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TPS3838K33DBVR产品简介:
ICGOO电子元器件商城为您提供TPS3838K33DBVR由Texas Instruments设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 TPS3838K33DBVR价格参考。Texas InstrumentsTPS3838K33DBVR封装/规格:PMIC - 监控器, 开路漏极或开路集电极 监控器 1 通道 SOT-23-5。您可以下载TPS3838K33DBVR参考资料、Datasheet数据手册功能说明书,资料中有TPS3838K33DBVR 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | 集成电路 (IC)半导体 |
描述 | IC 2.93V NANOPWR MON SOT23-5监控电路 220nA w/ 10ms/200ms Select delay time |
产品分类 | |
品牌 | Texas Instruments |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 电源管理 IC,监控电路,Texas Instruments TPS3838K33DBVR- |
NumberofInputsMonitored | 1 Input |
数据手册 | |
产品型号 | TPS3838K33DBVR |
PCN设计/规格 | |
产品种类 | 监控电路 |
人工复位 | Manual Reset |
供应商器件封装 | SOT-23-5 |
其它名称 | 296-26956-1 |
功率失效检测 | No |
包装 | 剪切带 (CT) |
单位重量 | 13 mg |
受监控电压数 | 1 |
商标 | Texas Instruments |
复位 | 低有效 |
复位超时 | 最小为 100 ms |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
封装 | Reel |
封装/外壳 | SC-74A,SOT-753 |
封装/箱体 | SOT-23-5 |
工作温度 | -40°C ~ 85°C |
工作电源电流 | 0.25 uA |
工厂包装数量 | 3000 |
最大功率耗散 | 437 mW |
最大工作温度 | + 85 C |
最小工作温度 | - 40 C |
标准包装 | 1 |
欠电压阈值 | 2.93 V |
电压-阈值 | 2.93V |
电池备用开关 | No Backup |
电源电压-最大 | 6 V |
电源电压-最小 | 1.6 V |
监视器 | No Watchdog |
类型 | 简单复位/加电复位 |
系列 | TPS3838K33 |
芯片启用信号 | No Chip Enable |
被监测输入数 | 1 Input |
输出 | 开路漏极或开路集电极 |
输出类型 | Open Collector / Drain |
过电压阈值 | 2.99 V |
重置延迟时间 | 10 ms, 200 ms |
阈值电压 | 1.6 V to 6 V |
TPS3836 TPS3837 TPS3838 www.ti.com SLVS292E–JUNE2000–REVISEDOCTOBER2010 NanoPower Supervisory Circuits CheckforSamples:TPS3836,TPS3837,TPS3838 FEATURES DESCRIPTION 1 • SupplyCurrent:220nA(typical) The TPS3836, TPS3837, and TPS3838 families of 23 • PrecisionSupplyVoltageSupervisionRange: supervisory circuits provide circuit initialization and 1.8V,2.5V,3.0V,and3.3V timing supervision, primarily for DSP and processor-basedsystems. • Power-OnResetGeneratorWithSelectable DelayTime:10msor200ms During power-on, RESET is asserted when the supply voltage V becomes higher than 1.1 V. • Push/PullRESETOutput(TPS3836),Push/Pull DD Thereafter, the supervisory circuit monitors V and RESETOutput(TPS3837),orOpen-Drain DD keeps the RESET output active as long as V RESETOutput(TPS3838) DD remains below the threshold voltage of V . An IT • ManualReset internal timer delays the return of the output to the • SOT23-5and2x2SON-6Packages inactive state (high) to ensure proper system reset. The delay time starts after V has risen above the • TemperatureRange:–40°Cto+85°C DD thresholdvoltageV . IT APPLICATIONS When CT is connected to GND, a fixed delay time of typical 10 ms is asserted. When connected to V , • ApplicationsUsingLow-PowerDSPs, DD the delay time is typically 200 ms. When the supply Microcontrollers,orMicroprocessors voltage drops below the threshold voltage V , the • Portable-andBattery-PoweredEquipment IT output becomes active (low) again. All the devices of • IntelligentInstruments this family have a fixed-sense threshold voltage (V ) IT • WirelessCommunicationSystems setbyaninternalvoltagedivider. • NotebookComputers The TPS3836 has an active-low, push-pull RESET • AutomotiveSystems output. The TPS3837 has an active-high, push-pull • ApplicationsUsingtheMSP430™ RESET, and the TPS3838 integrates an active-low, blank open-drain RESET output. The product spectrum is designed for supply voltages of 1.8 V, 2.5 V, 3.0 V, blank and 3.3 V. The circuits are available in either a TPS3838DRV SOT23-5 or 2x2 SON-6 package. The TPS3836, 2mm x 2mm SON-6 TPS3837, and TPS3838 families are characterized (TOP VIEW) for operation over a temperature range of –40°C to V 1 6 CT +85°C. DD GND 2 GND 5 N/C(1) RESET 3 4 MR TPS3836K33 MSP430 V V TPS3836, TPS3838 TPS3837 DD CC DBV PACKAGE DBV PACKAGE (TOP VIEW) (TOP VIEW) CT Lithium RESET RST Battery CT 1 5 VDD CT 1 5 VDD MR 3.6 V GND 2 GND 2 T GND VSS MR 3 4 RESET MR 3 4 RESET (1) N/C:Notconnected. Typical Application Circuit 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. MSP430isatrademarkofTexasInstruments. 2 Allothertrademarksarethepropertyoftheirrespectiveowners. 3 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2000–2010,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.
TPS3836 TPS3837 TPS3838 SLVS292E–JUNE2000–REVISEDOCTOBER2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. Table1. ORDERINGINFORMATION(1) PRODUCT NOMINALSUPPLYVOLTAGE THRESHOLDVOLTAGE(V )(2) IT TPS383xE18 1.8V 1.71V TPS383xJ25 2.5V 2.25V TPS383xH30 3.0V 2.79V TPS383xL30 3.0V 2.64V TPS383xK33 3.3V 2.93V (1) ForthemostcurrentpackageandorderinginformationseethePackageOptionAddendumattheendofthisdocument,orseetheTI websiteatwww.ti.com. (2) Customthresholdvoltagesareavailable.Minimumorderquantitiesapply.Contactfactoryfordetailsandavailability. ABSOLUTE MAXIMUM RATINGS(1) Overoperatingfree-airtemperaturerange,unlessotherwisenoted. TPS383xx UNIT Supplyvoltage,V (2) 7 V DD Allotherpins(2) (3) –0.3to7 V Maximumlowoutputcurrent,I 5 mA OL Maximumhighoutputcurrent,I –5 mA OH Inputclampcurrent,I (V <0orV >V ) ±10 mA IK I I DD Outputclampcurrent,I (V <0orV >V ) ±10 mA OK O O DD Continuoustotalpowerdissipation SeeDissipationRatingsTable Operatingtemperaturerange,T –40to+85 °C A Storagetemperaturerange,T –65to+150 °C STG Solderingtemperature +260 °C (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagevaluesarewithrespecttoGND. (3) IfRESETorRESETarepulledaboveV ,theinternalESDstructurewillpresentaneffective1.5kΩresistorbetweenthesepins, DD causingleakagecurrenttoflowintotheRESETorRESETpin. DISSIPATION RATINGS T <+25°C DERATINGFACTOR T =+70°C T =+85°C A A A PACKAGE POWERRATING ABOVET =+25°C POWERRATING POWERRATING A DBV 437mW 3.5mW/°C 280mW 227mW DRVLow-K(1) 715mW 7.1mW/°C 395mW 285mW DRVHigh-K(2) 1540mW 15.4mW/°C 845mW 615mW (1) TheJEDEClow-K(1s)boardusedtoderivethisdatawasa3inx3in,two-layerboardwith2-ouncecoppertracesontopoftheboard. (2) TheJEDEChigh-K(2s2p)boardusedtoderivethisdatawasa3inx3in,multilayerboardwith1-ounceinternalpowerandground planesand2-ouncecoppertracesonthetopandbottomoftheboard. 2 SubmitDocumentationFeedback Copyright©2000–2010,TexasInstrumentsIncorporated
TPS3836 TPS3837 TPS3838 www.ti.com SLVS292E–JUNE2000–REVISEDOCTOBER2010 RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT Supplyvoltage,V 1.6 6 V DD Voltagerange,CT,MR,RESET,andRESETpins 0 V +0.3 V DD High-levelinputvoltage,V 0.7×V V IH DD Low-levelinputvoltage,V 0.3×V V IL DD InputtransitionriseandfallrateatMR,Δt/ΔV 100 ns/V Operatingtemperaturerange,T –40 +85 °C A V Pull-up Pull-upresistorvalue,RESETpin(TPS3838only) Ω 50μA ELECTRICAL CHARACTERISTICS Overrecommendedoperatingconditions,unlessotherwisenoted. PARAMETER TESTCONDITIONS MIN TYP MAX UNIT RESET V =3.3V,I =–2mA DD OH (TPS3836) V =6V,I =–3mA DD OH V High-leveloutputvoltage 0.8×V V OH DD RESET V =1.8V,I =–1mA DD OH (TPS3837) V =3.3V,I =–2mA DD OL RESET V =1.8V,I =1mA DD OL (TPS3836, TPS3838) VDD=3.3V,IOL=2mA V Low-leveloutputvoltage 0.4 V OL RESET V =3.3V,I =2mA DD OL (TPS3837) V =6V,I =3mA DD OL TPS3836, V ≥1.1V,I =50mA 0.2 V Power-upresetvoltage(1) TPS3838 DD OL TPS3837 V ≥1.1V,I =–50mA 0.8×V V DD OL DD TPS383xE18 1.66 1.71 1.74 TPS383xJ25 2.18 2.25 2.29 Negative-goinginputthreshold VIT voltage(2) TPS383xH30 TA=–40°Cto+85°C 2.70 2.79 2.85 V TPS383xL30 2.56 2.64 2.69 TPS383xK33 2.84 2.93 2.99 1.7V<V <2.5V 30 IT V HysteresisatV input 2.5V<V <3.5V 40 mV HYS DD IT 3.5V<V <5V 50 IT MR (3) MR=0.7×V ,V =6V –40 –60 –100 mA DD DD I High-levelinputcurrent IH CT CT=V =6V –25 +25 nA DD MR (3) MR=0V,V =6V –130 –200 –340 mA DD I Low-levelinputcurrent IL CT CT=0V,V =6V –25 +25 nA DD I High-leveloutputcurrent TPS3838 V =V +0.2V,V =V 25 nA OH DD IT OH DD V >V ,V <3V 220 400 DD IT DD nA I Supplycurrent V >V ,V >3V 250 450 DD DD IT DD V <V 10 15 mA DD IT Internalpull-upresistoratMR 30 kΩ C InputcapacitanceatMRandCT V =0VtoV 5 pF I I DD (1) ThelowestvoltageatwhichtheRESEToutputbecomesactive.t ,V ≥15ms/V. R DD (2) Toensurebeststabilityofthethresholdvoltage,abypasscapacitor(ceramic,0.1mF)shouldbeplacednearthesupplyterminal. (3) Ifmanualresetisunused,MRshouldbeconnectedtoV tominimizecurrentconsumption. DD Copyright©2000–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3
TPS3836 TPS3837 TPS3838 SLVS292E–JUNE2000–REVISEDOCTOBER2010 www.ti.com SWITCHING CHARACTERISTICS AtT =+25°C,R =1MΩ,andC =50pF,unlessotherwisenoted. A L L PARAMETER TESTCONDITIONS MIN TYP MAX UNIT VDD≥VIT+0.2V,MR=0.7×VDD, 5 10 15 CT=GND,(SeeTimingDiagram) tD Delaytime ms VDD≥VIT+0.2V,MR=0.7×VDD, 100 200 300 CT=VDD,(SeeTimingDiagram) Propagation(delay)time, VDDtoRESET VIL=VIT–0.2V,VIH=VIT+0.2V 10 tPHL high-to-low-leveloutput dTePlSay38(T38P)S3836, VIL=1.6V 50 ms tPLH Plorwo-ptoa-ghaigtiohn-le(vdeellaoyu)tptiumte, VdeDlDayto(TRPESS3E8T37) VIL=VIT–0V.2ILV=,1V.I6HV=VIT+0.2V 1500 ms MRtoRESET tPHL Phirgohp-atog-alotiwon-le(vdeellaoyu)tptiumte, dTePlSay38(T38P)S3836, VDD≥VIT+0=.20V.7,V×ILV=DD0.3×VDD,VIL 0.1 ms tPLH Plorwo-ptoa-ghaigtiohn-le(vdeellaoyu)tptiumte, MdeRlatyo(RTPESS3E8T37) VDD≥VITV+IL0=.20V.7,V×ILV=DD0.3×VDD, 0.1 ms TIMING REQUIREMENTS AtT =+25°C,R =1MΩ,andC =50pF,unlessotherwisenoted. A L L PARAMETER TESTCONDITIONS MIN TYP MAX UNIT atV V =V +0.2V,V =V –0.2V 6 DD IH IT IL IT t Pulsewidth ms W atMR V ≥V +0.2V,V =0.3×V ,V =0.7×V 1 DD IT IL DD IH DD 4 SubmitDocumentationFeedback Copyright©2000–2010,TexasInstrumentsIncorporated
TPS3836 TPS3837 TPS3838 www.ti.com SLVS292E–JUNE2000–REVISEDOCTOBER2010 FUNCTIONAL BLOCK DIAGRAM V DD R3 CT MR R1 C1 ResetLogic RESET(TPS3837-Push-Pull) + andTimer S1 RESET(TPS3836-Push-Pull – TPS3838-Open-Drain) R2 C2 S2 S3 Band-Gap Reference C3 Refresh Timer GND FUNCTIONTABLE MR V >V RESET (1) RESET(2) DD IT L 0 L H L 1 L H H 0 L H H 1 H L (1) TPS3836andTPS3838. (2) TPS3837. Copyright©2000–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5
TPS3836 TPS3837 TPS3838 SLVS292E–JUNE2000–REVISEDOCTOBER2010 www.ti.com TIMING DIAGRAM A B C D E F G V DD V IT < 1.1 V t MR t RESET t Undefined tD tD tD Undefined Output Output TYPICAL CHARACTERISTICS SUPPLYCURRENT MANUALRESETCURRENT vs vs SUPPLYVOLTAGE MANUALRESETVOLTAGE 10 100 MR= Open V = 6 V DD CT = GND CT = GND T = 85°C A 0 8 A m T =-40°C A A - m nt rent- 6 TA= 25°C Curre -100 TA= 0°C y Cur TA= 0°C eset -200 uppl 4 ual R TA= 25°C S- an -300 D T =-40°C M D A - T = 85°C I 2 MR A I -400 0 -500 0 2 4 6 -2 0 2 4 6 V -Supply Voltage-V V -Manual Reset Voltage-V DD MR Figure1. Figure2. 6 SubmitDocumentationFeedback Copyright©2000–2010,TexasInstrumentsIncorporated
TPS3836 TPS3837 TPS3838 www.ti.com SLVS292E–JUNE2000–REVISEDOCTOBER2010 TYPICAL CHARACTERISTICS (continued) LOW-LEVELOUTPUTVOLTAGE HIGH-LEVELOUTPUTVOLTAGE vs vs LOW-LEVELOUTPUTCURRENT HIGH-LEVELOUTPUTCURRENT 2.0 2.0 V = 2 V V = 2 V DD DD MR= OPEN MR= OPEN V CT = GND V CT = GND - - ge 1.5 ge 1.5 a a Volt Volt TA= 85°C utput TA= 25°C utput TA= 25°C O 1.0 O 1.0 el el v v e e w-L TA= 85°C h-L TA= 0°C Lo TA= 0°C Hig 0.5 0.5 - - L H VO TA=-40°C VO TA=-40°C 0 0 0 1 2 3 4 5 6 7 0 1 2 3 4 5 I -Low-Level Output Current-mA I - High-Level Output Current-mA OL OH Figure3. Figure4. NORMALIZEDRESETTHRESHOLDVOLTAGE MINIMUMPULSEDURATIONATV DD VS vs FREE-AIRTEMPERATURE V THRESHOLDOVERDRIVE DD 1.001 22 CT = GND MR= Open MR= Open 20 CT = GND V - 1.000 s TA= +25°C e m 18 g - old Volta 0.999 n at VDD 1164 h o es ati 12 hr 0.998 ur d Reset T 0.997 m Pulse D 108 ze u 6 mali nim 4 r 0.996 Mi o N 2 0.995 0 -40 -15 10 35 60 85 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 T - Free-Air Temperature-°C A V -Threshold Overdrive-V DD Figure5. Figure6. Copyright©2000–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7
PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPS3836E18DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDNI & no Sb/Br) TPS3836E18DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDNI & no Sb/Br) TPS3836E18DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDNI & no Sb/Br) TPS3836H30DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PHRI & no Sb/Br) TPS3836H30DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PHRI & no Sb/Br) TPS3836J25DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDSI & no Sb/Br) TPS3836J25DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDSI & no Sb/Br) TPS3836K33DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDTI & no Sb/Br) TPS3836K33DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDTI & no Sb/Br) TPS3836K33DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDTI & no Sb/Br) TPS3836K33DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDTI & no Sb/Br) TPS3836L30DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCAI & no Sb/Br) TPS3836L30DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCAI & no Sb/Br) TPS3836L30DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCAI & no Sb/Br) TPS3836L30DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCAI & no Sb/Br) TPS3837E18DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDOI & no Sb/Br) TPS3837E18DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDOI & no Sb/Br) Addendum-Page 1
PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPS3837J25DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDRI & no Sb/Br) TPS3837J25DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDRI & no Sb/Br) TPS3837K33DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDUI & no Sb/Br) TPS3837K33DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDUI & no Sb/Br) TPS3837K33DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDUI & no Sb/Br) TPS3837L30DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCBI & no Sb/Br) TPS3837L30DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCBI & no Sb/Br) TPS3837L30DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCBI & no Sb/Br) TPS3838E18DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDQI & no Sb/Br) TPS3838E18DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDQI & no Sb/Br) TPS3838E18DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDQI & no Sb/Br) TPS3838E18DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDQI & no Sb/Br) TPS3838J25DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDPI & no Sb/Br) TPS3838J25DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDPI & no Sb/Br) TPS3838J25DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDPI & no Sb/Br) TPS3838J25DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDPI & no Sb/Br) TPS3838K33DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDVI & no Sb/Br) TPS3838K33DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDVI & no Sb/Br) Addendum-Page 2
PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPS3838K33DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDVI & no Sb/Br) TPS3838K33DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PDVI & no Sb/Br) TPS3838K33DRVR ACTIVE WSON DRV 6 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 CCS & no Sb/Br) TPS3838K33DRVT ACTIVE WSON DRV 6 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 CCS & no Sb/Br) TPS3838L30DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCCI & no Sb/Br) TPS3838L30DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCCI & no Sb/Br) TPS3838L30DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCCI & no Sb/Br) TPS3838L30DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCCI & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 3
PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPS3836, TPS3838 : •Automotive: TPS3836-Q1, TPS3838-Q1 •Enhanced Product: TPS3836-EP NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects •Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 4
PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS3836E18DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836E18DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836H30DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836H30DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836J25DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836J25DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836K33DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836K33DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836L30DBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TPS3836L30DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3837E18DBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3837J25DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3837J25DBVT SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TPS3837K33DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3837K33DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3837L30DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3837L30DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3838E18DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 PackMaterials-Page1
PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2018 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS3838E18DBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3838J25DBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3838J25DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3838J25DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3838J25DBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3838K33DBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3838K33DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3838K33DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3838K33DBVT SOT-23 DBV 5 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3838K33DRVR WSON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS3838K33DRVT WSON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS3838L30DBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3838L30DBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TPS3838L30DBVT SOT-23 DBV 5 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3838L30DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS3836E18DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3836E18DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 PackMaterials-Page2
PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2018 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS3836H30DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3836H30DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3836J25DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3836J25DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3836K33DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3836K33DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3836L30DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3836L30DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3837E18DBVT SOT-23 DBV 5 250 203.0 203.0 35.0 TPS3837J25DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3837J25DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3837K33DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3837K33DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3837L30DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3837L30DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3838E18DBVR SOT-23 DBV 5 3000 203.0 203.0 35.0 TPS3838E18DBVT SOT-23 DBV 5 250 203.0 203.0 35.0 TPS3838J25DBVR SOT-23 DBV 5 3000 203.0 203.0 35.0 TPS3838J25DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3838J25DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3838J25DBVT SOT-23 DBV 5 250 203.0 203.0 35.0 TPS3838K33DBVR SOT-23 DBV 5 3000 203.0 203.0 35.0 TPS3838K33DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3838K33DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3838K33DBVT SOT-23 DBV 5 250 203.0 203.0 35.0 TPS3838K33DRVR WSON DRV 6 3000 203.0 203.0 35.0 TPS3838K33DRVT WSON DRV 6 250 203.0 203.0 35.0 TPS3838L30DBVR SOT-23 DBV 5 3000 203.0 203.0 35.0 TPS3838L30DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3838L30DBVT SOT-23 DBV 5 250 203.0 203.0 35.0 TPS3838L30DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 PackMaterials-Page3
GENERIC PACKAGE VIEW DRV 6 WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4206925/F
PACKAGE OUTLINE DRV0006A WSON - 0.8 mm max height SCALE 5.500 PLASTIC SMALL OUTLINE - NO LEAD B 2.1 A 1.9 PIN 1 INDEX AREA 2.1 1.9 0.8 C 0.7 SEATING PLANE 0.08 C (0.2) TYP 1 0.1 0.05 EXPOSED 0.00 THERMAL PAD 3 4 2X 7 1.3 1.6 0.1 6 1 4X 0.65 0.35 6X PIN 1 ID 0.3 0.25 6X (OPTIONAL) 0.2 0.1 C A B 0.05 C 4222173/B 04/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com
EXAMPLE BOARD LAYOUT DRV0006A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 6X (0.45) (1) 1 7 6X (0.3) 6 SYMM (1.6) (1.1) 4X (0.65) 4 3 (R0.05) TYP SYMM ( 0.2) VIA (1.95) TYP LAND PATTERN EXAMPLE SCALE:25X 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK (PREFERRED) DEFINED SOLDER MASK DETAILS 4222173/B 04/2018 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown. www.ti.com
EXAMPLE STENCIL DESIGN DRV0006A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD SYMM 6X (0.45) METAL 1 7 6X (0.3) 6 (0.45) SYMM 4X (0.65) (0.7) 4 3 (R0.05) TYP (1) (1.95) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD #7 88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:30X 4222173/B 04/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com
PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 B A 1.45 MAX PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/D 11/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com
EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/D 11/2018 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com
EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/D 11/2018 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com
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