5.2V (3) J 0.97Vo Vo O T =25(cid:176) C 1.8 J TPS79318 0m A<I <200mA, 2.8V<V <5.5V 1.764 1.836 O I T =25(cid:176) C 2.5 J TPS79325 0m A<I <200mA, 3.5V<V <5.5V 2.45 2.55 O I T =25(cid:176) C 2.8 J TPS79328 Outputvoltage 0m A<I <200mA, 3.8V<V <5.5V 2.744 2.856 V O I T =25(cid:176) C 2.85 J TPS793285 0m A<I <200mA, 3.85V<V <5.5V 2.793 2.907 O I T =25(cid:176) C 3 J TPS79330 0m A<I <200mA, 4V<V <5.5V 2.94 3.06 O I T =25(cid:176) C 3.3 J TPS79333 0m A<I <200mA, 4.3V<V <5.5V 3.234 3.366 O I T =25(cid:176) C 4.75 J TPS793475 0m A<I <200mA, 5.25V<V <5.5V 4.655 4.845 O I 0m A<I <200mA, T =25(cid:176) C 170 Quiescentcurrent(GNDcurrent) O J m A 0m A<I <200mA 220 O Loadregulation 0m A<I <200mA, T =25(cid:176) C 5 mV O J V +1V<V £ 5.5V, T =25(cid:176) C 0.05 Outputvoltagelineregulation(D V /V )(4) O I J %/V O O V +1V<V £ 5.5V 0.12 O I C =0.001m F 55 (byp) Outputnoisevoltage(TPS79328) BIOW==202000mHAz,TtoJ=10205(cid:176)kCHz, CC((bbyypp))==00..00014m7Fm F 3363 m VRMS C =0.1m F 32 (byp) C =0.001m F 50 (byp) Time,start-up(TPS79328) RCL==114m WF,,T =25(cid:176) C C(byp)=0.0047m F 70 m s o J C =0.01m F 100 (byp) Outputcurrentlimit V =0V(3) 285 600 mA O Standbycurrent EN=0V, 2.7V<V <5.5V 0.07 1 m A I High-levelenableinputvoltage 2.7V<V <5.5V 2 V I Low-levelenableinputvoltage 2.7V<V <5.5V 0.7 V I Inputcurrent(EN) EN=0 –1 1 m A (1) Tocalculatetheminimuminputvoltageforyourmaximumoutputcurrent,usethefollowingformula: V(min)=V (max)+V (maxload) I O DO (2) Continuousoutputcurrentandoperatingjunctiontemperaturearelimitedbyinternalprotectioncircuitry,butitisnotrecommendedthat thedeviceoperateunderconditionsbeyondthosespecifiedinthistableforextendedperiodsoftime. (3) TheminimumINoperatingvoltageis2.7VorV +1V,whicheverisgreater.ThemaximumINvoltageis5.5V.Themaximum O(typ) outputcurrentis200mA. (4) IfV £ 2.5V,thenV =2.7V,V =5.5V: O Imin Imax VO(cid:5)VImax(cid:2)2.7V(cid:6) LineReg.(mV) (cid:3) (cid:5)%(cid:4)V(cid:6) (cid:1) 100 (cid:1)1000 IfV ‡ 2.5V,thenV =V +1V,V =5.5V. O Imin O Imax 4 SubmitDocumentationFeedback

TPS79301-EP,, TPS79318-EP,, TPS79325-EP,, TPS79328-EP TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP www.ti.com SGLS163B–APRIL2003–REVISEDNOVEMBER2006 ELECTRICAL CHARACTERISTICS (continued) overrecommendedoperatingfree-airtemperaturerange,EN=V,T =–55to125(cid:176) CandT =–40to125(cid:176) C,V =V + I J J I O(typ) 1V,I =1mA,C =10m F,C =0.01m F(unlessotherwisenoted) O o (byp) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Inputcurrent(FB)(TPS79301) FB=1.8V 1 m A f=100Hz,T =25(cid:176) C, I =10mA 70 J O Power-supplyripple f=100Hz,TJ=25(cid:176) C, IO=200mA 68 TPS79328 dB rejection f=10Hz,T =25(cid:176) C, I =200mA 70 J O f=100Hz,T =25(cid:176) C, I =200mA 43 J O I =200mA, T =25(cid:176) C 120 O J TPS79328 I =200mA 200 O I =200mA, T=25(cid:176) C 120 O J TPS793285 I =200mA 200 O I =200mA, T =25(cid:176) C 112 Dropoutvoltage(5) TPS79330 O J mV I =200mA 200 O I =200mA, T =25(cid:176) C 102 O J TPS79333 I =200mA 180 O I =200mA, T =25(cid:176) C 77 O J TPS793475 I =200mA 125 O UVLOthreshold V rising 2.25 2.65 V CC UVLOhysteresis T =25(cid:176) C V rising 100 mV J CC (5) INvoltageequalsV –100mV;TheTPS79325dropoutvoltageislimitedbytheinputvoltagerangelimitations. O(typ) SubmitDocumentationFeedback 5

TPS79301-EP,, TPS79318-EP,, TPS79325-EP,, TPS79328-EP TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP www.ti.com SGLS163B–APRIL2003–REVISEDNOVEMBER2006 DEVICE INFORMATION FUNCTIONALBLOCKDIAGRAM–ADJUSTABLEVERSION VIN VOUT UVLO Current Sense SHUTDOWN ILIM R1 GND _ + FB EN R2 UVLO Thermal Shutdown External to the Device Bandgap 250 kW Vref VIN Reference Bypass FUNCTIONALBLOCKDIAGRAM–FIXEDVERSION VIN VOUT UVLO Current Sense GND SHUTDOWN ILIM R1 _ + EN UVLO R2 Thermal Shutdown VIN RBeafnedregnacpe 250 kW Vref Bypass TERMINALFUNCTIONS TERMINAL I/O DESCRIPTION NAME ADJ FIXED Anexternalbypasscapacitor,connectedtothisterminal,inconjunctionwithaninternal BYPASS 4 4 resistor,createsalow-passfiltertofurtherreduceregulatornoise. Enableinputthatenablesorshutsdownthedevice.WhenENgoestoalogichigh,the EN 3 3 I deviceisenabled.Whenthedevicegoestoalogiclow,thedeviceisinshutdownmode. FB 5 N/A I Feedbackinputvoltagefortheadjustabledevice GND 2 2 Regulatorground IN 1 1 I Inputtothedevice OUT 6 5 O Regulatedoutputofthedevice 6 SubmitDocumentationFeedback

TPS79301-EP,, TPS79318-EP,, TPS79325-EP,, TPS79328-EP TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP www.ti.com SGLS163B–APRIL2003–REVISEDNOVEMBER2006 TYPICAL CHARACTERISTICS TPS79328 TPS79328 TPS79328 OUTPUT VOLTAGE OUTPUT VOLTAGE GROUND CURRENT vs vs vs OUTPUT CURRENT JUNCTION TEMPERATURE JUNCTION TEMPERATURE 2.805 2.805 250 − Output Voltage − V 222222......7788882990000.8912348 VCTJIo === 321.508° mVCF − Output Voltage − VO22..277.2897.5598 IO = 20I0O m= A1 mA mGround Current − A 112050000 VCIo == 31.08 mVF IO I=O 2 =0 01 mmAA O V V 2.797 50 2.78 2.796 VCIo == 31.08 mVF 2.795 2.775 0 0 50 100 150 200 −40−25−105 20 35 50 65 80 95 110125 −40−25−105 20 35 50 65 80 95110125 IO − Output Current − mA TJ − Junction Temperature − °C TJ − Junction Temperature − °C Figure1. Figure2. Figure3. TPS79328 TPS79328 TPS79328 OUTPUT SPECTRAL NOISE DENSITY OUTPUT SPECTRAL NOISE DENSITY OUTPUT SPECTRAL NOISE DENSITY vs vs vs FREQUENCY FREQUENCY FREQUENCY 0.3 0.3 1.6 mV/HzOutput Spectral Noise Density − 000...00012..555120 IO =I O2 0=0 VCC1 mIo( bm =Ay= Ap 32). .=82 V0m.F1 m F mV/HzOutput Spectral Noise Density − 000...00012..555120 IIOO == 12 0m0AVCC mIo( bA =y= p 31). 0=8 mV0F.1 m F mV/HzOutput Spectral Noise Density − 000011......24682401 C(bCyp(b) Cy=p( b)0 yC=.p0 (VIC)00bO =y.I1o 0p === 00)m .4132F=070.0 180 0 mm .m V1FFmF mAF 100 1 k 10 k 100 k 100 1 k 10 k 100 k 100 1 k 10 k 100 k f − Frequency − Hz f − Frequency − Hz f − Frequency − Hz Figure4. Figure5. Figure6. ROOT MEAN SQUARED OUTPUT NOISE OUTPUT IMPEDANCE TPS79328 vs vs DROPOUT VOLTAGE S) BYPASS CAPACITANCE FREQUENCY vs M R 60 2.5 JUNCTION TEMPERATURE md Output Noise −V( 345000 VICOOo = == 2 1200.08 m mVFA Wmpedance − 1.52 VCTJIo ==I=O 32 1.=508 ° 1 mVC FmA Voltage − mV 111110246800000 VCIo == 21.07 mVF IO = 200 mA ot Mean Square 1200 − Output IZo 0.51 IO = 100 mA − Dropout DO 468000 RMS − Ro 00.001BkHWzC =(b 1y0p0) −H Bz ytop a1s00s0. 0C1apacitance − m F 0.1 0010 100 f1 − k Freq1u0e nkcy 1−0 H0 zk 1 M 10 M V 200−40−25−10 5 2I0O =3 510 5m0A65 80 95110125 TJ − Junction Temperature − °C Figure7. Figure8. Figure9. SubmitDocumentationFeedback 7

TPS79301-EP,, TPS79318-EP,, TPS79325-EP,, TPS79328-EP TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP www.ti.com SGLS163B–APRIL2003–REVISEDNOVEMBER2006 TYPICAL CHARACTERISTICS (continued) TPS79328 TPS79328 TPS79328 RIPPLE REJECTION RIPPLE REJECTION RIPPLE REJECTION vs vs vs FREQUENCY FREQUENCY FREQUENCY 100 100 100 VI = 3.8 V VI = 3.8 V 90 IO = 200 mA 90 Co = 2.2 m F 90 Co = 2.2 m F Ripple Rejection − dB 485367000000 IO = 10 mA Ripple Rejection − dB 647358000000 C(bypIO) == 01.00 1m mAF IO = 200 mA Ripple Rejection − dB 647358000000 C(bIOyp =) =1 00 .m1 Am F IO = 200 mA 20 VI = 3.8 V 20 20 10 Co = 10 m F 10 10 C(byp) = 0.01 m F 0 0 0 10 100 1 k 10 k 100 k 1 M 10 M 10 100 1 k 10 k 100 k 1 M 10 M 10 100 1 k 10 k 100 k 1 M 10 M f − Frequency − Hz f − Frequency − Hz f − Frequency − Hz Figure10. Figure11. Figure12. TPS79328 TPS79328 TPS79328 OUTPUT VOLTAGE, ENABLE VOLTAGE LINE TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE V − Output Voltage − VEnable Voltage − VO 31200240 2C0(by4p0T) =IM 06.0E00 1(8S 0mvTF1sA0R0CC1(Tb(2VVICTby-Oy0JpIOoU p ) == = )=1== P = 432 2 220 )0.050.8..20°80. 10C V 1mm6V0 F0m4AF71 m8F0200 mVV − Output Voltage − mVV− Input Voltage − OI -3422..800080 ICC1Oo(0 b =y= p 22)20 .=020 0mm.3F0A01 tm 4−F0 Tim50e − 6m0sdd7vt0(cid:1)800m.4sV90 100 D − Change InVO− Output Current − mA Output Voltage − mVIO−1−23000224000000000 5VC0Io 1 ==0 301.08 1 mV5F02t0 −0 T2i5m0e 3−0 0m s13m5dd0Ait4(cid:1)000.m4052s0A500 t − Time − m s Figure13. Figure14. Figure15. POWER UP / POWER DOWN DC DROPOUT VOLTAGE TPS79301 vs DROPOUT VOLTAGE VO = 3 V OUTPUT CURRENT vs RL = 15 W 250 INPUT VOLTAGE 200 div mV 200 TJ = 125°C 500 mV/ VI VO Dropuoy Voltage − 110500 TJ = 25°TCJ = 125°C opout Voltage − mV 110500 TJ = 25°C 1s/div DC 50 TJ = −55°C − DrDO 50 TJ = −40°C V 00 20 40 60 80 100120140160180 200 0 IO = 200 mA IO − Output Current − mA 2.5 3 3.5 4 4.5 5 VI − Input Voltage − V Figure16. Figure17. Figure18. 8 SubmitDocumentationFeedback

TPS79301-EP,, TPS79318-EP,, TPS79325-EP,, TPS79328-EP TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP www.ti.com SGLS163B–APRIL2003–REVISEDNOVEMBER2006 TYPICAL CHARACTERISTICS (continued) MINIMUM REQUIRED INPUT VOLTAGE TYPICAL REGIONS OF STABILITY TYPICAL REGIONS OF STABILITY vs EQUIVALENT SERIES RESISTANCE (ESR) EQUIVALENT SERIES RESISTANCE (ESR) OUTPUT VOLTAGE vs vs 4 OUTPUT CURRENT OUTPUT CURRENT − Minimum Required Input Voltage − VVI 2.8231.5 I1O. 7=5 2002 mTAJ2 .=2 5−T4J0 2=T°.C5 J2 =5 °21C.2755°C3 3.25 3.5 WESR − Equivalent Series Resistance − 01.0001.10101 CVTJIo === 5−2.4.520 VR°mC,Fe V gtoOio 1n≥2 1oR5.f°e5 CSg Vtiaobni loitfy Instability WESR − Equivalent Series Resistance − 01.0001.10101 CVTJIo === 5−1.4050 mV°CF Rtoe g1i2o5nR° Coefg Siotna boilfi tIynstability VO − Output Voltage − V 0 0.02 0.04 0.06 0.08 0.2 0 0.02 0.04 0.06 0.08 0.2 IO − Output Current − A IO − Output Current − A Figure19. Figure20. Figure21. SubmitDocumentationFeedback 9

TPS79301-EP,, TPS79318-EP,, TPS79325-EP,, TPS79328-EP TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP www.ti.com SGLS163B–APRIL2003–REVISEDNOVEMBER2006 APPLICATION INFORMATION The TPS793xx family of low-dropout (LDO) regulators has been optimized for use in noise-sensitive battery-operated equipment. The device features extremely low dropout voltages, high PSRR, ultralow output noise, low quiescent current (170 m A typically), and enable-input to reduce supply currents to less than 1 m A whentheregulatoristurnedoff. AtypicalapplicationcircuitisshowninFigure22. TPS793xx 1 VI IN 4 BYPASS 5 OUT VO 0.1 m F 3 0.01 m F EN + 2.2 m F GND 2 Figure22.TypicalApplicationCircuit External Capacitor Requirements A 0.1-m F or larger ceramic input bypass capacitor, connected between IN and GND and located close to the TPS793xx, is required for stability and improves transient response, noise rejection, and ripple rejection. A higher-value electrolytic input capacitor may be necessary if large, fast-rise-time load transients are anticipated andthedeviceislocatedseveralinchesfromthepowersource. Like all LDOs, the TPS793xx requires an output capacitor connected between OUT and GND to stabilize the internal control loop. The minimum recommended capacitance is 2.2-m F. Any 2.2-m F or larger ceramic capacitor issuitable,providedthecapacitancedoesnotvarysignificantlyovertemperature. The internal voltage reference is a key source of noise in an LDO regulator. The TPS793xx has a BYPASS pin that is connected to the voltage reference through a 250-kW internal resistor. The 250-kW internal resistor, in conjunction with an external bypass capacitor connected to the BYPASS pin, creates a low pass filter to reduce the voltage reference noise and, therefore, the noise at the regulator output. In order for the regulator to operate properly, the current flow out of the BYPASS pin must be at a minimum, because any leakage current creates an IR drop across the internal resistor, thus, creating an output error. Therefore, the bypass capacitor must have minimalleakagecurrent. For example, the TPS79328 exhibits only 32 m V of output voltage noise using a 0.1-m F ceramic bypass RMS capacitor and a 2.2-m F ceramic output capacitor. Note that the output starts up slower as the bypass capacitance increases due to the RC time constant at the BYPASS pin that is created by the internal 250-kW resistorandexternalcapacitor. Board Layout Recommendation to Improve PSRR and Noise Performance To improve ac measurements like PSRR, output noise, and transient response, it is recommended that the board be designed with separate ground planes for V and V , with each ground plane connected only at the IN OUT GND pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the GNDpinofthedevice. 10 SubmitDocumentationFeedback

TPS79301-EP,, TPS79318-EP,, TPS79325-EP,, TPS79328-EP TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP www.ti.com SGLS163B–APRIL2003–REVISEDNOVEMBER2006 APPLICATION INFORMATION (continued) Power Dissipation and Junction Temperature Specified regulator operation is ensured to a junction temperature of 125(cid:176) C; the maximum junction temperature should be restricted to 125(cid:176) C under normal operating conditions. This restriction limits the power dissipation the regulator can handle in any given application. To ensure the junction temperature is within acceptable limits, calculate the maximum allowable dissipation, P , and the actual dissipation, P , which must be less than or D(max) D equaltoP . D(max) Themaximumpowerdissipationlimitisdeterminedusingthefollowingequation: T max(cid:1)T P (cid:2) J A D(max) Rq JA (1) Where: T max=Maximumallowablejunctiontemperature J Rq =Thermalresistance,junctiontoambient,forthepackage,seethedissipationratingtable JA T =Ambienttemperature A Theregulatordissipationiscalculatedusing: PD(cid:3)(cid:4)VI(cid:2)VO(cid:5)(cid:1)IO (2) Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal protectioncircuit. Programming the TPS79301 Adjustable LDO Regulator The output voltage of the TPS79301 adjustable regulator is programmed using an external resistor divider as showninFigure23.Theoutputvoltageiscalculatedusing: (cid:4) R1(cid:5) VO(cid:3)Vref(cid:1) 1(cid:2)R2 (3) Where: V =1.2246Vtypical(theinternalreferencevoltage) ref SubmitDocumentationFeedback 11

TPS79301-EP,, TPS79318-EP,, TPS79325-EP,, TPS79328-EP TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP www.ti.com SGLS163B–APRIL2003–REVISEDNOVEMBER2006 APPLICATION INFORMATION (continued) Programming the TPS79301 Adjustable LDO Regulator (continued) Resistors R1 and R2 should be chosen for approximately 50-m A divider current. Lower-value resistors can be used for improved noise performance, but the solution consumes more power. Higher resistor values should be avoided as leakage current into/out of FB across R1/R2 creates an offset voltage that artificially increases/decreases the feedback voltage and, thus, erroneously decreases/increases V . The recommended O designprocedureistochooseR2=30.1kW tosetthedividercurrentat50m A,C1=15pFforstability, and then calculateR1using: (cid:4)V (cid:5) O R1(cid:3) (cid:2)1 (cid:1)R2 V ref (4) In order to improve the stability of the adjustable version, it is suggested that a small compensation capacitor be placed between OUT and FB. For voltages <1.8 V, the value of this capacitor should be 100 pF. For voltages >1.8V,theapproximatevalueofthiscapacitorcanbecalculatedas: (3x10–7)x(R1 (cid:1) R2) C1 (cid:2) (R1xR2) (5) The suggested value of this capacitor for several resistor ratios is shown in the table below. If this capacitor is not used (such as in a unity-gain configuration) or if an output voltage <1.8 V is chosen, then the minimum recommendedoutputcapacitoris4.7m Finsteadof2.2m F. TPS79301 OUTPUT VOLTAGE PROGRAMMING GUIDE VI IN 1 m F OUTPUT R1 R2 C1 ≥ 2 V VOLTAGE EN OUT C1 VO 2.5 V 31.6 kW 30.1 kW 22 pF ≤ 0.7 V R1 1 m F 3.3 V 51 kW 30.1 kW 15 pF BYPASS FB 3.6 V 59 kW 30.1 kW 15 pF 0.01 m F GND R2 Figure23.TPS79301AdjustableLDORegulatorProgramming Regulator Protection The TPS793xx features internal current limiting and thermal protection. During normal operation, the TPS793xx limits output current to approximately 400 mA. When current limiting engages, the output voltage scales back linearly until the overcurrent condition ends. While current limiting is designed to prevent gross device failure, care should be taken not to exceed the power dissipation ratings of the package or the absolute maximum voltage ratings of the device. If the temperature of the device exceeds approximately 165(cid:176) C, thermal-protection circuitry shuts it down. Once the device has cooled down to below approximately 140(cid:176) C, regulator operation resumes. 12 SubmitDocumentationFeedback

PACKAGE OPTION ADDENDUM www.ti.com 17-Dec-2015 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPS79301DBVREP ACTIVE SOT-23 DBV 6 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 PGVE & no Sb/Br) TPS79301MDBVREP ACTIVE SOT-23 DBV 6 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 PMBM & no Sb/Br) TPS79318DBVREP ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 PHHE & no Sb/Br) TPS79333DBVREP ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 PHUE & no Sb/Br) TPS793475DBVREP ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 PHJE & no Sb/Br) V62/03634-01YE ACTIVE SOT-23 DBV 6 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 PGVE & no Sb/Br) V62/03634-02XE ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 PHHE & no Sb/Br) V62/03634-07XE ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 PHUE & no Sb/Br) V62/03634-08XE ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 PHJE & no Sb/Br) V62/03634-09XE ACTIVE SOT-23 DBV 6 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 PMBM & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 17-Dec-2015 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPS79333-EP : •Catalog: TPS79333 NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 1-May-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS79301DBVREP SOT-23 DBV 6 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 TPS79318DBVREP SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 TPS79333DBVREP SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 TPS793475DBVREP SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 1-May-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS79301DBVREP SOT-23 DBV 6 3000 182.0 182.0 20.0 TPS79318DBVREP SOT-23 DBV 5 3000 182.0 182.0 20.0 TPS79333DBVREP SOT-23 DBV 5 3000 182.0 182.0 20.0 TPS793475DBVREP SOT-23 DBV 5 3000 182.0 182.0 20.0 PackMaterials-Page2

PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 B A 1.45 MAX PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/D 11/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com

EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/D 11/2018 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/D 11/2018 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

PACKAGE OUTLINE DBV0006A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 B A 1.45 MAX PIN 1 INDEX AREA 1 6 2X 0.95 3.05 2.75 1.9 5 2 4 3 0.50 6X 0.25 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214840/B 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. 4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation. 5. Refernce JEDEC MO-178. www.ti.com

EXAMPLE BOARD LAYOUT DBV0006A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 6X (1.1) 1 6X (0.6) 6 SYMM 2 5 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214840/B 03/2018 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0006A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 6X (1.1) 1 6X (0.6) 6 SYMM 2 5 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214840/B 03/2018 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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