Product Sample & Technical Tools & Support & Folder Buy Documents Software Community TPD2E001 SLLS684I–JULY2006–REVISEDMARCH2016 TPD2E001 Low-Capacitance 2-Channel ESD-Protection for High-Speed Data Interfaces 1 Features 3 Description • IEC61000-4-2ESDProtection(Level4) The TPD2E001 is a two-channel Transient Voltage 1 Suppressor (TVS) based Electrostatic Discharge – ±8-kVContactDischarge (ESD) protection diode array. The TPD2E001 is rated – ±15-kVAir-GapDischarge to dissipate ESD strikes at the maximum level • IOCapacitance:1.5pF(Typ) specified in the IEC 61000-4-2 Level 4 international standard. • LowLeakageCurrent:1nA(Maximum) • LowSupplyCurrent:1nA The DRS package (3.00 mm x 3.00 mm) is also available as a non-magnetic package for medical • 0.9Vto5.5VSupply-VoltageRange imagingapplications. • Space-SavingDRL,DRY,andQFNPackage See also TPD2E2U06DRLR which is p2p compatible Options to TPD2E001DRLR and offers higher IEC ESD • Alternate3,4,6-ChanneloptionsAvailable: Protection, lower clamping voltage, and eliminates TPD3E001,TPD4E001,TPD6E001 theinputcapacitorrequirement. 2 Applications DeviceInformation(1) • USB2.0 PARTNUMBER PACKAGE BODYSIZE(NOM) • Ethernet SOT(5) 1.60mmx1.20mm • FireWire™ WSON(6) 3.00mmx3.00mm TPD2E001 USON(6) 1.45mmx1.00mm • LVDS SOP(4) 2.90mmx1.30mm • SVGAVideoConnections (1) For all available packages, see the orderable addendum at • GlucoseMeters theendofthedatasheet. • MedicalImaging ApplicationSchematic 0.1 µF V CC V BUS R T IO1 D+ USB R D1 Controller T D– IO2 GND GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

TPD2E001 SLLS684I–JULY2006–REVISEDMARCH2016 www.ti.com Table of Contents 1 Features.................................................................. 1 7.3 FeatureDescription...................................................6 2 Applications........................................................... 1 7.4 DeviceFunctionalModes..........................................6 3 Description............................................................. 1 8 ApplicationandImplementation.......................... 7 4 RevisionHistory..................................................... 2 8.1 ApplicationInformation..............................................7 8.2 TypicalApplication....................................................7 5 PinConfigurationandFunctions......................... 3 9 PowerSupplyRecommendations........................ 8 6 Specifications......................................................... 4 10 Layout..................................................................... 8 6.1 AbsoluteMaximumRatings......................................4 6.2 ESDRatings..............................................................4 10.1 LayoutGuidelines...................................................8 6.3 ESDRatings:SurgeProtection.................................4 10.2 LayoutExample......................................................8 6.4 RecommendedOperatingConditions.......................4 11 DeviceandDocumentationSupport................... 9 6.5 ThermalInformation..................................................4 11.1 CommunityResources............................................9 6.6 ElectricalCharacteristics...........................................5 11.2 Trademarks.............................................................9 6.7 TypicalCharacteristics..............................................5 11.3 ElectrostaticDischargeCaution..............................9 7 DetailedDescription.............................................. 6 11.4 Glossary..................................................................9 7.1 Overview...................................................................6 12 Mechanical,Packaging,andOrderable Information............................................................. 9 7.2 FunctionalBlockDiagram.........................................6 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionH(August2014)toRevisionI Page • UpdatedtheESDSsection .................................................................................................................................................... 1 • UpdatedtheHandlingRatingstabletoanESDRatingstableandmovedtheT totheAbsoluteMaximumRatings stg table........................................................................................................................................................................................ 4 • Addedtestconditionfrequencytocapacitance ..................................................................................................................... 5 • AddednotetotheApplicationandImplementation ............................................................................................................... 7 • AddedCommunityResources ............................................................................................................................................... 9 ChangesfromRevisionG(November2013)toRevisionH Page • AddedPinConfigurationandFunctionssection,HandlingRatingtable,FeatureDescriptionsection,Device FunctionalModes,ApplicationandImplementationsection,PowerSupplyRecommendationssection,Layout section,DeviceandDocumentationSupportsection,andMechanical,Packaging,andOrderableInformation section ................................................................................................................................................................................... 1 ChangesfromRevisionF(Feburary2012)toRevisionG Page • Updateddocumentformatting................................................................................................................................................ 1 • UpdatedDescription............................................................................................................................................................... 1 • RemovedOrderingInformationtable..................................................................................................................................... 3 ChangesfromRevisionE(June2008)toRevisionF Page • AddedMedicalImagingtoApplications.................................................................................................................................. 1 • Added"The3x3mmDRSpackageisalsoavailableasanon-magneticpackageformedicalimagingapplication."to thedescription........................................................................................................................................................................ 1 • Added3x3SON–DRS(Non-Magnetic)packagetoOrderingInformationtable................................................................ 3 2 SubmitDocumentationFeedback Copyright©2006–2016,TexasInstrumentsIncorporated ProductFolderLinks:TPD2E001

TPD2E001 www.ti.com SLLS684I–JULY2006–REVISEDMARCH2016 5 Pin Configuration and Functions DRYPackage 6-PinUSON DRSPackage TopView 6-PinWSON TopView V 1 6 IO2 CC V 1 6 IO2 N.C. 2 5 N.C. CC IO1 3 4 GND N.C. 2 GND 5 N.C. N.C.–Notinternallyconnected IO1 3 4 GND DRLPackage N.C.–Notinternallyconnected 5-PinSOT TopView DZDPackage 4-PinSOP V 1 5 IO2 CC TopView N.C. 2 GND V 1 4 CC IO1 3 4 GND N.C.–Notinternallyconnected IO1 2 3 IO2 PinFunctions PIN DRY DRL DRS DZD DESCRIPTION NAME NO. NO. NO. NO. EP — — EP — Exposedpad.ConnecttoGND. GND 4 4 4 1 Ground IOx 3,6 3,5 3,6 2,3 ESD-protectedchannel N.C. 2,5 2 2,5 — Noconnection.Notinternallyconnected. V 1 1 1 4 Power-supplyinput.BypassV toGNDwitha0.1-μFceramiccapacitor. CC CC Copyright©2006–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:TPD2E001

TPD2E001 SLLS684I–JULY2006–REVISEDMARCH2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V Powerpinvoltage –0.3 7 V CC V IOpinvoltage –0.3 V +0.3 V IO CC T Junctiontemperature 150 °C J Infrared(15s) 220 Bumptemperature(soldering) °C Vaporphase(60s) 215 Leadtemperature(soldering,10s) 300 °C T Storagetemperature –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedintheoperationalsectionsofthe specificationsisnotimplied.Exposuretoabsolute-maximum-ratingconditionsforextendedperiodsmayaffectdevicereliability. 6.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001,allpins(1) ±15000 Electrostatic V(ESD) discharge Cpihnasr(g2)eddevicemodel(CDM),perJEDECspecificationJESD22-C101,all ±1000 V (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 ESD Ratings: Surge Protection VALUE UNIT Electrostatic IEC61000-4-2contact ±8000 V V (ESD) discharge IEC61000-4-2air-gapdischarge ±15000 6.4 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT T ,operatingfree-airtemperature –40 85 °C A V pin 0.9 5.5 CC Operatingvoltage V IO1,IO2pins 0 V CC 6.5 Thermal Information TPD2E001 THERMALMETRIC(1) DRY(USON) DRL(SOT) DRS(WSON) DZD(SOP) UNIT 5PINS 5PINS 6PINS 4PINS R Junction-to-ambientthermalresistance 374.2 257.6 91.9 213.7 °C/W θJA R Junction-to-case(top)thermalresistance 223.4 97.6 106.9 93.5 °C/W θJC(top) R Junction-to-boardthermalresistance 227.8 74.2 64.8 56.8 °C/W θJB ψ Junction-to-topcharacterizationparameter 52.9 7.5 10.2 4.2 °C/W JT ψ Junction-to-boardcharacterizationparameter 224.8 73.7 64.9 56.4 °C/W JB R Junction-to-case(bottom)thermalresistance 87.5 N/A 29.9 N/A °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report,SPRA953. 4 SubmitDocumentationFeedback Copyright©2006–2016,TexasInstrumentsIncorporated ProductFolderLinks:TPD2E001

TPD2E001 www.ti.com SLLS684I–JULY2006–REVISEDMARCH2016 6.6 Electrical Characteristics V =5V±10%,T =–40°Cto85°C(unlessotherwisenoted) CC A PARAMETER TESTCONDITIONS MIN TYP(1) MAX UNIT V Supplyvoltage 0.9 5.5 V CC I Supplycurrent 1 100 nA CC V Diodeforwardvoltage I =10mA 0.65 0.95 V F F V Breakdownvoltage I =10mA 11 V BR BR TA=25°C,±15-kVHBM, Positivetransients VCC+25 IF=10A Negativetransients –25 T =25°C, Positivetransients V +60 A CC V Channelclampvoltage(2) ±8-kVcontactdischarge V C (IEC61000-4-2),I =24A Negativetransients –60 F T =25°C, Positivetransients V +100 A CC ±15-kVair-gapdischarge (IEC61000-4-2),I =45A Negativetransients –100 F I Channelleakagecurrent V =GNDtoV –1 1 nA IO I/O CC C Channelinputcapacitance V =5V,biasofV /2;ƒ=10MHz 1.5 pF IO CC CC (1) TypicalvaluesareatV =5VandT =25°C CC A (2) Channelclampvoltageisnotproductiontested. 6.7 Typical Characteristics 2.20 1000 2.00 pacitance (pF) 11..6800 age Current (pA) 100 Ca 1.40 ak 10 O Le I O 1.20 I 1.00 1 0.00 1.00 2.00 2.50 3.00 4.00 5.00 –40 25 45 65 85 IO Voltage (V) Temperature (°C) Figure1.IOCapacitancevsIOVoltage(VCC=5V) Figure2.IOLeakageCurrentvsTemperature(VCC=5V) 14 12 12 10 10 8 nt (A) 8 nt (A) 6 e e urr 6 urr C C 4 4 2 2 0 0 1 3 5 7 9 11 13 15 17 19 21 1 2 3 4 5 6 7 8 9 Voltage (V) Voltage (V) C003 C004 Figure3.TLPIOtoGND(DRSPackage) Figure4.TLPGNDtoIO(DRSPackage) Copyright©2006–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:TPD2E001

TPD2E001 SLLS684I–JULY2006–REVISEDMARCH2016 www.ti.com 7 Detailed Description 7.1 Overview The TPD2E001 is a two-channel transient voltage suppressor (TVS) based ESD protection diode array. The TPD2E001 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 Level 4 internationalstandard. 7.2 Functional Block Diagram V CC IO1 IO2 GND 7.3 Feature Description TPD2E001 is a uni-directional ESD protection device with low capacitance. The device is constructed with a central ESD clamp that features two hiding diodes per line to reduce the capacitive loading. This central ESD clamp is also connected to V to provide protection for the V line. Each IO line is rated to dissipate ESD CC CC strikes above the maximum level specified in the IEC 61000-4-2 level 4 international standard. The TPD2E001's lowloadingcapacitancemakesitidealforprotectionhigh-speedsignalterminals. 7.4 Device Functional Modes TPD2E001 is a passive integrated circuit that activates whenever voltages above V or below the lower diodes BR V (–0.6V) are present upon the circuit being protected. During ESD events, voltages as high as ±15 kV can forward be directed to ground and V via the internal diode network. Once the voltages on the protected lines fall below CC the trigger voltage of the TPD2E001 (usually within 10s of nanoseconds) the device reverts back to a high impedancestate. 6 SubmitDocumentationFeedback Copyright©2006–2016,TexasInstrumentsIncorporated ProductFolderLinks:TPD2E001

TPD2E001 www.ti.com SLLS684I–JULY2006–REVISEDMARCH2016 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 8.1 Application Information TPD2E001 is a diode array type Transient Voltage Suppressor (TVS) which is typically used to provide a path to ground for dissipating ESD events on hi-speed signal lines between a human interface connector and a system. As the current from ESD passes through the TVS, only a small voltage drop is present across the diode. This is the voltage presented to the protected IC. The low R of the triggered TVS holds this voltage, V , to a DYN CLAMP tolerableleveltotheprotectedIC. 8.2 Typical Application 0.1 µF V CC V BUS R T IO1 D+ USB R D1 Controller T D– IO2 GND GND Figure5. TypicalUSBApplicationDiagram 8.2.1 DesignRequirements Forthisdesignexample,asingleTPD2E001isusedtoprotectallpinsofaUSB2.0connector. GiventheUSBapplication,Table1showstheDesignParameters: Table1.DesignParameters DESIGNPARAMETER VALUE SignalrangeonIO1,andIO2 0Vto5V SignalvoltagerangeonV 0Vto5V CC Operatingfrequency 240MHz 8.2.2 DetailedDesignProcedure Tobeginthedesignprocess,someparametersmustbedecidedupon;thedesignerneedstoknowthefollowing: • Signalvoltagerangeonalltheprotectedlines • Operatingfrequency TheV pincanbeconnectedintwodifferentways: CC 1. If the V pin is connected to the system power supply, the TPD2E001 works as a transient suppressor for CC any signal swing above V + V . A 0.1-μF capacitor on the device V pin is recommended for ESD CC F CC Copyright©2006–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:TPD2E001

TPD2E001 SLLS684I–JULY2006–REVISEDMARCH2016 www.ti.com bypass. 2. If the V pin is not connected to the system power supply, the TPD2E001 can tolerate higher signal swing CC in the range up to 10 V. Please note that a 0.1-μF capacitor is still recommended at the V pin for ESD CC bypass. 8.2.2.1 SignalRangeonIO1andIO2andV Pins CC The TPD2E001 has 2 IO pins which support 0 to either 10 V or V + V (depending on if the V pin is CC forward CC connectedtoaV lineorhasa0.1µFcapacitortoground). CC 9 Power Supply Recommendations This device is a passive ESD protection device and there is no need to power it. Care should be taken to make surethatthemaximumvoltagespecificationsforeachlinearenotviolated. 10 Layout 10.1 Layout Guidelines • Theoptimumplacementisasclosetotheconnectoraspossible. – EMI during an ESD event can couple from the trace being struck to other nearby unprotected traces, resultinginearlysystemfailures. – The PCB designer needs to minimize the possibility of EMI coupling by keeping any unprotected traces awayfromtheprotectedtraceswhicharebetweentheTVSandtheconnector. • Routetheprotectedtracesasstraightaspossible. • Eliminate any sharp corners on the protected traces between the TVS and the connector by using rounded cornerswiththelargestradiipossible. – Electricfieldstendtobuilduponcorners,increasingEMIcoupling. 10.2 Layout Example Thisapplicationistypicalofadifferentialdatapairapplication,suchaUSB2.0. V CC IO2 IO1 GND = VIA to GND Figure6. RoutingWithDRLPackage 8 SubmitDocumentationFeedback Copyright©2006–2016,TexasInstrumentsIncorporated ProductFolderLinks:TPD2E001

TPD2E001 www.ti.com SLLS684I–JULY2006–REVISEDMARCH2016 11 Device and Documentation Support 11.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 11.2 Trademarks E2EisatrademarkofTexasInstruments. FireWireisatrademarkofAppleComputer,Inc. Allothertrademarksarethepropertyoftheirrespectiveowners. 11.3 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. 11.4 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©2006–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:TPD2E001

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPD2E001DRLR ACTIVE SOT-5X3 DRL 5 4000 Green (RoHS NIPDAUAG Level-1-260C-UNLIM -40 to 85 (2AR, 2AZ) & no Sb/Br) (2AH, 2AW) TPD2E001DRLRG4 ACTIVE SOT-5X3 DRL 5 4000 Green (RoHS NIPDAUAG Level-1-260C-UNLIM -40 to 85 (2AR, 2AZ) & no Sb/Br) (2AH, 2AW) TPD2E001DRSR ACTIVE SON DRS 6 1000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 ZWK & no Sb/Br) TPD2E001DRST-NM ACTIVE SON DRS 6 250 Green (RoHS SN Level-2-260C-1 YEAR -40 to 85 ZWKNM & no Sb/Br) TPD2E001DRYR ACTIVE SON DRY 6 5000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2A & no Sb/Br) TPD2E001DRYRG4 ACTIVE SON DRY 6 5000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2A & no Sb/Br) TPD2E001DZDR ACTIVE SOT-23 DZD 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 NFGO & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPD2E001 : •Automotive: TPD2E001-Q1 NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 15-Feb-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPD2E001DRLR SOT-5X3 DRL 5 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3 TPD2E001DRSR SON DRS 6 1000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPD2E001DRST-NM SON DRS 6 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPD2E001DRYR SON DRY 6 5000 180.0 9.5 1.2 1.65 0.7 4.0 8.0 Q1 TPD2E001DRYR SON DRY 6 5000 179.0 8.4 1.2 1.65 0.7 4.0 8.0 Q1 TPD2E001DZDR SOT-23 DZD 4 3000 179.0 8.4 3.15 2.6 1.2 4.0 8.0 Q3 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 15-Feb-2018 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPD2E001DRLR SOT-5X3 DRL 5 4000 183.0 183.0 20.0 TPD2E001DRSR SON DRS 6 1000 367.0 367.0 35.0 TPD2E001DRST-NM SON DRS 6 250 210.0 185.0 35.0 TPD2E001DRYR SON DRY 6 5000 189.0 185.0 36.0 TPD2E001DRYR SON DRY 6 5000 203.0 203.0 35.0 TPD2E001DZDR SOT-23 DZD 4 3000 203.0 203.0 35.0 PackMaterials-Page2

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GENERIC PACKAGE VIEW DRY 6 USON - 0.6 mm max height PLASTIC SMALL OUTLINE - NO LEAD Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4207181/G

PACKAGE OUTLINE DRY0006A USON - 0.6 mm max height SCALE 8.500 PLASTIC SMALL OUTLINE - NO LEAD B 1.05 A 0.95 PIN 1 INDEX AREA 1.5 1.4 0.6 MAX C SEATING PLANE 0.05 0.00 0.08 C 3X 0.6 SYMM (0.127) TYP (0.05) TYP 3 4 4X 0.5 SYMM 2X 1 6 1 0.25 6X 0.15 0.4 0.3 0.1 C A B 0.05 C PIN 1 ID (OPTIONAL) 0.35 5X 0.25 4222894/A 01/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com

EXAMPLE BOARD LAYOUT DRY0006A USON - 0.6 mm max height PLASTIC SMALL OUTLINE - NO LEAD SYMM (0.35) 5X (0.3) 1 6 6X (0.2) SYMM 4X (0.5) 4 3 (R0.05) TYP (0.6) LAND PATTERN EXAMPLE 1:1 RATIO WITH PKG SOLDER PADS EXPOSED METAL SHOWN SCALE:40X 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND EXPOSED EXPOSED METAL METAL SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS 4222894/A 01/2018 NOTES: (continued) 3. For more information, see QFN/SON PCB application report in literature No. SLUA271 (www.ti.com/lit/slua271). www.ti.com

EXAMPLE STENCIL DESIGN DRY0006A USON - 0.6 mm max height PLASTIC SMALL OUTLINE - NO LEAD SYMM (0.35) 5X (0.3) 1 6 6X (0.2) SYMM 4X (0.5) 4 3 (R0.05) TYP (0.6) SOLDER PASTE EXAMPLE BASED ON 0.075 - 0.1 mm THICK STENCIL SCALE:40X 4222894/A 01/2018 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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