Product Order Technical Tools & Support & Folder Now Documents Software Community TPS3836,TPS3837,TPS3838 SLVS292F–JUNE2000–REVISEDSEPTEMBER2019 TPS383x Nano Power Voltage Supervisor With Selectable Reset Delay 1 Features 3 Description • Supplycurrent:220nA(typical) The TPS3836, TPS3837, and TPS3838 device 1 families of supervisory circuits provide circuit • Precisionsupplyvoltagesupervisionrange: initialization and timing supervision, primarily for 1.8V,2.5V,3.0V,and3.3V digital signal processors (DSP) and processor-based • Power-onresetgeneratorwithselectabledelay systems. time:10msor200ms During power-on, RESET is asserted when the • PushandpullRESEToutput(TPS3836), supply voltage V becomes higher than 1.1 V. DD PushandpullRESEToutput(TPS3837),oropen- Thereafter, the supervisory circuit monitors V and DD drainRESEToutput(TPS3838) keeps the RESET output active as long as V DD • Manualreset remains below the threshold voltage of VIT. An internal timer delays the return of the output to the • 5-pinSOT23and2-mm×2-mm,6-pinSON inactive state (high) to ensure proper system reset. packages The delay time starts after V rises above the DD • Temperaturerange:–40°Cto85°C thresholdvoltageV . IT When CT is connected to GND, a fixed delay time of 2 Applications typically 10 ms is asserted. When connected to V , DD • Applicationsusinglow-powerDSPs, the delay time is typically 200 ms. When the supply microcontrollers,ormicroprocessors voltage drops below the threshold voltage VIT, the output becomes active (low) again. All the devices of • Portable-andbattery-poweredequipment this family have a fixed-sense threshold voltage (V ) IT • Intelligentinstruments setbyaninternalvoltagedivider. • Wirelesscommunicationsystems The TPS3836 has an active-low, push-pull RESET • Notebookcomputers output. The TPS3837 has an active-high, push-pull • Applicationsusingthe MSP430™ RESET, and the TPS3838 integrates an active-low, open-drain RESET output. The product spectrum is • Forautomotivesystems,seeTPS383x-Q1 designed for supply voltages of 1.8 V, 2.5 V, 3.0 V, and 3.3 V. The circuits are available in either a SOT23-5 or a 2-mm × 2-mm SON-6 package. The TPS3836, TPS3837, and TPS3838 families are characterized for operation over a temperature range of–40°Cto85°C. DeviceInformation(1) PARTNUMBER PACKAGE BODYSIZE(NOM) WSON(6) 2.00mm×2.00mm TPS383x SOT(5) 2.90mm×1.60mm (1) For all available packages, see the orderable addendum at theendofthedatasheet. TypicalApplicationCircuit TPS3836K33 MSP430 VDD VCC CT Lithium RESET RST Battery 3.6 V MR T GND VSS 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

TPS3836,TPS3837,TPS3838 SLVS292F–JUNE2000–REVISEDSEPTEMBER2019 www.ti.com Table of Contents 1 Features.................................................................. 1 9.1 Overview...................................................................9 2 Applications........................................................... 1 9.2 FunctionalBlockDiagram.........................................9 3 Description............................................................. 1 9.3 FeatureDescription...................................................9 9.4 DeviceFunctionalModes........................................10 4 RevisionHistory..................................................... 2 10 ApplicationandImplementation........................ 11 5 DeviceComparisonTable..................................... 3 10.1 ApplicationInformation..........................................11 6 PinConfigurationandFunctions......................... 3 10.2 TypicalApplication ...............................................11 7 Specifications......................................................... 4 11 PowerSupplyRecommendations..................... 13 7.1 AbsoluteMaximumRatings......................................4 12 Layout................................................................... 13 7.2 DissipationRatings ..................................................4 12.1 LayoutGuidelines.................................................13 7.3 ESDRatings..............................................................4 12.2 LayoutExample....................................................13 7.4 RecommendedOperatingConditions.......................4 13 DeviceandDocumentationSupport................. 14 7.5 ThermalInformation..................................................5 7.6 ElectricalCharacteristics...........................................5 13.1 RelatedLinks........................................................14 7.7 TimingRequirements................................................6 13.2 ReceivingNotificationofDocumentationUpdates14 7.8 SwitchingCharacteristics..........................................6 13.3 SupportResources...............................................14 7.9 TypicalCharacteristics..............................................7 13.4 Trademarks...........................................................14 13.5 ElectrostaticDischargeCaution............................14 8 ParameterMeasurementInformation..................8 13.6 Glossary................................................................14 8.1 TimingDiagram.........................................................8 14 Mechanical,Packaging,andOrderable 9 DetailedDescription.............................................. 9 Information........................................................... 14 4 Revision History ChangesfromRevisionE(October2010)toRevisionF Page • Changedformattomeetlatestdatasheetstandards;changeddatasheettitle,addedDeviceInformationtable,Pin ConfigurationsandFunctions,ParameterMeasurementInformation,DetailedDescription,Applicationand Implementation,PowerSupplyRecommendations,Layout,ReceivingNotificationofDocumentationUpdates,and SupportResourcessections.Movedexistingsectionsintothenewformat.......................................................................... 1 • Changed2x2WSONto2-mm×2-mmWSONinfifthFeaturesbullet.................................................................................. 1 • Changedlinktoautomotivedatasheet.................................................................................................................................. 1 • AddedfullacronymnameforDSPtofirstsentenceofDescriptionsection .......................................................................... 1 • Changed2x2WSONto2-mm×2-mmWSONinlastparagraphofDescriptionsection...................................................... 1 • ChangedOrderingInformationtabletoDeviceComparisonTable........................................................................................ 3 • DeletedsolderingtemperatureparameterfromAbsoluteMaximumRatingstable............................................................... 4 • MovedstoragetemperaturerangetoAbsoluteMaximumRatingstable............................................................................... 4 • ChangedHandlingRatingstabletoESDRatings.................................................................................................................. 4 • AddedThermalInformationtable........................................................................................................................................... 5 • Movedpropagation(delay)timemaximumvaluestotheTYPcolumn ................................................................................. 6 • Changedpropagationtimesforthehigh-to-low-leveloutputandlow-to-high-leveloutputfrom:0.1µsto:0.3µs................ 6 2 SubmitDocumentationFeedback Copyright©2000–2019,TexasInstrumentsIncorporated ProductFolderLinks:TPS3836 TPS3837 TPS3838

TPS3836,TPS3837,TPS3838 www.ti.com SLVS292F–JUNE2000–REVISEDSEPTEMBER2019 5 Device Comparison Table(1) PRODUCT NOMINALSUPPLYVOLTAGE THRESHOLDVOLTAGE(V )(1) IT TPS383xE18 1.8V 1.71V TPS383xJ25 2.5V 2.25V TPS383xH30 3.0V 2.79V TPS383xL30 3.0V 2.64V TPS383xK33 3.3V 2.93V (1) ForthemostcurrentpackageandorderinginformationseethePackageOptionAddendumattheendofthisdocument,orseetheTI websiteatwww.ti.com. (1) Customthresholdvoltagesareavailable.Minimumorderquantitiesapply.Contactfactoryfordetailsandavailability. 6 Pin Configuration and Functions TPS3838DRVPackage 6-PinWSON (TopView) V 1 6 CT DD GND 2 GND 5 N/C(1) RESET 3 4 MR (1) N/C:NotConnected TPS3836andTPS3838DBVPackage 5-PinSOT TPS3837DBVPackage (TopView) 5-PinSOT (TopView) CT 1 5 V DD CT 1 5 V DD GND 2 GND 2 MR 3 4 RESET MR 3 4 RESET PinFunctions PIN NO. I/O DESCRIPTION NAME SOT SOT WSON (TPS3836, (TPS3837) TPS3838) CapacitorTimeDelayPin.ConnectthispintoGNDtosetreset CT 6 1 1 — delaytimeto10ms.ConnectthispintoV tosetresetdelaytime DD to200ms. GND 2 2 2 — Ground ManualReset.WhenMRactivatestologiclow,RESET/RESET activates.WhenMRisinactive,RESET/RESETdependsonlyon MR 4 3 3 I thevoltageatV .IfMRisunused,connecttoV tominimize DD DD currentconsumption. N/C 5 — — — NoConnect Active-LowOutputReset.WhenV fallsbelowV orwhenMR DD IT activatestologiclow,theRESETpinactivatestologiclow.When RESET 3 4 — O V risesaboveV plusV andMRdeactivatestologichigh, DD IT HYS RESETdeactivatestologichighafterresetdelaytimet . D Active-HighOutputReset.WhenV fallsbelowV orwhenMR DD IT activatestologiclow,theRESETpinactivatestologichigh.When RESET — — 4 O V risesaboveV plusV andMRdeactivatestologichigh, DD IT HYS RESETdeactivatestologiclowafterresetdelaytimet . D Copyright©2000–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:TPS3836 TPS3837 TPS3838

TPS3836,TPS3837,TPS3838 SLVS292F–JUNE2000–REVISEDSEPTEMBER2019 www.ti.com PinFunctions(continued) PIN NO. I/O DESCRIPTION NAME SOT SOT WSON (TPS3836, (TPS3837) TPS3838) InputSupplyVoltage.ThisdevicemonitorsthevoltageattheV V 1 5 5 I DD DD pin. 7 Specifications 7.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V (2) 7 V DD Supplyvoltage Allotherpins(2) (3) –0.3 7 V Maximumlowoutputcurrent,I 5 mA OL Maximumhighoutputcurrent,I –5 mA OH Inputclampcurrent,I (V <0orV >V ) ±10 mA IK I I DD Outputclampcurrent,I (V <0orV >V ) ±10 mA OK O O DD Continuoustotalpowerdissipation SeetheThermalInformationtable Operatingtemperature,T –40 85 °C A Storagetemperature,T –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagevaluesarewithrespecttoGND. (3) IfRESETorRESETarepulledaboveV ,theinternalESDstructurepresentsaneffective1.5-kΩresistorbetweenthesepins,causing DD leakagecurrenttoflowintotheRESETorRESETpin. 7.2 Dissipation Ratings T <+25°C DERATINGFACTOR T =+70°C T =+85°C A A A PACKAGE POWERRATING ABOVET =+25°C POWERRATING POWERRATING A DBV 437mW 3.5mW/°C 280mW 227mW DRVLow-K(1) 715mW 7.1mW/°C 395mW 285mW DRVHigh-K(2) 1540mW 15.4mW/°C 845mW 615mW (1) TheJEDEClow-K(1s)boardusedtoderivethisdatawasa3inx3in,two-layerboardwith2-ouncecoppertracesontopoftheboard. (2) TheJEDEChigh-K(2s2p)boardusedtoderivethisdatawasa3inx3in,multilayerboardwith1-ounceinternalpowerandground planesand2-ouncecoppertracesonthetopandbottomoftheboard. 7.3 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) 4000 V(ESD) Electrostaticdischarge Chargeddevicemodel(CDM),perJEDECspecification V JESD22-C101(2) 1000 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 7.4 Recommended Operating Conditions MIN MAX UNIT Supplyvoltage,V 1.6 6 V DD Voltage CT,MR,RESET,andRESETpins 0 V +0.3 V DD High-levelinputvoltage,V 0.7×V V IH DD 4 SubmitDocumentationFeedback Copyright©2000–2019,TexasInstrumentsIncorporated ProductFolderLinks:TPS3836 TPS3837 TPS3838

TPS3836,TPS3837,TPS3838 www.ti.com SLVS292F–JUNE2000–REVISEDSEPTEMBER2019 Recommended Operating Conditions (continued) MIN MAX UNIT Low-levelinputvoltage,V 0.3×V V IL DD InputtransitionriseandfallrateatMR,Δt/ΔV 100 ns/V Operatingtemperature,T –40 85 °C A V Pullup Pullupresistorvalue RESETpin(TPS3838only) Ω 50μA 7.5 Thermal Information TPS383x THERMALMETRIC(1) DRV(WSON) DBV(SOT) UNIT 6PINS 5PINS R Junction-to-ambientthermalresistance 84.7 153.6 θJA R Junction-to-case(top)thermalresistance 85.2 108.1 θJC(top) R Junction-to-boardthermalresistance 49.5 33.5 θJB °C/W ψ Junction-to-topcharacterizationparameter 2.9 10.9 JT ψ Junction-to-boardcharacterizationparameter 48.2 33.1 JB R Junction-to-case(bottom)thermalresistance 30.0 n/a θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report(SPRA953). 7.6 Electrical Characteristics overrecommendedoperatingconditions(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT RESET VDD=3.3V,IOH=–2mA (TPS3836) V =6V,I =–3mA DD OH V High-leveloutputvoltage 0.8×V V OH DD RESET VDD=1.8V,IOH=–1mA (TPS3837) V =3.3V,I =–2mA DD OL RESET V =1.8V,I =1mA DD OL (TPS3836, TPS3838) VDD=3.3V,IOL=2mA V Low-leveloutputvoltage 0.4 V OL RESET VDD=3.3V,IOL=2mA (TPS3837) V =6V,I =3mA DD OL TPS3836, V ≥1.1V,I =50μA 0.2 V Power-upresetvoltage(1) TPS3838 DD OL TPS3837 V ≥1.1V,I =–50μA 0.8×V V DD OL DD TPS383xE18 1.66 1.71 1.74 TPS383xJ25 2.18 2.25 2.29 Negative-goinginputthreshold VIT voltage(2) TPS383xH30 TA=–40°Cto85°C 2.70 2.79 2.85 V TPS383xL30 2.56 2.64 2.69 TPS383xK33 2.84 2.93 2.99 1.7V<V <2.5V 30 IT V HysteresisatV input 2.5V<V <3.5V 40 mV HYS DD IT 3.5V<V <5V 50 IT MR (3) MR=0.7×V ,V =6V –40 –60 –100 μA DD DD I High-levelinputcurrent IH CT CT=V =6V –25 25 nA DD (1) ThelowestvoltageatwhichtheRESEToutputbecomesactive.t ,V ≥15μs/V. R DD (2) Toensurebeststabilityofthethresholdvoltage,abypasscapacitor(ceramic,0.1μF)shouldbeplacednearthesupplyterminal. (3) Ifmanualresetisunused,MRshouldbeconnectedtoV tominimizecurrentconsumption. DD Copyright©2000–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:TPS3836 TPS3837 TPS3838

TPS3836,TPS3837,TPS3838 SLVS292F–JUNE2000–REVISEDSEPTEMBER2019 www.ti.com Electrical Characteristics (continued) overrecommendedoperatingconditions(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT MR (3) MR=0V,V =6V –130 –200 –340 μA DD I Low-levelinputcurrent IL CT CT=0V,V =6V –25 25 nA DD I High-leveloutputcurrent TPS3838 V =V +0.2V,V =V 25 nA OH DD IT OH DD V >V ,V <3V 220 400 DD IT DD nA I Supplycurrent V >V ,V >3V 250 450 DD DD IT DD V <V 10 15 μA DD IT InternalpullupresistoratMR 30 kΩ C InputcapacitanceatMRandCT V =0VtoV 5 pF I I DD 7.7 Timing Requirements AtT =25°C,R =1MΩ,andC =50pF,unlessotherwisenoted. A L L PARAMETER TESTCONDITIONS MIN TYP MAX UNIT AtV V =V +0.2V,V =V –0.2V 6 DD IH IT IL IT t Pulseduration μs W AtMR V ≥V +0.2V,V =0.3×V ,V =0.7×V 1 DD IT IL DD IH DD 7.8 Switching Characteristics AtT =25°C,R =1MΩ,andC =50pF,unlessotherwisenoted. A L L PARAMETER TESTCONDITIONS MIN TYP MAX UNIT VDD≥VIT+0.2V,MR=0.7×VDD, 5 10 15 CT=GND,(seeTimingDiagram) tD Delaytime ms VDD≥VIT+0.2V,MR=0.7×VDD, 100 200 300 CT=VDD,(seeTimingDiagram) Propagation(delay)time,high- VDDtoRESET VIL=VIT–0.2V,VIH=VIT+0.2V 10 tPHL to-low-leveloutput dTePlSay38(T38P)S3836, VIL=1.6V 50 μs tPLH Phirgohp-alegvaetiloonu(tpduetlay)time,low-to- VdeDlDayto(TRPESS3E8T37) VVIILL==V1.IT6–V0.2V,VIH=VIT+0.2V 1500 μs MRtoRESET tPHL Ptor-olopwa-gleavtieolno(udtepluaty)time,high- dTePlSay38(T38P)S3836, V=D0D.7≥×VVITD+D0.2V,VIL=0.3×VDD,VIL 0.3 μs tPLH Phirgohp-alegvaetiloonu(tpduetlay)time,low-to- MdeRlatyo(RTPESS3E8T37) VVDILD=≥0V.7IT×+V0D.2DV,VIL=0.3×VDD, 0.3 μs 6 SubmitDocumentationFeedback Copyright©2000–2019,TexasInstrumentsIncorporated ProductFolderLinks:TPS3836 TPS3837 TPS3838

TPS3836,TPS3837,TPS3838 www.ti.com SLVS292F–JUNE2000–REVISEDSEPTEMBER2019 7.9 Typical Characteristics TestconditionsareT =25°Cunlessotherwisenoted. J 10 100 TA= 85°C TA= 85°C 8 TA= 25°C A) 0 TA= 25°C ply Current (mA) 64 TTAA== –04°C0°C Reset Current (m ––120000 TTAA== –0°4C0°C Sup nual –300 2 Ma –400 0 –500 0 2 4 6 –2 0 2 4 6 Supply Voltage (V) Manual Reset Voltage (V) Figure1.SupplyCurrentvsSupplyVoltage Figure2.ManualResetCurrentvsManualResetVoltage 2.0 2.0 TA= 85°C e (V) 1.5 TTAA== 205°C°C ge (V) 1.5 oltag TA=–40°C Volta w-Level Output V 01..50 gh-Level Output 01..50 TTTTTTAAAAAA====== 82082055°55°CC°°°°CCCC Lo Hi TTAA==––4400°°CC 0 0 0 1 2 3 4 5 6 7 0 1 2 3 4 5 Low-Level Output Current (mA) High-Level Output Current (mA) Figure3.Low-LevelOutputVoltagevs Figure4.High-LevelOutputVoltagevs Low-LevelOutputCurrent High-LevelOutputCurrent V) 1.001 22 hold Voltage ( 01..909090 n at V(ms)DD11218604 s o Thre 0.998 urati 12 Reset 0.997 ulse D 180 ed m P 6 aliz 0.996 mu 4 orm Mini 2 N 0.995 0 –40 –15 10 35 60 85 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Free-AirTemperature (ºC) Threshold Overdrive (V) Figure5.NormalizedResetThresholdVoltagevs Figure6.MinimumPulseDurationatV vs DD Free-AirTemperature V ThresholdOverdrive DD Copyright©2000–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:TPS3836 TPS3837 TPS3838

TPS3836,TPS3837,TPS3838 SLVS292F–JUNE2000–REVISEDSEPTEMBER2019 www.ti.com 8 Parameter Measurement Information 8.1 Timing Diagram A B C D E F G V DD V IT < 1.1 V t MR t RESET t Undefined tD tD tD Undefined Output Output Figure7. TimingDiagram 8 SubmitDocumentationFeedback Copyright©2000–2019,TexasInstrumentsIncorporated ProductFolderLinks:TPS3836 TPS3837 TPS3838

TPS3836,TPS3837,TPS3838 www.ti.com SLVS292F–JUNE2000–REVISEDSEPTEMBER2019 9 Detailed Description 9.1 Overview The TPS3836, TPS3837, and TPS3838 devices are a family of nano power voltage supervisors with manual resetandselectableresetdelay. 9.2 Functional Block Diagram V DD R3 CT MR R1 C1 ResetLogic RESET(TPS3837-Push-Pull) + andTimer S1 RESET(TPS3836-Push-Pull – TPS3838-Open-Drain) R2 C2 S2 S3 Band-Gap Reference C3 Refresh Timer GND 9.3 Feature Description 9.3.1 InputVoltage(V ) DD The V pin monitors the input voltage with an internal comparator and when the voltage at V falls below V , DD DD IT the reset output is asserted to active state after the propagation delay time: t for TPS3836 and TPS3838, t PHL PLH forTPS3837. When V rises above V plus V and MR is logic high, the reset output deasserts to an inactive DD IT HYS state after the reset delay time, t . Note that the V and MR pins have different propagation delays with the D DD samelabel. 9.3.2 ManualReset(MR) Manual reset is an active-low logic input that when MR is logic low, the reset output asserts to the active state afterthepropagationdelay:t forTPS3836andTPS3838,T forTPS3837.Once MRislogichighandV is PHL PLH DD above V , the reset output deasserts to an inactive state after the reset delay time, t . As previously noted, the IT D V andMRpinshavedifferentpropagationdelayswiththesamelabel. DD 9.3.3 SelectableResetDelay(CT) Theresetdelay,t ,canbeconfiguredto10msbyconnectingCTtoGNDor200msbyconnectingCTtoV . D DD Copyright©2000–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:TPS3836 TPS3837 TPS3838

TPS3836,TPS3837,TPS3838 SLVS292F–JUNE2000–REVISEDSEPTEMBER2019 www.ti.com Feature Description (continued) 9.3.4 ResetOutput(RESET/RESET) TPS3836 is a push-pull, active-low RESET output. The RESET output is logic high when inactive and logic low whenactive.Thisdevicedoesnotrequireapullupresistor. TPS3837 is a push-pull, active-high RESET output. The RESET output is logic low when inactive and logic high whenactive.Thisdevicedoesnotrequireapullupresistor. TPS3838 is an open-drain, active-low RESET output. The RESET output is logic high when inactive and logic low when active. This device does require a pullup resistor. Refer to Recommended Operating Conditions to determinetherecommendedvalueofthepullupresistor. NOTE The reset output is active when V is below V or MR is logic low. The reset output is DD IT inactivewhenV isaboveV plusV andMRislogichigh. DD IT HYS 9.4 Device Functional Modes Table 1 summarized the various functional modes of the device. Logic high is represented at "H" and logic low is representedby"L".Trueisrepresentedas"1"andfalseisrepresentedas"0". Table1.FunctionTable MR V >V RESET (1) RESET(2) DD IT L 0 L H L 1 L H H 0 L H H 1 H L (1) TPS3836andTPS3838. (2) TPS3837only. 10 SubmitDocumentationFeedback Copyright©2000–2019,TexasInstrumentsIncorporated ProductFolderLinks:TPS3836 TPS3837 TPS3838

TPS3836,TPS3837,TPS3838 www.ti.com SLVS292F–JUNE2000–REVISEDSEPTEMBER2019 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 10.1 Application Information The following section describes a typical application for this device. This is to serve as an example only as differentapplicationshavedifferentrequirements. 10.2 Typical Application In this application, TPS3836K33 monitors a 3.6-V Lithium-ion battery and sends a reset signal to a MCU when thebatteryreachesundervoltage. TPS3836K33 MSP430 VDD VCC CT Lithium RESET RST Battery 3.6 V MR T GND VSS Figure8. TypicalApplicationCircuit 10.2.1 DesignRequirements Thisapplication monitors the 3.6-V battery and triggers a undervoltage fault to the MCU when the battery voltage falls below 3 V. The application does not release the undervoltage fault until the battery voltage is above approximately3Vforlongerthan200mstypical.Theapplicationmustnotconsumemorethan1 µA. 10.2.2 DetailedDesignProcedure The TPS3836K33 is the correct device variant to choose since the undervoltage threshold for this variant is 2.93 V typical. This meets the undervoltage fault requirement of the application. To achieve releasing the undervoltage fault condition after the battery is above 3 V for 200 ms, connect CT to V to select the 200-ms DD resetdelayoption.Choosing TPS3836 push-pull variant save a pullup resistor since no pullup resistor is required for the push-pull variant. These family of devices have 450-nA maximum Iq, which meets the current consumptionrequirement. Copyright©2000–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:TPS3836 TPS3837 TPS3838

TPS3836,TPS3837,TPS3838 SLVS292F–JUNE2000–REVISEDSEPTEMBER2019 www.ti.com Typical Application (continued) 10.2.3 ApplicationCurves This section shows the voltage monitoring functionality. Figure 9 shows when V drops below 2.93 V, the DD RESET output asserts to active low. Figure 10 shows that when the V rises above 2.93 V + 40 mV = DD approximately2.97Vfor200ms,the RESEToutputdeassertstoinactivelogichigh. VDD VIT = ~2.93 V VDD VIT + VHYS = ~3 V tPHL = ~8.8 µs tD = ~200 ms RESET Figure9.V FallingBelowV TriggersaRESET DD IT Figure10.V RisingAboveV +V fort Releases DD IT HYS D AssertionAftert PHL RESETtoInactive 12 SubmitDocumentationFeedback Copyright©2000–2019,TexasInstrumentsIncorporated ProductFolderLinks:TPS3836 TPS3837 TPS3838

TPS3836,TPS3837,TPS3838 www.ti.com SLVS292F–JUNE2000–REVISEDSEPTEMBER2019 11 Power Supply Recommendations These devices are designed to operate from an input supply with a voltage range between 1.6 V and 6 V. TI recommends an input supply capacitor between the V pin and GND pin. This device has a 7-V absolute DD maximum rating on the V pin. Take extra precautions if the voltage supply providing power to V is DD DD susceptibletoanylargevoltagetransientthatcanexceed7V. 12 Layout 12.1 Layout Guidelines Make sure that the connection to the V pin is low impedance. Good analog design practice recommends DD placing a minimum 0.1-µF ceramic capacitor as near as possible to the V pin to GND. If using the TPS3838 DD variant, be sure to follow the Recommended Operating Conditions to determine the pullup resistor value. Larger transients and faster slew rates on V should use larger input capacitors. If not using MR, tie to V to reduce DD DD currentconsumption. 12.2 Layout Example C IN Pull-up resistor required for Open-Drain (TPS3838) only CT VDD R pull-up GND RESET Reset input signal (TPS3837) MR RESET active Figure11. TPS3836,TPS3837,andTPS3838TypicalLayout Copyright©2000–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:TPS3836 TPS3837 TPS3838

TPS3836,TPS3837,TPS3838 SLVS292F–JUNE2000–REVISEDSEPTEMBER2019 www.ti.com 13 Device and Documentation Support 13.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstoordernow. Table2.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER ORDERNOW DOCUMENTS SOFTWARE COMMUNITY TPS3836 Clickhere Clickhere Clickhere Clickhere Clickhere TPS3837 Clickhere Clickhere Clickhere Clickhere Clickhere TPS3838 Clickhere Clickhere Clickhere Clickhere Clickhere 13.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed.Forchangedetails,reviewtherevisionhistoryincludedinanyreviseddocument. 13.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight fromtheexperts.Searchexistinganswersoraskyourownquestiontogetthequickdesignhelpyouneed. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do notnecessarilyreflectTI'sviews;seeTI'sTermsofUse. 13.4 Trademarks MSP430,E2EaretrademarksofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 13.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. 13.6 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 14 SubmitDocumentationFeedback Copyright©2000–2019,TexasInstrumentsIncorporated ProductFolderLinks:TPS3836 TPS3837 TPS3838

PACKAGE OPTION ADDENDUM www.ti.com 4-Jul-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) Ball material (3) (4/5) (6) TPS3836E18DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDNI & no Sb/Br) TPS3836E18DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDNI & no Sb/Br) TPS3836E18DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDNI & no Sb/Br) TPS3836H30DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PHRI & no Sb/Br) TPS3836H30DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PHRI & no Sb/Br) TPS3836J25DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDSI & no Sb/Br) TPS3836J25DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDSI & no Sb/Br) TPS3836K33DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDTI & no Sb/Br) TPS3836K33DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDTI & no Sb/Br) TPS3836K33DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDTI & no Sb/Br) TPS3836K33DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDTI & no Sb/Br) TPS3836L30DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PCAI & no Sb/Br) TPS3836L30DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PCAI & no Sb/Br) TPS3836L30DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PCAI & no Sb/Br) TPS3836L30DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PCAI & no Sb/Br) TPS3837E18DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDOI & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 4-Jul-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) Ball material (3) (4/5) (6) TPS3837E18DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDOI & no Sb/Br) TPS3837J25DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDRI & no Sb/Br) TPS3837J25DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDRI & no Sb/Br) TPS3837K33DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDUI & no Sb/Br) TPS3837K33DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDUI & no Sb/Br) TPS3837K33DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDUI & no Sb/Br) TPS3837L30DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PCBI & no Sb/Br) TPS3837L30DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PCBI & no Sb/Br) TPS3837L30DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PCBI & no Sb/Br) TPS3838E18DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDQI & no Sb/Br) TPS3838E18DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDQI & no Sb/Br) TPS3838E18DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDQI & no Sb/Br) TPS3838E18DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDQI & no Sb/Br) TPS3838J25DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDPI & no Sb/Br) TPS3838J25DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDPI & no Sb/Br) TPS3838J25DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDPI & no Sb/Br) TPS3838J25DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDPI & no Sb/Br) Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 4-Jul-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) Ball material (3) (4/5) (6) TPS3838K33DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDVI & no Sb/Br) TPS3838K33DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDVI & no Sb/Br) TPS3838K33DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDVI & no Sb/Br) TPS3838K33DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PDVI & no Sb/Br) TPS3838K33DRVR ACTIVE WSON DRV 6 3000 Green (RoHS NIPDAUAG Level-1-260C-UNLIM -40 to 85 CCS & no Sb/Br) TPS3838K33DRVT ACTIVE WSON DRV 6 250 Green (RoHS NIPDAUAG Level-1-260C-UNLIM -40 to 85 CCS & no Sb/Br) TPS3838L30DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PCCI & no Sb/Br) TPS3838L30DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PCCI & no Sb/Br) TPS3838L30DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PCCI & no Sb/Br) TPS3838L30DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 PCCI & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 4-Jul-2020 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPS3836, TPS3838 : •Automotive: TPS3836-Q1, TPS3838-Q1 •Enhanced Product: TPS3836-EP NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects •Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS3836E18DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836E18DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836H30DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836H30DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836J25DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836J25DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836K33DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836K33DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3836L30DBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TPS3836L30DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3837E18DBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3837J25DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3837J25DBVT SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TPS3837K33DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3837K33DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3837L30DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3837L30DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3838E18DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS3838E18DBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3838J25DBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3838J25DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3838J25DBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3838J25DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3838K33DBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3838K33DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3838K33DBVT SOT-23 DBV 5 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3838K33DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS3838K33DRVR WSON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS3838K33DRVT WSON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS3838L30DBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TPS3838L30DBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3838L30DBVT SOT-23 DBV 5 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS3838L30DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS3836E18DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3836E18DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 PackMaterials-Page2

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS3836H30DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3836H30DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3836J25DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3836J25DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3836K33DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3836K33DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3836L30DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3836L30DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3837E18DBVT SOT-23 DBV 5 250 203.0 203.0 35.0 TPS3837J25DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3837J25DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3837K33DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3837K33DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3837L30DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3837L30DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3838E18DBVR SOT-23 DBV 5 3000 203.0 203.0 35.0 TPS3838E18DBVT SOT-23 DBV 5 250 203.0 203.0 35.0 TPS3838J25DBVR SOT-23 DBV 5 3000 203.0 203.0 35.0 TPS3838J25DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3838J25DBVT SOT-23 DBV 5 250 203.0 203.0 35.0 TPS3838J25DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3838K33DBVR SOT-23 DBV 5 3000 203.0 203.0 35.0 TPS3838K33DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3838K33DBVT SOT-23 DBV 5 250 203.0 203.0 35.0 TPS3838K33DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS3838K33DRVR WSON DRV 6 3000 203.0 203.0 35.0 TPS3838K33DRVT WSON DRV 6 250 203.0 203.0 35.0 TPS3838L30DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS3838L30DBVR SOT-23 DBV 5 3000 203.0 203.0 35.0 TPS3838L30DBVT SOT-23 DBV 5 250 203.0 203.0 35.0 TPS3838L30DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 PackMaterials-Page3

PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 1.45 B A 0.90 PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com

EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

GENERIC PACKAGE VIEW DRV 6 WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4206925/F

PACKAGE OUTLINE DRV0006A WSON - 0.8 mm max height SCALE 5.500 PLASTIC SMALL OUTLINE - NO LEAD B 2.1 A 1.9 PIN 1 INDEX AREA 2.1 1.9 0.8 C 0.7 SEATING PLANE 0.08 C (0.2) TYP 1 0.1 0.05 EXPOSED 0.00 THERMAL PAD 3 4 2X 7 1.3 1.6 0.1 6 1 4X 0.65 0.35 6X PIN 1 ID 0.3 0.25 6X (OPTIONAL) 0.2 0.1 C A B 0.05 C 4222173/B 04/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com

EXAMPLE BOARD LAYOUT DRV0006A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 6X (0.45) (1) 1 7 6X (0.3) 6 SYMM (1.6) (1.1) 4X (0.65) 4 3 (R0.05) TYP SYMM ( 0.2) VIA (1.95) TYP LAND PATTERN EXAMPLE SCALE:25X 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK (PREFERRED) DEFINED SOLDER MASK DETAILS 4222173/B 04/2018 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown. www.ti.com

EXAMPLE STENCIL DESIGN DRV0006A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD SYMM 6X (0.45) METAL 1 7 6X (0.3) 6 (0.45) SYMM 4X (0.65) (0.7) 4 3 (R0.05) TYP (1) (1.95) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD #7 88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:30X 4222173/B 04/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

PACKAGE OUTLINE DRV0006D WSON - 0.8 mm max height SCALE 5.500 PLASTIC SMALL OUTLINE - NO LEAD B 2.1 A 1.9 PIN 1 INDEX AREA 2.1 1.9 0.8 C 0.7 SEATING PLANE 0.08 C (0.2) TYP 1 0.1 0.05 EXPOSED 0.00 THERMAL PAD 3 4 2X 7 1.3 1.6 0.1 6 1 4X 0.65 0.35 6X PIN 1 ID 0.3 0.25 6X (OPTIONAL) 0.2 0.1 C A B 0.05 C 4225563/A 12/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com

EXAMPLE BOARD LAYOUT DRV0006D WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 6X (0.45) (1) 1 7 6X (0.3) 6 SYMM (1.6) (1.1) 4X (0.65) 4 3 (R0.05) TYP SYMM ( 0.2) VIA (1.95) TYP LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:25X 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND EXPOSED EXPOSED METAL METAL SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK (PREFERRED) DEFINED SOLDER MASK DETAILS 4225563/A 12/2019 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown. www.ti.com

EXAMPLE STENCIL DESIGN DRV0006D WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD SYMM 6X (0.45) METAL 1 7 6X (0.3) 6 (0.45) SYMM 4X (0.65) (0.7) 4 3 (R0.05) TYP (1) (1.95) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD #7 88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:30X 4225563/A 12/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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