SMP50 / SMTPA / TPA Trisil™ for telecom equipment protection Features ■ Bidirectional crowbar protection ■ Voltage range from 62 V to 320 V ■ Low capacitance from 12 pF to 20 pF @ 50 V ■ Low leakage current : I = 2 µA max R SMA SMB ■ Holding current: I = 150 mA min (JEDEC DO-214AC) (JEDEC DO-214AA) H SMP50 SMTPA ■ Repetitive peak pulse current : I = 50 A (10/1000 µs) PP Main applications Telecommunication equipment such as: ■ Analog and digital line cards (xDSL, T1/E1, DO-15 ISDN, ...) TPA ■ Terminals (phone, fax, modem, ...) and central office equipment Description Order codes These Trisil series have been designed to protect Part Number Marking telecommunication equipment against lightning SMP50-xxx and transient induced by AC power lines. See Ordering Information TPAxxx on page9 They are available in SMA, SMB and DO-15 SMTPAxxx packages. Schematic Diagram Benefits Trisils are not subject to ageing and provide a fail safe mode in short circuit for a better protection. They are used to help equipment to meet various standards such as UL1950, IEC950 / CSA C22.2, UL1459 and FCC part 68. Trisils have UL94 V0 approved resin. SMA and SMB packages are JEDEC registered (DO-214AC and DO-214AA). Trisils are UL497B approved (file: E136224). TM: TRISIL is a trademark of STMicroelectronics June 2007 Rev 3 1/11 www.st.com 11

Characteristics SMP50 / SMTPA / TPA 1 Characteristics T able 1. Compliant with the following standards Peak Surge Required Minimum serial Waveform Current Standard Voltage peak current resistor to meet Voltage waveform (V) (A) standard (Ω) GR-1089 Core 2500 2/10 µs 500 2/10 µs 20 First level 1000 10/1000 µs 100 10/1000 µs 10 GR-1089 Core 5000 2/10 µs 500 2/10 µs 40 Second level GR-1089 Core 1500 2/10 µs 100 2/10 µs 0 Intra-building 6000 150 53 ITU-T-K20/K21 10/700 µs 5/310 µs 1500 37.5 0 ITU-T-K20 8000 ESD contact discharge 0 1/60 ns (IEC61000-4-2) 15000 ESD air discharge 0 4000 100 21.5 VDE0433 10/700 µs 5/310 µs 2000 50 0 4000 100 0 VDE0878 1.2/50 µs 1/20 µs 2000 50 0 4000 10/700 µs 100 5/310 µs 21.5 IEC61000-4-5 4000 1.2/50 µs 100 8/20 µs 0 FCC Part 68, lightning 1500 10/160 µs 200 10/160 µs 12.5 surge type A 800 10/560 µs 100 10/560 µs 6.5 FCC Part 68, lightning 1000 9/720 µs 25 5/320 µs 0 surge type B T able 2. Absolute ratings (T = 25° C) amb Symbol Parameter Value Unit 10/1000 µs 50 8/20 µs 150 10/560 µs 55 I Repetitive peak pulse current (see Figure1) 5/310 µs 65 A PP 10/160 µs 75 1/20 µs 100 2/10 µs 100 I Fail-safe mode : maximum current(1) 8/20 µs 2.5 kA FS t = 0.2 s 16 Non repetitive surge peak on-state current t = 1 s 11.5 I A TSM (sinusoidal) t = 2 s 10 t = 15 mn 3.5 t = 16.6 ms 6.2 I2t I2t value for fusing A2s t = 20 ms 6.5 T Storage temperature range -55 to 150 stg °C T Maximum junction temperature 150 j T Maximum lead temperature for soldering during 10 s. 260 °C L 1. in fail safe mode, the device acts as a short circuit 2/11

SMP50 / SMTPA / TPA Characteristics T able 3. Thermal resistances Value Symbol Parameter Unit DO-15 SMA SMB Junction to ambient (with recommended footprint R 100 120 100 °C/W th(j-a) or with L = 10 mm for DO-15) lead R Junction to leads (L = 10 mm for DO-15) 60 30 20 °C/W th(j-l) lead T able 4. Electrical characteristics - definitions (T = 25°C) amb Symbol Parameter V Stand-off voltage RM V Breakdown voltage BR V Breakover voltage BO I Leakage current RM I Peak pulse current PP I Breakover current BO I Holding current H V Continuous reverse voltage R I Leakage current at V R R C Capacitance 3/11

Characteristics SMP50 / SMTPA / TPA Table 5. E lectrical characteristics - values (T = 25°C) amb Dynamic Static Types I @ V I @ V (1) I (4) C(5) C(6) RM RM R R V (2) V @ I (3) H BO BO BO max. max. max. max. max. min. typ. typ. µA V µA V V V mA mA pF pF SMP50-62 / TPA62 56 62 85 82 20 40 SMTPA62 SMP50-68 / TPA68 61 68 93 90 20 40 SMTPA68 SMP50-100 / TPA100 90 100 135 133 16 35 SMTPA100 SMP50-120 / TPA120 108 120 160 160 16 30 SMTPA120 SMP50-130 / TPA130 117 130 173 173 14 30 SMTPA130 SMP50-180 / TPA180 2 5 800 150 162 180 235 240 14 25 SMTPA180 SMP50-200 / TPA200 180 200 262 267 12 25 SMTPA200 SMP50-220 / TPA220 198 220 285 293 12 25 SMTPA220 SMP50-240 / TPA240 216 240 300 320 12 25 SMTPA240 SMP50-270 / TPA270 243 270 350 360 12 25 SMTPA270 SMP50-320 / SMTPA320 290 320 400 400 12 25 1. I measured at V guarantee V min ≥ V R R BR R 2. See functional test circuit 1(Figure 9.) 3. See test circuit 2(Figure 10.) 4. See functional holding current test circuit 3(Figure 11.) 5. V = 50 V bias, V = 1 V, F = 1 MHz R RMS 6. V = 2 V bias, V = 1 V, F = 1 MHz R RMS Figure 1. Pulse waveform (10/1000 µs) Figure 2. Non repetitive surge peak on-state current versus overload duration %I Repetitive peak pulse current ITSM(A) PP tr = rise time (µs) 30 tp = pulse duration time (µs) 100 F=50Hz 25 20 50 15 10 5 0 t(s) t t t 0 r p 1E-2 1E-1 1E+0 1E+1 1E+2 1E+3 4/11

SMP50 / SMTPA / TPA Characteristics Figure 3. O n-state voltage versus on-state Figure 4. Relative variation of holding current (typical values) current versus junction temperature IT(A) IH[Tj] / IH[Tj=25°C] 50 2.0 1.8 20 Tj=25°C 1.6 1.4 10 1.2 1.0 5 0.8 0.6 0.4 2 VT(V) 0.2 Tj(°C) 1 0.0 0 1 2 3 4 5 6 7 8 9 10 -40 -20 0 20 40 60 80 100 120 Figure 5. Relative variation of breakover Figure 6. Relative variation of leakage voltage versus junction current versus reverse voltage temperature applied (typical values) VBO[Tj] /VBO[Tj=25°C] IRM[Tj] / IRM[Tj=25°C] 1.10 2000 VR=VRM 1000 1.05 100 1.00 270V 10 0.95 62V Tj(°C) Tj(°C) 0.90 1 -40 -20 0 20 40 60 80 100 25 50 75 100 125 Figure 7. V ariation of thermal impedance Figure 8. Relative variation of junction junction to ambient versus pulse capacitance versus reverse voltage duration (Printed circuit board FR4, applied (typical values) S = 35 µm, recommended pad Cu layout) Zth(j-a)(°C/W) C[VR] / C[VR=50V] 1E+2 2.5 Tj=25°C F=1MHz VRMS=1V 2.0 SMTPA /TPA 1E+1 1.5 SMP50 1.0 1E+0 0.5 tp(s) VR(V) 1E-1 0.0 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 1 2 5 10 20 50 100 300 5/11

Characteristics SMP50 / SMTPA / TPA Figure 9. Test circuit 1 for Dynamic I and V parameters BO BO 100V/µs,di/dt<10A/µs,Ipp=50A 2Ω 45Ω 83Ω 46 µH U 10 µF 66Ω 470Ω 0.36 nF KeyTek'System2' generatorwithPN246I module 1kV/µs,di/dt<10A/µs,Ipp=10A 26µH 250Ω 47Ω 46 µH U 60 µF 12Ω KeyTek'System2' generatorwithPN246I module Figure 10. Test circuit 2 for I and V parameters BO BO K ton = 20ms R1 = 140Ω R2 = 240Ω 220V 50Hz Vout DUT measVuBrOement 1/4 IBO measurement TEST PROCEDURE Pulse test duration (tp = 20ms): ● for Bidirectional devices = Switch K is closed ● for Unidirectional devices = Switch K is open VOUTselection: ● Device withVBO> 200V➔VOUT= 250VRMS, R1 = 140Ω ● Device withVBO≥200V➔VOUT= 480VRMS, R2 = 240Ω Figure 11. Test circuit 3 for dynamic I parameters H R Surge generator VBAT =-48V D.U.T This is a GO-NOGO test which allows to confirm the holding current (IH) level in a functional test circuit. TEST PROCEDURE 1/ Adjust the current level at the IHvalue by short circuiting the AK of the D.U.T. 2/ Fire the D.U.T.with a surge current➔IPP=10A,10/1000µs. 3/The D.U.T.will come back off-state within 50ms maximum. 6/11

SMP50 / SMTPA / TPA Ordering information scheme 2 Ordering information scheme SMP 50 - xxx Series SMP =Trisil surface mount in SMA SMTP =Trisil surface mount in SMB TP =Trisil in DO-15 Repetitive Peak Pulse Current A or 50 = 50 A Voltage 62 = 62V 3 Package information ● Epoxy meets UL94, V0 T able 6. SMA dimensions Dimensions Ref. Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 D A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 E c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 A1 E 4.80 5.35 0.189 0.211 C A2 L b E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 Figure 12. Footprint, dimensions in mm (inches) 1.4 2.63 1.4 (0.055) (0.103) (0.055) 1.64 (0.064) 5.43 (0.214) 7/11

Package information SMP50 / SMTPA / TPA T able 7. SMB dimensions Dimensions Ref. Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 D A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 E c 0.15 0.40 0.006 0.016 A1 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 C A2 L b D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 Figure 13. Footprint, dimensions in mm (inches) 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.300) T able 8. DO-15 dimensions Dimensions C A C Ref. Millimeters Inches Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 D B C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/11

SMP50 / SMTPA / TPA Ordering Information 4 Ordering Information Part Number Marking Package Weight Base qty Delivery mode SMP50-62 V06 SMP50-68 V07 SMP50-100 V10 SMP50-120 V12 SMP50-130 V13 SMP50-180 V18 SMA 0.068 g 5000 Tape & reel SMP50-200 V20 SMP50-220 V22 SMP50-240 V24 SMP50-270 V27 SMP50-320 V32 SMTPA62 U01 SMTPA68 U05 SMTPA100 U13 SMTPA120 U17 SMTPA130 U19 SMTPA180 U25 SMB 0.11 g 2500 Tape & reel SMTPA200 U27 SMTPA220 U31 SMTPA240 U35 SMTPA270 U39 SMTPA320 U47 TPA62 1000 Ammopack TPA62 TPA62RL 6000 Tape & reel TPA68 1000 Ammopack TPA68 TPA68RL 6000 Tape & reel TPA100 1000 Ammopack TPA100 TPA100RL 6000 Tape & reel TPA120 TPA120 1000 Ammopack TPA130 1000 Ammopack TPA130 TPA130RL 6000 Tape & reel TPA180 DO-15 0.40 g 1000 Ammopack TPA180 TPA180RL 6000 Tape & reel TPA200 1000 Ammopack TPA200 TPA200RL 6000 Tape & reel TPA220 1000 Ammopack TPA220 TPA220RL 6000 Tape & reel TPA240 1000 Ammopack TPA240 TPA240RL 6000 Tape & reel TPA270 1000 Ammopack TPA270 TPA270RL 6000 Tape & reel 9/11

Revision History SMP50 / SMTPA / TPA 5 Revision History Date Revision Description of Changes 16-Nov-2004 1 SMP50, SMTPA and TPA datasheets merge. Reformatted to current standards. Updated I value in PP Table 2 . Added part numbers SMP50-320 and 30-Mar-2007 2 SMTPA320. Updated dimensions and footprint for SMA and footprint for SMB. Corrected typographical error in part number. Added 12-Jun-2007 3 dimensions in inches to footprint illustrations. 10/11

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