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ICGOO电子元器件商城为您提供TPS72725DSET由Texas Instruments设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 TPS72725DSET价格参考。Texas InstrumentsTPS72725DSET封装/规格:PMIC - 稳压器 - 线性, Linear Voltage Regulator IC Positive Fixed 1 Output 2.5V 250mA 6-WSON (1.5x1.5)。您可以下载TPS72725DSET参考资料、Datasheet数据手册功能说明书,资料中有TPS72725DSET 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

集成电路 (IC)半导体

描述

IC REG LDO 2.5V 0.25A 6WSON低压差稳压器 250mAUltraLo IQ FastTrans RespRF

产品分类

PMIC - 稳压器 - 线性

品牌

Texas Instruments

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

电源管理 IC,低压差稳压器,Texas Instruments TPS72725DSET-

数据手册

点击此处下载产品Datasheet

产品型号

TPS72725DSET

PCN设计/规格

点击此处下载产品Datasheet

PSRR/纹波抑制—典型值

45 dB

产品种类

低压差稳压器

供应商器件封装

6-WSON(1.5x1.5)

其它名称

296-27801-1

包装

剪切带 (CT)

商标

Texas Instruments

回动电压—最大值

200 mV

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

6-WFDFN

封装/箱体

WSON-6

工作温度

-40°C ~ 125°C

工厂包装数量

250

最大功率耗散

485 mW

最大工作温度

+ 125 C

最大输入电压

5.5 V

最小工作温度

- 40 C

最小输入电压

2 V

标准包装

1

电压-跌落(典型值)

0.163V @ 250mA

电压-输入

最高 5.5V

电压-输出

2.5V

电压调节准确度

2 %

电流-输出

250mA

电流-限制(最小值)

300mA

稳压器拓扑

正,固定式

稳压器数

1

系列

TPS72725

线路调整率

8 uV/V

负载调节

20 uV/mA

输出电压

2.5 V

输出电流

200 mA

输出端数量

1 Output

输出类型

Fixed

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PDF Datasheet 数据手册内容提取

Product Sample & Technical Tools & Support & Folder Buy Documents Software Community TPS727 SBVS128F–JUNE2009–REVISEDDECEMBER2015 TPS727 250-mA, Ultralow I , Fast Transient Response, Q RF Low-Dropout Linear Regulator 1 Features 3 Description • VeryLowDropout: The TPS727 family of low-dropout (LDO) linear 1 regulators are ultralow quiescent current LDOs with – 65mVTypicalat100mA excellent line and ultra-fast load transient – 130mVTypicalat200mA performance and are designed for power-sensitive – 163mVTypicalat250mA applications. The LDO output voltage level is preset by the use of innovative factory EEPROM • 2%AccuracyOverLoad,Line,Temperature programming. A precision band-gap and error • UltralowIQ:7.9μA amplifierprovidesoverall2%accuracyoverload,line, • ExcellentLoadTransientPerformance:±50mVfor and temperature extremes. The TPS727 family is 200mALoadingandUnloadingTransient available in 1.5-mm × 1.5-mm SON and wafer chip- scale (WCSP) packages that make the devices ideal • AvailableinFixed-OutputVoltagesFrom0.9Vto for handheld applications. This family of devices is 5VUsingInnovativeFactoryEEPROM fully specified over a temperature range of T = Programming J –40°Cto+125°C. • HighPSRR:70dBat1kHz • Stablewitha1.0-μFCeramicCapacitor DeviceInformation • ThermalShutdownandOvercurrentProtection PARTNUMBER PACKAGE BODYSIZE(NOM) • Availablein4-Ball,0.4-mmPitchWafer-Level TPS727xxDSE WSON(6) 1.50mm×1.50mm ChipScaleand1.5-mm×1.5-mmSONPackages TPS727xxYFF DSBGA(4) 1.20mm×0.80mm 2 Applications (1) For all available packages, see the orderable addendum at theendofthedatasheet. • WirelessHandsets,SmartPhones,PDAs • MP3PlayersandOtherHandheldProducts • WirelessLAN,Bluetooth®,Zigbee® • RemoteControls • PortableConsumerProducts TYPICAL APPLICATION CIRCUIT VIN IN OUT VOUT 1mF CIN COUT Ceramic TPS727xx On Off EN GND PSRR vs FREQUENCY GROUND PIN CURRENT vs TEMPERATURE 100 15 Ratio (dB) 987000 12 VIOIUNT== 2 0.1mVA Supply Rejection 65430000 IOUT= 10mA mI(A)GND 96 wer- 20 3 Po 10 IOUT= 200mA 0 0 10 100 1k 10k 100k 1M 10M -40 -25 -10 5 20 35 50 65 80 95 110 125 Frequency (Hz) Temperature (°C) 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

TPS727 SBVS128F–JUNE2009–REVISEDDECEMBER2015 www.ti.com Table of Contents 1 Features.................................................................. 1 7.4 DeviceFunctionalModes........................................12 2 Applications........................................................... 1 8 ApplicationsandImplementation...................... 13 3 Description............................................................. 1 8.1 ApplicationInformation............................................13 4 RevisionHistory..................................................... 2 8.2 TypicalApplication..................................................13 8.3 Do'sandDon'ts.......................................................17 5 PinConfigurationsandFunctions....................... 4 9 Power-SupplyRecommendations...................... 17 6 Specifications......................................................... 5 10 Layout................................................................... 17 6.1 AbsoluteMaximumRatings......................................5 6.2 ESDRatings..............................................................5 10.1 LayoutGuidelines.................................................17 6.3 RecommendedOperatingConditions.......................5 10.2 LayoutExample....................................................18 6.4 ThermalInformation..................................................5 11 DeviceandDocumentationSupport................. 22 6.5 ElectricalCharacteristics...........................................6 11.1 DocumentationSupport........................................22 6.6 TypicalCharacteristics..............................................7 11.2 CommunityResources..........................................22 7 DetailedDescription............................................ 11 11.3 Trademarks...........................................................22 7.1 Overview.................................................................11 11.4 ElectrostaticDischargeCaution............................22 7.2 FunctionalBlockDiagram.......................................11 11.5 Glossary................................................................22 7.3 FeatureDescription.................................................11 12 Mechanical,Packaging,andOrderable Information........................................................... 22 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionE(September2014)toRevisionF Page • ChangedDSBGAbodysizeinDeviceInformationtable ...................................................................................................... 1 ChangesfromRevisionD(February2014)toRevisionE Page • AddedTPS727105todocument............................................................................................................................................ 1 • Changedterminaltopinthroughoutdocument...................................................................................................................... 1 • UpdatedDeviceInformationtabletocurrentstandards......................................................................................................... 1 • ChangedPinConfigurationsnote.......................................................................................................................................... 4 • ChangedPinFunctionstable:reorderedtablebypinname,addedI/Ocolumn................................................................... 4 • UpdatedHandlingRatingstabletocurrentstandard............................................................................................................. 5 • ChangedThermalInformationtable:updatedsymbols.......................................................................................................... 5 • DeletednewgenerationfromfirstsentenceofOverviewsection........................................................................................ 11 • AddednotetoApplicationsandImplementationsection...................................................................................................... 13 ChangesfromRevisionC(January,2011)toRevisionD Page • Changedformattomeetlatestdatasheetstandards;addednewsectionsandmovedexistingsections............................ 1 • Deletedpinoutdiagramsfromfrontpage;seePinConfigurationsandFunctionssection.................................................... 1 • ChangedPinConfigurationssectionandmovedtoPinConfigurationsandFunctionssection............................................ 4 • ChangednoteinPinConfigurationsandFunctionssection.................................................................................................. 4 • DeletedFigure26andFigure27.......................................................................................................................................... 17 ChangesfromRevisionB(April,2010)toRevisionC Page • UpdatedYFFfrontpagepindrawingtoshowpinlocations................................................................................................... 1 • RevisedPinConfigurationssection ....................................................................................................................................... 4 • ChangedgraphtitleforFigure6............................................................................................................................................. 7 2 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated

TPS727 www.ti.com SBVS128F–JUNE2009–REVISEDDECEMBER2015 ChangesfromRevisionA(September,2009)toRevisionB Page • UpdatedFeatureslist............................................................................................................................................................. 1 • Changedtitleofdatasheet..................................................................................................................................................... 1 • Changedfootnote2toAbsoluteMaximumRatingstable...................................................................................................... 5 • RevisednumerousspecificationsandparametersinElectricalCharacteristicstable........................................................... 6 • RevisedoperatingparametersforFigure4............................................................................................................................ 7 • ReplacedFigure5.................................................................................................................................................................. 7 • AddedoperatingparameterstoFigure6................................................................................................................................ 7 • UpdatedFigure9.................................................................................................................................................................... 7 Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3

TPS727 SBVS128F–JUNE2009–REVISEDDECEMBER2015 www.ti.com 5 Pin Configurations and Functions TPS72715,TPS72718,TPS72728,TPS72748 YFFPackage AllOtherTPS727Devices DSBGA-4 YFFPackage TopView DSBGA-4 TopView OUT GND OUT GND B2 B1 B2 B1 A2 A1 A2 A1 IN EN IN EN Seenote. Seenote. DSEPackage 1,5mm×1,5mmWSON-6 TopView OUT 1 6 IN NC 2 5 NC GND 3 4 EN Tape and Reel Tape and Reel Sprocket Holes Sprocket Holes Top Dot Top Dot Mark Mark TPS72715YFF, TPS72718YFF TPS72711YFF TPS72728YFF, TPS72748YFF (Example) TPS727xxDSE See Note See Note NOTE The EN pin is marked with a dot for the 1.5-V, 1.8-V, 2.8-V, and 4.8-V versions of the YFF package. The GND pin is marked with a dot for all other voltage versions of the YFF package. Refer to YFF0004 Package Outline page included at the end of this document for dimensions of the YFF package. On the package outline, the shaded box indicates the location of ball A1 and does not correlate to any marking on the topside of the physical package. PinFunctions PIN I/O NAME YFF DSE DESCRIPTION Enablepin.DrivingENover0.9Vturnsontheregulator.DrivingENbelow0.4Vputstheregulatorintoshutdown EN A1 4 I mode,thusreducingtheoperatingcurrentto120nA,nominal. GND B1 3 — Groundpin. Inputpin.Asmallcapacitorisneededfromthispintogroundtoassurestability.SeeInputandOutputCapacitor IN A2 6 I RequirementsintheApplicationInformationsectionformoredetails. NC — 2,5 — Noconnection.Thispincanbetiedtogroundtoimprovethermaldissipation. Regulatedoutputvoltagepin.Asmall1-μFceramiccapacitorisneededfromthispintogroundtoassurestability. OUT B2 1 O SeeInputandOutputCapacitorRequirementsintheApplicationInformationsectionformoredetails. 4 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated

TPS727 www.ti.com SBVS128F–JUNE2009–REVISEDDECEMBER2015 6 Specifications 6.1 Absolute Maximum Ratings atT =–40°Cto+125°C(unlessotherwisenoted);allvoltagesarewithrespecttoGND(1) J MIN MAX UNIT Inputvoltagerange,V –0.3 +6.0 V IN Enablevoltagerange,V –0.3 +6.0(2) V EN Outputvoltagerange,V –0.3 +6.0 V OUT Maximumoutputcurrent,I Internallylimited OUT Outputshort-circuitduration Indefinite Operatingjunctiontemperature,T –55 +150 °C J Storagetemperature,T –55 +150 °C stg (1) Stressesabovetheseratingsmaycausepermanentdamage.Exposuretoabsolutemaximumconditionsforextendedperiodsmay degradedevicereliability.Thesearestressratingsonly,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyond thosespecifiedisnotimplied. (2) V absolutemaximumratingisV or6.0V,whicheverisless. EN IN 6.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001,allpins(1) ±2000 V(ESD) Electrostaticdischarge Chargeddevicemodel(CDM),perJEDECspecificationJESD22-C101, V allpins(2) ±500 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingjunctiontemperaturerange(unlessotherwisenoted) MIN NOM MAX UNIT V Inputvoltage 2 5.5 V IN I Outputcurrent 0 250 mA OUT T Operatingjunctiontemperaturerange –40 +125 °C J 6.4 Thermal Information TPS727 THERMALMETRIC(1) DSE(WSON) YFF(DSBGA) UNITS 6PINS 4PINS R Junction-to-ambientthermalresistance 190.5 160 °C/W θJA R Junction-to-case(top)thermalresistance 94.9 75 °C/W θJC(top) R Junction-to-boardthermalresistance 149.3 76 °C/W θJB ψ Junction-to-topcharacterizationparameter 6.4 3 °C/W JT ψ Junction-to-boardcharacterizationparameter 152.8 74 °C/W JB R Junction-to-case(bottom)thermalresistance(2) N/A N/A °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953. (2) θ isnotapplicablebecausethereisnothermalpad. JCbot Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5

TPS727 SBVS128F–JUNE2009–REVISEDDECEMBER2015 www.ti.com 6.5 Electrical Characteristics Overoperatingtemperaturerange(T =–40°Cto+125°C),V =V +0.3Vor2.0V,whicheverisgreater; J IN OUT(TYP) I =10mA,V =0.9V,andC =1.0μF(unlessotherwisenoted).TypicalvaluesareatT =+25°C. OUT EN OUT J PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V Inputvoltagerange 2.0 5.5 V IN V Outputvoltagerange 0.9 5.0 V O T =+25°C –2.5 +2.5 mV J V +0.3V≤V ≤5.5V, V (1) DCoutputaccuracy 0OmUAT ≤I ≤20I0NmA –2.0% ±1.0% +2.0% OUT OUT V +0.3V≤V ≤5.5V, OUT IN ±1.0% 0mA≤I ≤250mA OUT 1mAto200mAor ±50.0 200mAto1mAin1μs,C =1μF OUT ΔV Loadtransient mV OUT 1mAto250mAor ±65 250mAto1mAin1μs,C =1μF OUT V +0.3V≤V ≤5.5V, ΔV /ΔV Lineregulation OUT(NOM) IN 8 μV/V O IN I =10mA OUT ΔV /ΔI Loadregulation 0mA≤I ≤250mA 20 μV/mA O OUT OUT V =0.98×V ,I =10mA 6.5 IN OUT(NOM) OUT V =0.98×V ,I =50mA 32.5 IN OUT(NOM) OUT V Dropoutvoltage(2) V =0.98×V ,I =100mA 65 mV DO IN OUT(NOM) OUT V =0.98×V ,I =200mA 130 200 IN OUT(NOM) OUT V =0.98×V ,I =250mA 162.5 IN OUT(NOM) OUT I Outputcurrentlimit V =0.9×V 300 400 550 mA CL OUT OUT(NOM) I =0mA,T =–40°Cto+125°C 7.9 12 OUT J I Groundpincurrent I =200mA 110 µA GND OUT I =250mA 130 OUT V ≤0.4V,V =2V,T =+25°C 0.12 EN IN J ISHDN Shutdowncurrent(IGND) VEN≤0.4V,2.0V<VIN≤4.5V, 0.55 2 µA T =–40°Cto+85°C J f=10Hz 85 f=100Hz 75 VIN=2.3V, f=1kHz 70 PSRR Power-supplyrejectionratio V =1.8V, dB OUT I =10mA f=10kHz 55 OUT f=100kHz 40 f=1MHz 45 BW=100Hzto100kHz,V =2.1V, V Outputnoisevoltage IN 33.5 μV N V =1.8V,I =10mA RMS OUT OUT t Startuptime(3) C =1.0μF,0≤I ≤250mA 100 μs STR OUT OUT V Enablepinhigh(enabled) 0.9 V V HI IN V Enablepinlow(disabled) 0 0.4 V LO I Enablepincurrent EN=5.5V 40 500 nA EN UVLO Undervoltagelock-out V rising 1.85 1.90 1.95 V IN Shutdown,temperatureincreasing +160 T Thermalshutdowntemperature °C SD Reset,temperaturedecreasing +140 T Operatingjunctiontemperature –40 +125 °C J (1) Theoutputvoltageisprogrammedatthefactory. (2) V ismeasuredfordeviceswithV ≥2.35VsothatV ≥2.3V. DO OUT(NOM) IN (3) Startuptime:timefromENassertionto0.98×V . OUT(NOM) 6 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated

TPS727 www.ti.com SBVS128F–JUNE2009–REVISEDDECEMBER2015 6.6 Typical Characteristics Overoperatingtemperaturerange(T =–40°Cto+125°C),V =V +0.3Vor2.0V,whicheverisgreater;I = J IN OUT(TYP) OUT 10mA,V =V ,andC =1.0μF(unlessotherwisenoted).TypicalvaluesareatT =+25°C. EN IN OUT J 1.90 1.90 1.88 1.88 1.86 1.86 1.84 1.84 V) 1.82 V) 1.82 ( ( T1.80 T1.80 U U O O V 1.78 V 1.78 1.76 1.76 +125°C +125°C 1.74 +85°C 1.74 +85°C 1.72 +25°C 1.72 +25°C -40°C -40°C 1.70 1.70 2.1 2.6 3.1 3.6 4.1 4.6 5.1 5.6 2.1 2.6 3.1 3.6 4.1 4.6 5.1 5.6 V (V) V (V) IN IN I =10mA I =200mA OUT OUT Figure1.LineRegulation Figure2.LineRegulation (TPS72718) (TPS72718) 1.90 1.90 1.88 1.88 1.86 1.86 1.84 1.84 V) 1.82 V) 1.82 (OUT 1.80 (OUT 1.80 V 1.78 V 1.78 1.76 1.76 +125°C +125°C 1.74 +85°C 1.74 +85°C 1.72 +-4205°°CC 1.72 +-4205°°CC 1.70 1.70 0 1 2 3 4 5 6 7 8 9 10 0 25 50 75 100 125 150 175 200 225 250 IOUT(mA) IOUT(mA) 0mA≤IOUT≤10mA 0mA≤IOUT≤250mA Figure3.LoadRegulationUnderLightLoads Figure4.LoadRegulation (TPS72718) (TPS72718) 160 160 140 140 120 120 100 100 V) V) m m ( 80 ( 80 O O D D V 60 V 60 40 +125°C 40 +125°C +85°C +85°C 20 +25°C 20 +25°C -40°C -40°C 0 0 0 50 100 150 200 250 2.25 2.75 3.25 3.75 4.25 4.75 I (mA) V (V) OUT IN I =200mA OUT Figure5.DropoutVoltagevsOutputCurrent(TPS72750) Figure6.DropoutVoltagevsInputVoltage Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7

TPS727 SBVS128F–JUNE2009–REVISEDDECEMBER2015 www.ti.com Typical Characteristics (continued) Overoperatingtemperaturerange(T =–40°Cto+125°C),V =V +0.3Vor2.0V,whicheverisgreater;I = J IN OUT(TYP) OUT 10mA,V =V ,andC =1.0μF(unlessotherwisenoted).TypicalvaluesareatT =+25°C. EN IN OUT J 1.90 12.0 +125°C 1.88 11.5 +85°C 1.86 11.0 +25°C -40°C 1.84 10.5 I = 10 mA V) 1.82 OUT A) 10.0 ( m T 1.80 ( 9.5 OU ND V 1.78 I = 200 mA IG 9.0 1.76 OUT 8.5 1.74 8.0 1.72 7.5 1.70 7.0 -40 -25 -10 5 20 35 50 65 80 95 110 125 2.1 2.6 3.1 3.6 4.1 4.6 5.1 5.6 Temperature (°C) V (V) IN I =0mA OUT Figure7.OutputVoltagevsTemperature Figure8.GroundPinCurrentvsInputVoltage (TPS72718) (TPS72718) 140 15 120 12 100 A) 80 A) 9 m m ( ( D D IGN 60 IGN 6 40 +125°C +85°C 3 20 +25°C -40°C 0 0 0 25 50 75 100 125 150 175 200 225 250 -40 -25 -10 5 20 35 50 65 80 95 110 125 I (mA) Temperature (°C) OUT 0mA≤IOUT≤250mA VIN=2.1V,IOUT=0mA Figure9.GroundPinCurrentvsLoad Figure10.GroundPinCurrentvsTemperature (TPS72718) (TPS72718) 2.0 550 +125°C +85°C 1.6 +25°C -40°C 500 A) 1.2 A) m m I(GND 0.8 I(LIM 450 400 0.4 0 350 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 V (V) V (V) IN IN Figure11.ShutdownCurrentvsInputVoltage Figure12.CurrentLimitvsInputVoltage (TPS72718) (TPS72718) 8 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated

TPS727 www.ti.com SBVS128F–JUNE2009–REVISEDDECEMBER2015 Typical Characteristics (continued) Overoperatingtemperaturerange(T =–40°Cto+125°C),V =V +0.3Vor2.0V,whicheverisgreater;I = J IN OUT(TYP) OUT 10mA,V =V ,andC =1.0μF(unlessotherwisenoted).TypicalvaluesareatT =+25°C. EN IN OUT J 100 100 B) 90 B) 90 d d o ( 80 o ( 80 ati ati R 70 R 70 n n ctio 60 IOUT= 10 mA ctio 60 I = 10 mA eje 50 eje 50 OUT R R y 40 y 40 pl pl up 30 up 30 S S er- 20 er- 20 w w Po 10 IOUT= 200 mA Po 10 I = 200 mA OUT 0 0 10 100 1k 10k 100k 1M 10M 10 100 1k 10k 100k 1M 10M Frequency (Hz) Frequency (Hz) Figure13.PSRRvsFrequency Figure14.PSRRvsFrequency (V –V =0.5V,TPS72718) (V –V =0.3V,TPS72718) IN OUT IN OUT 80 10.00 o (dB) 70 )HzÖ ction Rati 6500 nsity (V/m 1.00 eje 40 De 0.10 er-Supply R 3200 1 kHz se Spectral 0.01 ow 10 10 kHz Noi P 100 kHz 0 0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 10 100 1k 10k 100k 1M 10M V (V) Frequency (Hz) IN I =10mA,C =C =1µF OUT IN OUT Figure15.PSRRvsInputVoltage Figure16.OutputSpectralNoiseDensityvsOutputVoltage (TPS72718) (TPS72718) 200 mA 200 mA 100 mA/div IOUT 0.1 mA 50 m 100 mA/div IOUT 1 mA 50 m VOUT V/div VOUT V/div 100ms/div 50ms/div V =2.3V,t =t =1µs V =2.3V,t =t =1µs IN R F IN R F Figure17.LoadTransientResponse:0.1mAto200mA Figure18.LoadTransientResponse:1mAto200mA (TPS72718) (TPS72718) Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9

TPS727 SBVS128F–JUNE2009–REVISEDDECEMBER2015 www.ti.com Typical Characteristics (continued) Overoperatingtemperaturerange(T =–40°Cto+125°C),V =V +0.3Vor2.0V,whicheverisgreater;I = J IN OUT(TYP) OUT 10mA,V =V ,andC =1.0μF(unlessotherwisenoted).TypicalvaluesareatT =+25°C. EN IN OUT J 200 mA mA/div mV/div VOUT 00 IOUT 10 mA 2 1 5 0 m 2.7 V V V V OUT /d IN iv div 5 V/ 2.1 V 0. 50ms/div 1 ms/div VIN=2.3V,tR=tF=1µs Slewrate=1V/µs,IOUT=100µA Figure19.LoadTransientResponse:10mAto200mA Figure20.LineTransientResponse (TPS72718) (TPS72718) EN v di VOUT 1 V/ v v di di V/ V/ V m 1 OUT 5 2.7 V V IN v 0.5 V/div 2.1 V 50 mA/di IIN 100ms/div 20ms/div Slewrate=1V/µs,I =200µA V =2.1V,V =1.8V,I =100µA OUT IN OUT OUT Figure21.LineTransientResponse Figure22.V InrushCurrent IN (TPS72718) (TPS72718) EN v di V/ 1 VIN v di 1 V/ VOUT div V/ 1 v di V A/ OUT m 0 I 0 IN 1 20ms/div 200 ms/div VIN=2.1V,VOUT=1.8V,IOUT=200mA IOUT=200mA Figure23.VINInrushCurrent Figure24.VINRampUp,RampDownResponse (TPS72718) (TPS72718) 10 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated

TPS727 www.ti.com SBVS128F–JUNE2009–REVISEDDECEMBER2015 7 Detailed Description 7.1 Overview The TPS727 devices belong to a family of LDO regulators that consume extremely low quiescent current while simultaneously delivering excellent PSRR with very little headroom (V – V differential voltage), and very IN OUT good transient response. These features, combined with low noise without a noise reduction pin in an ultrasmall package, make these devices ideal for portable applications. This family of regulators offers sub-band-gap output voltages,currentlimitandthermalprotection,andisfullyspecifiedfrom –40°Cto+125°C. 7.2 Functional Block Diagram IN OUT Current Limit Thermal Shutdown UVLO EEPROM EN Bandgap LOGIC 7.3 Feature Description 7.3.1 InternalCurrentLimit The TPS727 internal current limit helps protect the regulator during fault conditions. During current limit, the output sources a fixed amount of current that is largely independent of output voltage. In such a case, the output voltage is not regulated and is V = I × R . The PMOS pass transistor dissipates (V – V ) × I OUT LIMIT LOAD IN OUT LIMIT until thermal shutdown is triggered and the device is turned off. As the device cools down, it is turned on by the internal thermal shutdown circuit. If the fault condition continues, the device cycles between current limit and thermalshutdown.SeetheThermalProtectionsectionformoredetails. The PMOS pass element in the TPS727 has a built-in body diode that conducts current when the voltage at the OUT pin exceeds the voltage at the IN pin. This current is not limited, so if extended reverse voltage operation is anticipated,externallimitingto5%ofratedoutputcurrentisrecommended. 7.3.2 SoftStart ThestartupcurrentisgivenbyEquation1: I (mA) = C (mF)´0.07(V/ms) + I (mA) SOFT START OUT LOAD (1) Equation1showsthatsoft-startcurrentisdirectlyproportionaltoC . OUT TheoutputvoltageramprateisindependentofC andloadcurrent,andhasatypicalvalueof0.07V/μs. OUT Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11

TPS727 SBVS128F–JUNE2009–REVISEDDECEMBER2015 www.ti.com Feature Description (continued) The TPS727 automatically adjusts the soft-start current to supply both the load current and the C charge OUT current. For example, if I = 0 mA upon enabling the LDO, I = 1 μF × 0.07 V/μs + 0 mA = 70 mA, LOAD SOFT START thecurrentthatchargestheoutputcapacitor. If I = 200 mA, I = 1 μF × 0.07 V/μs + 200 mA = 270 mA, the current required for charging output LOAD SOFT START capacitorandsupplyingtheloadcurrent. If the output capacitor and load are increased such that the soft-start current exceeds the output current limit, the current is clamped at the typical current limit of 400 mA. For example, if C = 10 μF and I = 200 mA, 10 μF OUT OUT ×0.07V/μs+200mA=900mAisnotsupplied.Instead,thecurrentisclampedat400mA. 7.3.3 Shutdown The enable pin (EN) is active high and is compatible with standard and low voltage, TTL-CMOS levels. When shutdowncapabilityisnotrequired,ENcanbeconnectedtotheINpin. 7.3.4 DropoutVoltage The TPS727 uses a PMOS pass transistor to achieve low dropout. When (V – V ) is less than the dropout IN OUT voltage (V ), the PMOS pass device is in the linear region of operation and the input-to-output resistance is the DO R of the PMOS pass element. V approximately scales with output current because the PMOS device DS(ON) DO functionslikearesistorindropout. As with any linear regulator, PSRR and transient response are degraded as (V – V ) approaches dropout. IN OUT ThiseffectisillustratedinFigure15intheTypicalCharacteristicssection. 7.3.5 UndervoltageLock-out(UVLO) The TPS727 uses an undervoltage lock-out circuit that keeps the output shut off until the input voltage reaches theUVLOthresholdvoltage. 7.3.6 ThermalProtection Thermal protection disables the output when the junction temperature rises to approximately +160°C, allowing the device to cool. When the junction temperature cools to approximately +140°C the output circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a resultofoverheating. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. For reliable operation, limit junction temperature to +125°C maximum. To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection triggers at least +35°C above the maximum expected ambient condition of a particular application. This configuration produces a worst-casejunctiontemperatureof+125°Catthehighestexpectedambienttemperatureandworst-caseload. The internal protection circuitry of the TPS727 is designed to protect against overload conditions. This circuitry is not intended to replace proper heatsinking. Continuously running the TPS727 into thermal shutdown degrades devicereliability. 7.4 Device Functional Modes 7.4.1 OperationwithENControl Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode, thusreducingtheoperatingcurrentto120nA,nominal. 12 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated

TPS727 www.ti.com SBVS128F–JUNE2009–REVISEDDECEMBER2015 8 Applications and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 8.1 Application Information The TPS727 family of low-dropout (LDO) linear regulators are utralow quiescent current LDOs with excellent line andultra-fastloadtransientperformanceandaredesignedforpower-sensitiveapplications. 8.2 Typical Application Figure25. TPS72718YFF2.5V to1.8V at200mASchematic IN OUT 8.2.1 DesignRequirements 8.2.1.1 InputandOutputCapacitorRequirements Although an input capacitor is not required for stability, good analog design practice is to connect a 0.1-μF to 1.0-μF low equivalent series resistance (ESR) capacitor across the IN pin and GND input of the regulator. This capacitor counteracts reactive input sources and improves transient response, noise rejection, and ripple rejection. A higher-value capacitor may be necessary if large, fast rise-time load transients are anticipated, or if the device is not located close to the power source. If source impedance is not sufficiently low, a 0.1-μF input capacitormaybenecessarytoensurestability. The TPS727 is designed to be stable with standard ceramic capacitors with values of 1.0 μF or larger at the output. X5R- and X7R-type capacitors are best because they have minimal variation in value and ESR over temperature.MaximumESRmustbelessthan200mΩ. 8.2.1.2 TransientResponse As with any regulator, increasing the size of the output capacitor reduces over- and undershoot magnitude but increasesdurationofthetransientresponse. Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13

TPS727 SBVS128F–JUNE2009–REVISEDDECEMBER2015 www.ti.com Typical Application (continued) 8.2.2 DetailedDesignProcedure Selectthedesireddevicebasedontheoutputvoltage. Provide an input supply with adequate headroom to include dropout and output current to account for the GND pincurrentandtopowertheload. Selectadequateinputandoutputcapacitors. ThestartupcurrentisgivenbyEquation2: I (mA) = C (mF)´0.07(V/ms) + I (mA) SOFT START OUT LOAD (2) Equation2showsthatsoft-startcurrentisdirectlyproportionaltoC . OUT TheoutputvoltageramprateisindependentofC andloadcurrentandhasatypicalvalueof0.07V/μs. OUT The TPS727 automatically adjusts the soft-start current to supply both the load current and the C charge OUT current. For example, if I = 0 mA upon enabling the LDO, I = 1 μF × 0.07 V/μs + 0 mA = 70 mA, LOAD SOFT START thecurrentthatchargestheoutputcapacitor. If I = 200 mA, I = 1 μF × 0.07 V/μs + 200 mA = 270 mA, the current required for charging output LOAD SOFT START capacitorandsupplyingtheloadcurrent. If the output capacitor and load are increased such that the soft-start current exceeds the output current limit, the current is clamped at the typical current limit of 400 mA. For example, if C = 10 μF and I = 200 mA, 10 μF OUT OUT ×0.07V/μs+200mA=900mAisnotsupplied.Instead,thecurrentisclampedat400mA. 14 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated

TPS727 www.ti.com SBVS128F–JUNE2009–REVISEDDECEMBER2015 Typical Application (continued) 8.2.3 ApplicationCurves 100 10.00 o (dB) 9800 )HzÖ n Rati 70 y (V/m 1.00 ctio 60 IOUT= 10 mA nsit eje 50 De 0.10 er-Supply R 432000 se Spectral 0.01 w oi Po 10 IOUT= 200 mA N 0 0 10 100 1k 10k 100k 1M 10M 10 100 1k 10k 100k 1M 10M Frequency (Hz) Frequency (Hz) I =10mA,C =C =1µF OUT IN OUT Figure26.PSRRvsFrequency Figure27.OutputSpectralNoiseDensityvsOutput (V –V =0.5V,TPS72718) Voltage(TPS72718) IN OUT 200 mA 200 mA 100 mA/div IOUT 0.1 mA 50 m 100 mA/div IOUT 1 mA 50 m VOUT V/div VOUT V/div 100ms/div 50ms/div V =2.3V,t =t =1µs V =2.3V,t =t =1µs IN R F IN R F Figure28.LoadTransientResponse:0.1mAto200mA Figure29.LoadTransientResponse:1mAto200mA (TPS72718) (TPS72718) 200 mA mA/div mV/div VOUT 00 IOUT 10 mA 2 1 5 0 m 2.7 V V V V OUT /d IN iv div 5 V/ 2.1 V 0. 50ms/div 1 ms/div VIN=2.3V,tR=tF=1µs Slewrate=1V/µs,IOUT=100µA Figure30.LoadTransientResponse:10mAto200mA Figure31.LineTransientResponse(TPS72718) (TPS72718) Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15

TPS727 SBVS128F–JUNE2009–REVISEDDECEMBER2015 www.ti.com Typical Application (continued) EN v di VOUT 1 V/ v v di di V/ V/ V m 1 OUT 5 2.7 V V IN v 0.5 V/div 2.1 V 50 mA/di IIN 100ms/div 20ms/div Slewrate=1V/µs,I =200µA V =2.1V,V =1.8V,I =100µA OUT IN OUT OUT Figure32.LineTransientResponse(TPS72718) Figure33.V InrushCurrent(TPS72718) IN EN v di V/ 1 VIN v di 1 V/ VOUT div V/ 1 v di V A/ OUT m 0 I 0 IN 1 20ms/div 200 ms/div VIN=2.1V,VOUT=1.8V,IOUT=200mA IOUT=200mA Figure34.VINInrushCurrent(TPS72718) Figure35.VINRampUp,RampDownResponse (TPS72718) 16 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated

TPS727 www.ti.com SBVS128F–JUNE2009–REVISEDDECEMBER2015 8.3 Do's and Don'ts Doplaceatleastone1.0-µFceramiccapacitorascloseaspossibletotheOUTpinoftheregulator. Donotplacetheoutputcapacitormorethan10mmawayfromtheregulator. ForDSEdevices,dotietheNCpinstogroundtoimprovethermaldissipation. Do connect a 0.1-μF to 1.0-μF low equivalent series resistance (ESR) capacitor across the IN pin and GND input oftheregulator. Donotexceedtheabsolutemaximumratings. 9 Power-Supply Recommendations These devices are designed to operate from an input voltage supply range between 2.0 V and 5.5 V. The input voltage range provides adequate headroom in order for the device to have a regulated output. This input supply mustbewellregulated.Iftheinputsupplyisnoisy,additionalinputcapacitorswithlowESRcanhelpimprovethe outputnoiseperformance. 10 Layout 10.1 Layout Guidelines 10.1.1 BoardLayoutRecommendationstoImprovePSRRandNoisePerformance To improve ac performance (such as PSRR, output noise, and transient response), TI recommends that the board be designed with separate ground planes for V and V , with the ground plane connected only at the IN OUT GND pin of the device. In addition, the ground connection for the output capacitor must be connected directly to theGNDpinofthedevice.HighESRcapacitorsmaydegradePSRR. 10.1.2 PowerDissipation The ability to remove heat from the die is different for each package type, presenting different considerations in the printed circuit board (PCB) layout. The PCB area around the device that is free of other components moves theheatfromthedevicetotheambientair.PerformancedataforJEDEClow-andhigh-Kboardsaregiveninthe Thermal Information table. Using heavier copper increases the effectiveness in removing heat from the device. Theadditionofplatedthrough-holestoheat-dissipatinglayersalsoimprovestheheatsinkeffectiveness. Powerdissipationdependsoninputvoltageandloadconditions.Powerdissipation(P )isequaltotheproductof D theoutputcurrenttimesthevoltagedropacrosstheoutputpasselement(V toV ),asshowninEquation3: IN OUT P = (V -V )´I D IN OUT OUT (3) 10.1.3 PackageMounting Solder pad footprint recommendations and recommended land patterns are attached to the end of this document. Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17

TPS727 SBVS128F–JUNE2009–REVISEDDECEMBER2015 www.ti.com 10.2 Layout Example 10.2.1 DSEEVMBoardLayout ThissectionprovidestheTPS727xxDSEEVM-406boardlayoutandillustrations. Figure36. TopLayerAssembly Figure37. TopLayerRouting 18 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated

TPS727 www.ti.com SBVS128F–JUNE2009–REVISEDDECEMBER2015 Layout Example (continued) Figure38. BottomLayerRouting Figure39. BottomLayerAssembly Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 19

TPS727 SBVS128F–JUNE2009–REVISEDDECEMBER2015 www.ti.com Layout Example (continued) 10.2.2 YFFEVMBoardLayout ThissectionprovidestheTPS727xxYFFEVM-407boardlayoutandillustrations. Figure40. TopLayerAssembly Figure41. TopLayerRouting 20 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated

TPS727 www.ti.com SBVS128F–JUNE2009–REVISEDDECEMBER2015 Layout Example (continued) Figure42. BottomLayerRouting Figure43. BottomLayerAssembly Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 21

TPS727 SBVS128F–JUNE2009–REVISEDDECEMBER2015 www.ti.com 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 RelatedDocumentation ApplicationreportSLAA414,LDOPSRRMeasurementSimplified. ApplicationreportSLAA412,LDONoiseDemystified. UserguideSLVU323,TPS727xxYFFEVM UserguideSLVU325,TPS727xxDSEEVM 11.1.2 DeviceNomenclature Table1.DeviceNomenclature(1) PRODUCT V (2) OUT TPS727xxxyyyz XXXisthenominaloutputvoltage. YYYispackagedesignator. Zispackagetapeandreelquantity(R=3000,T=250). (1) ForthemostcurrentpackageandorderinginformationseethePackageOptionAddendumattheendofthisdocument,orvisitthe deviceproductfolderatwww.ti.com. (2) Outputvoltagesfrom0.9Vto5.0Vin50-mVincrementsareavailablethroughtheuseofinnovativefactoryEEPROMprogramming; minimumorderquantitiesmayapply.Contactfactoryfordetailsandavailability. 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 11.3 Trademarks E2EisatrademarkofTexasInstruments. BluetoothisaregisteredtrademarkofBluetoothSIG. ZigbeeisaregisteredtrademarkofZigbeeAlliance. Allothertrademarksarethepropertyoftheirrespectiveowners. 11.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. 11.5 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 22 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated

TPS727 www.ti.com SBVS128F–JUNE2009–REVISEDDECEMBER2015 Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 23

TPS727 SBVS128F–JUNE2009–REVISEDDECEMBER2015 www.ti.com 24 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated

TPS727 www.ti.com SBVS128F–JUNE2009–REVISEDDECEMBER2015 TPS727xxYFF PACKAGE OUTLINE YFF0004 DSBGA- 0.625 mm max height SCALE 13.000 DIE SIZE BALLGRIDARRAY A B E BALLA1 CORNER D 0.625 MAX C SEATING PLANE 0.30 BALLTYP 0.12 0.4TYP B SYMM D: Max = 0.82 mm, Min = 0.76 mm 0.4 TYP E: Max = 1.19 mm, Min = 1.13 mm A 1 2 0.3 4X SYMM 0.2 0.015 C A B 02/2014 NOTES: NanoFree Is a trademark ofTexas Instruments. 1.All linear dimensions are in millimeters.Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing perASMEY14.5M. 2.This drawing is subject to change without notice. 3. NanoFreeTMpackage configuration. Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 25

TPS727 SBVS128F–JUNE2009–REVISEDDECEMBER2015 www.ti.com TPS727xxYFF EXAMPLE BOARD LAYOUT YFF0004 DSBGA - 0.625 mm max height DIE SIZE BALLGRIDARRAY (0.4)TYP 4 0.23 0.02 1 2 A SYMM (0.4)TYP B SYMM LAND PATTERN EXAMPLE SCALE:50X ( 0.23) 0.05 MAX 0.05 MIN METAL METAL UNDER MASK SOLDER MASK ( 0.23) OPENING SOLDER MASK OPENING NON-SOLDER MASK DEFINED SOLDER MASK (PREFERRED) DEFINED SOLDER MASK DETAILS NOTTO SCALE 02/2014 NOTES: (continued) 4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. Refer toTexas Instruments Literature No. SBVA017 (www.ti.com/lit/sbva017). 26 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated

TPS727 www.ti.com SBVS128F–JUNE2009–REVISEDDECEMBER2015 TPS727xxYFF EXAMPLE STENCIL DESIGN YFF0004 DSBGA - 0.625 mm max height DIE SIZE BALLGRIDARRAY (0.4)TYP 4X ( 0.25) (R0.05)TYP 1 2 A SYMM (0.4) TYP B METAL SYMM TYP SOLDER PASTE EXAMPLE BASED ON 0.1 mmTHICK STENCIL SCALE:50X 02/2014 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 27

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPS727105YFFR ACTIVE DSBGA YFF 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 GA & no Sb/Br) TPS727105YFFT ACTIVE DSBGA YFF 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 GA & no Sb/Br) TPS72710DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 UR & no Sb/Br) TPS72710DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 UR & no Sb/Br) TPS72711YFFR ACTIVE DSBGA YFF 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 QL & no Sb/Br) TPS72711YFFT ACTIVE DSBGA YFF 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 QL & no Sb/Br) TPS72715DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAUAG Level-1-260C-UNLIM -40 to 125 GS & no Sb/Br) TPS72715DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAUAG Level-1-260C-UNLIM -40 to 125 GS & no Sb/Br) TPS72715YFFR ACTIVE DSBGA YFF 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 GS & no Sb/Br) TPS72715YFFT ACTIVE DSBGA YFF 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 GS & no Sb/Br) TPS727185YFFR ACTIVE DSBGA YFF 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 RW & no Sb/Br) TPS727185YFFT ACTIVE DSBGA YFF 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 RW & no Sb/Br) TPS72718DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 GT & no Sb/Br) TPS72718DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 GT & no Sb/Br) TPS72718YFFR ACTIVE DSBGA YFF 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 GT & no Sb/Br) TPS72718YFFT ACTIVE DSBGA YFF 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 GT & no Sb/Br) TPS72719DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 CB & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPS72719DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 CB & no Sb/Br) TPS72719YFFR ACTIVE DSBGA YFF 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 AA & no Sb/Br) TPS72719YFFT ACTIVE DSBGA YFF 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 AA & no Sb/Br) TPS72725DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAUAG Level-1-260C-UNLIM -40 to 125 QA & no Sb/Br) TPS72725DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAUAG Level-1-260C-UNLIM -40 to 125 QA & no Sb/Br) TPS72727DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 TS & no Sb/Br) TPS72727DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 TS & no Sb/Br) TPS727285DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 QK & no Sb/Br) TPS727285DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 QK & no Sb/Br) TPS72728DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 GU & no Sb/Br) TPS72728DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 GU & no Sb/Br) TPS72728YFFR ACTIVE DSBGA YFF 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 GU & no Sb/Br) TPS72728YFFT ACTIVE DSBGA YFF 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 GU & no Sb/Br) TPS72730DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 QB & no Sb/Br) TPS72730DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 QB & no Sb/Br) TPS72730YFFR ACTIVE DSBGA YFF 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 ZZ & no Sb/Br) TPS72730YFFT ACTIVE DSBGA YFF 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 ZZ & no Sb/Br) TPS72733DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 QC & no Sb/Br) Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPS72733DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 QC & no Sb/Br) TPS72733YFFR ACTIVE DSBGA YFF 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 ZY & no Sb/Br) TPS72733YFFT ACTIVE DSBGA YFF 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 ZY & no Sb/Br) TPS72748YFFR ACTIVE DSBGA YFF 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 EY & no Sb/Br) TPS72748YFFT ACTIVE DSBGA YFF 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 EY & no Sb/Br) TPS72750YFFR ACTIVE DSBGA YFF 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 CA & no Sb/Br) TPS72750YFFT ACTIVE DSBGA YFF 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 CA & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 1-Feb-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS727105YFFR DSBGA YFF 4 3000 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q1 TPS727105YFFT DSBGA YFF 4 250 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q1 TPS72710DSER WSON DSE 6 3000 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TPS72710DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS72710DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS72710DSET WSON DSE 6 250 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TPS72711YFFR DSBGA YFF 4 3000 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q1 TPS72711YFFT DSBGA YFF 4 250 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q1 TPS72715DSER WSON DSE 6 3000 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TPS72715DSET WSON DSE 6 250 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TPS72715YFFR DSBGA YFF 4 3000 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q2 TPS72715YFFT DSBGA YFF 4 250 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q2 TPS727185YFFR DSBGA YFF 4 3000 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q1 TPS727185YFFT DSBGA YFF 4 250 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q1 TPS72718DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS72718DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS72718YFFR DSBGA YFF 4 3000 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q2 TPS72718YFFT DSBGA YFF 4 250 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q2 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 1-Feb-2018 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS72719DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS72719DSER WSON DSE 6 3000 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TPS72719DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS72719DSET WSON DSE 6 250 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TPS72719YFFR DSBGA YFF 4 3000 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q1 TPS72719YFFT DSBGA YFF 4 250 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q1 TPS72725DSER WSON DSE 6 3000 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TPS72725DSET WSON DSE 6 250 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TPS72727DSER WSON DSE 6 3000 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TPS72727DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS72727DSET WSON DSE 6 250 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TPS72727DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS727285DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS727285DSER WSON DSE 6 3000 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TPS727285DSET WSON DSE 6 250 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TPS727285DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS72728DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS72728DSER WSON DSE 6 3000 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TPS72728DSET WSON DSE 6 250 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TPS72728DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS72728YFFR DSBGA YFF 4 3000 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q2 TPS72728YFFT DSBGA YFF 4 250 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q2 TPS72730DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS72730DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS72730YFFR DSBGA YFF 4 3000 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q1 TPS72730YFFT DSBGA YFF 4 250 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q1 TPS72733DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS72733DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TPS72733YFFR DSBGA YFF 4 3000 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q1 TPS72733YFFT DSBGA YFF 4 250 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q1 TPS72748YFFR DSBGA YFF 4 3000 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q2 TPS72748YFFT DSBGA YFF 4 250 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q2 TPS72750YFFR DSBGA YFF 4 3000 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q1 TPS72750YFFT DSBGA YFF 4 250 180.0 8.4 0.89 1.26 0.69 4.0 8.0 Q1 PackMaterials-Page2

PACKAGE MATERIALS INFORMATION www.ti.com 1-Feb-2018 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS727105YFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TPS727105YFFT DSBGA YFF 4 250 182.0 182.0 20.0 TPS72710DSER WSON DSE 6 3000 203.0 203.0 35.0 TPS72710DSER WSON DSE 6 3000 205.0 200.0 33.0 TPS72710DSET WSON DSE 6 250 205.0 200.0 33.0 TPS72710DSET WSON DSE 6 250 203.0 203.0 35.0 TPS72711YFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TPS72711YFFT DSBGA YFF 4 250 182.0 182.0 20.0 TPS72715DSER WSON DSE 6 3000 203.0 203.0 35.0 TPS72715DSET WSON DSE 6 250 203.0 203.0 35.0 TPS72715YFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TPS72715YFFT DSBGA YFF 4 250 182.0 182.0 20.0 TPS727185YFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TPS727185YFFT DSBGA YFF 4 250 182.0 182.0 20.0 TPS72718DSER WSON DSE 6 3000 205.0 200.0 33.0 TPS72718DSET WSON DSE 6 250 205.0 200.0 33.0 TPS72718YFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TPS72718YFFT DSBGA YFF 4 250 182.0 182.0 20.0 TPS72719DSER WSON DSE 6 3000 205.0 200.0 33.0 TPS72719DSER WSON DSE 6 3000 203.0 203.0 35.0 PackMaterials-Page3

PACKAGE MATERIALS INFORMATION www.ti.com 1-Feb-2018 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS72719DSET WSON DSE 6 250 205.0 200.0 33.0 TPS72719DSET WSON DSE 6 250 203.0 203.0 35.0 TPS72719YFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TPS72719YFFT DSBGA YFF 4 250 182.0 182.0 20.0 TPS72725DSER WSON DSE 6 3000 203.0 203.0 35.0 TPS72725DSET WSON DSE 6 250 203.0 203.0 35.0 TPS72727DSER WSON DSE 6 3000 203.0 203.0 35.0 TPS72727DSER WSON DSE 6 3000 205.0 200.0 33.0 TPS72727DSET WSON DSE 6 250 203.0 203.0 35.0 TPS72727DSET WSON DSE 6 250 205.0 200.0 33.0 TPS727285DSER WSON DSE 6 3000 205.0 200.0 33.0 TPS727285DSER WSON DSE 6 3000 203.0 203.0 35.0 TPS727285DSET WSON DSE 6 250 203.0 203.0 35.0 TPS727285DSET WSON DSE 6 250 205.0 200.0 33.0 TPS72728DSER WSON DSE 6 3000 205.0 200.0 33.0 TPS72728DSER WSON DSE 6 3000 203.0 203.0 35.0 TPS72728DSET WSON DSE 6 250 203.0 203.0 35.0 TPS72728DSET WSON DSE 6 250 205.0 200.0 33.0 TPS72728YFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TPS72728YFFT DSBGA YFF 4 250 182.0 182.0 20.0 TPS72730DSER WSON DSE 6 3000 205.0 200.0 33.0 TPS72730DSET WSON DSE 6 250 205.0 200.0 33.0 TPS72730YFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TPS72730YFFT DSBGA YFF 4 250 182.0 182.0 20.0 TPS72733DSER WSON DSE 6 3000 205.0 200.0 33.0 TPS72733DSET WSON DSE 6 250 205.0 200.0 33.0 TPS72733YFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TPS72733YFFT DSBGA YFF 4 250 182.0 182.0 20.0 TPS72748YFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TPS72748YFFT DSBGA YFF 4 250 182.0 182.0 20.0 TPS72750YFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TPS72750YFFT DSBGA YFF 4 250 182.0 182.0 20.0 PackMaterials-Page4

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