This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com.

PACKAGE MATERIALS INFORMATION www.ti.com 27-Jul-2013 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS51610IRHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 TPS51610IRHBT VQFN RHB 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 TPS51610RHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 TPS51610RHBT VQFN RHB 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 27-Jul-2013 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS51610IRHBR VQFN RHB 32 3000 367.0 367.0 35.0 TPS51610IRHBT VQFN RHB 32 250 210.0 185.0 35.0 TPS51610RHBR VQFN RHB 32 3000 367.0 367.0 35.0 TPS51610RHBT VQFN RHB 32 250 210.0 185.0 35.0 PackMaterials-Page2

GENERIC PACKAGE VIEW RHB 32 VQFN - 1 mm max height 5 x 5, 0.5 mm pitch PLASTIC QUAD FLATPACK - NO LEAD Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4224745/A www.ti.com

PACKAGE OUTLINE RHB0032E VQFN - 1 mm max height SCALE 3.000 PLASTIC QUAD FLATPACK - NO LEAD A 5.1 B 4.9 PIN 1 INDEX AREA 5.1 (0.1) 4.9 SIDE WALL DETAIL OPTIONAL ME20.000TAL THICKNESS C 1 MAX SEATING PLANE 0.05 0.00 0.08 C 2X 3.5 3.45 0.1 (0.2) TYP 9 16 EXPOSED THERMAL PAD 28X 0.5 8 17 SEE SIDE WALL DETAIL 2X 33 SYMM 3.5 0.3 32X 0.2 24 0.1 C A B 1 0.05 C 32 25 PIN 1 ID SYMM (OPTIONAL) 0.5 32X 0.3 4223442/B 08/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com

EXAMPLE BOARD LAYOUT RHB0032E VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD ( 3.45) SYMM 32 25 32X (0.6) 1 24 32X (0.25) (1.475) 28X (0.5) 33 SYMM (4.8) ( 0.2) TYP VIA 8 17 (R0.05) TYP 9 16 (1.475) (4.8) LAND PATTERN EXAMPLE SCALE:18X 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND SOLDER MASK METAL OPENING SOLDER MASK METAL UNDER OPENING SOLDER MASK NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4223442/B 08/2019 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com

EXAMPLE STENCIL DESIGN RHB0032E VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD 4X ( 1.49) (R0.05) TYP (0.845) 32 25 32X (0.6) 1 24 32X (0.25) 28X (0.5) (0.845) SYMM 33 (4.8) 8 17 METAL TYP 9 16 SYMM (4.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 33: 75% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X 4223442/B 08/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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