TPS3305 www.ti.com SLVS198C–DECEMBER1998–REVISEDMARCH2008 DUAL PROCESSOR SUPERVISORS FEATURES DESCRIPTION 1 • DualSupervisoryCircuitsforDSP-and The TPS3305 family is a series of micropower supply 2 Processor-BasedSystems voltage supervisors designed for circuit initialization. • Power-OnResetGeneratorwithFixedDelay Its dual monitor topology is well-suited to use in DSP Timeof200ms;noExternalCapacitorNeeded and processor-based systems, which often require twosupplyvoltages,coreandI/O. • WatchdogTimerRetriggerstheRESETOutput atSENSEn≥V RESET is asserted when the voltage at either IT+ • Temperature-CompensatedVoltageReference SENSEn pin falls below its threshold voltage, VIT. When both SENSEn pins are again above their • MaximumSupplyCurrentof40m A respective threshold voltages, RESET is held low for • SupplyVoltageRange:2.7Vto6V the factory-programmed delay time (200ms typ). • DefinedRESETOutputFromV ≥1.1V RESET is also asserted if the watchdog input (WDI) DD isnottoggledformorethan1.6styp. • MSOP-8andSO-8Packages • TemperatureRange:–40(cid:176) Cto+85(cid:176) C The TPS3305-xx devices are available in either 8-pin MSOP or SO packages, and are specified for operation over a temperature range of –40(cid:176) C to APPLICATIONS +85(cid:176) C. • ProcessorSupplyMonitoring • IndustrialEquipment • AutomotiveSystems • Portable/Battery-PoweredEquipment • WirelessCommunicationSystems • Notebook/DesktopComputers TPS73233 3.3V 5V V V IN GND OUT GND D OR DGN PACKAGE VIN TPS73618VOUT 1.8V (TOP VIEW) SENSE1 V DD V DSP SENSE2 MR DD External SENSE1 VI/O WDI RESET Reset MR SENSE2 VCORE GND RESET Source TPS3305-18 RESET RESET WDI WDO GND GND 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©1998–2008,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

TPS3305 www.ti.com SLVS198C–DECEMBER1998–REVISEDMARCH2008 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. ORDERINGINFORMATION(1) NOMINALSUPERVISEDVOLTAGE THRESHOLDVOLTAGE(TYP) DEVICE SENSE1 SENSE2 SENSE1 SENSE2 TPS3305-18 3.3V 1.8V 2.93V 1.68V TPS3305-25 3.3V 2.5V 2.93V 2.25V TPS3305-33 5.0V 3.3V 4.55V 2.93V (1) Forthemostcurrentspecificationsandpackageinformation,seethePackageOptionAddendumattheendofthisdocument,orseethe TIwebsiteatwww.ti.com. ABSOLUTE MAXIMUM RATINGS(1)(2) Overoperatingjunctiontemperaturerange(unlessotherwisenoted). UNIT Supplyvoltagerange,V –0.3Vto+7V DD V ,V –0.3VtoV +0.3V MR WDI DD InputvoltageatSENSE1andSENSE2,V (V +0.3)V /1.25V I DD IT V ,V –0.3Vto+7V RESET RESET Maximumlowoutputcurrent,I 5mA OL Maximumhighoutputcurrent,I –5mA OH Inputclampcurrent,I (V <0orV >V ) ±20mA IK I I DD Outputclampcurrent,I (V <0orV >V ) ±20mA OK O O DD Continuoustotalpowerdissipation SeeDissipationRatingsTable Operatingjunctiontemperaturerange,T –40(cid:176) Cto+85(cid:176) C J Storagetemperaturerange,T –65(cid:176) Cto+150(cid:176) C stg Solderingtemperature +260(cid:176) C (1) Stressesbeyondthoselistedunderabsolutemaximumratingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderrecommendedoperating conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagevaluesarewithrespecttoGND. DISSIPATION RATINGS TABLE T ≤+25(cid:176) C DERATINGFACTOR T =+70(cid:176) C T =+85(cid:176) C A A A PACKAGE POWERRATING ABOVET =+25(cid:176) C POWERRATING POWERRATING A DGN 2.14W 17.1mW/(cid:176) C 1.37W 1.11W D 725mW 5.8mW/(cid:176) C 464mW 377mW 2 SubmitDocumentationFeedback Copyright©1998–2008,TexasInstrumentsIncorporated ProductFolderLink(s):TPS3305

TPS3305 www.ti.com SLVS198C–DECEMBER1998–REVISEDMARCH2008 ELECTRICAL CHARACTERISTICS Overoperatingjunctiontemperaturerange(unlessotherwisenoted). TPS3305-xx PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V Inputsupplyrange 2.7 6.0 V DD T Operatingjunctiontemperaturerange –40 +85 (cid:176) C J V =2.7Vto6V, I DD=–20m A VDD–0.2V V OH V High-leveloutputvoltage OH V =3.3V,I =–2mA V –0.4V V DD OH DD V =6V,I =–3mA V –0.4V V DD OH DD V =2.7Vto6V, I DD=20m A 0.2 V OL V Low-leveloutputvoltage OL V =3.3V,I =2mA 0.4 V DD OL V =6V,I =3mA 0.4 V DD OL Power-upresetvoltage(1) V ≥1.1V,I =20m A 0.4 V DD OL 1.64 1.68 1.72 V VSENSE1, V =2.7Vto6V, 2.20 2.25 2.30 V DD VSENSE2 TA=0(cid:176) Cto+85(cid:176) C 2.86 2.93 3.0 V Negative-goinginputthreshold 4.46 4.55 4.64 V VIT– voltage(2) 1.64 1.68 1.73 V VSENSE1, V =2.7Vto6V, 2.20 2.25 2.32 V DD VSENSE2 TA=–40(cid:176) Cto+85(cid:176) C 2.86 2.93 3.02 V 4.46 4.55 4.67 V V =1.68V 15 mV IT– V =2.25V 20 mV IT– V HysteresisatVSENSEninput hys V =2.93V 30 mV IT– V =4.55V 40 mV IT– I Averagehigh-levelinputcurrent WDI WDI=VDD=6V 100 150 m A H(AV) Timeaverage(dc=88%) I Averagelow-levelinputcurrent WDI WDI=0V,VDD=6V –15 –20 m A L(AV) Timeaverage(dc=12%) V High-levelinputvoltageatMRandWDI 0.7xV V IH DD V Low-levelinputvoltageatMRandWDI 0.3xV V IL DD Δt/ΔV InputtransitionriseandfallrateatMR 50 ns/V WDI WDI=V =6V 120 170 m A DD MR MR=0.7· V ,V =6V –130 –180 m A DD DD I High-levelinputcurrent H SENSE1 VSENSE1=V =6V 5 8 m A DD SENSE2 VSENSE2=V =6V 6 9 m A DD WDI WDI=0V,V =6V –120 –170 m A DD I Low-levelinputcurrent MR MR=0V,V =6V –430 –600 m A L DD SENSEn VSENSE1,2=0V –1 1 m A I Supplycurrent 40 m A DD C Inputcapacitance V =0VtoV 10 pF I I DD (1) ThelowestsupplyvoltageatwhichRESETbecomesactive.t,V ≥15m s/V. r DD (2) Toensurebeststabilityofthethresholdvoltage,abypasscapacitor(0.1m Fceramic)shouldbeplacedclosetothesupplyterminals. Copyright©1998–2008,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TPS3305

TPS3305 www.ti.com SLVS198C–DECEMBER1998–REVISEDMARCH2008 TIMINGDIAGRAM SENSEn V (nom) V IT- t MR 1 0 t WDI tt(out) 1 0 t RESET 1 0 t td td td t d RESET because of WDI RESET because of SENSE below V RESET because ofMR IT- RESET because of SENSE below V IT- RESET because of SENSE below V IT- TIMING REQUIREMENTS AtV =2.7Vto6V,R =1MΩ,C =50pF,andT =+25(cid:176) C. DD L L J PARAMETER TESTCONDITIONS MIN TYP MAX UNIT SENSEn V =V –0.2V,V =V +0.2V 6 m s SENSEnL IT– SENSEnH IT+ t Pulsewidth MR 100 ns w V =0.7· V ,V =0.3· V IH DD IL DD WDI 100 ns SWITCHING CHARACTERISTICS AtV =2.7Vto6V,R =1MΩ,C =50pF,andT =+25(cid:176) C. DD L L J PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V ≥V +0.2V,MR ≥0.7· I(SENSEn) IT+ t Watchdogtime-out V 1.1 1.6 2.3 s t(out) DD SeeTimingDiagram V ≥V +0.2V,MR ≥0.7· V t Delaytime I(SENSEn) IT+ DD 140 200 280 ms d SeeTimingDiagram Propagation(delay)time, MRtoRESET, V ≥V +0.2V, tPHL high-to-lowleveloutput MRtoRESET VI(SE=N0S.E7n)· VIT+,V =0.3· V 200 500 ns IH DD IL DD Propagation(delay)time, MRtoRESET, V ≥V +0.2V, tPLH low-to-highleveloutput MRtoRESET VI(SE=N0S.E7n)· VIT+,V =0.3· V 200 500 ns IH DD IL DD tPHL Phirgohp-atog-alotiwonle(vdeellaoyu)tptiumte, SSEENNSSEEnnttooRREESSEETT, VMIRH=≥V0IT.7+·+0V.2V,VIL=VIT– –0.2V, 1 5 m s DD tPLH Plorwo-ptoa-ghaigtiohnle(vdeellaoyu)tptiumte, SSEENNSSEEnnttooRREESSEETT, VMIRH=≥V0IT.7+·+0V.2V,VIL=VIT– –0.2V, 1 5 m s DD 4 SubmitDocumentationFeedback Copyright©1998–2008,TexasInstrumentsIncorporated ProductFolderLink(s):TPS3305

TPS3305 www.ti.com SLVS198C–DECEMBER1998–REVISEDMARCH2008 DEVICE INFORMATION FUNCTION/TRUTH TABLE(1) MR SENSE1>V SENSE2>V RESET RESET IT1 IT2 L X X L H H 0 0 L H H 0 1 L H H 1 0 L H H 1 1 H L (1) X=Don'tcare FUNCTIONALBLOCKDIAGRAM V DD TPS3305 14kW MR R1 SENSE1 RESET R2 RESET R3 Logic + Timer SENSE2 RESET R4 GND Reference Voltage of 1.25V Oscillator Transition Watchdog WDI Detection Logic + Timer 40kW TERMINALFUNCTIONS TERMINAL NAME NO. DESCRIPTION GND 4 Ground MR 7 Manualreset RESET 5 Active-lowresetoutput RESET 6 Active-highresetoutput SENSE1 1 Sensevoltageinput1 SENSE2 2 Sensevoltageinput2 WDI 3 Watchdogtimerinput V 8 Supplyvoltage DD Copyright©1998–2008,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TPS3305

TPS3305 www.ti.com SLVS198C–DECEMBER1998–REVISEDMARCH2008 TYPICAL CHARACTERISTICS NORMALIZEDSENSETHRESHOLDVOLTAGE SUPPLYCURRENT vs vs JUNCTIONTEMPERATUREATV SUPPLYVOLTAGE DD 1.005 18 C) VDD= 6V 16 °5 1.004 MR= Open 2 + 14 (T TPS3305-33 ), VIA 1.003 12 V(TIT 1.002 mA 10 oltage - 1.001 urrent - 86 d V 1 y C 4 hol ppl 2 es 0.999 Su hr - 0 T D ut 0.998 ID −2 p n ed I 0.997 −4 SENSEn = VDD z ali −6 MR= Open orm 0.996 −8 TJ= +25°C N 0.995 −10 −40 −15 10 35 60 85 −0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 TJ- Junction Temperature -°C VDD- Supply Voltage - V Figure1. Figure2. INPUTCURRENT MINIMUMPULSEDURATIONATSENSE vs vs INPUTVOLTAGEATMR THRESHOLDOVERDRIVE 100 10 V = 6V V = 6V DD DD 0 TJ= +25°C 9 MR= Open s −100 m 8 - −200 Vsense 7 ment -A −300 ation at 6 nput Curr −−450000 Pulse Dur 54 - I m II −600 mu 3 ni Mi −700 - 2 W t −800 1 −900 0 −1−0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 0 100 200 300 400 500 600 700 800 900 1000 VI- Input Voltage atMR- V SENSE - Threshold Overdrive - mV Figure3. Figure4. 6 SubmitDocumentationFeedback Copyright©1998–2008,TexasInstrumentsIncorporated ProductFolderLink(s):TPS3305

TPS3305 www.ti.com SLVS198C–DECEMBER1998–REVISEDMARCH2008 TYPICAL CHARACTERISTICS (continued) HIGH-LEVELOUTPUTVOLTAGE HIGH-LEVELOUTPUTVOLTAGE vs vs HIGH-LEVELOUTPUTCURRENT HIGH-LEVELOUTPUTCURRENT 2.5 6.5 VDD= 2V 6 VDD= 6V MR= Open MR= Open 5.5 2 e - V e - V 5 ag ag 4.5 olt olt ut V 1.5 ut V 4 -40°C p p ut ut 3.5 O O el -40°C el 3 v v e e +85°C h-L 1 h-L 2.5 g g - Hi +85°C - Hi 2 H H VO VO 1.5 0.5 1 0.5 0 0 0 −0.5 −1 −1.5 −2 −2.5 −3 −3.5 −4 −4.5 −5 −5.5 −6 0 −5 −10 −15 −20 −25 −30 −35 −40 −45 −50 I - High-Level Output Current - mA I - High-Level Output Current - mA OH OH Figure5. Figure6. LOW-LEVELOUTPUTVOLTAGE LOW-LEVELOUTPUTVOLTAGE vs vs LOW-LEVELOUTPUTCURRENT LOW-LEVELOUTPUTCURRENT 2.5 6.5 V = 2V V = 6V DD 6 DD MR= Open MR= Open 5.5 2 V V 5 e - e - g g 4.5 a a olt olt V V 4 ut 1.5 ut utp utp 3.5 O O el el 3 v v w-Le 1 +85°C w-Le 2.5 +85°C o o - L - L 2 OL OL V V 1.5 0.5 -40°C -40°C 1 0.5 0 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 0 5 10 15 20 25 30 35 40 45 50 55 60 I - Low-Level Output Current - mA I - Low-Level Output Current - mA OL OL Figure7. Figure8. Copyright©1998–2008,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TPS3305

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPS3305-18D ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 30518 & no Sb/Br) TPS3305-18DG4 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 30518 & no Sb/Br) TPS3305-18DGN ACTIVE HVSSOP DGN 8 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AAM & no Sb/Br) TPS3305-18DGNG4 ACTIVE HVSSOP DGN 8 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AAM & no Sb/Br) TPS3305-18DGNR ACTIVE HVSSOP DGN 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AAM & no Sb/Br) TPS3305-18DGNRG4 ACTIVE HVSSOP DGN 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AAM & no Sb/Br) TPS3305-18DR ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 30518 & no Sb/Br) TPS3305-18DRG4 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 30518 & no Sb/Br) TPS3305-25D ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 30525 & no Sb/Br) TPS3305-25DGN ACTIVE HVSSOP DGN 8 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AAN & no Sb/Br) TPS3305-25DGNR ACTIVE HVSSOP DGN 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AAN & no Sb/Br) TPS3305-25DR ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 30525 & no Sb/Br) TPS3305-33D ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 30533 & no Sb/Br) TPS3305-33DG4 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 30533 & no Sb/Br) TPS3305-33DGN ACTIVE HVSSOP DGN 8 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AAO & no Sb/Br) TPS3305-33DGNG4 ACTIVE HVSSOP DGN 8 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AAO & no Sb/Br) TPS3305-33DGNR ACTIVE HVSSOP DGN 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AAO & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPS3305-33DGNRG4 ACTIVE HVSSOP DGN 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AAO & no Sb/Br) TPS3305-33DR ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 30533 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 6-Sep-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS3305-18DGNR HVSSOP DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS3305-18DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TPS3305-25DGNR HVSSOP DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS3305-25DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TPS3305-33DGNR HVSSOP DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS3305-33DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 6-Sep-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS3305-18DGNR HVSSOP DGN 8 2500 358.0 335.0 35.0 TPS3305-18DR SOIC D 8 2500 350.0 350.0 43.0 TPS3305-25DGNR HVSSOP DGN 8 2500 358.0 335.0 35.0 TPS3305-25DR SOIC D 8 2500 350.0 350.0 43.0 TPS3305-33DGNR HVSSOP DGN 8 2500 358.0 335.0 35.0 TPS3305-33DR SOIC D 8 2500 350.0 350.0 43.0 PackMaterials-Page2

PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE DGN0008D PowerPAD TM VSSOP - 1.1 mm max height SCALE 4.000 SMALL OUTLINE PACKAGE C 5.05 A 4.75 TYP 0.1 C PIN 1 INDEX AREA SEATING PLANE 6X 0.65 8 1 2X 3.1 1.95 2.9 NOTE 3 4 5 0.38 8X 0.25 B 3.1 0.13 C A B 2.9 NOTE 4 0.23 0.13 SEE DETAIL A EXPOSED THERMAL PAD 4 5 0.25 GAGE PLANE 1.89 1.63 9 1.1 MAX 8 1 0.7 0.15 0 -8 0.05 0.4 DETA 20AIL A 1.57 TYPICAL 1.28 4225481/A 11/2019 PowerPAD is a trademark of Texas Instruments. NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-187. www.ti.com

EXAMPLE BOARD LAYOUT DGN0008D PowerPAD TM VSSOP - 1.1 mm max height SMALL OUTLINE PACKAGE (2) NOTE 9 METAL COVERED BY SOLDER MASK (1.57) SYMM SOLDER MASK DEFINED PAD 8X (1.4) (R0.05) TYP 8 8X (0.45) 1 (3) 9 SYMM NOTE 9 (1.89) 6X (0.65) (1.22) 5 4 ( 0.2) TYP VIA (0.55) SEE DETAILS (4.4) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 15X SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDE15.000R MASK DETAILS 4225481/A 11/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. 9. Size of metal pad may vary due to creepage requirement. www.ti.com

EXAMPLE STENCIL DESIGN DGN0008D PowerPAD TM VSSOP - 1.1 mm max height SMALL OUTLINE PACKAGE (1.57) BASED ON 0.125 THICK STENCIL SYMM 8X (1.4) (R0.05) TYP 8 8X (0.45) 1 (1.89) SYMM BASED ON 0.125 THICK STENCIL 6X (0.65) 4 5 METAL COVERED SEE TABLE FOR BY SOLDER MASK DIFFERENT OPENINGS (4.4) FOR OTHER STENCIL THICKNESSES SOLDER PASTE EXAMPLE EXPOSED PAD 9: 100% PRINTED SOLDER COVERAGE BY AREA SCALE: 15X STENCIL SOLDER STENCIL THICKNESS OPENING 0.1 1.76 X 2.11 0.125 1.57 X 1.89 (SHOWN) 0.15 1.43 X 1.73 0.175 1.33 X 1.60 4225481/A 11/2019 NOTES: (continued) 10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 11. Board assembly site may have different recommendations for stencil design. www.ti.com

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