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  • 型号: TPS73101DBVT
  • 制造商: Texas Instruments
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ICGOO电子元器件商城为您提供TPS73101DBVT由Texas Instruments设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 TPS73101DBVT价格参考。Texas InstrumentsTPS73101DBVT封装/规格:PMIC - 稳压器 - 线性, Linear Voltage Regulator IC Positive Adjustable 1 Output 1.2 V ~ 5.5 V 150mA SOT-23-5。您可以下载TPS73101DBVT参考资料、Datasheet数据手册功能说明书,资料中有TPS73101DBVT 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

集成电路 (IC)半导体

描述

IC REG LDO ADJ 0.15A SOT23-5低压差稳压器 Cap Free NMOS 150mA

产品分类

PMIC - 稳压器 - 线性

品牌

Texas Instruments

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

电源管理 IC,低压差稳压器,Texas Instruments TPS73101DBVT-

数据手册

点击此处下载产品Datasheet

产品型号

TPS73101DBVT

PCN设计/规格

点击此处下载产品Datasheet

产品目录页面

点击此处下载产品Datasheet

产品种类

低压差稳压器

供应商器件封装

SOT-23-5

其它名称

296-15800-1

制造商产品页

http://www.ti.com/general/docs/suppproductinfo.tsp?distId=10&orderablePartNumber=TPS73101DBVT

包装

剪切带 (CT)

参考电压

1.2 V

商标

Texas Instruments

回动电压—最大值

100 mV at 150 mA

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

SC-74A,SOT-753

封装/箱体

SOT-23-5

工作温度

-40°C ~ 125°C

工厂包装数量

250

最大功率耗散

0.56 W

最大工作温度

+ 125 C

最大输入电压

5.5 V

最小工作温度

- 40 C

最小输入电压

+ 1.7 V

标准包装

1

电压-跌落(典型值)

0.03V @ 150mA

电压-输入

1.7 V ~ 5.5 V

电压-输出

1.2 V ~ 5.5 V

电压调节准确度

0.5 %

电流-输出

150mA

电流-限制(最小值)

150mA

稳压器拓扑

正,可调式

稳压器数

1

系列

TPS73101

线路调整率

0.01 % / V

设计资源

http://www.digikey.com/product-highlights/cn/zh/texas-instruments-webench-design-center/3176

负载调节

0.002 % / mA

输入偏压电流—最大

0.4 mA

输出电压

1.2 V to 5.5 V

输出电流

150 mA

输出端数量

1 Output

输出类型

Adjustable

配用

/product-detail/zh/DEM-SOT23LDO/296-20843-ND/1216448

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PDF Datasheet 数据手册内容提取

Product Sample & Technical Tools & Support & Folder Buy Documents Software Community TPS731 SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 TPS731xx Capacitor-Free, NMOS, 150-mA Low Dropout Regulator With Reverse Current Protection 1 Features 3 Description • StableWithorWithoutCapacitorsofAllTypes The TPS731xx family of low-dropout (LDO) linear 1 voltage regulators uses a new topology: an NMOS • InputVoltageRangeof1.7Vto5.5V pass element in a voltage-follower configuration. This • UltralowDropoutVoltage:30mVTypical(150-mA topology is stable using output capacitors with low Load) equivalent series resistance (ESR), and even allows • ExcellentLoadTransientResponse—Withor operation without a capacitor. The device also provides high reverse blockage (low reverse current) WithoutOptionalOutputCapacitor and ground pin current that is nearly constant over all • NewNMOSTopologyProvidesLowReverse valuesofoutputcurrent. LeakageCurrent The TPS731xx uses an advanced BiCMOS process • LowNoise:30 μV Typical(10kHzto100kHz) RMS to yield high precision while delivering very low • 0.5%InitialAccuracy dropout voltages and low ground pin current. Current • 1%OverallAccuracyOverLine,Load,and consumption, when not enabled, is less than 1 μA Temperature and ideal for portable applications. The extremely low output noise (30 μV with 0.1-μF C ) is ideal for • LessThan1-μAMaximumI inShutdownMode RMS NR Q powering VCOs. These devices are protected by • ThermalShutdownandSpecifiedMinimumand thermalshutdownandfoldbackcurrentlimit. MaximumCurrentLimitProtection • AvailableinMultipleOutputVoltageVersions DeviceInformation(1) – FixedOutputsof1.20Vto5V PARTNUMBER PACKAGE BODYSIZE(NOM) – AdjustableOutputsfrom1.2Vto5.5V TPS731xx SOT-23(5) 2.90mm×1.60mm – CustomOutputsAvailable (1) For all available packages, see the orderable addendum at theendofthedatasheet. 2 Applications • SmartGridandEnergy • BuildingAutomation • Set-TopBoxes • MedicalEquipment • TestandMeasurement • Point-of-SaleTerminals • WirelessInfrastructure TypicalApplicationCircuitforFixed-VoltageVersions 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

TPS731 SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 www.ti.com Table of Contents 1 Features.................................................................. 1 8 ApplicationandImplementation........................ 14 2 Applications........................................................... 1 8.1 ApplicationInformation............................................14 3 Description............................................................. 1 8.2 TypicalApplications................................................14 4 RevisionHistory..................................................... 2 9 PowerSupplyRecommendations...................... 17 5 PinConfigurationandFunctions......................... 3 10 Layout................................................................... 17 6 Specifications......................................................... 4 10.1 LayoutGuidelines.................................................17 6.1 AbsoluteMaximumRatings......................................4 10.2 LayoutExample....................................................17 6.2 ESDRatings ............................................................4 10.3 ThermalConsiderations........................................17 6.3 RecommendedOperatingConditions.......................4 11 DeviceandDocumentationSupport................. 19 6.4 ThermalInformation..................................................4 11.1 DeviceSupport......................................................19 6.5 ElectricalCharacteristics...........................................5 11.2 DocumentationSupport .......................................19 6.6 TypicalCharacteristics..............................................6 11.3 RelatedLinks........................................................19 7 DetailedDescription............................................ 11 11.4 CommunityResources..........................................20 7.1 Overview.................................................................11 11.5 Trademarks...........................................................20 7.2 FunctionalBlockDiagrams.....................................11 11.6 ElectrostaticDischargeCaution............................20 7.3 FeatureDescription.................................................12 11.7 Glossary................................................................20 7.4 DeviceFunctionalModes........................................13 12 Mechanical,Packaging,andOrderable Information........................................................... 20 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionM(August2009)toRevisionN Page • ChangedfirstandthirdFeaturesbullets................................................................................................................................ 1 • AddedESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection ................................................................................................. 1 • ChangedlistofrecommendedApplications........................................................................................................................... 1 • ChangedPinConfigurationandFunctionssection;updatedtableformattomeetnewstandards ...................................... 3 • Changedfree-airtemperaturetojunctiontemperatureinAbsoluteMaximumRatingsconditionstatement ........................4 • DeletedPowerDissipationRatingstable............................................................................................................................... 4 • ChangedThermalInformationtable;updatedthermalresistancevaluesforallpackages .................................................. 4 ChangesfromRevisionL(May,2009)toRevisionM Page • ChangedFigure10 ................................................................................................................................................................ 6 • Addedparagraphaboutrecommendedstart-upsequencetoInternalCurrentLimitsection.............................................. 13 • Addedparagraphaboutcurrentfoldbackanddevicestart-uptoEnablePinandShutdownsection.................................. 13 2 SubmitDocumentationFeedback Copyright©2003–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS731

TPS731 www.ti.com SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 5 Pin Configuration and Functions DBVPackage 5-PinSOT-23 TopView IN 1 5 OUT GND 2 EN 3 4 NR/FB PinFunctions PIN I/O DESCRIPTION NAME NO. IN 1 I Inputsupply. GND 2 — Ground. Drivingtheenablepin(EN)highturnsontheregulator.Drivingthispinlowputstheregulatorinto EN 3 I shutdownmode.RefertoEnablePinandShutdownformoredetails.ENcanbeconnectedtoINifnot used. Fixed-voltageversionsonly—connectinganexternalcapacitortothispinbypassesnoisegeneratedby NR 4 — theinternalbandgap,reducingoutputnoisetoverylowlevels. Adjustable-voltageversiononly—thisistheinputtothecontrollooperroramplifier,andisusedtosetthe FB 4 I outputvoltageofthedevice. OUT 5 O Outputoftheregulator.Therearenooutputcapacitorrequirementsforstability. Copyright©2003–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:TPS731

TPS731 SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingjunctiontemperaturerange(unlessotherwisenoted) (1) MIN MAX UNIT V –0.3 6 IN V –0.3 6 EN Voltage V V –0.3 5.5 OUT V ,V –0.3 6 NR FB Peakoutputcurrent I Internallylimited OUT Outputshort-circuitduration Indefinite Continuoustotalpower P SeePowerDissipation dissipation DISS Junction,T –55 150 J Temperature °C Storage,T –65 150 stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. 6.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001,all pins(1) ±2000 V Electrostaticdischarge V (ESD) Chargeddevicemodel(CDM),perJEDECspecificationJESD22- C101,allpins(2) ±500 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingjunctiontemperaturerange(unlessotherwisenoted) MIN NOM MAX UNIT V Inputsupplyvoltagerange 1.7 5.5 V IN I Outputcurrent 0 150 mA OUT T Operatingjunctiontemperature –40 125 °C J 6.4 Thermal Information TPS731xx THERMALMETRIC(1) DBV(SOT-23) UNIT 5PINS R Junction-to-ambientthermalresistance 207.2 θJA R Junction-to-case(top)thermalresistance 124.2 θJC(top) R Junction-to-boardthermalresistance 35 °C/W θJB ψ Junction-to-topcharacterizationparameter 13.5 JT ψ Junction-to-boardcharacterizationparameter 34.1 JB (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953. 4 SubmitDocumentationFeedback Copyright©2003–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS731

TPS731 www.ti.com SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 6.5 Electrical Characteristics Overoperatingtemperaturerange(T =–40°Cto+125°C),V =V +0.5V(1),I =10mA,V =1.7V,and J IN OUT(nom) OUT EN C =0.1μF,unlessotherwisenoted.TypicalvaluesareatT =25°C. OUT J PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V Inputvoltagerange(1) 1.7 5.5 V IN V Internalreference(TPS73101) T =25°C 1.198 1.20 1.210 V FB J Outputvoltagerange(TPS73101)(2) V 5.5–V V FB DO Nominal T =25°C –0.5% 0.5% V J OUT Accuracy(1) (3) V +0.5V≤V ≤5.5V; V ,I ,andT OUT IN –1% ±0.5% 1% IN OUT 10mA≤I ≤150mA OUT ΔV Lineregulation(1) V +0.5V≤V ≤5.5V 0.01 %/V OUT(ΔVIN) OUT(nom) IN 1mA≤I ≤150mA 0.002 OUT ΔV Loadregulation %/mA OUT(ΔIOUT) 10mA≤I ≤150mA 0.0005 OUT Dropoutvoltage(4) V I =150mA 30 100 mV DO (V =V (nom)–0.1V) OUT IN OUT Z Outputimpedanceindropout 1.7V≤V ≤V +V 0.25 Ω O(DO) IN OUT DO I Outputcurrentlimit V =0.9×V 150 360 500 mA CL OUT OUT(nom) I Short-circuitcurrent V =0V 200 mA SC OUT I Reverseleakagecurrent(5)(–I ) V ≤0.5V,0V≤V ≤V 0.1 10 μA REV IN EN IN OUT I =10mA(I ) 400 550 OUT Q I GNDpincurrent μA GND I =150mA 550 750 OUT V ≤0.5V,V ≤V ≤5.5V, I Shutdowncurrent(I ) EN OUT IN 0.02 1 μA SHDN GND –40°C≤T ≤100°C J I FBpincurrent(TPS73101) 0.1 0.3 μA FB Power-supplyrejectionratio f=100Hz,IOUT=150mA 58 PSRR dB (ripplerejection) f=10kHz,I =150mA 37 OUT Outputnoisevoltage COUT=10μF,NoCNR 27×VOUT V μV n BW=10Hz-100kHz C =10μF,C =0.01μF 8.5×V RMS OUT NR OUT V =3V,R =30Ω t Startuptime OUT L 600 μs STR C =1μF,C =0.01μF OUT NR V ENpinhigh(enabled) 1.7 V V EN(high) IN V ENpinlow(shutdown) 0 0.5 V EN(low) I ENpincurrent(enabled) V =5.5V 0.02 0.1 μA EN(high) EN Shutdown Tempincreasing 160 T Thermalshutdowntemperature °C SD Reset Tempdecreasing 140 T Operatingjunctiontemperature –40 125 °C J (1) MinimumV =V +V or1.7V,whicheverisgreater. IN OUT DO (2) TPS73101istestedatV =2.5V. OUT (3) Toleranceofexternalresistorsnotincludedinthisspecification. (4) V isnotmeasuredforfixedoutputversionswithV <1.8VbecauseminimumV =1.7V. DO OUT(nom) IN (5) Fixed-voltageversionsonly;refertoApplicationInformationformoreinformation. Copyright©2003–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:TPS731

TPS731 SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 www.ti.com 6.6 Typical Characteristics ForallvoltageversionsatT =25°C,V =V +0.5V,I =10mA,V =1.7V,andC =0.1μF,unlessotherwise J IN OUT(nom) OUT EN OUT noted. 0.5 0.20 0.4 ReferredtoIOUT=10mA ReferredtoVIN=VOUT+0.5VatIOUT=10mA 0.15 0.3 0.10 (%)UT 00..21 (%)UT 0.05 +125°C +25°C O O V V n 0 n 0 i i nge -0.1 nge -0.05 Cha -0.2 Cha -0.10 -40°C -0.3 -0.4 -0.15 -0.5 -0.20 0 15 30 45 60 75 90 105 120 135 150 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 IOUT(mA) VIN-VOUT(V) Figure1.LoadRegulation Figure2.LineRegulation 50 50 TPS73125DBV TPS73125DBV +125°C IOUT=150mA 40 40 V) 30 V) 30 m +25°C m ( ( O O VD20 VD20 10 10 -40°C 0 0 0 30 60 90 120 150 -50 -25 0 25 50 75 100 125 IOUT(mA) Temperature(°C) Figure3.DropoutVoltagevsOutputCurrent Figure4.DropoutVoltagevsTemperature 30 18 I =10mA I =10mA OUT OUT 16 AllVoltageVersions 25 14 %) %) ( 20 ( 12 s s Unit Unit 10 15 of of 8 nt nt e e erc 10 erc 6 P P 4 5 2 0 0 098765432101234567890 000000000000000000000 -1.-0.-0.-0.-0.-0.-0.-0.-0.-0. 0.0.0.0.0.0.0.0.0.1. -10-9-8-7-6-5-4-3-2-1 12345678910 V Error(%) WorstCasedV /dT(ppm/°C) OUT OUT Figure5.OutputVoltageAccuracyHistogram Figure6.OutputVoltageDriftHistogram 6 SubmitDocumentationFeedback Copyright©2003–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS731

TPS731 www.ti.com SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 Typical Characteristics (continued) ForallvoltageversionsatT =25°C,V =V +0.5V,I =10mA,V =1.7V,andC =0.1μF,unlessotherwise J IN OUT(nom) OUT EN OUT noted. 700 700 I =150mA OUT 600 600 500 500 A) 400 A) 400 m m ( ( D D GN300 GN300 I I 200 200 VIN=5.5V VIN=5.5V VIN=4V 100 VIN=4 V 100 VIN=2V V =2 V IN 0 0 0 30 60 90 120 150 -50 -25 0 25 50 75 100 125 IOUT(mA) Temperature(°C) Figure7.GroundPinCurrentvsOutputCurrent Figure8.GroundPinCurrentvsTemperature 1 400 V =0.5V TPS73133 VEINNA=BVLEO+0.5V 350 ICL A) 300 m m(A)ND0.1 Current ( 225000 ISC IG ut 150 p ut O 100 50 0.01 0 -50 -25 0 25 50 75 100 125 -0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Temperature(°C) Output Voltage (V) Figure9.GroundPinCurrentinShutdownvsTemperature Figure10. CurrentLimitvsV (Foldback) OUT 500 500 450 450 A) 400 A) 400 m m mit( 350 mit( 350 Li Li nt 300 nt 300 e e Curr 250 Curr 250 200 200 150 150 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 -50 -25 0 25 50 75 100 125 V (V) Temperature(°C) IN Figure11. CurrentLimitvsV Figure12.CurrentLimitvsTemperature IN Copyright©2003–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:TPS731

TPS731 SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 www.ti.com Typical Characteristics (continued) ForallvoltageversionsatT =25°C,V =V +0.5V,I =10mA,V =1.7V,andC =0.1μF,unlessotherwise J IN OUT(nom) OUT EN OUT noted. 90 40 I = 100mA I = 1mA 80 COUT = Any COUT = 1mF 35 OUT OUT 70 B) IOUT= 1mA 30 e Rejection (d 654000 ICOOUUTT== 1 AmnAy COUT= 10mF IOC= O10=0 1mmAF PSRR (dB) 221505 pl 30 Rip 10 Frequency = 10kHz 20 IOUT= 100mA COUT= 10mF C = 10mF 10 IOUT= Any OUT 5 VOUT= 2.5V 0 VIN= VOUT+ 1V COUT= 0mF 0 IOUT= 100mA 10 100 1k 10k 100k 1M 10M 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Frequency (Hz) VIN-VOUT(V) Figure13. PSRR(RippleRejection)vsFrequency Figure14.PSRR(RippleRejection)vsVIN–VOUT 1 1 C =1mF OUT √Hz) COUT=0mF √Hz) COUT=1mF V/ 0.1 V/ 0.1 m C =10mF m ( OUT ( N N e e C =0mF OUT C =10mF OUT IOUT=150mA IOUT=150mA 0.01 0.01 10 100 1k 10k 100k 10 100 1k 10k 100k Frequency(Hz) Frequency(Hz) Figure15.NoiseSpectralDensityC =0μF Figure16.NoiseSpectralDensityC =0.01μF NR NR 60 140 V =5.0V OUT 50 120 V =5.0V OUT 100 40 MS) MS) 80 VOUT=3.3V (RN 30 VOUT=3.3V (RN 60 V V 20 40 V =1.5V V =1.5V OUT OUT 10 20 CNR=0.01mF COUT=0mF 10 Hz<Frequency<100kHz 10 Hz<Frequency<100kHz 0 0 0.1 1 10 1p 10p 100p 1n 10n C (mF) C (F) OUT NR Figure17.RMSNoiseVoltagevsC Figure18.RMSNoiseVoltagevsC OUT NR 8 SubmitDocumentationFeedback Copyright©2003–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS731

TPS731 www.ti.com SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 Typical Characteristics (continued) ForallvoltageversionsatT =25°C,V =V +0.5V,I =10mA,V =1.7V,andC =0.1μF,unlessotherwise J IN OUT(nom) OUT EN OUT noted. VIN=3.8V COUT=0mF IOUT=150 mA 40 mV/tick V OUT COUT=0mF 50 mV/div V COUT=1mF OUT 40 mV/tick V OUT 40 mV/tick COUT=10mF V 50 mV/div COUT=100mF V OUT OUT dV 150mA 5.5V IN=0.5V/ms dt 25 mA/tick IOUT 4.5 V 10 mA 1V/div VIN 10ms/div 10ms/div Figure19.TPS73133LoadTransientResponse Figure20.TPS73133LineTransientResponse RCLOU=T1=k(cid:3)0WmF VOUT RCLOU=T2=0(cid:3)(cid:3)1W0mF 1V/div RCLOU=T2=01W(cid:3)mF 1V/div RCLOU=T2=01WmF RCLOU=T2=0(cid:3)1W0(cid:3)(cid:3)mF RCLOU=T1=k0(cid:3)W(cid:3)mF V OUT 2V 2V V EN 1V/div 1V/div 0V 0V V EN 100(cid:3)ms/div 100(cid:3)ms/div Figure21.TPS73133TurnonResponse Figure22.TPS73133TurnoffResponse 6 10 5 V IN 4 V OUT 1 3 A) n Volts 2 (BLE A 1 EN I 0.1 0 -1 -2 0.01 50ms/div -50 -25 0 25 50 75 100 125 Temperature(°C) Figure23.TPS73133PowerUpandPowerDown Figure24.I vsTemperature ENABLE Copyright©2003–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:TPS731

TPS731 SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 www.ti.com Typical Characteristics (continued) ForallvoltageversionsatT =25°C,V =V +0.5V,I =10mA,V =1.7V,andC =0.1μF,unlessotherwise J IN OUT(nom) OUT EN OUT noted. 60 160 55 140 50 120 45 100 V(rms)N 4305 I(nA)FB 8600 V =2.5V 30 OUT 40 C =0mF OUT 25 R1=39.2kW 20 10Hz<Frequency<100kHz 20 0 10p 100p 1n 10n -50 -25 0 25 50 75 100 125 C (F) Temperature(°C) FB Figure25.TPS73101RMSNoiseVoltagevsCFB Figure26.TPS73101IFBvsTemperature CFB=10nF VOUT=2.5V 50mV/div R1=39.2kW COUT=0mF VOUT 100mV/div COUT=0mF CFB=10nF VOUT COUT=10mF 100mV/div V OUT 50mV/div COUT=10mF V OUT 4.5V 150mA 3.5V V IN 10mA I OUT 25ms/div 5ms/div Figure27.TPS73101LoadTransient,AdjustableVersion Figure28.TPS73101LineTransient,AdjustableVersion 10 SubmitDocumentationFeedback Copyright©2003–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS731

TPS731 www.ti.com SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 7 Detailed Description 7.1 Overview The TPS731xx family of low-dropout linear regulators operates down to an input voltage of 1.7 V and supports output voltages down to 1.2 V while sourcing up to 150 mA of load current. This linear regulator uses an NMOS pass element with an integrated 4-MHz charge pump to provide a dropout voltage of less than 100 mV at full load current. This unique architecture also permits stable regulation over a wide range of output capacitors. In fact, the TPS731xx family of devices does not require any output capacitor for stability. The increased insensitivity to the output capacitor value and type makes this family of linear regulators an ideal choice when poweringaloadwheretheeffectivecapacitanceisunknown. The TPS731xx family of devices also features a noise reduction (NR) pin that allows for additional reduction of the output noise. With a noise reduction capacitor of 0.01 µF connected from the NR pin to GND, the TPS73115 outputnoisecanbeaslowas12.75µV .ThelownoiseoutputfeaturedbytheTPS731xxfamilymakesitwell- RMS suitedforpoweringVCOsoranyothernoisesensitiveload. 7.2 Functional Block Diagrams IN 4-MHZ ChargePump EN Thermal Protection Ref Servo 27kW Bandgap Error Amp Current Limit OUT 8kW GND R 1 R1+R2=80kW R2 NR Figure29. Fixed-VoltageVersion Copyright©2003–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:TPS731

TPS731 SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 www.ti.com Functional Block Diagrams (continued) IN Standard 1% Resistor Values for Common Output Voltages VO R1 R2 4-MHZ ChargePump 1.2 V Short Open 1.5 V 23.2 kW 95.3kW EN Thermal 1.8 V 28.0 kW 56.2 kW Protection Ref 2.5 V 39.2kW 36.5 kW Servo 2.8 V 44.2 kW 33.2 kW 27kW 3.0 V 46.4 kW 30.9 kW Bandgap Error 3.3 V 52.3 kW 30.1 kW Amp OUT NOTE: VOUT= (R1+ R2)/R2× 1.204; Current R1ǁR2@19kWfor best Limit accuracy. GND 8kW 80kW R 1 FB R 2 Figure30. Adjustable-VoltageVersion 7.3 Feature Description 7.3.1 OutputNoise A precision band-gap reference is used to generate the internal reference voltage, V . This reference is the REF dominant noise source within the TPS731xx and it generates approximately 32 μV (10 Hz to 100 kHz) at the RMS reference output (NR). The regulator control loop gains up the reference noise with the same gain as the referencevoltage,sothatthenoisevoltageoftheregulatorisapproximatelygivenbyEquation1: (R (cid:2)R ) V V (cid:3)32(cid:1)V (cid:1) 1 2 (cid:3)32(cid:1)V (cid:1) OUT N RMS R2 RMS VREF (1) BecausethevalueofV is1.2V,thisrelationshipreducestoEquation2forthecaseofnoC . REF NR (cid:3)(cid:1)V (cid:4) VN((cid:1)VRMS)(cid:2)27 VRMS (cid:1)VOUT(V) (2) An internal 27-kΩ resistor in series with the noise reduction pin (NR) forms a low-pass filter for the voltage reference when an external noise reduction capacitor, C , is connected from NR to ground. For C = 10 nF, NR NR the total noise in the 10-Hz to 100-kHz bandwidth is reduced by a factor of approximately 3.2, giving the approximaterelationshipshowninEquation3forC =10nF. NR æmV ö VN(mVRMS)=8.5ç RMS ÷´VOUT(V) è V ø (3) ThisnoisereductioneffectisshownasRMSNoiseVoltagevsC inTypicalCharacteristics. NR The TPS73101 adjustable version does not have the NR pin available. However, connecting a feedback capacitor, C , from the output to the feedback pin (FB) reduces output noise and improves load transient FB performance. 12 SubmitDocumentationFeedback Copyright©2003–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS731

TPS731 www.ti.com SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 Feature Description (continued) The TPS731xx uses an internal charge pump to develop an internal supply voltage sufficient to drive the gate of the NMOS pass element above V . The charge pump generates approximately 250 μV of switching noise at OUT approximately 4 MHz; however, charge-pump noise contribution is negligible at the output of the regulator for mostvaluesofI andC . OUT OUT 7.3.2 InternalCurrentLimit The TPS731xx internal current limit helps protect the regulator during fault conditions. Foldback current limit helps to protect the regulator from damage during output short-circuit conditions by reducing current limit when V dropsbelow0.5V.SeeFigure10. OUT Note from Figure 10 that approximately –0.2 V of V results in a current limit of 0 mA. Therefore, if OUT is OUT forced below –0.2 V before EN goes high, the device may not start up. In applications that work with both a positiveandnegativevoltagesupply,theTPS731xxshouldbeenabledfirst. 7.3.3 EnablePinandShutdown The enable pin (EN) is active high and is compatible with standard TTL-CMOS levels. A V below 0.5 V EN (maximum) turns the regulator off and drops the GND pin current to approximately 10 nA. When EN is used to shutdown the regulator, all charge is removed from the pass transistor gate, and the output ramps back up to a regulatedV (seeFigure21). OUT When shutdown capability is not required, EN can be connected to V . However, the pass gate may not be IN discharged using this configuration, and the pass transistor may be left on (enhanced) for a significant time after V hasbeenremoved.Thisscenariocanresultinreversecurrentflow(iftheINpinislowimpedance)andfaster IN ramp times upon power up. In addition, for V ramp times slower than a few milliseconds, the output may IN overshootuponpowerup. Thecurrentlimitfoldbackcanpreventdevicestart-upundersomeconditions.SeeInternalCurrentLimit. 7.3.4 ReverseCurrent The NMOS pass element of the TPS731xx provides inherent protection against current flow from the output of the regulator to the input when the gate of the pass device is pulled low. To ensure that all charge is removed from the gate of the pass element, the EN pin must be driven low before the input voltage is removed. If this is notdone,thepasselementmaybeleftonduetostoredchargeonthegate. After the EN pin is driven low, no bias voltage is needed on any pin for reverse current blocking. The reverse current is specified as the current flowing out of the IN pin due to voltage applied on the OUT pin. There will be additionalcurrentflowingintotheOUTpinduetothe80-kΩ internalresistordividertoground(seeFigure29 and Figure30). FortheTPS73101,reversecurrentmayflowwhenV ismorethan1.0VaboveV . FB IN 7.4 Device Functional Modes 7.4.1 NormalOperationWith1.7V ≤ V ≤5.5VandV ≥ 1.7V IN EN The TPS731xx family requires an input voltage of at least 1.7 V to function properly and attempt to maintain regulation. When operating the device near 5.5 V, take care to suppress any transient spikes that may exceed the 6.0-V absolutemaximumvoltagerating.ThedeviceshouldneveroperateataDCvoltagegreaterthan5.5V. Copyright©2003–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:TPS731

TPS731 SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 8.1 Application Information The TPS731xx belongs to a family of new generation LDO regulators that use an NMOS pass transistor to achieve ultra-low-dropout performance, reverse current blockage, and freedom from output capacitor constraints. These features, combined with low noise and an enable input, make the TPS731xx ideal for portable applications. This regulator family offers a wide selection of fixed output voltage versions and an adjustable outputversion.Allversionshavethermalandover-currentprotection,includingfoldbackcurrentlimit. 8.2 Typical Applications Figure 31 shows the basic circuit connections for the fixed-voltage models. Figure 32 gives the connections for theadjustableoutputversion(TPS73101). Optional input capacitor. Optional output capacitor. May improve source May improve load transient, impedance, noise, or PSRR. noise, or PSRR. VIN IN OUT VOUT TPS731xx EN GND NR ON OFF Optional bypass capacitor to reduce output noise. Figure31. TypicalApplicationCircuitforFixed-VoltageVersions Optional input capacitor. Optional output capacitor. May improve source May improve load transient, impedance, noise, or PSRR. noise, or PSRR. VIN IN OUT VOUT TPS73101 R C 1 FB EN GND FB ON R OFF 2 (R +R) Optional capacitor VOUT= 1R 2 x 1.204 reduces output noise 2 and improves transient response. Figure32. TypicalApplicationCircuitforAdjustable-VoltageVersion 8.2.1 DesignRequirements R and R can be calculated for any output voltage using the formula shown in Figure 32. Sample resistor values 1 2 forcommonoutputvoltagesareshowninFigure30. For best accuracy, make the parallel combination of R and R approximately equal to 19 kΩ. This 19 kΩ, in 1 2 addition to the internal 8-kΩ resistor, presents the same impedance to the error amp as the 27-kΩ bandgap referenceoutput.Thisimpedancehelpscompensateforleakagesintotheerrorampterminals. 14 SubmitDocumentationFeedback Copyright©2003–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS731

TPS731 www.ti.com SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 Typical Applications (continued) 8.2.2 DetailedDesignProcedure 8.2.2.1 InputandOutputCapacitorRequirements Although an input capacitor is not required for stability, it is good analog design practice to connect a 0.1-μF to 1-μF, low ESR capacitor across the input supply near the regulator. This counteracts reactive input sources and improves transient response, noise rejection, and ripple rejection. A higher-value capacitor may be necessary if large,fastrise-timeloadtransientsareanticipatedorthedeviceislocatedseveralinchesfromthepowersource. 8.2.2.2 DropoutVoltage The TPS731xx uses an NMOS pass transistor to achieve extremely low dropout. When (V – V ) is less than IN OUT the dropout voltage (V ), the NMOS pass device is in its linear region of operation and the input-to-output DO resistanceistheR oftheNMOSpasselement. DS(on) For large step changes in load current, the TPS731xx requires a larger voltage drop from V to V to avoid IN OUT degraded transient response. The boundary of this transient dropout region is approximately twice the DC dropout.ValuesofV –V abovethislineinsurenormaltransientresponse. IN OUT Operating in the transient dropout region can cause an increase in recovery time. The time required to recover from a load transient is a function of the magnitude of the change in load current rate, the rate of change in load current, and the available headroom (V to V voltage drop). Under worst-case conditions [full-scale IN OUT instantaneous load change with (V – V ) close to DC dropout levels], the TPS731xx can take a couple of IN OUT hundredmicrosecondstoreturntothespecifiedregulationaccuracy. 8.2.2.3 TransientResponse The low open-loop output impedance provided by the NMOS pass element in a voltage follower configuration allows operation without an output capacitor for many applications. As with any regulator, the addition of a capacitor (nominal value 1 μF) from the output pin (OUT) to ground will reduce undershoot magnitude but increase its duration. In the adjustable version, the addition of a capacitor, C , from the OUT pin to the FB pin FB willalsoimprovethetransientresponse. The TPS731xx does not have active pulldown when the output is overvoltage. This allows applications that connect higher voltage sources, such as alternate power supplies, to the output. This also results in an output overshootofseveralpercentiftheloadcurrentquicklydropstozerowhenacapacitorisconnectedtotheoutput. The duration of overshoot can be reduced by adding a load resistor. The overshoot decays at a rate determined by output capacitor C and the internal and external load resistance. The rate of decay is given by Equation 4 OUT andEquation5: (Fixed-voltageversion) V dV/dt= OUT C ´80kWPR OUT LOAD (4) (Adjustable-voltageversion) V dV/dt= OUT C ´80kWP(R +R )PR OUT 1 2 LOAD (5) Copyright©2003–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:TPS731

TPS731 SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 www.ti.com Typical Applications (continued) 8.2.3 ApplicationCurves RCLOU=T1=k(cid:3)0WmF VOUT RCLOU=T2=0(cid:3)(cid:3)1W0mF 1V/div RCLOU=T2=01W(cid:3)mF 1V/div RCLOU=T2=01WmF RCLOU=T2=0(cid:3)1W0(cid:3)(cid:3)mF RCLOU=T1=k0(cid:3)W(cid:3)mF V OUT 2V 2V V EN 1V/div 1V/div 0V 0V V EN 100(cid:3)ms/div 100(cid:3)ms/div Figure33.TPS73133TurnonResponse Figure34.TPS73133TurnoffResponse 16 SubmitDocumentationFeedback Copyright©2003–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS731

TPS731 www.ti.com SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 9 Power Supply Recommendations These devices are designed to operate from an input voltage supply range between 1.7 V and 5.5 V. The input voltage range provides adequate headroom in order for the device to have a regulated output. This input supply mustbewellregulated.Iftheinputsupplyisnoisy,additionalinputcapacitorswithlowESRcanhelpimprovethe outputnoiseperformance. 10 Layout 10.1 Layout Guidelines To improve AC performance such as PSRR, output noise, and transient response, it is recommended that the PCB be designed with separate ground planes for V and V , with each ground plane connected only at the IN OUT ground pin (GND) of the device. In addition, the ground connection for the bypass capacitor should connect directlytotheGNDpinofthedevice. Solder pad footprint recommendations for the TPS731xx are presented in Application Bulletin Solder Pad RecommendationsforSurface-MountDevices(SBFA015),availablefromtheTIwebsiteatwww.ti.com. 10.2 Layout Example GND VIN VOUT PLANE COUT TPS731 CIN GND R1 R2 PLANE EN Figure35. ExampleLayout(DBVPackage) 10.3 Thermal Considerations Thermal protection disables the output when the junction temperature rises to approximately 160°C, allowing the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This limits the dissipation of the regulator, protecting it from damage due to overheating. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. For reliable operation, junction temperature should be limited to 125°C maximum. To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should trigger at least 35°C above the maximum expected ambient condition of your application. This produces a worst- casejunctiontemperatureof125°Catthehighestexpectedambienttemperatureandworst-caseload. The internal protection circuitry of the TPS731xx has been designed to protect against overload conditions. It was not intended to replace proper heatsinking. Continuously running the TPS731xx into thermal shutdown degradesdevicereliability. Copyright©2003–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:TPS731

TPS731 SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 www.ti.com Thermal Considerations (continued) 10.3.1 PowerDissipation The ability to remove heat from the die is different for each package type, presenting different considerations in the PCB layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. Performance data for JEDEC low- and high-K boards are shown in the Thermal Information table.Usingheaviercopperwillincreasetheeffectivenessinremovingheatfromthedevice. Powerdissipationdependsoninputvoltageandloadconditions.Powerdissipation(P )isequaltotheproductof D theoutputcurrenttimesthevoltagedropacrosstheoutputpasselement(V toV ): IN OUT P =(V -V )´I D IN OUT OUT (6) Power dissipation can be minimized by using the lowest possible input voltage necessary to assure the required outputvoltage. 18 SubmitDocumentationFeedback Copyright©2003–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS731

TPS731 www.ti.com SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 11 Device and Documentation Support 11.1 Device Support 11.1.1 DevelopmentSupport 11.1.1.1 SpiceModels Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TPS731 is available through the product folders under Tools &Software. 11.1.2 DeviceNomenclature Table1.DeviceNomenclature(1) PRODUCT V OUT TPS731xxyyyz xxisthenominaloutputvoltage(forexample,25=2.5V;01=Adjustable). yyyisthepackagedesignator. zisthetapeandreelquantity(R=3000,T=250). (1) ForthemostcurrentpackageandorderinginformationseethePackageOptionAddendumattheendofthisdocument,orseetheTI websiteatwww.ti.com. 11.2 Documentation Support 11.2.1 RelatedDocumentation Forrelateddocumentation,seethefollowing: • Applicationreport. SolderPadRecommendationsforSurface-MountDevices.LiteraturenumberSBFA015. 11.3 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table2.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY TPS73101 Clickhere Clickhere Clickhere Clickhere Clickhere TPS731125 Clickhere Clickhere Clickhere Clickhere Clickhere TPS73115 Clickhere Clickhere Clickhere Clickhere Clickhere TPS73118 Clickhere Clickhere Clickhere Clickhere Clickhere TPS73125 Clickhere Clickhere Clickhere Clickhere Clickhere TPS73130 Clickhere Clickhere Clickhere Clickhere Clickhere TPS73131 Clickhere Clickhere Clickhere Clickhere Clickhere TPS73132 Clickhere Clickhere Clickhere Clickhere Clickhere TPS73133 Clickhere Clickhere Clickhere Clickhere Clickhere TPS73150 Clickhere Clickhere Clickhere Clickhere Clickhere Copyright©2003–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLinks:TPS731

TPS731 SBVS034N–SEPTEMBER2003–REVISEDDECEMBER2015 www.ti.com 11.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 11.5 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 11.6 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 11.7 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 20 SubmitDocumentationFeedback Copyright©2003–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS731

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPS73101DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 PWYQ & no Sb/Br) TPS73101DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 PWYQ & no Sb/Br) TPS73101DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 PWYQ & no Sb/Br) TPS73101DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 PWYQ & no Sb/Br) TPS731125DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BYX & no Sb/Br) TPS731125DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BYX & no Sb/Br) TPS73115DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T31 & no Sb/Br) TPS73115DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T31 & no Sb/Br) TPS73115DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T31 & no Sb/Br) TPS73118DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T32 & no Sb/Br) TPS73118DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T32 & no Sb/Br) TPS73118DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T32 & no Sb/Br) TPS73118DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T32 & no Sb/Br) TPS73125DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 PHWI & no Sb/Br) TPS73125DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 PHWI & no Sb/Br) TPS73125DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 PHWI & no Sb/Br) TPS73125DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 PHWI & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPS73130DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T33 & no Sb/Br) TPS73130DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T33 & no Sb/Br) TPS73130DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T33 & no Sb/Br) TPS73131DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BYS & no Sb/Br) TPS73131DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BYS & no Sb/Br) TPS73132DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T52 & no Sb/Br) TPS73132DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T52 & no Sb/Br) TPS73133DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T34 & no Sb/Br) TPS73133DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T34 & no Sb/Br) TPS73133DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T34 & no Sb/Br) TPS73150DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T35 & no Sb/Br) TPS73150DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T35 & no Sb/Br) TPS73150DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 T35 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS73101DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS73101DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS731125DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS731125DBVT SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TPS73115DBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TPS73115DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS73118DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS73118DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS73125DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS73125DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS73130DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS73130DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS73131DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS73131DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS73132DBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS73132DBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS73133DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS73133DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS73150DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS73150DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS73101DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS73101DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS731125DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS731125DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS73115DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS73115DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS73118DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS73118DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS73125DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS73125DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS73130DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS73130DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS73131DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS73131DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS73132DBVR SOT-23 DBV 5 3000 203.0 203.0 35.0 PackMaterials-Page2

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS73132DBVT SOT-23 DBV 5 250 203.0 203.0 35.0 TPS73133DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS73133DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS73150DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS73150DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 PackMaterials-Page3

PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 1.45 B A 0.90 PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com

EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

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