Product Sample & Technical Tools & Support & Folder Buy Documents Software Community TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 TPS6102x 96% Efficient Synchronous Boost Converter 1 Features 3 Description • 96%EfficientSynchronousBoostConverter The TPS6102x family of devices provide a power 1 supply solution for products powered by either a one- • OutputVoltageRemainsRegulatedWhenInput cell, two-cell, or three-cell alkaline, NiCd or NiMH, or VoltageExceedsNominalOutputVoltage one-cell Li-Ion or Li-polymer battery. Output currents • DeviceQuiescentCurrent:25 µA(Typ) can go as high as 200 mA while using a single-cell • InputVoltageRange:0.9Vto6.5V alkaline battery, and discharge it down to 0.9 V. The device can also be used for generating 5 V at 500 • FixedandAdjustableOutputVoltageOptionsUp mA from a 3.3-V rail or a Li-Ion battery. The boost to5.5V converter is based on a fixed-frequency, pulse width • PowerSaveModeforImprovedEfficiencyatLow modulation (PWM) controller using a synchronous OutputPower rectifier to obtain maximum efficiency. At low load currents the converter enters the power save mode to • LowBatteryComparator maintain a high efficiency over a wide-load current • LowEMI-Converter(IntegratedAnti-ringing range. The Power Save mode can be disabled, Switch) forcing the converter to operate at a fixed switching • LoadDisconnectDuringShutdown frequency. The maximum peak current in the boost • OvertemperatureProtection switch is limited to a value of 800 mA, 1500 mA, or 1800mAdependingontheversionofthedevice. • Small3-mm×3-mmVSON-10Package The TPS6102x devices keep the output voltage 2 Applications regulated even when the input voltage exceeds the nominal output voltage. The output voltage can be • AllOne-Cell,Two-Cell,andThree-CellAlkaline, programmed by an external resistor divider, or is NiCdorNiMH,orOne-CellLi-IonorLi-Polymer fixed internally on the chip. The converter can be Battery-PoweredProducts disabled to minimize battery drain. During shutdown, • PortableAudioPlayers the load is completely disconnected from the battery. A low-EMI mode is implemented to reduce ringing • PDAs and, in effect, lower radiated electromagnetic energy • CellularPhones when the converter enters the discontinuous • PersonalMedicalProducts conduction mode. The device is packaged in a 10-pin VSON PowerPAD™ package measuring 3 mm x 3 • CameraWhiteLEDFlashLights mm(DRC). DeviceInformation(1) PARTNUMBER PACKAGE BODYSIZE(NOM) TPS6102x VSON(10) 3.00mmx3.00mm (1) For all available packages, see the orderable addendum at theendofthedatasheet. 4 Typical Schematic L1 SW VOUT VO 6.8 m H 3.3 V Up To C2 C3 VBAT R3 2.2 m F 47 m F 200 mA 0.9-V To C1 R1 EN FB 6.5-V Input 10 m F LBI R4 R5 R2 PS LBO Low Battery Output GND PGND TPS61020 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 www.ti.com Table of Contents 1 Features.................................................................. 1 10.4 DeviceFunctionalModes......................................12 2 Applications........................................................... 1 10.5 Programming.........................................................12 3 Description............................................................. 1 11 ApplicationandImplementation........................ 14 4 TypicalSchematic.................................................. 1 11.1 ApplicationInformation..........................................14 11.2 TypicalApplication................................................14 5 RevisionHistory..................................................... 2 11.3 SystemExamples.................................................18 6 DeviceComparisonTable..................................... 3 12 PowerSupplyRecommendations..................... 20 7 PinConfigurationandFunctions......................... 3 13 Layout................................................................... 20 8 Specifications......................................................... 4 13.1 LayoutGuidelines.................................................20 8.1 AbsoluteMaximumRatings......................................4 13.2 LayoutExample....................................................21 8.2 ESDRatings..............................................................4 13.3 ThermalConsiderations........................................21 8.3 RecommendedOperatingConditions.......................4 14 DeviceandDocumentationSupport................. 22 8.4 ThermalInformation..................................................4 14.1 DeviceSupport......................................................22 8.5 ElectricalCharacteristics...........................................5 14.2 RelatedLinks........................................................22 8.6 TypicalCharacteristics..............................................6 14.3 Trademarks...........................................................22 9 ParameterMeasurementInformation..................8 14.4 ElectrostaticDischargeCaution............................22 10 DetailedDescription............................................. 9 14.5 Glossary................................................................22 10.1 Overview.................................................................9 15 Mechanical,Packaging,andOrderable 10.2 FunctionalBlockDiagram.......................................9 Information........................................................... 22 10.3 FeatureDescription...............................................10 5 Revision History ChangesfromRevisionF(April2012)toRevisionG Page • AddedESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection.................................................................................................. 1 2 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 www.ti.com SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 6 Device Comparison Table T OUTPUTVOLTAGEDC-DC(1) NOMINALSWITCHCURRENTLIMIT PARTNUMBER(2) A Adjustable 1500mA TPS61020DRC Adjustable 800mA TPS61028DRC Adjustable 1800mA TPS61029DRC –40°Cto85°C 3.0V 1500mA TPS61024DRC 3.3V 1500mA TPS61025DRC 5V 1800mA TPS61026DRC 5V 1500mA TPS61027DRC (1) Contactthefactorytocheckavailabilityofotherfixedoutputvoltageversions. (2) TheDRCpackageisavailabletapedandreeled.AddRsuffixtodevicetype(forexample,TPS61020DRCR)toorderquantitiesof3000 devicesperreel.AddaTsuffixtothedevicetype(thatis,TPS61020DRCT)toorderquantitiesof250devicesperreel. 7 Pin Configuration and Functions EN PGND VOUT SW FB PS LBO LBI GND VBAT PinFunctions PIN I/O DESCRIPTION NAME NO. EN 1 I Enableinput.(1/VBATenabled,0/GNDdisabled) FB 3 I Voltagefeedbackofadjustableversions GND 5 Control/logicground LBI 7 I Lowbatterycomparatorinput(comparatorenabledwithEN),maynotbeleftfloating,shouldbe connectedtoGNDorVBATifcomparatorisnotused LBO 4 O Lowbatterycomparatoroutput(opendrain) PS 8 I Enable/disablepowersavemode(1/VBATdisabled,0/GNDenabled) SW 9 I Boostandrectifyingswitchinput PGND 10 Powerground VBAT 6 I Supplyvoltage VOUT 2 O Boostconverteroutput PowerPAD™ — — Mustbesolderedtoachieveappropriatepowerdissipation.ShouldbeconnectedtoPGND. Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 www.ti.com 8 Specifications 8.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT InputvoltageonSW,VOUT,LBO,VBAT,PS,EN,FB,LBI –0.3 7 V T Operatingvirtualjunctiontemperature –40 150 °C J T Storagetemperature –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. 8.2 ESD Ratings VALUE UNIT Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±2000 V(ESD) Electrostaticdischarge Charged-devicemodel(CDM),perJEDECspecificationJESD22- ±750 V C101(2) (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess.Manufacturingwith lessthan500-VHBMispossiblewiththenecessaryprecautions. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess.Manufacturingwith lessthan250-VCDMispossiblewiththenecessaryprecautions. 8.3 Recommended Operating Conditions MIN NOM MAX UNIT SupplyvoltageatVBAT,V (TPS61020,TPS61024,TPS61025,TPS61028) 0.9 6.5 V I SupplyvoltageatVBAT,V (TPS61026,TPS61029) 0.9 5.5 V I Operatingvirtualjunctiontemperaturerange,T –40 125 °C J 8.4 Thermal Information TPS6102x THERMALMETRIC(1) SON UNIT 10PINS R Junction-to-ambientthermalresistance 47.2 θJA R Junction-to-case(top)thermalresistance 67.5 θJC(top) R Junction-to-boardthermalresistance 21.6 θJB °C/W ψ Junction-to-topcharacterizationparameter 1.7 JT ψ Junction-to-boardcharacterizationparameter 21.8 JB R Junction-to-case(bottom)thermalresistance 3.6 θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953. 4 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 www.ti.com SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 8.5 Electrical Characteristics Overrecommendedjunctiontemperaturerangeandoverrecommendedinputvoltagerange.TypicalvaluesareatT =25°C J (unlessotherwisenoted). PARAMETER TESTCONDITIONS MIN TYP MAX UNIT DC-DCSTAGE Minimuminputvoltageforstart-up R =120Ω 0.9 1.2 V L Inputvoltagerange,afterstart-up(TPS61020, 0.9 6.5 V V TPS61024,TPS61025,TPS61027,TPS61028) I Inputvoltagerange,afterstart-up(TPS61026, 0.9 5.5 V TPS61029) TPS61020,TPS61028andTPS61029output V 1.8 5.5 V O voltagerange TPS61020,TPS61028andTPS61029feedback V 490 500 510 mV FB voltage f Oscillatorfrequency 480 600 720 kHz Switchcurrentlimit(TPS61020,TPS61024, I VOUT=3.3V 1200 1500 1800 mA SW TPS61025,TPS61027) I Switchcurrentlimit(TPS61028) VOUT=3.3V 800 mA SW I Switchcurrentlimit(TPS61026,TPS61029) VOUT=3.3V 1500 1800 2100 mA SW Start-upcurrentlimit 0.4xI mA SW SWNswitchonresistance VOUT=3.3V 260 mΩ SWPswitchonresistance VOUT=3.3V 290 mΩ Totalaccuracy(includinglineandloadregulation) ±3% Lineregulation 0.6% Loadregulation 0.6% VBAT I =0mA,V =VBAT=1.2V, 1 3 µA Quiescentcurrent O EN VOUT VOUT=3.3V,TA=25°C 25 45 µA V =0V,VBAT=1.2V, Shutdowncurrent EN 0.1 1 µA T =25°C A CONTROLSTAGE V Undervoltagelockoutthreshold V voltagedecreasing 0.8 V UVLO LBI V LBIvoltagethreshold V voltagedecreasing 490 500 510 mV IL LBI LBIinputhysteresis 10 mV LBIinputcurrent EN=VBATorGND 0.01 0.1 µA V LBOoutputlowvoltage V =3.3V,I =100µA 0.04 0.4 V OL O OI V LBOoutputleakagecurrent V =7V 0.01 0.1 µA lkg LBO 0.2× V V EN,PSinputlowvoltage IL VBAT 0.8× V V EN,PSinputhighvoltage IH VBAT EN,PSinputcurrent ClampedonGNDorVBAT 0.01 0.1 µA Overtemperatureprotection 140 °C Overtemperaturehysteresis 20 °C Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 www.ti.com 8.6 Typical Characteristics Table1.TableofGraphs FIGURE Maximumoutputcurrent vsInputvoltage(TPS61020) Figure1 vsOutputcurrent(TPS61020) Figure2 vsOutputcurrent(TPS61025) Figure3 Efficiency vsOutputcurrent(TPS61027) Figure4 vsInputvoltage(TPS61025) Figure5 vsInputvoltage(TPS61027) Figure6 vsOutputcurrent(TPS61025) Figure7 Outputvoltage vsOutputcurrent(TPS61027) Figure8 NoloadsupplycurrentintoVBAT vsInputvoltage Figure9 NoloadsupplycurrentintoVOUT vsInputvoltage Figure10 1400 100 90 VBAT = 0.9 V VO = 1.8 V 1200 A VO = 3.3 V VO = 5 V 80 m ent - 1000 70 VBAT = 1.8 V m Output Curr 680000 Efficiency - % 456000 ximu 400 VO = 1.8 V 30 a M 20 200 10 0 0 0.9 1.7 2.5 3.3 4.1 4.9 5.7 6.5 1 10 100 1000 VI - Input Voltage - V IO - Output Current - mA Figure1.TPS61020MaximumOutputCurrentvsInput Figure2.TPS61020EfficiencyvsOutputCurrent Voltage 100 100 90 90 80 80 VBAT = 2.4 V 70 VBAT = 1.8 V 70 VBAT = 1.2 V VBAT = 2.4 V % 60 % 60 VBAT = 1.8 V VBAT = 3.6 V ncy - 50 VBAT = 0.9 V ncy - 50 Efficie 40 Efficie 40 30 30 20 20 10 VO = 3.3 V 10 VO = 5 V 0 0 1 10 100 1000 1 10 100 1000 IO - Output Current - mA IO - Output Current - mA Figure3.TPS61025EfficiencyvsOutputCurrent Figure4.TPS61027EfficiencyvsOutputCurrent 6 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 www.ti.com SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 100 100 95 IO = 100 mA VO = 3.3 V 95 IO = 100 mA 90 90 85 85 % 80 IO = 10 mA % 80 IO = 10 mA Efficiency - 7705 IO = 250 mA Efficiency - 7705 IO = 250 mA 65 65 60 60 55 55 VO = 5 V 50 50 0.9 1.4 1.9 2.4 2.9 3.4 3.9 4.4 4.9 0.9 1.4 1.9 2.4 2.9 3.4 3.9 4.4 4.95.45.9 6.4 VI - Input Voltage - V VI - Input Voltage - V Figure5.TPS61025EfficiencyvsInputVoltage Figure6.TPS61027EfficiencyvsInputVoltage 3.35 5.10 VO = 3.3 V VO = 5 V 5.05 Output Voltage - V 3.30 VBAT = 2.4 V Output Voltage - V 4.955 VBAT = 3.6 V - 3.25 - 4.90 O O V V 4.85 3.20 4.80 1 10 100 1000 1 10 100 1000 IO - Output Current - mA IO - Output Current - mA Figure7.TPS61025OutputVoltagevsOutputCurrent Figure8.TPS61027OutputVoltagevsOutputCurrent 1.6 34.8 TA = 85°C TA = 85°C mANo Load Supply Current Into VBAT - 000011......2468241 TA = 25°C TA = -40°C mANo Load Supply Current Into VOUT - 1122494949......888888 TA = -40°C TA = 25°C 0 -0.2 0.9 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 0.9 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 VI- Input Voltage - V VI- Input Voltage - V Figure9.NoLoadSupplyCurrentIntoVBATvsInput Figure10.NoLoadSupplyCurrentIntoVOUTvsInput Voltage Voltage Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 www.ti.com 9 Parameter Measurement Information L1 SW VOUT VCC 6.8µH C2 C3 Boost Output VBAT R3 2.2µF 47µF Power C1 R1 EN FB Supply 10µF LBI R4 R5 R2 PS LBO Control Output GND PGND List of Components: TPS6102x U1 = TPS6102xDRC L1 = EPCOS B82462−G4682 C1, C2 = X7R/X5R Ceramic C3 = Low ESR Tantalum Figure11. ParameterMeasurementSchematic 8 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 www.ti.com SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 10 Detailed Description 10.1 Overview TPS6102x is based on a fixed frequency, pulse-width-modulation (PWM) controller using synchronous rectification to obtain maximum efficiency. Input voltage, output voltage, and voltage drop on the NMOS switch are monitored and forwarded to the regulator. So changes in the operating conditions of the converter directly affect the duty cycle. At low load currents, the converter enters Power Save Mode to ensure high efficiency over a wide load current range. The Power Save mode can be disabled, forcing the converter to operate at a fixed switchingfrequency. 10.2 Functional Block Diagram SW Backgate Control Anti- VBAT Ringing VOUT VOUT 10 kΩ 20 pF Vmax Gate Control Control PGND PGND PGND Error Amplifier _ Regulator FB + + Vref= 0.5 V _ GND Control Logic Oscillator Temperature EN Control PS GND LBO Low Battery Comparator _ LBI + + _ Vref= 0.5 V GND Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 www.ti.com 10.3 Feature Description 10.3.1 ControllerCircuit The controller circuit of the device is based on a fixed frequency multiple feed forward controller topology. Input voltage, output voltage, and voltage drop on the NMOS switch are monitored and forwarded to the regulator. So changes in the operating conditions of the converter directly affect the duty cycle and must not take the indirect andslowwaythroughthecontrolloopandtheerroramplifier.Thecontrolloop,determinedbytheerroramplifier, only has to handle small signal errors. The input for it is the feedback voltage on the FB pin or, at fixed output voltage versions, the voltage on the internal resistor divider. It is compared with the internal reference voltage to generateanaccurateandstableoutputvoltage. ThepeakcurrentoftheNMOSswitchisalsosensedtolimitthemaximumcurrentflowingthroughtheswitchand the inductor. An internal temperature sensor prevents the device from getting overheated in case of excessive powerdissipation. 10.3.2 SynchronousRectifier The device integrates an N-channel and a P-channel MOSFET transistor to realize a synchronous rectifier. Because the commonly used discrete Schottky rectifier is replaced with a low RDS(ON) PMOS switch, the power conversion efficiency reaches 96%. To avoid ground shift due to the high currents in the NMOS switch, two separate ground pins are used. The reference for all control functions is the GND pin. The source of the NMOS switch is connected to PGND. Both grounds must be connected on the PCB at only one point close to the GND pin. A special circuit is applied to disconnect the load from the input during shutdown of the converter. In conventional synchronous rectifier circuits, the backgate diode of the high-side PMOS is forward biased in shutdown and allows current flowing from the battery to the output. This device however uses a special circuit which takes the cathode of the backgate diode of the high-side PMOS and disconnects it from the source when theregulatorisnotenabled(EN=low). The benefit of this feature for the system design engineer is that the battery is not depleted during shutdown of the converter. No additional components have to be added to the design to make sure that the battery is disconnectedfromtheoutputoftheconverter. 10.3.3 DownRegulation In general, a boost converter only regulates output voltages which are higher than the input voltage. This device operatesdifferently.Forexample,itisabletoregulate3.0Vattheoutputwithtwofreshalkalinecellsattheinput havingatotalcellvoltageof3.2V.AnotherexampleispoweringwhiteLEDswithaforwardvoltageof3.6Vfrom a fully charged Li-Ion cell with an output voltage of 4.2 V. To control these applications properly, a down conversionmodeisimplemented. If the input voltage reaches or exceeds the output voltage, the converter changes to the conversion mode. In this mode, the control circuit changes the behavior of the rectifying PMOS. It sets the voltage drop across the PMOS as high as needed to regulate the output voltage. This means the power losses in the converter increase. This has to be taken into account for thermal consideration. The down conversion mode is automatically turned off as soon as the input voltage falls about 50 mV below the output voltage. For proper operation in down conversion mode the output voltage should not be programmed below 50% of the maximum input voltage which can be applied. 10.3.4 DeviceEnable The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In shutdown mode, the regulator stops switching, all internal control circuitry including the low-battery comparator is switched off, and the load is isolated from the input (as described in the Synchronous Rectifier Section). This also means that the output voltage can drop below the input voltage during shutdown. During start-up of the converter, the duty cycle and the peak current are limited in order to avoid high peak currents drawn from the battery. 10 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 www.ti.com SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 Feature Description (continued) 10.3.5 UndervoltageLockout An undervoltage lockout function prevents device start-up if the supply voltage on VBAT is lower than approximately 0.8 V. When in operation and the battery is being discharged, the device automatically enters the shutdown mode if the voltage on VBAT drops below approximately 0.8 V. This undervoltage lockout function is implementedinordertopreventthemalfunctioningoftheconverter. 10.3.6 SoftstartandShortCircuitProtection When the device enables, the internal startup cycle starts with the first step, the precharge phase. During precharge, the rectifying switch is turned on until the output capacitor is charged to a value close to the input voltage. The rectifying switch is current limited during that phase. The current limit increases with the output voltage. This circuit also limits the output current under short circuit conditions at the output. Figure 12 shows the typicalprechargecurrentvsoutputvoltageforspecificinputvoltages: 0.35 VBAT = 5 V 0.3 A 0.25 − nt e rr 0.2 u C VBAT = 3.6 V e g ar 0.15 h ec VBAT = 2.4 V r P 0.1 VBAT = 1.8 V 0.05 VBAT = 1.2 V 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 VO − Output Voltage − V Figure12. PrechargeandShortCircuitCurrent After charging the output capacitor to the input voltage, the device starts switching. If the input voltage is below 1.4 V the device works with a fixed duty cycle of 50% until the output voltage reaches 1.4 V. After that the duty cycle is set depending on the input output voltage ratio. Until the output voltage reaches its nominal value, the boost switch current limit is set to 40% of its nominal value to avoid high peak currents at the battery during startup. As soon as the output voltage is reached, the regulator takes control and the switch current limit is set backto100%. 10.3.7 LowBatteryDetectorCircuit—LBI/LBO The low-battery detector circuit is typically used to supervise the battery voltage and to generate an error flag when the battery voltage drops below a user-set threshold voltage. The function is active only when the device is enabled. When the device is disabled, the LBO pin is high-impedance. The switching threshold is 500 mV at LBI. During normal operation, LBO stays at high impedance when the voltage, applied at LBI, is above the threshold. ItisactivelowwhenthevoltageatLBIgoesbelow500mV. The battery voltage, at which the detection circuit switches, can be programmed with a resistive divider connected to the LBI pin. The resistive divider scales down the battery voltage to a voltage level of 500 mV, which is then compared to the LBI threshold voltage. The LBI pin has a built-in hysteresis of 10 mV. See the application section for more details about the programming of the LBI threshold. If the low-battery detection circuit is not used, the LBI pin should be connected to GND (or to VBAT) and the LBO pin can be left unconnected.DonotlettheLBIpinfloat. Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 www.ti.com Feature Description (continued) 10.3.8 Low-EMISwitch The device integrates a circuit that removes the ringing that typically appears on the SW node when the converterentersdiscontinuouscurrentmode.Inthiscase,thecurrentthroughtheinductorrampstozeroandthe rectifying PMOS switch is turned off to prevent a reverse current flowing from the output capacitors back to the battery. Due to the remaining energy that is stored in parasitic components of the semiconductor and the inductor, a ringing on the SW pin is induced. The integrated antiringing switch clamps this voltage to VBAT and thereforedampensringing. 10.4 Device Functional Modes 10.4.1 UndervoltageLockout An undervoltage lockout function prevents device start-up if the supply voltage on VBAT is lower than approximately 0.8 V. When in operation and the battery is being discharged, the device automatically enters the shutdown mode if the voltage on VBAT drops below approximately 0.8 V. This undervoltage lockout function is implementedinordertopreventthemalfunctioningoftheconverter. 10.4.2 PowerSaveMode The PS pin can be used to select different operation modes. To enable power save, PS must be set low. Power save mode is used to improve efficiency at light load. In power save mode the converter only operates when the output voltage trips below a set threshold voltage. It ramps up the output voltage with one or several pulses and goes again into power save mode once the output voltage exceeds the set threshold voltage. This power save mode can be disabled by setting the PS to VBAT. In down conversion mode, power save mode is always active andthedevicecannotbeforcedintofixedfrequencyoperationatlightloads. 10.5 Programming 10.5.1 ProgrammingtheOutputVoltage The output voltage of the TPS61020 DC-DC converter can be adjusted with an external resistor divider. The typical value of the voltage at the FB pin is 500 mV. The maximum recommended value for the output voltage is 5.5 V. The current through the resistive divider should be about 100 times greater than the current into the FB pin.ThetypicalcurrentintotheFBpinis0.01 µA,andthevoltageacrossR4istypically500mV.Basedonthose two values, the recommended value for R4 should be lower than 500 kΩ, in order to set the divider current at 1 µA or higher. Because of internal compensation circuitry the value for this resistor should be in the range of 200 kΩ. From that, the value of resistor R3, depending on the needed output voltage (V ), can be calculated using O Equation1: æ V ö æ V ö R3=R4´ç O -1÷=180kW´ç O -1÷ èVFB ø è500mV ø (1) If as an example, an output voltage of 3.3 V is needed, a 1.0-MΩ resistor should be chosen for R3. If for any reason the value for R4 is chosen significantly lower than 200 kΩ additional capacitance in parallel to R3 is recommended, in case the device shows unstable regulation of the output voltage. The required capacitance valuecanbeeasilycalculatedusingEquation2: 200kW C =20pF´( -1) parR3 R4 (2) 10.5.2 ProgrammingtheLBI/LBOThresholdVoltage The current through the resistive divider should be about 100 times greater than the current into the LBI pin. The typical current into the LBI pin is 0.01 µA, and the voltage across R2 is equal to the LBI voltage threshold that is generatedon-chip,whichhasavalueof500mV.TherecommendedvalueforR2 isthereforeintherangeof500 kΩ. From that, the value of resistor R1, depending on the desired minimum battery voltage V can be BAT, calculatedusingEquation3. V V R1=R2´( BAT -1)=390kW´( BAT -1) V 500mV LBI-threshold (3) 12 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 www.ti.com SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 Programming (continued) The output of the low battery supervisor is a simple open-drain output that goes active low if the dedicated battery voltage drops below the programmed threshold voltage on LBI. The output requires a pull up resistor with arecommendedvalueof1MΩ.Ifnotused,theLBOpincanbeleftfloatingortiedtoGND. Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 www.ti.com 11 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 11.1 Application Information The devices are designed to operate from an input voltage supply range between 0.9 V (Vin rising UVLO is 1.2 V) and 6.5 V with a maximum switching current limit up to 1.8 A. The devices operate in PWM mode for medium to heavy load conditions and in power save mode at light load currents. In PWM mode the TPS6102x converter operates with the nominal switching frequency of 600 kHz typically. As the load current decreases, the converter enters power save mode, reducing the switching frequency and minimizing the IC quiescent current to achieve high efficiency over the entire load current range. The Power Save mode can be disabled when connecting PS pintologichigh,forcingtheconvertertooperateatafixedswitchingfrequency. 11.2 Typical Application Figure13showsatypicalapplicationofTPS6102xwith1.2-Vto6.5-Vinputrangeand800-mAoutputcurrent. L1 SW VOUT VCC Boost Output C2 C3 VBAT R3 Power C1 R1 EN FB Supply LBI R4 R5 R2 PS LBO Control Output GND PGND TPS61020 Figure13. TypicalApplicationCircuitforAdjustableOutputVoltageOption 11.2.1 DesignRequirements The TPS6102x DC-DC converters are intended for systems powered by a single up to triple cell Alkaline, NiCd, NiMH battery with a typical terminal voltage between 0.9 V and 6.5 V. They can also be used in systems powered by one-cell Li-Ion or Li-Polymer with a typical voltage between 2.5 V and 4.2 V. Additionally, any other voltage source with a typical output voltage between 0.9 V and 6.5 V can power systems where the TPS6102x is used. 11.2.2 DetailedDesignProcedure 11.2.2.1 InductorSelection A boost converter normally requires two main passive components for storing energy during the conversion. A boost inductor and a storage capacitor at the output are required. To select the boost inductor, it is recommended to keep the possible peak inductor current below the current limit threshold of the power switch in the chosen configuration. For example, the current limit threshold of the TPS61029 switch is 1800 mA at an output voltage of 5 V. The highest peak current through the inductor and the switch depends on the output load, theinput(V ),andtheoutputvoltage(V ).Estimationofthemaximumaverageinductorcurrentcanbedone BAT OUT usingEquation4: V I =I ´ OUT L OUT V ´0.8 BAT (4) 14 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 www.ti.com SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 Typical Application (continued) For example, for an output current of 200 mA at 3.3 V, at least 920 mA of average current flows through the inductorataminimuminputvoltageof0.9V. The second parameter for choosing the inductor is the desired current ripple in the inductor. Normally, it is advisable to work with a ripple of less than 20% of the average inductor current. A smaller ripple reduces the magnetic hysteresis losses in the inductor, as well as output voltage ripple and EMI. But in the same way, regulation time at load changes rises. In addition, a larger inductor increases the total system costs. With those parameters,itispossibletocalculatethevaluefortheinductorbyusingEquation5: V ´(V -V ) L = BAT OUT BAT DI ´f´V L OUT (5) Parameter f is the switching frequency and ΔI is the ripple current in the inductor, i.e., 20% × I . In this example, L L the desired inductor has the value of 5.5 µH. With this calculated value and the calculated currents, it is possible to choose a suitable inductor. In typical applications a 6.8-µH inductance is recommended. The device has been optimized to operate with inductance values between 2.2 µH and 22 µH. Nevertheless operation with higher inductance values may be possible in some applications. Detailed stability analysis is then recommended. Care has to be taken that load transients and losses in the circuit can lead to higher currents as estimated in Equation 5. Also, the losses in the inductor caused by magnetic hysteresis losses and copper losses are a major parameterfortotalcircuitefficiency. ThefollowinginductorseriesfromdifferentsuppliershavebeenusedwiththeTPS6102xconverters: Table2.ListofInductors VENDOR INDUCTORSERIES CDRH4D28 Sumida CDRH5D28 7447789 WurthElektronik 744042 EPCOS B82462-G4 SD25 CooperElectronicsTechnologies SD20 11.2.2.2 InputCapacitorSelection At least a 10-µF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior of the total power supply circuit. A ceramic capacitor or a tantalum capacitor with a 100-nF ceramic capacitor in parallel,placedclosetotheIC,isrecommended. 11.2.2.3 OutputCapacitorSelection The major parameter necessary to define the output capacitor is the maximum allowed output voltage ripple of the converter. This ripple is determined by two parameters of the capacitor, the capacitance and the ESR. It is possible to calculate the minimum capacitance needed for the defined ripple, supposing that the ESR is zero, by usingEquation6: I ´(V -V ) C = OUT OUT BAT min f´DV´V OUT (6) ParameterfistheswitchingfrequencyandΔVisthemaximumallowedripple. With a chosen ripple voltage of 10 mV, a minimum capacitance of 24 µF is needed. The total ripple is larger due totheESRoftheoutputcapacitor.ThisadditionalcomponentoftheripplecanbecalculatedusingEquation7: DV =I ´R ESR OUT ESR (7) Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 www.ti.com Anadditionalrippleof16mVistheresultofusingatantalumcapacitorwithalowESRof80mΩ.Thetotalripple is the sum of the ripple caused by the capacitance and the ripple caused by the ESR of the capacitor. In this example, the total ripple is 26 mV. Additional ripple is caused by load transients. This means that the output capacitor has to completely supply the load during the charging phase of the inductor. A reasonable value of the output capacitance depends on the speed of the load transients and the load current during the load change. With the calculated minimum value of 24 µF and load transient considerations the recommended output capacitance value is in a 47 to 100 µF range. For economical reasons, this is usually a tantalum capacitor. Therefore, the control loop has been optimized for using output capacitors with an ESR of above 30 mΩ. Additionally,aceramicoutputcapacitorof2.2µFmustbeaddedinparallelwiththetantalumoutputcapacitor. The device is not designed to operate with ceramic capacitors only, unless a discrete resistor is added in series withthemtoreplicatetherequiredESR.LargeamountsoflowESRcapacitanceontheoutputcausesinstability. 11.2.3 ApplicationCurves VI= 1.2 V, RL= 33W, ge utput Voltage20 mV/div VO= 3.3 V Outoltaput V20 mV/div O nt Inductor Current200 mA/div Inductor Curre200 mA/div VRVIOL=== 3 25.65 V WV,, t - Time - 1ms/div t - Time - 1ms/div Figure14.TPS61025OutputVoltageinContinuousMode Figure15.TPS61027OutputVoltageinContinuousMode Outoltaput Vge20 ,ACmV/div VRVIOL=== 1 33.23.3 0V V,W, Outpoltagut Ve5,0 mV/divAC VRVIOL=== 3 25.65 V 0V,W, Inductor Current100 , DCmA/div Inductor Current2, 00 mA/divDC t - Time - 50ms/div t - Time - 50ms/div Figure16.TPS61025OutputVoltageinPowerSaveMode Figure17.TPS61027OutputVoltageinPowerSaveMode 16 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 www.ti.com SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 Output Current100 , DCmA/div VIVLIO=== 11 30.2.03 V mV,Ato 200 mA, Output Current1, 00 mA/divDC VIVLIO=== 13 50.60 V Vm,Ato 200 mA, Ooutput Vltage20 ,ACmV/div Outoltaput Vge2,0 mV/divAC t - Time - 2 ms/div t - Time - 2 ms/div Figure19.TPS61027LoadTransientResponse Figure18.TPS61025LoadTransientResponse VRIL== 1 3.83 WV ,to 2.4 V, VRIL== 3 2 V5 Wto, 3.6 V, Ionput Vltage500 m,ACV/div VO= 3.3 V Input oltageV5,00 mV/divAC VO= 5 V oOutput Vltage20 m,ACV/div Outputoltage V2,0 mV/divAC t - Time - 2 ms/div t - Time - 2 ms/div Figure20.TPS61025LineTransientResponse Figure21.TPS61027LineTransientResponse C C EnableV/div, D Enable, V/divD 5 5 Output Voltage1 V/di, DCv VRVIOL=== 2 33.43.3VW ,V, Inductor Current200 mA/d, DCiv Output Voltage2 V/di, DCv VRVIOL=== 3 55.60 V VW,, Inductor Current200 mA/div, DC W W t - Time - 1 ms/div VolAt tageS2 V/div, DC t - Time - 500ms/div VoltageAt S2 V/div, DC Figure22.TPS61025Start-UpAfterEnable Figure23.TPS61027Start-UpAfterEnable Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 www.ti.com 11.3 System Examples L1 SW VOUT VCC5 V 6.8µH Boost Output C2 C3 Battery VBAT 2.2µF 100µF Input C1 R1 EN FB 10µF LBI R5 R2 PS LBO LBO GND PGND TPS61027 List of Components: U1 = TPS61027DRC L1 = EPCOS B82462-G4682 C1, C2 = X7R,X5R Ceramic C3 = Low ESR Tantalum Figure24. PowerSupplySolutionforMaximumOutputPowerOperatingFromaSingleAlkalineCell L1 SW VOUT VCC5 V 6.8µH Boost Output C2 C3 Battery VBAT 2.2µF 47µF Input C1 R1 EN FB 10µF LBI R5 R2 PS LBO LBO GND PGND TPS61027 List of Components: U1 = TPS61027DRC L1 = EPCOS B82462-G4682 C1, C2 = X7R,X5R Ceramic C3 = Low ESR Tantalum Figure25. PowerSupplySolutionforMaximumOutputPowerOperatingFromaDual/TripleAlkalineCell orSingleLi-IonCell 18 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 www.ti.com SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 System Examples (continued) VCC2 10 V C5 DS1 Unregulated Auxiliary Output C6 0.1 m F 1 m F L1 6.8 m H SW VOUT C2 C3 VBCoCo1s t5 M Vain Output Battery VBAT 2.2 m F 47 m F Input C1 R1 EN 10 m F R5 LBI FB R2 PS LBO LBO GND PGND List of Components: TPS61027 U1 = TPS61027DRC1 L1 = EPCOS B82462-G4682 C3, C5, C6, = X7R,X5R Ceramic C3 = Low ESR Tantalum DS1 = BAT54S Figure26. PowerSupplySolutionWithAuxiliaryPositiveOutputVoltage VCC2-5 V C5 DS1 Unregulated C6 Auxiliary Output 1µF 0.1µF L1 SW VOUT VCC15 V 6.8µH C2 C3 Boost Main Output Battery VBAT 2.2µF 47µF Input C1 R1 EN 10µF R5 LBI FB R2 PS LBO LBO GND PGND List of Components: TPS61027 U1 = TPS61027DRC L1 = EPCOS B82462-G4682 C1, C2, C5, C6 = X7R,X5R Ceramic C3 = Low ESR Tantalum DS1 = BAT54S Figure27. PowerSupplySolutionWithAuxiliaryNegativeOutputVoltage Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 www.ti.com 12 Power Supply Recommendations This input supply should be well regulated with the rating of TPS6102x. If the input supply is located more than a few inches from the device, additional bulk capacitance may be required in addition to the ceramic bypass capacitors.Anelectrolyticortantalumcapacitorwithavalueof47 μFisatypicalchoice. 13 Layout 13.1 Layout Guidelines As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground tracks. Use a common ground node for power ground and a different one for control ground to minimize the effects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC. The most critical current path for all boost converters is from the switching FET, through the synchronous FET, then the output capacitors, and back to ground of the switching FET. Therefore, both output capacitors and their traces should be placed on the same board layer as close as possible between the IC’s VOUT and PGND pin. Especially at output voltages above 4.5 V, adding an RC snubber from the SW pin to PGND pin may assist in further reducing the parasitic inductance impact of this critical current path. Refer to the application report (SLVA255) for details of implementing a snubber. In addition, the input capacitor should be placed as close as possible between the IC’s VBAT and PGND pin. Placing the inductor close to the SW pin with a wide but short trace helps to improve efficiency and minimize EMI. To lay out the control ground, it is recommended to use short traces as well, separated from the power ground traces. This avoids ground shift problems that can occur due to superimposition of power ground current and control ground current. The recommended layout is shown inLayoutExample. 20 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 www.ti.com SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 13.2 Layout Example Top Layer Bottom Layer LBO Resistor VIA connect with Ground xxxx Feedback Feedback VIA connect with LBO, LBI, EN Resistors2 Resistors1 x Ground x VOUT x Input Output Capacitor G L F V E Capacitor xND xBO BxOU xN T V L P S P B B S W G Exposed VIN AT I ND Thermal PAD Ground xx xxx Inductor x LBI Resistor 1 LBI Resistor 2 x Figure28. PCBLayoutRecommendation 13.3 Thermal Considerations Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power- dissipationlimitsofagivencomponent. Threebasicapproachesforenhancingthermalperformancearelistedbelow. • ImprovingthepowerdissipationcapabilityofthePCBdesign • ImprovingthethermalcouplingofthecomponenttothePCB • Introducingairflowinthesystem The maximum recommended junction temperature (T ) of the TPS6102x devices is 125°C. The thermal J resistance of the 10-pin VSON 3 × 3 package (DRC) is R = 47.2°C/W, if the PowerPAD is soldered. Specified ΘJA regulator operation is assured to a maximum ambient temperature T of 85°C. Therefore, the maximum power A dissipation is about 847 mW. More power can be dissipated if the maximum ambient temperature of the applicationislower. T -T 125°C-85°C P = J(MAX) A = =847mW D(MAX) R 47.2°C/W qJA (8) Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 21 ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020,TPS61024,TPS61025,TPS61026,TPS61027,TPS61028,TPS61029 SLVS451G–SEPTEMBER2003–REVISEDDECEMBER2014 www.ti.com 14 Device and Documentation Support 14.1 Device Support 14.1.1 Third-PartyProductsDisclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONEORINCOMBINATIONWITHANYTIPRODUCTORSERVICE. 14.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table3.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY TPS61020 Clickhere Clickhere Clickhere Clickhere Clickhere TPS61024 Clickhere Clickhere Clickhere Clickhere Clickhere TPS61025 Clickhere Clickhere Clickhere Clickhere Clickhere TPS61026 Clickhere Clickhere Clickhere Clickhere Clickhere TPS61027 Clickhere Clickhere Clickhere Clickhere Clickhere TPS61028 Clickhere Clickhere Clickhere Clickhere Clickhere TPS61029 Clickhere Clickhere Clickhere Clickhere Clickhere 14.3 Trademarks PowerPADisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 14.4 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 14.5 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 15 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 22 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPS61020DRCR ACTIVE VSON DRC 10 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 BDR & no Sb/Br) TPS61020DRCRG4 ACTIVE VSON DRC 10 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 BDR & no Sb/Br) TPS61024DRCR ACTIVE VSON DRC 10 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 BDS & no Sb/Br) TPS61025DRCR ACTIVE VSON DRC 10 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 BDT & no Sb/Br) TPS61026DRCR ACTIVE VSON DRC 10 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 BRD & no Sb/Br) TPS61026DRCT ACTIVE VSON DRC 10 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 BRD & no Sb/Br) TPS61026DRCTG4 ACTIVE VSON DRC 10 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 BRD & no Sb/Br) TPS61027DRCR ACTIVE VSON DRC 10 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 BDU & no Sb/Br) TPS61027DRCRSY ACTIVE VSON DRC 10 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 BDU & no Sb/Br) TPS61028DRCR ACTIVE VSON DRC 10 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 BNE & no Sb/Br) TPS61029DRCR ACTIVE VSON DRC 10 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 BRF & no Sb/Br) TPS61029DRCT ACTIVE VSON DRC 10 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 BRF & no Sb/Br) TPS61029DRCTG4 ACTIVE VSON DRC 10 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 BRF & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPS61029 : •Automotive: TPS61029-Q1 NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 4-Apr-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS61020DRCR VSON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS61020DRCR VSON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS61024DRCR VSON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS61025DRCR VSON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS61025DRCR VSON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS61026DRCR VSON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS61026DRCT VSON DRC 10 250 180.0 12.5 3.3 3.3 1.1 8.0 12.0 Q2 TPS61027DRCR VSON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS61028DRCR VSON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS61029DRCR VSON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS61029DRCT VSON DRC 10 250 180.0 12.5 3.3 3.3 1.1 8.0 12.0 Q2 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 4-Apr-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS61020DRCR VSON DRC 10 3000 338.0 355.0 50.0 TPS61020DRCR VSON DRC 10 3000 367.0 367.0 35.0 TPS61024DRCR VSON DRC 10 3000 367.0 367.0 35.0 TPS61025DRCR VSON DRC 10 3000 338.0 355.0 50.0 TPS61025DRCR VSON DRC 10 3000 367.0 367.0 35.0 TPS61026DRCR VSON DRC 10 3000 338.0 355.0 50.0 TPS61026DRCT VSON DRC 10 250 205.0 200.0 33.0 TPS61027DRCR VSON DRC 10 3000 338.0 355.0 50.0 TPS61028DRCR VSON DRC 10 3000 338.0 355.0 50.0 TPS61029DRCR VSON DRC 10 3000 338.0 355.0 50.0 TPS61029DRCT VSON DRC 10 250 205.0 200.0 33.0 PackMaterials-Page2

GENERIC PACKAGE VIEW DRC 10 VSON - 1 mm max height PLASTIC SMALL OUTLINE - NO LEAD Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4204102-3/M

PACKAGE OUTLINE DRC0010J VSON - 1 mm max height SCALE 4.000 PLASTIC SMALL OUTLINE - NO LEAD 3.1 B A 2.9 PIN 1 INDEX AREA 3.1 2.9 1.0 C 0.8 SEATING PLANE 0.05 0.00 0.08 C 1.65 0.1 2X (0.5) (0.2) TYP EXPOSED 4X (0.25) THERMAL PAD 5 6 2X 11 SYMM 2 2.4 0.1 10 1 8X 0.5 0.30 10X 0.18 PIN 1 ID SYMM 0.1 C A B (OPTIONAL) 0.5 0.05 C 10X 0.3 4218878/B 07/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. www.ti.com

EXAMPLE BOARD LAYOUT DRC0010J VSON - 1 mm max height PLASTIC SMALL OUTLINE - NO LEAD (1.65) (0.5) 10X (0.6) 1 10 10X (0.24) 11 SYMM (2.4) (3.4) (0.95) 8X (0.5) 6 5 (R0.05) TYP ( 0.2) VIA TYP (0.25) (0.575) SYMM (2.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:20X 0.07 MIN 0.07 MAX EXPOSED METAL ALL AROUND ALL AROUND EXPOSED METAL SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4218878/B 07/2018 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com

EXAMPLE STENCIL DESIGN DRC0010J VSON - 1 mm max height PLASTIC SMALL OUTLINE - NO LEAD 2X (1.5) (0.5) SYMM EXPOSED METAL 11 TYP 10X (0.6) 1 10 (1.53) 10X (0.24) 2X (1.06) SYMM (0.63) 8X (0.5) 6 5 (R0.05) TYP 4X (0.34) 4X (0.25) (2.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 11: 80% PRINTED SOLDER COVERAGE BY AREA SCALE:25X 4218878/B 07/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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