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  • 型号: TPCA8051-H(T2L1,VM
  • 制造商: Toshiba America Electronic Components, Inc.
  • 库位|库存: xxxx|xxxx
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TPCA8051-H(T2L1,VM产品简介:

ICGOO电子元器件商城为您提供TPCA8051-H(T2L1,VM由Toshiba America Electronic Components, Inc.设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 TPCA8051-H(T2L1,VM价格参考。Toshiba America Electronic Components, Inc.TPCA8051-H(T2L1,VM封装/规格:晶体管 - FET,MOSFET - 单, 表面贴装 N 沟道 80V 28A(Ta) 1.6W(Ta),45W(Tc) 8-SOP Advance(5x5)。您可以下载TPCA8051-H(T2L1,VM参考资料、Datasheet数据手册功能说明书,资料中有TPCA8051-H(T2L1,VM 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

MOSFET N-CH 80V 28A 8-SOP ADV

产品分类

FET - 单

FET功能

标准

FET类型

MOSFET N 通道,金属氧化物

品牌

Toshiba Semiconductor and Storage

数据手册

http://www.semicon.toshiba.co.jp/info/docget.jsp?type=datasheet&lang=en&pid=TPCA8051-H点击此处下载产品Datasheet

产品图片

产品型号

TPCA8051-H(T2L1,VM

rohs

无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

-

不同Id时的Vgs(th)(最大值)

2.3V @ 1mA

不同Vds时的输入电容(Ciss)

7540pF @ 10V

不同Vgs时的栅极电荷(Qg)

91nC @ 10V

不同 Id、Vgs时的 RdsOn(最大值)

9.4 毫欧 @ 14A,10V

产品目录绘图

产品目录页面

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供应商器件封装

8-SOP 高级

其它名称

TPCA8051-H(T2L1VMDKR
TPCA8051-HTE12LQDKR
TPCA8051-HTE12LQDKR-ND

功率-最大值

45W

包装

Digi-Reel®

安装类型

表面贴装

封装/外壳

8-PowerVDFN

标准包装

1

漏源极电压(Vdss)

80V

电流-连续漏极(Id)(25°C时)

28A (Ta)

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PDF Datasheet 数据手册内容提取

TPCA8051-H TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (U-MOSⅥ-H) TPCA8051-H Switching Regulator Applications Unit: mm Motor Drive Applications 1.27 0.4 ± 0.1 DC-DC Converter Applications 8 0.05 MA 5 0.3 0.2 • Small footprint due to a small and thin package 0 ± 0 ± 0.15 ± 0.05 6. 5. • High-speed switching • Small gate charge: QSW = 18 nC (typ.) 1 4 0.595 ••• LLHooigwwh ld efroaarkiwnaa-gsreod uc turrcraerne OsnfNte:r -I rDaeSdsSims t=iat t1na0cn eμc: eAR: (D|mYSfa s(x|O )=N ( )9V 6=D SS6 . =0(t y8mp0Ω. )V ()t yp.) 0.95 0.05± 5.0 ± 0.2 0.166 0.05± A • Enhancement mode: Vth = 1.3 to 2.3 V (VDS = 10 V, ID = 1.0 mA) 0.05 S S 0.2 ± Absolute Maximum Ratings (Ta = 25°C) 1 4 1.1 1 0. Characteristic Symbol Rating Unit 0.6 ± 4.25 ± 0.2 0.2± 5 Drain-source voltage VDSS 80 V 3. Drain-gate voltage (RGS = 20 kΩ) VDGR 80 V 8 5 1 0. Gate-source voltage VGSS ±20 V 8 ± 0. DC (Note 1) ID 28 1,2,3:SOURCE 4 :GATE Drain current A Pulsed (Note 1) IDP 84 5,6,7,8:DRAIN Drain power dissipation (Tc = 25℃) PD 45 W JEDEC ⎯ Drain power dissipation (t = 10 s) JEITA ⎯ PD 2.8 W (Note 2a) TOSHIBA 2-5Q1A Drain power dissipation (t = 10 s) PD 1.6 W Weight: 0.069 g (typ.) (Note 2b) Single-pulse avalanche energy EAS 255 mJ (Note 3) Circuit Configuration Avalanche current IAR 28 A Repetitive avalanche energy 8 7 6 5 EAR 2.03 mJ (Tc = 25℃) (Note 4) Channel temperature Tch 150 °C Storage temperature range Tstg −55 to 150 °C Note: For Notes 1 to 4, refer to the next page. Using continuously under heavy loads (e.g. the application of high 1 2 3 4 temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). This transistor is an electrostatic-sensitive device. Handle with care. Start of commercial production 2008-10 1 2013-11-01

TPCA8051-H Thermal Characteristics Characteristic Symbol Max Unit Thermal resistance, channel to case Rth (ch-c) 2.78 °C/W (Tc = 25℃) Thermal resistance, channel to ambient Rth (ch-a) 44.6 °C/W (t = 10 s) (Note 2a) Thermal resistance, channel to ambient Rth (ch-a) 78.1 °C/W (t = 10 s) (Note 2b) Marking (Note 5) TPCA Part number 8051-H ※ Lot No. Note 1: Ensure that the channel temperature does not exceed 150°C. Note 2: (a) Device mounted on a glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b) FR-4 FR-4 25.4 × 25.4 × 0.8 25.4 × 25.4 × 0.8 (Unit: mm) (Unit: mm) (a) (b) Note 3: VDD = 24 V, Tch = 25°C (initial), L = 100 μH, RG = 25 Ω, IAR = 28 A Note 4: Repetitive rating: pulse width limited by maximum channel temperature Note 5: * Weekly code: (Three digits) Week of manufacture (01 for the first week of the year, continuing up to 52 or 53) Year of manufacture (The last digit of the year) 2 2013-11-01

TPCA8051-H Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Min Typ. Max Unit Gate leakage current IGSS VGS = ±20 V, VDS = 0 V ⎯ ⎯ ±100 nA Drain cutoff current IDSS VDS = 80 V, VGS = 0 V ⎯ ⎯ 10 μA V (BR) DSS ID = 10 mA, VGS = 0 V 80 ⎯ ⎯ Drain-source breakdown voltage V V (BR) DSX ID = 10 mA, VGS = −20 V 60 ⎯ ⎯ Gate threshold voltage Vth VDS = 10 V, ID = 1.0 mA 1.3 ⎯ 2.3 V VGS = 4.5 V, ID = 14 A ⎯ 6.4 9.8 Drain-source ON-resistance RDS (ON) mΩ VGS = 10 V, ID = 14 A ⎯ 6.0 9.4 Forward transfer admittance |Yfs| VDS = 10 V, ID = 14 A 48 96 ⎯ S Input capacitance Ciss ⎯ 5800 7540 Reverse transfer capacitance Crss VDS = 10 V, VGS = 0 V, f = 1 MHz ⎯ 150 210 pF Output capacitance Coss ⎯ 520 ⎯ Gate resistance rg VDS = 10 V, VGS = 0 V, f = 1 MHz ⎯ 1.0 1.5 Ω Rise time tr ⎯ 3.4 ⎯ VGS100 VV ID=14AVOUT Turn-on time ton Ω ⎯ 13 ⎯ Switching time Ω 2.9 ns Fall time tf 4.7 =L ⎯ 6.3 ⎯ R VDD ≈ 40 V Turn-off time toff Duty ≤ 1%, tw = 10 μs ⎯ 66 ⎯ Total gate charge VDD ≈ 64 V, VGS = 10 V, ID = 28 A ⎯ 91 ⎯ (gate-source plus gate-drain) Qg VDD ≈ 64 V, VGS = 5 V, ID = 28 A ⎯ 47 ⎯ Gate-source charge 1 Qgs1 ⎯ 16 ⎯ nC Gate-drain (“Miller”) charge Qgd VDD ≈ 64 V, VGS = 10 V, ID = 28 A ⎯ 11 ⎯ Gate switch charge QSW ⎯ 18 ⎯ Source-Drain Ratings and Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Min Typ. Max Unit Drain reverse current Pulse (Note 1) IDRP ⎯ ⎯ ⎯ 84 A Forward voltage (diode) VDSF IDR = 28 A, VGS = 0 V ⎯ ⎯ −1.2 V 3 2013-11-01

TPCA8051-H 4.5 3.2 3 ID – VDS 4.5 3.43.2 ID – VDS 20 50 10 2.8 2.7 Common source 10 3 2.9 Common source Ta = 25°C Ta = 25°C 2.9 Pulse test 3.1 Pulse test 16 40 A) 2.6 A) 2.8 ( ( D D I 12 I 30 ent ent 2.7 urr 8 2.5 urr 20 c c n n ai ai Dr VGS = 2.4 V Dr 2.6 4 10 VGS = 2.5 V 0 0 0 0.2 0.4 0.6 0.8 1 0 0.4 0.8 1.2 1.6 2 Drain-source voltage VDS (V) Drain-source voltage VDS (V) ID – VGS VDS – VGS 60 0.5 Common source Common source VDS = 10 V V) Ta = 25°C 50 Pulse test ( Pulse test A) S 0.4 ( 40 VD D I e 0.3 g ent 30 olta ain curr 20 Ta = −55°C ource v 0.2 ID = 28 A Dr 100 25 n-s 14 10 ai 0.1 Dr 7 0 0 0 1 2 3 4 5 0 2 4 6 8 10 Gate-source voltage VGS (V) Gate-source voltage VGS (V) ⎪Yfs⎪ – ID RDS (ON) – ID S) 1000 Common source 100 Common source ( VDS = 10 V Ta = 25°C Y| fs Pulse test ce Pulse test | 100 an nce Ta = −55°C esistm) Ω er admitta 10 100 25 urce ON-r (S (ON) 10 VGS = 4.5 V ansf n-soRD 10 ard tr 1 Drai w or F 0.1 1 0.1 1 10 100 0.1 1 10 100 Drain current ID (A) Drain current ID (A) 4 2013-11-01

TPCA8051-H RDS (ON) – Ta IDR – VDS 16 1000 Common source Common source e Pulse test (A) TPau l=s e2 5te°sCt anc 12 R 100 4.5 sist) Ω ID = 7, 14, 28 A ID 10 source ON-reR (mDS (ON) 8 VGS = 4.5 V ID = 7, 14, 28 A verse current 10 3 2 1 VGS = 0 V ain- 4 n re 1 Dr VGS = 10 V ai Dr 0 0.1 −80 −40 0 40 80 120 160 0 −0.2 −0.4 −0.6 −0.8 −1.0 −1.2 Ambient temperature Ta (°C) Drain-source voltage VDS (V) Capacitance – VDS Vth – Ta 10000 2.5 Ciss (V) 2.0 pF) V th C ( 1000 ge 1.5 ce Coss volta citan Crss hold 1.0 a 100 s p e Ca CVf =Go m1S m M=o H0nz V s ource ate thr 0.5 CVDomS m= o1n0 sVo urce G ID = 1 mA Ta = 25°C Pulse test 10 0 0.1 1 10 100 −80 −40 0 40 80 120 160 Drain-source voltage VDS (V) Ambient temperature Ta (°C) Dynamic input/output characteristics 100 20 Common source V) ID = 28 A V) (S 80 TPau l=s e2 5te°sCt 16 (S D G V V e 60 VDS = 64 V 12 e g g a a olt 16 32 olt e v 40 8 e v urc 32 VDD = 64 V urc o o Drain-s 20 16 4 Gate-s 0 0 0 40 80 120 160 Total gate charge Qg (nC) 5 2013-11-01

TPCA8051-H rth – tw 1000 (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy board (b) (Note 2b) e (3) Tc = 25℃ (2) c n a 100 d (1) e mpW) al iC/ m° 10 er ( nt thr th (3) e nsi 1 a Tr Single - pulse 0.1 0.001 0.01 0.1 1 10 100 1000 Pulse width tw (s) PD – Ta PD – Tc 3.0 50 (1) Device mounted on a glass-epoxy W) (1) (b2o) aDrde v(iac)e ( Nmootuen 2tead) on a glass-epoxy W) ( 2.5 board (b) (Note 2b) ( 40 D t = 10 s D P P n 2.0 n atio (2) atio 30 sip 1.5 sip s s di di 20 er 1.0 er w w o o p p n n 10 ai 0.5 ai Dr Dr 0 0 0 40 80 120 160 0 40 80 120 160 Ambient temperature Ta (°C) Case temperature TC (°C) Safe operating area 1000 100 ID max (Pulse) * A) t =1 ms* ( ID 10 t =10 ms* ent curr 1 n ai Dr * Single-pulse 0.1 Ta = 25℃ Curves must be derated linearly with increase in temperature. VDSS max 0.01 0.1 1 10 100 Drain-source voltage VDS (V) 6 2013-11-01

TPCA8051-H RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 7 2013-11-01