TPS781 Series www.ti.com........................................................................................................................................................... SBVS102B–MARCH2008–REVISEDMAY2008 m 150mA, Low-Dropout Regulator, Ultralow-Power, I 1 A Q with Pin-Selectable, Dual-Level Output Voltage FEATURES The V pin allows the end user to switch between SET 1 • LowI :1m A two voltage levels on-the-fly through a 2 Q microprocessor-compatible input. This LDO is • 150mA,Low-DropoutRegulatorwith designed specifically for battery-powered applications Pin-SelectableDualVoltageLevelOutput where dual-level voltages are needed. With ultralow • LowDropout:200mVat150mA I (1m A), microprocessors, memory cards, and smoke Q • 3%AccuracyOverLoad/Line/Temperature detectorsareidealapplicationsforthisdevice. • AvailableinDual-Level,FixedOutputVoltages The ultralow-power and selectable dual-level output from1.5Vto4.2VUsingInnovativeFactory voltages allow designers to customize power consumption for specific applications. Designers can EPROMProgramming nowshifttoalowervoltagelevelina battery-powered • AvailableinanAdjustableVersionfrom1.22V design when the microprocessor is in sleep mode, to5.25VoraDual-LevelOutputVersion further reducing overall system power consumption. • V PinTogglesOutputVoltageBetweenTwo The two voltage levels are preset at the factory SET Factory-ProgrammedVoltageLevels through a unique architecture using an EPROM. The EPROM technique allows for numerous output • Stablewitha1.0m FCeramicCapacitor voltage options between V low (1.5V to 4.2V) and • ThermalShutdownandOvercurrentProtection V high (2.0V to 3.0V) iSnETthe fixed output version SET • CMOSLogicLevel-CompatibleEnablePin only. Consult with your local factory representative for • AvailableinDDC(TSOT23-5)orDRV(2mm· exact voltage options and ordering information; minimumorderquantitiesmayapply. 2mmSON-6)PackageOptions The TPS781 series are designed to be compatible APPLICATIONS with the TI MSP430 and other similar products. The • TIMSP430AttachApplications enable pin is compatible with standard CMOS logic. This LDO is stable with any output capacitor greater • PowerRailswithProgrammingMode than 1.0m F. Therefore, implementations of this device • DualVoltageLevelsforPower-SavingMode require minimal board space because of miniaturized • WirelessHandsets,Smartphones,PDAs,MP3 packaging and a potentially small output capacitor. Players,andOtherBattery-OperatedHandheld The TPS781 series I (1m A) also come with thermal Q Products shutdown and current limit to protect the device during fault conditions. All packages have an DESCRIPTION operating temperature range of T = –40(cid:176) C to J +125(cid:176) C. For high-performance applications requiring The TPS781 family of low-dropout (LDO) regulators a dual-level voltage option, consider the TPS780 omfifneiratuthriezedbepnaecfiktsagionfgu(2lt·ra2loSwONp-o6w),eran(dIQse=lec1tam bAl)e, ssecarileinsg,.with an IQ of 500nA and dynamic voltage dual-level output voltage levels. An adjustable version is also available, but does not have the capability to shiftvoltagelevels. TPS781DDC TPS781DRV TSOT23-5 2mm x 2mm SON-6 (TOP VIEW) (TOP VIEW) IN 1 5 OUT OUT 1 6 IN Thermal GND 2 N/C 2 Pad 5 GND EN 3 4 VSET/FB VSET/FB 3 4 EN 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2008,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

TPS781 Series SBVS102B–MARCH2008–REVISEDMAY2008........................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. ORDERINGINFORMATION(1)(2) PRODUCT V OUT TPS781vvvxxxyyyz VVVisthenominaloutputvoltageforV andcorrespondstoV pinlow. OUT(HIGH) SET XXXisthenominaloutputvoltageforV andcorrespondstoV pinhigh. OUT(LOW) SET YYYisthepackagedesignator. Zisthetapeandreelquantity(R=3000,T=250). Adjustableversion(3)(4) (1) ForthemostcurrentpackageandorderinginformationseethePackageOptionAddendumattheendofthisdocument,orseetheTI websiteatwww.ti.com. (2) Additionaloutputvoltagecombinationsareavailableonaquick-turnbasisusinginnovative,factoryEPROMprogramming. Minimum-orderquantitiesapply;contactyoursalesrepresentativefordetailsandavailability. (3) Toordertheadjustableversion,useTPS78101YYYZ. (4) Thedeviceiseitherfixedvoltage,dual-levelV ,oradjustablevoltageonly.Devicedesigndoesnotpermitafixedandadjustable OUT outputsimultaneously. ABSOLUTE MAXIMUM RATINGS(1) AtT =–40(cid:176) Cto+125(cid:176) C,unlessotherwisenoted.AllvoltagesarewithrespecttoGND. J PARAMETER TPS781Series UNIT Inputvoltagerange,V –0.3to+6.0 V IN EnableandV voltagerange,V andV –0.3toV +0.3(2) V SET EN VSET IN Outputvoltagerange,V –0.3toV +0.3V V OUT IN Maximumoutputcurrent,I Internallylimited OUT Outputshort-circuitduration Indefinite Totalcontinuouspowerdissipation,P SeetheDissipationRatingstable DISS Humanbodymodel(HBM) 2 kV ESDrating Chargeddevicemodel(CDM) 500 V Operatingjunctiontemperaturerange,T –40to+125 (cid:176) C J Storagetemperaturerange,T –55to+150 (cid:176) C STG (1) Stressesabovetheseratingsmaycausepermanentdamage.Exposuretoabsolutemaximumconditionsforextendedperiodsmay degradedevicereliability.Thesearestressratingsonly,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyond thosespecifiedisnotimplied. (2) V andV absolutemaximumratingareV +0.3Vor+6.0V,whicheverisless. EN VSET IN DISSIPATION RATINGS DERATINGFACTOR BOARD PACKAGE Rq JC Rq JA ABOVETA=+25(cid:176) C TA<+25(cid:176) C TA=+70(cid:176) C TA=+85(cid:176) C High-K(1) DRV 20(cid:176) C/W 65(cid:176) C/W 15.4mW/(cid:176) C 1540mW 845mW 615mW High-K(1) DDC 90(cid:176) C/W 200(cid:176) C/W 5.0mW/(cid:176) C 500mW 275mW 200mW (1) TheJEDEChigh-K(2s2p)boardusedtoderivethisdatawasa3-inch· 3-inch,multilayerboardwith1-ounceinternalpowerandground planesand2-ouncecoppertracesontopandbottomoftheboard. 2 SubmitDocumentationFeedback Copyright©2008,TexasInstrumentsIncorporated

TPS781 Series www.ti.com........................................................................................................................................................... SBVS102B–MARCH2008–REVISEDMAY2008 ELECTRICAL CHARACTERISTICS Overoperatingtemperaturerange(T =–40(cid:176) Cto+125(cid:176) C),V =V +0.5Vor2.2V,whicheverisgreater;I = J IN OUT(NOM) OUT 100m A,V =V =V ,C =1.0m F,fixedoradjustable,unlessotherwisenoted.TypicalvaluesatT =+25(cid:176) C. VSET EN IN OUT J TPS781Series PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V Inputvoltagerange 2.2 5.5 V IN Nominal T =+25(cid:176) C,V =high/low –2 ±1 +2 % J SET VOUT(1) DCoutputaccuracy OverVIN,IOUT, VOUT+0.5V≤VIN≤5.5V, –3.0 ±2.0 +3.0 % temperature 0mA≤I ≤150mA,V =high/low OUT SET V Internalreference(2) T =+25(cid:176) C,V =4.0V,I =75mA 1.216 V FB (adjustableversiononly) J IN OUT V Outputvoltagerange(3)(4) V =5.5V,I =100m A(2) V 5.25 V OUT_RANGE (adjustableversiononly) IN OUT FB ΔV /ΔV Lineregulation V +0.5V≤V ≤5.5V,I =5mA –1 +1 % OUT IN OUT(NOM) IN OUT ΔV /ΔI Loadregulation 0mA≤I ≤150mA –2 +2 % OUT OUT OUT V Dropoutvoltage(5) V =95%V ,I =150mA 250 mV DO IN OUT(NOM) OUT V Outputnoisevoltage BW=100Hzto100kHz,VIN=2.2V, 86 m V N V =1.2V,I =1mA RMS OUT OUT V high(outputV V SET OUT(LOW) 1.2 V V HI selected),orENhigh(enabled) IN V low(outputV V SET OUT(HIGH) 0 0.4 V LO selected),orENlow(disabled) I Outputcurrentlimit V =0.90· V 150 230 400 mA CL OUT OUT(NOM) I =0mA 1.0 1.3 m A OUT I Groundpincurrent GND I =150mA 8 m A OUT V ≤0.4V,2.2V≤V <5.5V, ISHDN Shutdowncurrent(IGND) TEN=–40(cid:176) Cto+100(cid:176) CIN 18 130 nA J I V pincurrent V =V =5.5V 70 nA VSET SET EN VSET I ENpincurrent V =V =5.5V 40 nA EN EN VSET I FBpincurrent(6) V =5.5V,V =1.2V,I =100m A 10 nA FB (adjustableversiononly) IN OUT OUT f=10Hz 40 dB V =4.3V, IN PSRR Power-supplyrejectionratio V =3.3V, f=100Hz 20 dB OUT I =150mA OUT f=1kHz 15 dB tTR(H→L) VVOUTt=ra9n7s%itio·nVtime(high-to-low) VI OUT=_L1O0Wm=A2.2V,VOUT(HIGH)=3.3V, 800 m s OUT OUT(HIGH) OUT tTR(L→H) VVOUTt=ra9n7s%itio·nVtime(low-to-high) VI OUT=_H1IG0Hm=A3.3V,VOUT(LOW)=2.2V, 800 m s OUT OUT(LOW) OUT t Startuptime(7) COUT=1.0m F,VOUT=10%VOUT(NOM)to 500 m s STR V =90%V OUT OUT(NOM) I =150mA,C =1.0m F,V =2.8V, OUT OUT OUT t Shutdowntime(8) V =90%V toV =10% 500(9) m s SHDN OUT OUT(NOM) OUT V OUT(NOM) Shutdown,temperatureincreasing +160 (cid:176) C T Thermalshutdowntemperature SD Reset,temperaturedecreasing +140 (cid:176) C T Operatingjunctiontemperature –40 +125 (cid:176) C J (1) TheoutputvoltageforV =low/highisprogrammedatthefactory. SET (2) Adjustableversiononly. (3) NoV pinontheadjustableversion. SET (4) Nodynamicvoltagescalingontheadjustableversion. (5) V isnotmeasuredfordeviceswithV <2.3VbecauseminimumV =2.2V. DO OUT(NOM) IN (6) TheTPS78101FBpinistiedtoV .Adjustableversiononly. OUT (7) TimefromV =1.2VtoV =90%(V ). EN OUT OUT(NOM) (8) TimefromV =0.4VtoV =10%(V ). EN OUT OUT(NOM) (9) SeeShutdownintheApplicationInformationsectionformoredetails. Copyright©2008,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3

TPS781 Series SBVS102B–MARCH2008–REVISEDMAY2008........................................................................................................................................................... www.ti.com FUNCTIONAL BLOCK DIAGRAM IN OUT Current Limit Thermal Shutdown X EPROM U M EN Bandgap Active Pull- 10kW VSET/FB(1) Down LOGIC GND (1) Feedbackpin(FB)foradjustableversions;V forfixedvoltageversions. SET PIN CONFIGURATIONS TPS781DRV TPS781DDC 2mm x 2mm SON-6 TSOT23-5 (TOP VIEW) (TOP VIEW) OUT 1 6 IN IN 1 5 OUT Thermal N/C 2 (1) 5 GND GND 2 Pad VSET/FB 3 4 EN EN 3 4 VSET/FB (1) ItisrecommendedthattheSONpackagethermalpadbeconnectedtoground. Table1. TERMINALFUNCTIONS TERMINAL NAME DRV DDC DESCRIPTION Regulatedoutputvoltagepin.Asmall(1m F)ceramiccapacitorisneededfromthispinto OUT 1 5 groundtoassurestability.SeetheInputandOutputCapacitorRequirementsinthe ApplicationInformationsectionformoredetails. N/C 2 — Notconnected. Feedbackpin(FB)foradjustableversions;V forfixedvoltageversions.Drivingtheselect SET V /FB 3 4 pin(V )below0.4Vselectspresetoutputvoltagehigh.DrivingtheV pinover1.2V SET SET SET selectspresetoutputvoltagelow. Drivingtheenablepin(EN)over1.2Vturnsontheregulator.Drivingthispinbelow0.4Vputs EN 4 3 theregulatorintoshutdownmode,reducingoperatingcurrentto18nAtypical. GND 5 2 Groundpin. Inputpin.Asmallcapacitorisneededfromthispintogroundtoassurestability.Typicalinput IN 6 1 capacitor=1.0m F.BothinputandoutputcapacitorgroundsshouldbetiedbacktotheIC groundwithnosignificantimpedancebetweenthem. Thermalpad Thermalpad — ItisrecommendedthattheSONpackagethermalpadbeconnectedtoground. 4 SubmitDocumentationFeedback Copyright©2008,TexasInstrumentsIncorporated

TPS781 Series www.ti.com........................................................................................................................................................... SBVS102B–MARCH2008–REVISEDMAY2008 TYPICAL CHARACTERISTICS OvertheoperatingtemperaturerangeofT =–40(cid:176) Cto+125(cid:176) C,V =V +0.5Vor2.2V,whicheverisgreater; J IN OUT(TYP) I =100m A,V =V =V ,C =1m F,andC =1m F,unlessotherwisenoted. OUT EN VSET IN OUT IN LINEREGULATION LINEREGULATION I =5mA,V =1.22V(typ) I =5mA,V =1.2V,V =2.2V(typ) OUT OUT OUT VSET OUT TPS78101 TPS781330220 0.3 1.0 0.8 0.2 0.6 T = +85°C T = +25°C T =-40°C J J J 0.4 0.1 %) TJ= +125°C TJ= +25°C %) 0.2 (T 0 (T 0 U U VO VO -0.2 -0.1 -0.4 TJ= +125°C -0.6 -0.2 TJ=-40°C TJ= +85°C -0.8 -0.3 -1.0 2.2 2.7 3.2 3.7 4.2 4.7 5.2 5.7 2.7 3.2 3.7 4.2 4.7 5.2 5.7 V (V) V (V) IN IN Figure1. Figure2. LINEREGULATION LINEREGULATION I =150mA,V =1.2V,V =2.2V(typ) I =5mA,V =0.4V,V =3.3V(typ) OUT VSET OUT OUT VSET OUT TPS781330220 TPS781330220 3 1.0 0.8 2 0.6 TJ=-40°C T = +25°C J 0.4 1 (%)T 0 TJ= +25°C TJ=-40°C (%)T 0.20 U U VO VO -0.2 T = +85°C -1 J -0.4 -2 TJ= +85°C -0.6 -0.8 -3 -1.0 2.7 3.2 3.7 4.2 4.7 5.2 5.7 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 V (V) V (V) IN IN Figure3. Figure4. LINEREGULATION LOADREGULATION I =150mA,V =0.4V,V =3.3V(typ) V =3.3V OUT VSET OUT OUT TPS781330220 TPS78101 3 1.5 2 1.0 1 TJ= +125°C %) TJ=-40°C %) 0.5 (UT 0 (UT TJ= +25°C O O V V 0 -1 -0.5 -2 T = +85°C T = +25°C T = +85°C J J J T =-40°C J -3 -1.0 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 0 25 50 75 100 125 150 V (V) I (mA) IN OUT Figure5. Figure6. Copyright©2008,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5

TPS781 Series SBVS102B–MARCH2008–REVISEDMAY2008........................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) OvertheoperatingtemperaturerangeofT =–40(cid:176) Cto+125(cid:176) C,V =V +0.5Vor2.2V,whicheverisgreater; J IN OUT(TYP) I =100m A,V =V =V ,C =1m F,andC =1m F,unlessotherwisenoted. OUT EN VSET IN OUT IN LOADREGULATION LOADREGULATION V =1.2V,V =2.7V,V =2.2V V =0.4V,V =3.8V,V =3.3V VSET IN OUT VSET IN OUT TPS781330220 TPS781330220 3.0 3 2.5 2 2.0 T =-40°C 1.5 J 1 %) 1.0 %) (UT 0.5 T =-40°C (UT 0 O J O V 0 V -1 -0.5 -1.0 TJ= +25°C TJ= +85°C T = +25°C -2 -1.5 J T = +85°C -2.0 J -3 0 25 50 75 100 125 150 0 25 50 75 100 125 150 I (mA) I (mA) OUT OUT Figure7. Figure8. DROPOUTVOLTAGEvsOUTPUTCURRENT DROPOUTVOLTAGEvsOUTPUTCURRENT V =3.3V(typ),V =0.95· V (typ) V =0.4V,V =3.3V(typ),V =0.95· V (typ) OUT IN OUT VSET OUT IN OUT TPS78101 TPS781330220 200 250 180 TJ= +85°C TJ= +125°C 160 200 ) (mV)T 114200 TJ= +125°C ) (mV)T 150 TJ= +85°C U U O O V 100 V - - VIN 80 VIN 100 ( ( O 60 O D D V V 40 50 20 TJ= +25°C TJ=-40°C TJ= +25°C TJ=-40°C 0 0 0 25 50 75 100 125 150 0 25 50 75 100 125 150 I (mA) I (mA) OUT OUT Figure9. Figure10. DROPOUTVOLTAGEvsTEMPERATURE DROPOUTVOLTAGEvsTEMPERATURE V =3.3V(typ),V =0.95· V (typ) V =0.4V,V =3.3V(typ),V =0.95· V (typ) OUT IN OUT VSET OUT IN OUT TPS78101 TPS781330220 250 250 200 200 V) 150mA V) 150mA m m ) (T 150 ) (T 150 U U VO 100mA VO 100mA - - VIN 100 VIN 100 ( ( O 50mA O 50mA D D V V 50 50 10mA 10mA 0 0 -40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature (°C) Temperature (°C) Figure11. Figure12. 6 SubmitDocumentationFeedback Copyright©2008,TexasInstrumentsIncorporated

TPS781 Series www.ti.com........................................................................................................................................................... SBVS102B–MARCH2008–REVISEDMAY2008 TYPICAL CHARACTERISTICS (continued) OvertheoperatingtemperaturerangeofT =–40(cid:176) Cto+125(cid:176) C,V =V +0.5Vor2.2V,whicheverisgreater; J IN OUT(TYP) I =100m A,V =V =V ,C =1m F,andC =1m F,unlessotherwisenoted. OUT EN VSET IN OUT IN GROUNDPINCURRENTvsINPUTVOLTAGE GROUNDPINCURRENTvsINPUTVOLTAGE I =50mA,V =1.22V I =150mA,V =1.22V OUT OUT OUT OUT TPS78101 TPS78101 6 8 TJ= +85°C TJ= +125°C 7 5 T = +125°C T = +85°C J 6 J 4 5 A) A) m m ( 3 ( 4 D D N N G G I I 3 2 T = +25°C 2 TJ= +25°C TJ=-40°C J 1 T =-40°C 1 J 0 0 2.2 2.7 3.2 3.7 4.2 4.7 5.2 5.7 2.2 2.7 3.2 3.7 4.2 4.7 5.2 5.7 V (V) V (V) IN IN Figure13. Figure14. GROUNDPINCURRENTvsINPUTVOLTAGE GROUNDPINCURRENTvsINPUTVOLTAGE I =50mA,V =1.2V,V =2.2V I =150mA,V =1.2V,V =2.2V OUT VSET OUT OUT VSET OUT TPS781330220 TPS781330220 6 12 11 5 10 T = +85°C T = +125°C 9 J J T = +125°C 4 8 J T = +85°C A) A) 7 J m m ( 3 ( 6 D D GN GN 5 I I 2 4 TJ= +25°C TJ=-40°C 3 T = +25°C 1 2 J T =-40°C 1 J 0 0 2.7 3.2 3.7 4.2 4.7 5.2 5.7 2.7 3.2 3.7 4.2 4.7 5.2 5.7 V (V) V (V) IN IN Figure15. Figure16. GROUNDPINCURRENTvsINPUTVOLTAGE GROUNDPINCURRENTvsINPUTVOLTAGE I =50mA,V =0.4V,V =3.3V I =150mA,V =0.4V,V =3.3V OUT VSET OUT OUT VSET OUT TPS781330220 TPS781330220 6 9 8 5 TJ= +85°C TJ= +125°C 7 TJ= +85°C TJ= +125°C 4 6 A) A) 5 m m ( 3 ( ND ND 4 G G I I 2 3 TJ= +25°C TJ=-40°C 2 TJ= +25°C TJ=-40°C 1 1 0 0 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 V (V) V (V) IN IN Figure17. Figure18. Copyright©2008,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7

TPS781 Series SBVS102B–MARCH2008–REVISEDMAY2008........................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) OvertheoperatingtemperaturerangeofT =–40(cid:176) Cto+125(cid:176) C,V =V +0.5Vor2.2V,whicheverisgreater; J IN OUT(TYP) I =100m A,V =V =V ,C =1m F,andC =1m F,unlessotherwisenoted. OUT EN VSET IN OUT IN SHUTDOWNCURRENTvsINPUTVOLTAGE CURRENTLIMITvsINPUTVOLTAGE I =0mA,V =0.4V V =90%V (typ),V =1.22V(typ) OUT VSET OUT OUT OUT TPS78101 TPS78101 60 280 270 50 T =-40°C J T = +85°C 260 40 J A) m 250 nA) mit ( TJ= +25°C I(GND 3200 TJ= +25°C urrent Li 224300 C 220 T = +85°C 10 J T =-40°C 210 J 0 200 2.2 2.7 3.2 3.7 4.2 4.7 5.2 5.7 2.2 2.7 3.2 3.7 4.2 4.7 5.2 5.7 V (V) V (V) IN IN Figure19. Figure20. CURRENTLIMITvsINPUTVOLTAGE CURRENTLIMITvsINPUTVOLTAGE V =1.2V,V =95%V (typ),V =2.2V(typ) V =0.4V,V =95%V (typ),V =3.3V(typ) VSET OUT OUT OUT VSET OUT OUT OUT TPS781330220 TPS781330220 300 300 290 290 280 280 A) 270 TJ=-40°C A) 270 TJ=-40°C m m mit ( 260 mit ( 260 ent Li 225400 TJ= +25°C ent Li 225400 TJ= +25°C Curr 230 TJ= +85°C Curr 230 TJ= +85°C 220 220 T = +125°C T = +125°C J J 210 210 200 200 2.7 3.2 3.7 4.2 4.7 5.2 5.7 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 V (V) V (V) IN IN Figure21. Figure22. FEEDBACKPINCURRENTvsTEMPERATURE V PINCURRENTvsINPUTVOLTAGE SET I =0mA,V =1.22V I =100m A,V =1.2V,V =2.2V OUT OUT OUT VSET OUT TPS78101 TPS781330220 5 1.0 4 0.8 A) 3 nA) 0.6 I(nFB 2 (VSET 0.4 TJ= +85°C TJ=-40°C TJ= +25°C I V max IN 1 0.2 V min IN 0 0 -40 -25 -10 5 20 35 50 65 80 95 110 125 2.7 3.2 3.7 4.2 4.7 5.2 5.7 Temperature (°C) V (V) IN Figure23. Figure24. 8 SubmitDocumentationFeedback Copyright©2008,TexasInstrumentsIncorporated

TPS781 Series www.ti.com........................................................................................................................................................... SBVS102B–MARCH2008–REVISEDMAY2008 TYPICAL CHARACTERISTICS (continued) OvertheoperatingtemperaturerangeofT =–40(cid:176) Cto+125(cid:176) C,V =V +0.5Vor2.2V,whicheverisgreater; J IN OUT(TYP) I =100m A,V =V =V ,C =1m F,andC =1m F,unlessotherwisenoted. OUT EN VSET IN OUT IN V PINCURRENTvsINPUTVOLTAGE ENABLEPINCURRENTvsINPUTVOLTAGE SET I =100m A,V =0.4V,V =3.3V I =1mA,V =1.22V OUT VSET OUT OUT OUT TPS781330220 TPS78101 2.5 2.0 TJ= +125°C 1.8 2.0 1.6 1.4 1.5 (nA)T 1.0 (nA) 11..20 TJ= +85°C TJ= +25°C TJ=-40°C E N IVS TJ= +85°C TJ=-40°C IE 0.8 0.5 0.6 0.4 0 T = +25°C 0.2 J -0.5 0 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 2.2 2.7 3.2 3.7 4.2 4.7 5.2 5.7 V (V) V (V) IN IN Figure25. Figure26. ENABLEPINCURRENTvsINPUTVOLTAGE ENABLEPINCURRENTvsINPUTVOLTAGE I =100m A,V =1.2V,V =2.2V I =100m A,V =0.4V,V =3.3V OUT SET OUT OUT VSET OUT TPS781330220 TPS781330220 2.0 2.0 1.8 1.8 1.6 1.6 1.4 1.4 A) n 1.2 1.2 (N A) IE 10..08 TJ= +85°C TJ= +25°C TJ=-40°C I(nEN 10..08 TJ= +85°C TJ= +25°C TJ=-40°C 0.6 0.6 0.4 0.4 0.2 0.2 0 0 2.7 3.2 3.7 4.2 4.7 5.2 5.7 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 V (V) V (V) IN IN Figure27. Figure28. ENABLEPINHYSTERESISvsTEMPERATURE ENABLEPINHYSTERESISvsTEMPERATURE I =1mA,TPS78101 I =1mA,TPS781330220 OUT OUT 1.2 1.2 1.1 1.1 1.0 1.0 V On V On EN EN 0.9 0.9 V) V) ( 0.8 ( 0.8 N N E E V V 0.7 0.7 V Off V Off EN EN 0.6 0.6 0.5 0.5 0.4 0.4 -40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature (°C) Temperature (°C) Figure29. Figure30. Copyright©2008,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9

TPS781 Series SBVS102B–MARCH2008–REVISEDMAY2008........................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) OvertheoperatingtemperaturerangeofT =–40(cid:176) Cto+125(cid:176) C,V =V +0.5Vor2.2V,whicheverisgreater; J IN OUT(TYP) I =100m A,V =V =V ,C =1m F,andC =1m F,unlessotherwisenoted. OUT EN VSET IN OUT IN %ΔV vsTEMPERATURE %ΔV vsTEMPERATURE OUT OUT I =1mA,V =3.8V,V =3.3V V =1.2V,V =2.7V,V =2.2V(typ) OUT IN OUT VSET IN OUT TPS78101 TPS781330220 0.4 1 0.3 0.1mA 0.2 0 %V(V)OUT -00..101 D%V(V)OUT 5mA -1 -0.2 150mA -0.3 -0.4 -2 -40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature (°C) Temperature (°C) Figure31. Figure32. %ΔV vsTEMPERATURE OUTPUTSPECTRALNOISEDENSITYvsFREQUENCY OUT V =0.4V,V =3.8V,V =3.3V(typ) C =1m F,C =2.2m F,V =1.2V,V =2.7V VSET IN OUT IN OUT VSET IN TPS781330220 TPS781330220 3 100 )z H Ö 2 V/ m 10 y ( 150mA D%V(V)OUT -101 150m5AmA0.1mA Spectral Noise Densit 0.00.111 10590mmVARMS 109mVRMS -2 put 1mA ut 108mV -3 O 0.001 RMS -40 -25 -10 5 20 35 50 65 80 95 110 125 10 100 1k 10k 100k Temperature (°C) Frequency (Hz) Figure33. Figure34. RIPPLEREJECTIONvsFREQUENCY V =2.7V,V =1.2V,C =2.2m F INPUTVOLTAGERAMPvsOUTPUTVOLTAGE IN OUT OUT TPS78101 TPS781330220 80 V V = 0.0V to5.0V 1mA IN IN 70 V VOUT= 3.3V Enable OUT I = 150mA 60 V/div) COOUUTT= 10mF Cu B) 50 e (1 rren PSRR (d 4300 50mA Voltag Load Current t (50mA/d iv 20 0V ) 150mA 10 0 10 100 1k 10k 100k 1M 10M Time (20ms/div) Frequency (Hz) Figure35. Figure36. 10 SubmitDocumentationFeedback Copyright©2008,TexasInstrumentsIncorporated

TPS781 Series www.ti.com........................................................................................................................................................... SBVS102B–MARCH2008–REVISEDMAY2008 TYPICAL CHARACTERISTICS (continued) OvertheoperatingtemperaturerangeofT =–40(cid:176) Cto+125(cid:176) C,V =V +0.5Vor2.2V,whicheverisgreater; J IN OUT(TYP) I =100m A,V =V =V ,C =1m F,andC =1m F,unlessotherwisenoted. OUT EN VSET IN OUT IN OUTPUTVOLTAGEvsENABLE(SLOWRAMP) INPUTVOLTAGEvsDELAYTOOUTPUT TPS781330220 TPS781330220 VIN Enable VSET v) v) V/di VOUT Load Current Cu V/di V Cu e (1 rren e (1 Load Current IN rren Voltag V = 5.5V t (50m Voltag t (50m IN A A VIOOUUTT== 1 35.03mVA /div) VIN= 0.0V to 5.5V /div) 0V COUT= 10mF 00AV VOUT VICOOUUTT=== 1 210.002mmVFA OUT Time (20ms/div) Time (1ms/div) Figure37. Figure38. LINETRANSIENTRESPONSE LINETRANSIENTRESPONSE TPS781330220 TPS781330220 V V IN IN 1V/div 1V/div V V V = 4.0V to 4.5V OUT V = 4.0V to 4.5V OUT IN IN V = 2.2V V = 3.3V OUT OUT I = 150mA I = 150mA OUT OUT Slew Rate = 1V/ms Slew Rate = 1V/ms Time (200ms/div) Time (200ms/div) Figure39. Figure40. LOADTRANSIENTRESPONSE LOADTRANSIENTRESPONSE TPS781330220 TPS781330220 V Enable Enable v) IN v) edi edi Voltag00mV/ V Voltag00mV/ VIN VOUT 1 OUT 1 ( ( V = 5.5V IN VCIOOOUUUTTT=== 0 31m.03AmV Fto 10mA CLuorraednt (10mA/div)Current VVIONU=T =5 .35.V3V CLuorraednt (20mA/div)Current I = 0mA to 60mA 0A OUT 0A C = 10mF OUT Time (5ms/div) Time (2ms/div) Figure41. Figure42. Copyright©2008,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11

TPS781 Series SBVS102B–MARCH2008–REVISEDMAY2008........................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) OvertheoperatingtemperaturerangeofT =–40(cid:176) Cto+125(cid:176) C,V =V +0.5Vor2.2V,whicheverisgreater; J IN OUT(TYP) I =100m A,V =V =V ,C =1m F,andC =1m F,unlessotherwisenoted. OUT EN VSET IN OUT IN ENABLEPINvsOUTPUTVOLTAGERESPONSE ANDOUTPUTCURRENT ENABLEPINvsOUTPUTVOLTAGEDELAY TPS781330220 TPS781330220 Enable V = 5.5V IN e (1V/div) VIN VOUT Curren e (1V/div) VIN Enable VOUT VICOOOUUUTTT=== 1 315.003mmVFA Curren Voltag Load Current t (50m Voltag Load t (50m A/d Current A/d V = 5.50V iv iv 0V IN ) 0V ) V = 3.3V OUT I = 150mA OUT C = 10mF OUT Time (1ms/div) Time (1ms/div) Figure43. Figure44. V PINTOGGLE V PINTOGGLE SET SET TPS781330220 TPS781330220 VOUT VOUT 1V/div VSET 1V/div VSET V = 5.0V IN Enable = V V = 5.0V IN IN I = 150mA I = 150mA OUT OUT V Transitioning from 2.2V to 3.3V V Transitioning from 3.3V to 2.2V OUT OUT Time (500ms/div) Time (500ms/div) Figure45. Figure46. V PINTOGGLE(SLOWRAMP) SET TPS781330220 C V u IN rre n t (5 v) VOUT VSET 0mA V/di /div 1 ) oltage ( VVIONU=T =5 .35.V3V 5100m0mAA V Load Current I = 150mA OUT to 100mA 0A C = 10mF OUT Time (50ms/div) Figure47. 12 SubmitDocumentationFeedback Copyright©2008,TexasInstrumentsIncorporated

TPS781 Series www.ti.com........................................................................................................................................................... SBVS102B–MARCH2008–REVISEDMAY2008 APPLICATION INFORMATION ProgrammingtheTPS78101AdjustableLDO APPLICATION EXAMPLES Regulator The TPS781 series of LDOs typically take less than 800m s to transition from a lower voltage of 2.2V to a The output voltage of the TPS78101 adjustable regulator is programmed using an external resistor higher voltage of 3.3V under an output load of divider as shown in Figure 49. The output voltage 150mA; see Figure 45. Additionally, the TPS781 operating range is 1.2V to 5.1V, and is calculated series contain active pull-down circuitry that usingEquation1: automaticallypullscharge out of the voltage capacitor ( R ) to transition the output voltage from the higher V = V ´ 1 + 1 voltage to the lower voltage, even with no load OUT FB R2 (1) connected. Output voltage overshoots and undershoots are minimal under this load condition. Where: The TPS781 series typically take less than 800m s to V =1.216Vtyp(theinternalreferencevoltage) FB transition from V low (3.3V to 2.2V), or V high SET SET Resistors R and R should be chosen for (2.2V to 3.3V); see Figure 45 and Figure 46. Both 1 2 approximately 1.2m A divider current. Lower value output states of the TPS781 series are resistors can be used for improved noise factory-programmable between 1.5V to 4.2V. Note performance, but the solution consumes more power. that during startup or steady-state conditions, it is Higher resistor values should be avoided as leakage important that the EN pin and V pin voltages never SET current into/out of FB across R /R creates an offset exceedV +0.3V. 1 2 IN voltage that artificially increases/decreases the feedback voltage and thus erroneously 4.2V to 5.5V 2.2V to 3.3V decreases/increases V . Table 2 lists several VIN IN OUT VOUT common output voltageOsUTand resistor values. The 1mF 1mF recommended design procedure is to choose R = TPS781 1MΩ to set the divider current at 1.2m A, and th2en On calculateR usingEquation2: Off EN ( 1 ) V R = OUT -1 ´R 1 V 2 VSETHigh = VOUT(LOW) FB (2) VSETLow = VOUT(HIGH) VSET GND VIN IN OUT VOUT 1mF 1mF Figure48.TypicalApplicationCircuit R TPS78101 1 EN FB The TPS781 series is also used effectively in dynamic voltage scaling (DVS) applications. DVS applications are required to dynamically switch GND R2 between a high operational voltage to a low standby voltage in order to reduce power consumption. Modern multimillion gate microprocessors fabricated R with the latest sub-micron processes save power by V = V ´(1 + 1 ) OUT FB R transitioning to a lower voltage to reduce leakage 2 currents while maintaining content. This architecture enables the microprocessor to transition quickly into Figure49.TPS78101AdjustableLDORegulator an operational state (wake up) without requiring a Programming reload of the states from external memory, or a reboot. Table2.OutputVoltageProgrammingGuide OUTPUTVOLTAGE R R 1 2 1.8V 0.499MΩ 1MΩ 2.8V 1.33MΩ 1MΩ 5.0V 3.16MΩ 1MΩ Copyright©2008,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13

TPS781 Series SBVS102B–MARCH2008–REVISEDMAY2008........................................................................................................................................................... www.ti.com PoweringtheMSP430Microcontroller 3.0V Several versions of the TPS781 are ideal for VIN VOUT VCC 1mF 1mF powering the MSP430 microcontroller. Table 3 shows LDO MSP430 potentialapplicationsofsomevoltageversions. I/O GND V Table3.TypicalMSP430Applications SS V V OUT(HIGH) OUT(LOW) DEVICE (TYP) (TYP) APPLICATION V >1.800V OUT,MIN requiredbymany VCC= 3.0V MSP430s.Allows TPS781360200 3.6V 2.0V lowestpower 5mA consumption Active operation. Mode V >2.200V OUT,MIN TPS781360220 3.6V 2.2V rMeSquPi4re3d0sbyFLsAomSHe 1.6mA IQ LPM3/Sleep Mode operation. V >2.700V OUT,MIN requiredbysome TPS781360300 3.6V 3.0V MSP430sFLASH operation. Figure50.TypicalLDOwithoutDVS V <3.600V OUT,MIN requiredbysome TPS781360220 3.6V 2.2V MSP430s.Allows 2.2V to 3.6V highestspeed V V V operation. IN OUT CC 1mF 1mF TPS781 MSP430 The TPS781 family offers many output voltage versions to allow designers to optimize the supply VSET I/O GND V voltage for the processing speed required of the SS MSP430. This flexible architecture minimizes the supply current consumed by the particular MSP430 application. The MSP430 total system power can be reduced by substituting the 1m A IQ TPS781 series VCC= 3.6V LDO in place of an existing, older-technology LDO. Additionally, DVS allows for increasing the clock V = 2.2V 5mA speed in active mode (MSP430 V = 3.6V). The CC CC Active 3.6V V reduces the MSP430 time in active mode. Mode CC In low-power mode, MSP430 system power can be further reduced by lowering the MSP430 V to 2.2V 700nA I CC Q insleepmode. Current LPM3/Sleep Mode Key features of the TPS781 series are an ultralow quiescent current (1m A), DVS, and miniaturized packaging. The TPS781 family are available in SON-6 and TSOT-23 packages. Figure 50 shows a Figure51.TPS781withIntegratedDVS typical MSP430 circuit powered by an LDO without DVS. Figure 51 is an MSP430 circuit using a TPS781 The other benefit of DVS is that it allows a higher V CC LDO that incorporates an integrated DVS, thus voltage on the MSP430, increasing the clock speed simplifying the circuit design. In a circuit without DVS, andreducingtheactivemodedwelltime. as Figure 50 illustrates, V is always at 3.0V. When CC the MSP430 goes into sleep mode, V remains at CC 3.0V; if DVS is applied, V could be reduced in CC sleep mode. In Figure 51, the TPS781 LDO with integrated DVS maintains 3.6V V until a logic high CC signal from the MSP430 forces V to level shift OUT V from 3.6V down to 2.2V; thus reducing power in OUT sleepmode. 14 SubmitDocumentationFeedback Copyright©2008,TexasInstrumentsIncorporated

TPS781 Series www.ti.com........................................................................................................................................................... SBVS102B–MARCH2008–REVISEDMAY2008 INPUT AND OUTPUT CAPACITOR SHUTDOWN REQUIREMENTS The enable pin (EN) is active high and is compatible Although an input capacitor is not required for with standard and low-voltage CMOS levels. When stability, it is good analog design practice to connect shutdown capability is not required, EN should be a 0.1m F to 1.0m F low equivalent series resistance connected to the IN pin, as shown in Figure 52. (ESR) capacitor across the input supply near the Figure 53 shows both EN and V connected to IN. SET regulator. This capacitor counteracts reactive input The TPS781 series, with internal active output sources and improves transient response, noise pull-downcircuitry,discharges the output to within 5% rejection, and ripple rejection. A higher-value V withatime(t)showninEquation3: OUT capacitor may be necessary if large, fast rise-time 10kW´R load transients are anticipated, or if the device is not t = 3 L ´C located near the power source. If source impedance 10kW+ R OUT L is not sufficiently low, a 0.1m F input capacitor may be (3) necessarytoensurestability. Where: The TPS781 series are designed to be stable with R =outputloadresistance L standard ceramic capacitors with values of 1.0m F or C =outputcapacitance OUT larger at the output. X5R- and X7R-type capacitors arebestbecausetheyhaveminimal variation in value 4.2V to 5.5V 2.2V to 3.3V and ESR over temperature. Maximum ESR should be VIN IN OUT VOUT less than 1.0Ω. With tolerance and dc bias effects, 1mF 1mF theminimumcapacitancetoensurestabilityis1m F. TPS781 BOARD LAYOUT RECOMMENDATIONS TO EN IMPROVE PSRR AND NOISE PERFORMANCE To improve ac performance (such as PSRR, output VSETHigh = VOUT(LOW) noise, and transient response), it is recommended VSETLow = VOUT(HIGH) VSET GND that the printed circuit board (PCB) be designed with separate ground planes for V and V , with each IN OUT ground plane connected only at the GND pin of the device. In addition, the ground connection for the Figure52.CircuitShowingENTiedHighwhen output capacitor should connect directly to the GND ShutdownCapabilityisNotRequired pin of the device. High ESR capacitors may degrade PSRR. 4.2V to 5.5V 2.2V INTERNAL CURRENT LIMIT VIN IN OUT VOUT 1mF 1mF The TPS781 is internally current-limited to protect the TPS781 regulator during fault conditions. During current limit, the output sources a fixed amount of current that is EN largely independent of output voltage. For reliable operation, the device should not be operated in a currentlimitstateforextendedperiodsoftime. V SET The PMOS pass element in the TPS781 series has a GND built-in body diode that conducts current when the voltage at OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage Figure53.CircuittoTieBothENandV High operation is anticipated, external limiting to 5% of SET ratedoutputcurrentmaybeappropriate. Copyright©2008,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15

TPS781 Series SBVS102B–MARCH2008–REVISEDMAY2008........................................................................................................................................................... www.ti.com DROPOUT VOLTAGE ACTIVE V PULL-DOWN OUT The TPS781 series use a PMOS pass transistor to IntheTPS781series,theactivepull-downdischarges achieve low dropout. When (V – V ) is less than V when the device is off. However, the input IN OUT OUT the dropout voltage (V ), the PMOS pass device is voltage must be greater than 2.2V for the active DO the linear region of operation and the input-to-output pull-downtowork. resistance is the R of the PMOS pass element. DS(ON) V approximately scales with output current MINIMUM LOAD DO because the PMOS device behaves like a resistor in The TPS781 series are stable with no output load. dropout. As with any linear regulator, PSRR and Traditional PMOS LDO regulators suffer from lower transient response are degraded as (V – V ) IN OUT loop gain at very light output loads. The TPS781 approaches dropout. This effect is shown in the employs an innovative, low-current circuit under very Typical Characteristics section. Refer to application light or no-load conditions, resulting in improved report SLVA207, Understanding LDO Dropout, output voltage regulation performance down to zero availablefordownloadfromwww.ti.com. output current. See Figure 41 for the load transient response. TRANSIENT RESPONSE As with any regulator, increasing the size of the output capacitor reduces over/undershoot magnitude but increases duration of the transient response. For moreinformation,seeFigure42. 16 SubmitDocumentationFeedback Copyright©2008,TexasInstrumentsIncorporated

TPS781 Series www.ti.com........................................................................................................................................................... SBVS102B–MARCH2008–REVISEDMAY2008 THERMAL INFORMATION THERMAL PROTECTION POWER DISSIPATION Thermal protection disables the output when the The ability to remove heat from the die is different for junction temperature rises to approximately +160(cid:176) C, each package type, presenting different allowing the device to cool. Once the junction considerations in the PCB layout. The PCB area temperature cools to approximately +140(cid:176) C, the around the device that is free of other components output circuitry is enabled. Depending on power moves the heat from the device to the ambient air. dissipation, thermal resistance, and ambient Performance data for JEDEC low- and high-K boards temperature, the thermal protection circuit may cycle are given in the Dissipation Ratings table. Using on and off again. This cycling limits the dissipation of heavier copper increases the effectiveness in the regulator, protecting it from damage as a result of removing heat from the device. The addition of plated overheating. through-holes to heat-dissipating layers also improves the heatsink effectiveness. Power Any tendency to activate the thermal protection circuit dissipation depends on input voltage and load indicates excessive power dissipation or an conditions. Power dissipation (P ) is equal to the inadequate heatsink. For reliable operation, junction D product of the output current times the voltage drop temperature should be limited to +125(cid:176) C maximum. across the output pass element (V to V ), as Toestimatethemargin of safety in a complete design IN OUT showninEquation4: (including heatsink), increase the ambient P = (V -V )´I temperature until the thermal protection is triggered; D IN OUT OUT (4) use worst-case loads and signal conditions. For good reliability, thermal protection should trigger at least PACKAGE MOUNTING +35(cid:176) C above the maximum expected ambient Solder pad footprint recommendations for the condition of your particular application. This TPS781 series are available from the Texas configuration produces a worst-case junction temperature of +125(cid:176) C at the highest expected Instruments web site at www.ti.com through the TPS781seriesproductfolders. ambienttemperatureandworst-caseload. The internal protection circuitry of the TPS781 series has been designed to protect against overload conditions. However, it is not intended to replace proper heatsinking. Continuously running the TPS781 series into thermal shutdown degrades device reliability. Copyright©2008,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17

PACKAGE OPTION ADDENDUM www.ti.com 4-Jul-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) Ball material (3) (4/5) (6) TPS78101DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 CEB & no Sb/Br) TPS78101DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 CEB & no Sb/Br) TPS78101DRVR ACTIVE WSON DRV 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 CEB & no Sb/Br) TPS78101DRVT ACTIVE WSON DRV 6 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 CEB & no Sb/Br) TPS781250200DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 SAN & no Sb/Br) TPS781250200DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 SAN & no Sb/Br) TPS781330220DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 CED & no Sb/Br) TPS781330220DDCRG4 ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 CED & no Sb/Br) TPS781330220DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 CED & no Sb/Br) TPS781330220DRVR ACTIVE WSON DRV 6 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 CED & no Sb/Br) TPS781330220DRVT ACTIVE WSON DRV 6 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 CED & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 4-Jul-2020 Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS78101DDCR SOT- DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TPS78101DDCT SOT- DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TPS78101DRVR WSON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS78101DRVR WSON DRV 6 3000 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2 TPS78101DRVT WSON DRV 6 250 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2 TPS78101DRVT WSON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS781250200DDCR SOT- DDC 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TPS781250200DDCT SOT- DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TPS781330220DDCR SOT- DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TPS781330220DDCT SOT- DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TPS781330220DRVR WSON DRV 6 3000 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2 TPS781330220DRVR WSON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS781330220DRVT WSON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS781330220DRVT WSON DRV 6 250 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2018 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS78101DDCR SOT-23-THIN DDC 5 3000 195.0 200.0 45.0 TPS78101DDCT SOT-23-THIN DDC 5 250 195.0 200.0 45.0 TPS78101DRVR WSON DRV 6 3000 203.0 203.0 35.0 TPS78101DRVR WSON DRV 6 3000 205.0 200.0 33.0 TPS78101DRVT WSON DRV 6 250 205.0 200.0 33.0 TPS78101DRVT WSON DRV 6 250 203.0 203.0 35.0 TPS781250200DDCR SOT-23-THIN DDC 5 3000 195.0 200.0 45.0 TPS781250200DDCT SOT-23-THIN DDC 5 250 195.0 200.0 45.0 TPS781330220DDCR SOT-23-THIN DDC 5 3000 195.0 200.0 45.0 TPS781330220DDCT SOT-23-THIN DDC 5 250 195.0 200.0 45.0 TPS781330220DRVR WSON DRV 6 3000 205.0 200.0 33.0 TPS781330220DRVR WSON DRV 6 3000 203.0 203.0 35.0 TPS781330220DRVT WSON DRV 6 250 203.0 203.0 35.0 TPS781330220DRVT WSON DRV 6 250 205.0 200.0 33.0 PackMaterials-Page2

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GENERIC PACKAGE VIEW DRV 6 WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4206925/F

PACKAGE OUTLINE DRV0006A WSON - 0.8 mm max height SCALE 5.500 PLASTIC SMALL OUTLINE - NO LEAD B 2.1 A 1.9 PIN 1 INDEX AREA 2.1 1.9 0.8 C 0.7 SEATING PLANE 0.08 C (0.2) TYP 1 0.1 0.05 EXPOSED 0.00 THERMAL PAD 3 4 2X 7 1.3 1.6 0.1 6 1 4X 0.65 0.35 6X PIN 1 ID 0.3 0.25 6X (OPTIONAL) 0.2 0.1 C A B 0.05 C 4222173/B 04/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com

EXAMPLE BOARD LAYOUT DRV0006A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 6X (0.45) (1) 1 7 6X (0.3) 6 SYMM (1.6) (1.1) 4X (0.65) 4 3 (R0.05) TYP SYMM ( 0.2) VIA (1.95) TYP LAND PATTERN EXAMPLE SCALE:25X 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK (PREFERRED) DEFINED SOLDER MASK DETAILS 4222173/B 04/2018 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown. www.ti.com

EXAMPLE STENCIL DESIGN DRV0006A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD SYMM 6X (0.45) METAL 1 7 6X (0.3) 6 (0.45) SYMM 4X (0.65) (0.7) 4 3 (R0.05) TYP (1) (1.95) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD #7 88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:30X 4222173/B 04/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

PACKAGE OUTLINE DRV0006D WSON - 0.8 mm max height SCALE 5.500 PLASTIC SMALL OUTLINE - NO LEAD B 2.1 A 1.9 PIN 1 INDEX AREA 2.1 1.9 0.8 C 0.7 SEATING PLANE 0.08 C (0.2) TYP 1 0.1 0.05 EXPOSED 0.00 THERMAL PAD 3 4 2X 7 1.3 1.6 0.1 6 1 4X 0.65 0.35 6X PIN 1 ID 0.3 0.25 6X (OPTIONAL) 0.2 0.1 C A B 0.05 C 4225563/A 12/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com

EXAMPLE BOARD LAYOUT DRV0006D WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 6X (0.45) (1) 1 7 6X (0.3) 6 SYMM (1.6) (1.1) 4X (0.65) 4 3 (R0.05) TYP SYMM ( 0.2) VIA (1.95) TYP LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:25X 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND EXPOSED EXPOSED METAL METAL SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK (PREFERRED) DEFINED SOLDER MASK DETAILS 4225563/A 12/2019 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown. www.ti.com

EXAMPLE STENCIL DESIGN DRV0006D WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD SYMM 6X (0.45) METAL 1 7 6X (0.3) 6 (0.45) SYMM 4X (0.65) (0.7) 4 3 (R0.05) TYP (1) (1.95) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD #7 88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:30X 4225563/A 12/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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