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TNPW0805100KBXEN产品简介:
ICGOO电子元器件商城为您提供TNPW0805100KBXEN由Vishay设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 TNPW0805100KBXEN价格参考¥6.94-¥6.94。VishayTNPW0805100KBXEN封装/规格:芯片电阻 - 表面安装, 100 kOhms ±0.1% 0.2W,1/5W 薄膜 芯片电阻 0805(2012 公制) 耐硫,汽车级 AEC-Q200 汽车认证,防潮 薄膜。您可以下载TNPW0805100KBXEN参考资料、Datasheet数据手册功能说明书,资料中有TNPW0805100KBXEN 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | RES 100K OHM 1/8W 0.1% 0805 |
产品分类 | |
品牌 | Vishay Dale |
数据手册 | |
产品图片 | |
产品型号 | TNPW0805100KBXEN |
rohs | 无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | TNPW |
产品目录绘图 | |
供应商器件封装 | 0805 |
其它名称 | 541-1729-1 |
功率(W) | 0.125W,1/8W |
包装 | 剪切带 (CT) |
大小/尺寸 | 0.079" 长 x 0.049" 宽(2.00mm x 1.25mm) |
容差 | ±0.1% |
封装/外壳 | 0805(2012 公制) |
成分 | |
标准包装 | 1 |
温度系数 | ±15ppm/°C |
特性 | 耐硫,获得 AEC-Q200 汽车认证、 防潮 |
电阻(Ω) | 100k |
端子数 | 2 |
高度 | 0.022"(0.55mm) |
TNPW e3 www.vishay.com Vishay High Stability Thin Film Flat Chip Resistors FEATURES • Superior moisture resistivity (85 °C; 85 % RH) • Excellent overall stability at different environmental conditions 0.05 % (1000 h rated power at 70 °C) • AEC-Q200 qualified (sizes 0402 to 1206) • Single lot date code (optional) • Sulfur resistance verified according to ASTM B 809 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Test and measuring equipment TNPW e3 precision thin film flat chip resistors are the perfect • Medical equipment choice for most fields of modern electronics where highest reliability and stability is of major concern. Typical • Industrial equipment applications include test and measuring equipment, medical • Automotive equipment, industrial, and automotive. TECHNICAL SPECIFICATIONS DESCRIPTION TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3 (1) Imperial size 0402 0603 0805 1206 1210 Metric size code RR1005M RR1608M RR2012M RR3216M RR3225M Resistance range 10 to 100 k 4.7 to 332 k 4.7 to 1 M 4.7 to 2 M 10 to 3.01 M Resistance tolerance ± 1 %; ± 0.5 %; ± 0.1 % Temperature coefficient ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K Rated dissipation, P (2) 0.100 W 0.125 W 0.200 W 0.400 W 0.500 W 70 Operating voltage, U AC or DC 50 V 75 V 150 V 200 V 200 V max. RMS Permissible film temperature, F max. (2) 155 °C Operating temperature range -55 °C to 155 °C Permissible voltage against ambient (insulation): 1 min; U 75 V 100 V 200 V 300 V 300 V ins Failure rate: FITobserved 0.1 x 10-9/h Notes (1) The detail specification EN 140401-801 does not cover this product size. (2) Please refer to APPLICATION INFORMATION, see next page. APPLICATION INFORMATION When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Revision: 12-May-16 1 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TNPW e3 www.vishay.com Vishay MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION OPERATION MODE STANDARD POWER TNPW0402 e3 0.063 W 0.100 W TNPW0603 e3 0.100 W 0.125 W Rated dissipation, P TNPW0805 e3 0.125 W 0.200 W 70 TNPW1206 e3 0.250 W 0.400 W TNPW1210 e3 0.330 W 0.500 W Operating temperature range -55 °C to 125 °C -55 °C to 155 °C Permissible film temperature, F max. 125 °C 155 °C TNPW0402 e3 10 to 100 k 10 to 100 k TNPW0603 e3 4.7 to 332 k 4.7 to 332 k TNPW0805 e3 4.7 to 1 M 4.7 to 1 M TNPW1206 e3 4.7 to 2 M 4.7 to 2 M Max. resistance change at P70 for resistance range, |R/R| after: TNPW1210 e3 10 to 3.01 M 10 to 3.01 M 1000 h 0.05 % 0.10 % 8000 h 0.10 % 0.20 % 225 000 h 0.30 % 0.60 % Note • The presented operation modes do not refer to different types of resistors, but actually show examples of different loads, that lead to different film temperatures and different achievable load-life stability (drift) of the resistance value. A suitable low thermal resistance of the circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits. Please consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) for information on the general nature of thermal resistance. Revision: 12-May-16 2 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TNPW e3 www.vishay.com Vishay TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES ± 1 % 10 to 100 k E24; E96 ± 50 ppm/K ± 0.5 % 10 to 100 k E24; E192 ± 0.1 % 47 to 100 k ± 1 % 10 to 100 k E24; E96 TNPW0402 e3 ± 25 ppm/K ± 0.5 % 10 to 100 k ± 0.1 % E24; E192 ± 15 ppm/K ± 0.1 % 47 to 100 k ± 10 ppm/K ± 0.1 % ± 1 % 4.7 to 332 k E24; E96 ± 50 ppm/K ± 0.5 % 4.7 to 332 k E24; E192 ± 0.1 % ± 1 % 4.7 to 332 k E24; E96 TNPW0603 e3 ± 25 ppm/K ± 0.5 % 4.7 to 332 k ± 0.1 % E24; E192 ± 15 ppm/K ± 0.1 % 47 to 332 k ± 10 ppm/K ± 0.1 % ± 1 % 4.7 to 1 M E24; E96 ± 50 ppm/K ± 0.5 % 4.7 to 1 M E24; E192 ± 0.1 % ± 1 % 4.7 to 1 M E24; E96 TNPW0805 e3 ± 25 ppm/K ± 0.5 % 4.7 to 1 M ± 0.1 % E24; E192 ± 15 ppm/K ± 0.1 % 47 to 1 M ± 10 ppm/K ± 0.1 % ± 1 % 4.7 to 2 M E24; E96 ± 50 ppm/K ± 0.5 % 4.7 to 2 M E24; E192 ± 0.1 % ± 1 % 4.7 to 2 M E24; E96 TNPW1206 e3 ± 25 ppm/K ± 0.5 % 4.7 to 2 M ± 0.1 % E24; E192 ± 15 ppm/K ± 0.1 % 47 to 2 M ± 10 ppm/K ± 0.1 % ± 1 % 10 to 3.01 M E24; E96 ± 50 ppm/K ± 0.5 % 10 to 3.01 M E24; E192 ± 0.1 % 47 to 2.13 M ± 1 % 10 to 3.01 M E24; E96 TNPW1210 e3 ± 25 ppm/K ± 0.5 % 10 to 3.01 M ± 0.1 % E24; E192 ± 15 ppm/K ± 0.1 % 47 to 2.13 M ± 10 ppm/K ± 0.1 % Revision: 12-May-16 3 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TNPW e3 www.vishay.com Vishay PACKAGING PACKAGING PACKAGING TYPE / SIZE CODE QUANTITY WIDTH PITCH STYLE DIMENSIONS EP1 = EP 1000 (1) TNPW0402 e3 ET2 = EI 5000 2 mm Ø 180 mm/7" ET7 = ED 10 000 Paper tape acc. 8 mm IEC 60286-3, Type 1a E52 = EN 1000 (1) TNPW0603 e3 4 mm Ø 180 mm/7" TNPW0805 e3 ET1 = EA 5000 TNPW1206 e3 TNPW1210 e3 ET6 = EC (2) 20 000 4 mm Ø 330 mm/13" Notes (1) 1000 pieces packaging is available only for precision resistors with tolerance ± 0.1 % and temperature coefficient ± 25 ppm/K. (2) 20 000 pieces packaging is available only for resistors with TCR ± 25 ppm/K and ± 50 ppm/K. PART NUMBER AND PRODUCT DESCRIPTION Part Number: TNPW12061K32DEEA T N P W 1 2 0 6 1 K 3 2 D E E A TYPE/SIZE RESISTANCE TOLERANCE TCR PACKAGING SPECIAL TNPW0402 R = decimal B = ± 0.1 % H = ± 50 ppm/K EI Up to 2 digits TNPW0603 K = thousand D = ± 0.5 % E = ± 25 ppm/K EP Blank = standard TNPW0805 M = million F = ± 1.0 % X = ± 15 ppm/K EA 0H = single lot date TNPW1206 (4 digits) Y = ± 10 ppm/K EC code TNPW1210 ED EN (E.. = lead-free) Product Description: TNPW1206 1K32 0.5 % T-9 ET1 e3 TNPW1206 1K32 0.5 % T-9 ET1 e3 TYPE/SIZE RESISTANCE TOLERANCE TCR PACKAGING LEAD (Pb)-FREE TNPW0402 Examples: ± 0.1 % T-2 = ± 50 ppm/K EP1 e3 = pure tin TNPW0603 54R1 = 54.1 ± 0.5 % T-9 = ± 25 ppm/K ET1 termination finish TNPW0805 1K32 = 1320 ± 1.0 % T-10 = ± 15 ppm/K ET2 TNPW1206 T-13 = ± 10 ppm/K ET6 BV 20545 = single TNPW1210 ET7 lot date code E52 Note • The product can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION. Revision: 12-May-16 4 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TNPW e3 www.vishay.com Vishay DESCRIPTION MATERIALS Production is strictly controlled and follows an extensive set Vishay acknowledges the following systems for the of instructions established for reproducibility. A regulation of hazardous substances: homogeneous film of special metal alloy is deposited on a • IEC 62474, Material Declaration for Products of and for the high grade ceramic substrate (AI2O3) and conditioned to Electrotechnical Industry, with the list of declarable achieve the desired temperature coefficient. Specially substances given therein (2) designed inner contacts are deposited on both sides. A • The Global Automotive Declarable Substance List special laser is used to achieve the target value by smoothly (GADSL) (3) fine trimming the resistive layer without damaging the • The REACH regulation (1907/2006/EC) and the related list ceramics. A further conditioning is applied in order to of substances with very high concern (SVHC) (4) for its stabilize the trimming result. The resistor elements are supply chain covered by a protective coating designed for electrical, The products do not contain any of the banned substances mechanical and climatic protection. The terminations as per IEC 62474, GADSL, or the SVHC list, see receive a final pure tin on nickel plating. www.vishay.com/how/leadfree. The result of the determined production is verified by an Hence the products fully comply with the following extensive testing procedure and optical inspection directives: performed on 100 % of the individual chip resistors. This includes full screening for the elimination of products with a • 2000/53/EC End-of-Life Vehicle Directive (ELV) and potential risk of early life failures (feasible for R 10 ). Only Annex II (ELV II) accepted products are laid directly into the tape in • 2011/65/EU Restriction of the Use of Hazardous accordance with IEC 60286-3, Type 1a (1). Substances Directive (RoHS) with amendment 2015/863/EU ASSEMBLY • 2012/19/EU Waste Electrical and Electronic Equipment The resistors are suitable for processing on automatic SMD Directive (WEEE) assembly systems. They are suitable for automatic Vishay pursues the elimination of conflict minerals from its soldering using wave, reflow or vapour phase as shown in supply chain, see the Conflict Minerals Policy at IEC 61760-1 (1). The encapsulation is resistant to all www.vishay.com/doc?49037. cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. RELATED PRODUCTS The suitability of conformal coatings, potting compounds The TNPW with SnPb termination plating is designed for and their processes, if applied, shall be qualified by those applications, where lead bearing terminations are appropriate means to ensure the long-term stability of the mandatory. For ordering TNPW with SnPb terminations whole system. please refer to latest edition of datasheet TNPW The resistors are RoHS-compliant, the pure tin plating (www.vishay.com/doc?31006). provides compatibility with lead (Pb)-free and TNPU e3 ultra precision thin film flat chip resistors combine lead-containing soldering processes. Solderability is the proven reliability of TNPW e3 products with a most specified for 2 years after production or requalification. The advanced level of precision and stability permitted storage time is 20 years. The immunity of the (www.vishay.com/doc?28779). plating against tin whisker growth has been proven under TNPS .... ESCC high-reliability thin film chip resistors are the extensive testing. premium choice for design and manufacture of equipment, where matured technology and proven reliability are of utmost importance. They are regularly used in communication and research satellites and fit equally well into aircraft and military electronic systems. Approval of the TNPS .... ESCC products is granted by the European Space Components Coordination and registered in the ESCC Qualified Parts List, REP005 (www.vishay.com/doc?28789). TNPV e3 High Voltage Thin Film Flat Chip Resistors are designed for most fields of modern electronics where precision, reliability and stability at high operating voltage are primary concerns (www.vishay.com/doc?28881). Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents. (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474. (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org. (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table. Revision: 12-May-16 5 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TNPW e3 www.vishay.com Vishay FUNCTIONAL PERFORMANCE B 3 n d120 V/V 2 on-Linearity iA311910000 TTTTNNNNPPPPWWWW1000286400006532 eeee3333 µurrent Noise in 00..153 TNPW0402 e3 TNTPNWP0W600830 e53 e 3 N C 0.1 TNPW1206 e3 80 0.05 0.03 70 60 0.01 10 100 1K 10K 100K 100 1K 10K 100K 1M Resistance Value in Ω Resistance Value in Ω Non-Linearity Current Noise 60 60 ϑ° TNPW0603 e3 % TNPW0603 e3 se Angle in 2400 10 Ω [Z]-RO inRO4200 10 Ω ha 0 0 100 Ω P 100 Ω 1 k Ω - 20 1 k Ω - 40 - 40 4.75 k Ω - 60 4.75 k Ω - 60 10 k Ω -80 10 k Ω -80 1 5 10 50100 500 1000 1 5 10 50 100 500 1000 Frequency f in MHz Frequency f in MHz HF Performance (1) HF Performance (1) 60 60 ϑ° TNPW0805 e3 % TNPW0805 e3 n 40 n 40 e i O i gl RO se An 20 10 Ω [Z]-R20 10 Ω Pha 0 100 Ω 0 110 0k ΩΩ - 20 - 20 1 k Ω - 40 - 40 - 60 - 60 10 k Ω -80 10 k Ω -80 1 5 10 50 100 500 1000 1 5 10 50 100 500 1000 Frequency f in MHz Frequency f in MHz HF Performance (1) HF Performance (1) Note (1) Typical figures. HF-characteristic also depends on termination and circuit design. Revision: 12-May-16 6 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TNPW e3 www.vishay.com Vishay FUNCTIONAL PERFORMANCE 0.6 P on W TNPW0402 e3 ati 0.5 TNPW0603 e3 p si TNPW0805 e3 Dis 0.4 TNPW1206 e3 r TNPW1210 e3 e w 0.3 o P 0.2 0.1 0 -55 0 50 100 125 °C 155 70 Ambient Temparature ϑ amb Derating - Standard Operation 0.6 P on W TNPW0402 e3 ati 0.5 TNPW0603 e3 p si TNPW0805 e3 Dis 0.4 TNPW1206 e3 r TNPW1210 e3 e w 0.3 o P 0.2 0.1 0 -55 0 50 100 125 °C 155 70 Ambient Temparature ϑ amb Derating - Power Operation Note • The solid line is based on IEC/EN reference test conditions which is considered as standard mode. However, above that the maximum permissible film temperature is 155 °C (dashed line). Revision: 12-May-16 7 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TNPW e3 www.vishay.com Vishay FUNCTIONAL PERFORMANCE V 3K V 3K age in 1K TNPW0805 e3 age in 1K TNPW0805 e3 olt olt V V st TNPW0603 e3 st e e T T TNPW0603 e3 100 100 10 10 10R 100R 1K 10K 100K 10R 100R 1K 10K 100K Resistance VainluΩe Resistance VainluΩe Single-Pulse High Voltage Overload Single-Pulse High Voltage Overload Test 1.2/50 μs EN140000 4.27 Test 10/700 μs EN140000 4.27 100W 100W Pi, max. TTNNPPWW10820056 ee33 Pi, max. TNPW1206 e3 wer 10W TNPW0603 e3 wer 10W TNPW0805 e3 o o p p TNPW0603 e3 e e s s ul ul p p e e bl 1W bl 1W si si s s mi mi Conditions: er Conditions: er P ≤P (including derating) P P 0, n ≤ 1000 and Ui≤Ui, max. P anmdaxU.i≤mUaix, .max. 0.1W 0.1W 10 µs 100 µs 1 ms 10 ms 100 ms 1 s 10 s 10 µs 100 µs 1 ms 10 ms 100 ms 1 s 10 s Pulse Duration t Pulse Duration t i i Maximum Pulse Load P Maximum Pulse Load P i, max. i, max. for Single Pulses for Continuous Pulses 10 000 V max. Ui, e g olta1000V TNPW1206 e3 v se TNPW0805 e3 ul p TNPW0603 e3 e bl 100V si s mi er Conditions: P P≤P i i, max. 10V 10 µs 100 µs 1 ms 10 ms 100 ms 1 s 10 s Pulse Duration t i Maximum Pulse Voltage U i, max. Revision: 12-May-16 8 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TNPW e3 www.vishay.com Vishay TEST AND REQUIREMENTS All tests are carried out in accordance with the following The testing also covers most of the requirements specified specifications: by EIA / ECA-703 and JIS-C-5201-1. EN 60115-1, generic specification The tests are carried out under standard atmospheric EN 60115-8 (successor of EN 140400), sectional conditions in accordance with IEC 60068-1, 4.3, whereupon specification the following values are applied: EN 140401-801, detail specification Temperature: 15 °C to 35 °C IEC 60068-2-xx, test methods Relative humidity: 25 % to 75 % The parameters stated in the Test Procedures and Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar) Requirements table are based on the required tests and A climatic category LCT / UCT / 56 is applied, defined by the permitted limits of EN 140401-801. The table presents only lower category temperature (LCT), the upper category the most important tests, for the full test schedule refer to temperature (UCT), and the duration of exposure in the the documents listed above. However, some additional damp heat, steady state test (56 days). tests and a number of improvements against those The components are mounted for testing on printed circuit minimum requirements have been included. boards in accordance with EN 60115-8, 2.4.2, unless otherwise specified. TEST PROCEDURES AND REQUIREMENTS EN 60115-1 IEC 60068-2 (1) REQUIREMENTS TEST PROCEDURE CLAUSE TEST METHOD PERMISSIBLE CHANGE (R) Stability for product types: TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3 4.5 - Resistance - ± 1 %; ± 0.5 %; ± 0.1 % Temperature At (20 / -55 / 20) °C ± 50 ppm/K; ± 25 ppm/K; 4.8 - coefficient and (20 / 125 / 20) °C ± 15 ppm/K; ± 10 ppm/K U = P x R or U = U ; Endurance 70 max. whichever is the less severe; at 70 °C: 1.5 h on; 0.5 h off; standard operation 70 °C; 1000 h ± (0.05 % R + 0.01 ) mode 70 °C; 8000 h ±(0.1 % R + 0.02 ) 4.25.1 - U = P x R or U = U ; Endurance 70 max. whichever is the less severe; at 70 °C: 1.5 h on; 0.5 h off; power operation 70 °C; 1000 h ± (0.1 % R + 0.01 ) mode 70 °C; 8000 h ±(0.2 % R + 0.02 ) Endurance at 125 °C; 1000 h ± (0.05 % R + 0.01 ) 4.25.3 - upper category temperature 155 °C; 1000 h ± (0.1 % R + 0.02 ) Damp heat, (40 ± 2) °C; 56 days; 4.24 78 (Cab) ± (0.1 % R + 0.01 ) steady state (93 ± 3) % RH Damp heat, steady state (85 ± 2) °C accelerated: (85 ± 5) % RH 4.37 67 (Cy) ± (0.25 % R + 0.05 ) Standard U = 0.1 x P x R; 70 opmeoradteion U 0.3 x Umax.; 1000 h - 1 (Ab) Cold - 55 °C; 2 h ± (0.05 % R + 0.01 ) Revision: 12-May-16 9 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TNPW e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 IEC 60068-2 (1) REQUIREMENTS TEST PROCEDURE CLAUSE TEST METHOD PERMISSIBLE CHANGE (R) Stability for product types: TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3 30 min at LCT and 30 min at UCT; Rapid change 4.19 14 (Na) LCT = - 55 °C; UCT = 125 °C; ± (0.1 % R + 0.01 ) of temperature 1000 cycles Short time U = 2.5 x P x R overload: 70 or U = 2 x U ; standard max. ± (0.05 % R + 0.01 ) whichever is the less severe; operation 5 s mode 4.13 - Short time U = 2.5 x P x R overload: 70 or U = 2 x U ; power max. ± (0.1 % R + 0.01 ) whichever is the less severe; operation 5 s mode Single pulse Severity no. 4: high voltage U = 10 x P x R or overload: 70 ± (0.5 % R + 0.02 ) U = 2 x U ; standard max. no visible damage operation whichever is the less severe; mode 10 pulses 10 μs/700 μs 4.27 - Single pulse Severity no. 4: high voltage U = 10 x P x R or overload: 70 ± (1 % R + 0.02 ) U = 2 x U ; power max. no visible damage operation whichever is the less severe; mode 10 pulses 10 μs/700 μs Periodic U = 15 x P x R electric 70 or U = 2 x U ; overload: max. ± (0.5 % R + 0.05 ) 0.1 s on; 2.5 s off; standard no visible damage whichever is the less severe; operation 1000 cycles mode 4.39 - Periodic U = 15 x P x R electric 70 or U = 2 x U ; overload: max. ± (1 % R + 0.05 ) 0.1 s on; 2.5 s off; power no visible damage whichever is the less severe; operation 1000 cycles mode IEC 61340-3-1 (1); 3 pos. + 3 neg. Electro static (equivalent to MIL-STD-883, method discharge 3015) 4.38 - ±(0.5 % R + 0.05 ) (human body TNPW0402 e3: 400 V model) TNPW0603 e3: 1000 V TNPW0805 e3: 1500 V TNPW 1206 e3: 2000 V Endurance by sweeping; 10 Hz to 2000 Hz; ± (0.05 % R + 0.01 ) 4.22 6 (Fc) Vibration no resonance; no visible damage amplitude 1.5 mm or 200 m/s2; 7.5 h Revision: 12-May-16 10 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TNPW e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 IEC 60068-2 (1) REQUIREMENTS TEST PROCEDURE CLAUSE TEST METHOD PERMISSIBLE CHANGE (R) Stability for product types: TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3 Solder bath method; SnPb40; non-activated flux (215 ± 3) °C; (3 ± 0.3) s Good tinning ( 95 % covered); 4.17 58 (Td) Solderability Solder bath method; no visible damage SnAg3Cu0.5 or SnAg3.5; non-activated flux (235 ± 3) °C; (2 ± 0.2) s Resistance to Solder bath method; 4.18 58 (Td) ± (0.02 % R + 0.01 ) soldering heat (260 ± 5) °C; (10 ± 1) s Component 4.29 45 (XA) solvent Isopropyl alcohol + 50 °C; method 2 No visible damage resistance TNPW0402 e3 and TNPW0603 e3: 9 N Shear 4.32 21 (Ue ) No visible damage 3 (adhesion) TNPW0805 e3 and TNPW1206 e3: 45 N ± (0.05 % R + 0.01 ) Substrate 4.33 21 (Ue ) Depth 2 mm, 3 times no visible damage, 1 bending no open circuit in bent position 4.7 - Voltage proof U = U ; 60 ± 5 s No flashover or breakdown RMS ins IEC 60695-11-5 (1), 4.35 - Flammability No burning after 30 s needle flame test; 10 s Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents. Revision: 12-May-16 11 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TNPW e3 www.vishay.com Vishay DIMENSIONS T t T b DIMENSIONS AND MASS L W H T/T MASS TYPE / SIZE t b (mm) (mm) (mm) (mm) (mg) TNPW0402 e3 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.2 ± 0.10 0.65 TNPW0603 e3 1.55 ± 0.05 0.85 ± 0.10 0.45 ± 0.10 0.3 ± 0.20 2 TNPW0805 e3 2.0 ± 0.1 1.25 ± 0.15 0.45 ± 0.10 0.4 ± 0.20 5.5 TNPW1206 e3 3.2 + 0.1 / - 0.2 1.6 ± 0.15 0.55 ± 0.10 0.5 ± 0.25 10 TNPW1210 e3 3.2 + 0.1 / - 0.2 2.45 ± 0.15 0.60 ± 0.15 0.5 ± 0.25 16 SOLDER PAD DIMENSIONS RECOMMENDED SOLDER PAD DIMENSIONS REFLOW SOLDERING WAVE SOLDERING TYPE / SIZE a b l a b l (mm) (mm) (mm) (mm) (mm) (mm) TNPW0402 e3 0.4 0.6 0.5 - - - TNPW0603 e3 0.5 0.9 1.0 0.9 0.9 1.0 TNPW0805 e3 0.7 1.3 1.2 0.9 1.3 1.3 TNPW1206 e3 0.9 1.7 2.0 1.1 1.7 2.3 TNPW1210 e3 0.9 2.5 2.0 1.1 2.5 2.3 Revision: 12-May-16 12 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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