TNPW e3 www.vishay.com Vishay High Stability Thin Film Flat Chip Resistors FEATURES • Superior moisture resistivity (85 °C; 85 % RH) • Excellent overall stability at different environmental conditions  0.05 % (1000 h rated power at 70 °C) • AEC-Q200 qualified • Single lot date code (optional) • Sulfur resistance verified according to ASTM B 809 • Material categorization: for definitions of complianc e please see www.vishay.com/doc?99912 APPLICATIONS TNPW e3 precision thin film flat chip resistors are the perfect • Automotive choice for most fields of modern electronics where highest reliability and stability is of major concern. Typical • Industrial equipment applications include automotive, industrial, test an d • Test and measuring equipment measuring equipment, and medical equipment. • Medical equipment TECHNICAL SPECIFICATIONS DESCRIPTION TNPW0201 e3 TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3 Imperial size 0201 0402 0603 0805 1206 1210 Metric size code RR0603M RR1005M RR1608M RR2012M RR3216M RR3225M Resistance range 22  to 40 k 10  to 100 k 1  to 332 k 1  to 1 M 1  to 2 M 10  to 3.01 M Resistance tolerance ± 0.5 %; ± 0.1 % ± 1 %; ± 0.5 %; ± 0.1 % Temperature coefficient ± 25 ppm/K ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K Rated dissipation, P (1) 0.075 W 0.100 W 0.125 W 0.200 W 0.400 W 0.500 W 70 Operating voltage, 25 V 50 V 75 V 150 V 200 V 200 V U AC or DC max. RMS Permissible film 155 °C temperature, F max. (1) Operating temperature range -55 °C to 155 °C Internal thermal resistance (1) - 90 K/W 63 K/W 38 K/W 32 K/W - Permissible voltage against ambient (insulation): 1 min; U 50 V 75 V 100 V 200 V 300 V 300 V ins Failure rate: FITobserved  0.1 x 10-9/h Note (1) Please refer to APPLICATION INFORMATION APPLICATION INFORMATION When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded. Please consider the application note “Thermal Management in Surface-Mounted Resistor Applications ” (www.vishay.com/doc?28844) for information on the general nature of thermal resistance. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drif t increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Revision: 23-Oct-2020 1 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPW e3 www.vishay.com Vishay MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION OPERATION MODE STANDARD POWER TNPW0201 e3 0.050 W 0.075 W TNPW0402 e3 0.063 W 0.100 W TNPW0603 e3 0.100 W 0.125 W Rated dissipation, P 70 TNPW0805 e3 0.125 W 0.200 W TNPW1206 e3 0.250 W 0.400 W TNPW1210 e3 0.330 W 0.500 W Operating temperature range -55 °C to 125 °C -55 °C to 155 °C Permissible film temperature, F max. 125 °C 155 °C TNPW0201 e3 22  to 40 k 22  to 40 k TNPW0402 e3 10  to 100 k 10  to 100 k TNPW0603 e3 1  to 332 k 1  to 332 k TNPW0805 e3 1  to 1 M 1  to 1 M Max. resistance change at P70 for resistance range, TNPW1206 e3 1  to 2 M 1  to 2 M |R/R| after: TNPW1210 e3 10  to 3.01 M 10  to 3.01 M 1000 h  0.05 %  0.10 % 8000 h  0.10 %  0.20 % 225 000 h  0.30 %  0.60 % Note • The presented operation modes do not refer to different types of resistors, but actually show examples of different loads, that lead to different film temperatures and different achievable load-life stability (drift) of the resistance value. A suitable low thermal resistance of th e circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits. Please consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) for information on the general nature of thermal resistance Revision: 23-Oct-2020 2 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPW e3 www.vishay.com Vishay TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES ± 0.5 % 22  to 40 k TNPW0201 e3 ± 25 ppm/K E24; E192 ± 0.1 % 22  to 25 k ± 1 % E24; E96 10  to 100 k ± 50 ppm/K ± 0.5 % E24; E192 ± 0.1 % 47  to 100 k ± 1 % E24; E96 TNPW0402 e3 10  to 100 k ± 25 ppm/K ± 0.5 % ± 0.1 % E24; E192 ± 15 ppm/K 47  to 100 k ± 0.1 % ± 10 ppm/K ± 1 % E24; E96 1  to 332 k ± 50 ppm/K ± 0.5 % E24; E192 ± 0.1 % 3.5  to 332 k ± 1 % E24; E96 TNPW0603 e3 1  to 332 k ± 25 ppm/K ± 0.5 % ± 0.1 % 3.5  to 332 k E24; E192 ± 15 ppm/K ± 0.1 % 47  to 332 k ± 10 ppm/K ± 1 % E24; E96 1  to 1 M ± 50 ppm/K ± 0.5 % E24; E192 ± 0.1 % 3.5  to 1 M ± 1 % E24; E96 TNPW0805 e3 1  to 1 M ± 25 ppm/K ± 0.5 % ± 0.1 % E24; E192 ± 15 ppm/K 3.5  to 1 M ± 0.1 % ± 10 ppm/K ± 1 % E24; E96 1  to 2 M ± 50 ppm/K ± 0.5 % E24; E192 ± 0.1 % 3.5  to 2 M ± 1 % E24; E96 TNPW1206 e3 1  to 2 M ± 25 ppm/K ± 0.5 % ± 0.1 % 3.5  to 2 M E24; E192 ± 15 ppm/K ± 0.1 % 47  to 2 M ± 10 ppm/K ± 1 % E24; E96 10  to 3.01 M ± 50 ppm/K ± 0.5 % E24; E192 ± 0.1 % 47  to 2.13 M ± 1 % E24; E96 TNPW1210 e3 10  to 3.01 M ± 25 ppm/K ± 0.5 % ± 0.1 % E24; E192 ± 15 ppm/K 47  to 2.13 M ± 0.1 % ± 10 ppm/K Revision: 23-Oct-2020 3 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPW e3 www.vishay.com Vishay PACKAGING PACKAGING PACKAGING TYPE / SIZE CODE QUANTITY WIDTH PITCH STYLE DIMENSIONS ET2 = EI 5000 TNPW0201 e3 ET7 = ED 10 000 EP1 = EP 1000 (1) 2 mm Ø 180 mm / 7" TNPW0402 e3 ET2 = EI 5000 Paper tape according 8 mm IEC 60286-3, Type 1a ET7 = ED 10 000 E52 = EN 1000 (1) TNPW0603 e3 4 mm Ø 180 mm / 7" TNPW0805 e3 ET1 = EA 5000 TNPW1206 e3 TNPW1210 e3 ET6 = EC (2) 20 000 4 mm Ø 330 mm / 13" Notes (1) 1000 pieces packaging is available only for precision resistors with tolerance ± 0.1 % and temperature coefficient  ± 25 ppm/K (2) 20 000 pieces packaging is available only for resistors with TCR ± 25 ppm/K and ± 50 ppm/K PART NUMBER AND PRODUCT DESCRIPTION Part Number: TNPW12061K32DEEA T N P W 1 2 0 6 1 K 3 2 D E E A TYPE / SIZE RESISTANCE TOLERANCE TCR PACKAGING SPECIAL TNPW0201 R = decimal B = ± 0.1 % H = ± 50 ppm/K ED Up to 2 digits TNPW0402 K = thousand D = ± 0.5 % E = ± 25 ppm/K EP Blank = standard TNPW0603 M = million F = ± 1.0 % X = ± 15 ppm/K EI 0H = single lot date TNPW0805 (4 digits) Y = ± 10 ppm/K EN code TNPW1206 EA TNPW1210 EC (E.. = lead-free) Product Description: TNPW1206 1K32 0.5 % T-9 ET1 e3 TNPW1206 1K32 0.5 % T-9 ET1 e3 TYPE / SIZE RESISTANCE TOLERANCE TCR PACKAGING LEAD (Pb)-FREE TNPW0201 54R1 = 54.1  ± 0.1 % T-2 = ± 50 ppm/K ET7 e3 = pure matte tin TNPW0402 1K32 = 1320  ± 0.5 % T-9 = ± 25 ppm/K EP1 termination finish TNPW0603 ± 1.0 % T-10 = ± 15 ppm/K ET2 TNPW0805 T-13 = ± 10 ppm/K E52 BV 20545 = single TNPW1206 ET1 lot date code TNPW1210 ET6 (E.. = lead-free) Note • The product can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION Revision: 23-Oct-2020 4 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPW e3 www.vishay.com Vishay DESCRIPTION MATERIALS Production is strictly controlled and follows an extensive se t Vishay acknowledges the following systems for th e of instructions established for reproducibility. A regulation of hazardous substances: homogeneous film of special metal alloy is deposited on a • IEC 62474, Material Declaration for Products of and for the high grade ceramic substrate (AI2O3) and conditioned to Electrotechnical Industry, with the list of declarable achieve the desired temperature coefficient. Speciall y substances given therein (2) designed inner contacts are deposited on both sides. A • The Global Automotive Declarable Substance Lis t special laser is used to achieve the target value by smoothly (GADSL) (3) fine trimming the resistive layer without damaging the • The REACH regulation (1907/2006/EC) and the related lis t ceramics. A further conditioning is applied in order t o of substances with very high concern (SVHC) (4) for its stabilize the trimming result. The resistor elements are supply chain covered by a protective coating designed for electrical, The products do not contain any of the banned substances mechanical and climatic protection. The termination s as per IEC 62474, GADSL, or the SVHC list, see receive a final pure matte tin on nickel plating. www.vishay.com/how/leadfree. The result of the determined production is verified by an Hence the products fully comply with the following extensive testing procedure and optical inspection directives: performed on 100 % of the individual chip resistors. Thi s includes full screening for the elimination of products with a • 2000/53/EC End-of-Life Vehicle Directive (ELV) and potential risk of early life failures (feasible for R  10 ). Only Annex II (ELV II) accepted products are laid directly into the tape i n • 2011/65/EU Restriction of the Use of Hazardous accordance with IEC 60286-3, Type 1a (1). Substances Directive (RoHS) with amendmen t 2015/863/EU ASSEMBLY • 2012/19/EU Waste Electrical and Electronic Equipment The resistors are suitable for processing on automatic SMD Directive (WEEE) assembly systems. They are suitable for automatic Vishay pursues the elimination of conflict minerals from its soldering using wave, reflow or vapour phase as shown i n supply chain, see the Conflict Minerals Policy a t IEC 61760-1 (1). The encapsulation is resistant to all www.vishay.com/doc?49037. cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. RELATED PRODUCTS The suitability of conformal coatings, potting compounds The TNPW with SnPb termination plating is designed for and their processes, if applied, shall be qualified b y those applications, where lead bearing terminations ar e appropriate means to ensure the long-term stability of th e mandatory. For ordering TNPW with SnPb terminations whole system. please refer to latest edition of datasheet TNPW The resistors are RoHS-compliant, the pure matte tin plating (www.vishay.com/doc?31006). provides compatibility with lead (Pb)-free an d TNPU e3 ultra precision thin film flat chip resistors combine lead-containing soldering processes. Solderability is the proven reliability of TNPW e3 products with a most specified for 2 years after production or requalification. The advanced level of precision and stabilit y permitted storage time is 20 years. The immunity of th e (www.vishay.com/doc?28779). plating against tin whisker growth has been proven unde r TNPS .... ESCC high-reliability thin film chip resistors are the extensive testing. premium choice for design and manufacture of equipment , where matured technology and proven reliability are of utmost importance. They are regularly used i n communication and research satellites and fit equally well into aircraft and military electronic systems. Approval of the TNPS .... ESCC products is granted by th e European Space Components Coordination and registered in the ESCC Qualified Parts List, REP005 (www.vishay.com/doc?28789). TNPV e3 High Voltage Thin Film Flat Chip Resistors are designed for most fields of modern electronics wher e precision, reliability and stability at high operating voltage are primary concerns (www.vishay.com/doc?28881). Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474 (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table Revision: 23-Oct-2020 5 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPW e3 www.vishay.com Vishay FUNCTIONAL PERFORMANCE 3 B V Linearity A in d3111120000 TTTTNNNNPPPPWWWW1000286400006532 eeee3333 µV/ent Noise in 00..2153 TNPW0402 e3 TNTPNWP0W600830 e53 e 3 Non- 90 Curr 0.1 TNPW1206 e3 80 0.05 0.03 70 60 0.01 10 100 1K 10K 100K 100 1K 10K 100K 1M Resistance Value in (cid:2) Resistance Value in (cid:2) Non-Linearity Current Noise % 4 TNPW0201 e3 ϑ° 5 TNPW0201 e3 O in 2 25(cid:3)(cid:2) e in 4 RO 50(cid:3)(cid:2) gl 3 [Z]-R 0 100(cid:3)(cid:2) se An 2 25(cid:3)(cid:2) -2 Pha 1 0 50(cid:3)(cid:2) -4 -1 -6 -2 100(cid:3)(cid:2) 549(cid:3)(cid:2) 549(cid:3)(cid:2) -3 -8 -4 -10 -5 1 10 100 1000 3000 1 10 100 1000 3000 Frequency f in MHz Frequency f in MHz HF Performance (1) HF Performance (1) % 4 TNPW0402 e3 ϑ° 5 TNPW0402 e3 O in 2 25(cid:3)(cid:2) e in 4 25(cid:3)(cid:2) [Z]-RRO 0 5100(cid:3)0(cid:2)(cid:3)(cid:2) e Angl 23 s -2 200(cid:3)(cid:2) Pha 1 0 -4 -1 -6 -2 50(cid:3)(cid:2) -3 100(cid:3)(cid:2) -8 549 (cid:2) -4 200 (cid:2) 549 (cid:2) -10 -5 1 10 100 1000 3000 1 10 100 1000 3000 Frequency f in MHz Frequency f in MHz HF Performance (1) HF Performance (1) Note (1) Typical figures. HF-characteristic also depends on termination and circuit design Revision: 23-Oct-2020 6 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPW e3 www.vishay.com Vishay FUNCTIONAL PERFORMANCE [Z]-RO in%RO 200 TNPW0603 e3 211250005000(cid:3)(cid:3)(cid:3)(cid:3)(cid:3)(cid:2)(cid:2)(cid:2)(cid:2)(cid:2) ϑse Angle in° 11220505 TNPW0603 e3 10(cid:3)(cid:2) -20 Pha 5 549(cid:3)(cid:2) 0 25(cid:3)(cid:2) -40 50(cid:3)(cid:2) -5 100(cid:3)(cid:2) -60 1000 (cid:2) -10 200 (cid:2)(cid:3)/ 549 (cid:2) 41705000 (cid:2)(cid:2) 10 000 (cid:2) 4750 (cid:2) -15 10 000 (cid:2) -80 -20 1 10 100 1000 3000 1 10 100 1000 3000 Frequency f in MHz Frequency f in MHz HF Performance (1) HF Performance (1) % 20 TNPW0805 e3 ϑ° 20 TNPW0805 e3 RO inO 0 1100(cid:3)0(cid:2)(cid:3)(cid:2) gle in 0 10(cid:3)(cid:2) [Z]-R 1000 (cid:2) e An 100(cid:3)(cid:2) s -20 ha-20 P 1000 (cid:2) -40 -40 -60 -60 10 000 (cid:2) 10 000 (cid:2) -80 -80 1 10 100 1000 3000 1 10 100 1000 3000 Frequency f in MHz Frequency f in MHz HF Performance (1) HF Performance (1) Note (1) Typical figures. HF-characteristic also depends on termination and circuit design Revision: 23-Oct-2020 7 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPW e3 www.vishay.com Vishay FUNCTIONAL PERFORMANCE 0.6 P n W TNPW0201 e3 patio 0.5 TTNNPPWW00460023 ee33 si TNPW0805 e3 Dis 0.4 TNPW1206 e3 er TNPW1210 e3 w 0.3 o P 0.2 0.1 0 -55 0 50 100 125 °C 155 70 Ambient Temparature ϑ amb Derating - Standard Operation 0.6 P n W TNPW0201 e3 patio 0.5 TTNNPPWW00460023 ee33 si TNPW0805 e3 Dis 0.4 TNPW1206 e3 er TNPW1210 e3 w 0.3 o P 0.2 0.1 0 -55 0 50 100 125 °C 155 70 Ambient Temparature ϑ amb Derating - Power Operation Note • The solid line is based on IEC/EN reference test conditions which is considered as standard mode. However, above that the maximu m permissible film temperature is 155 °C (dashed line) Revision: 23-Oct-2020 8 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPW e3 www.vishay.com Vishay FUNCTIONAL PERFORMANCE V 3K V 3K age in 1K TNPW0805 e3 age in 1K TNPW0805 e3 olt olt V V st TNPW0603 e3 st e e T T TNPW0603 e3 100 100 10 10 10R 100R 1K 10K 100K 10R 100R 1K 10K 100K Resistance VainluΩe Resistance VainluΩe Single-Pulse High Voltage Overload  Single-Pulse High Voltage Overload  Test 1.2/50 μs EN140000 4.27 Test 10/700 μs EN140000 4.27 100W 100W Pi, max. TTNNPPWW10820056 ee33 Pi, max. TNPW1206 e3 wer 10W TNPW0603 e3 wer 10W TNPW0805 e3 o o p p TNPW0603 e3 e e s s ul ul p p e e bl 1W bl 1W si si s s mi mi Conditions: er Conditions: er P ≤P (including derating) P P 0, n ≤ 1000 and Ui≤Ui, max. P anmdaxU.i≤mUaix, .max. 0.1W 0.1W 10 µs 100 µs 1 ms 10 ms 100 ms 1 s 10 s 10 µs 100 µs 1 ms 10 ms 100 ms 1 s 10 s Pulse Duration t Pulse Duration t i i Maximum Pulse Load P  Maximum Pulse Load P i, max. i, max. for Single Pulses for Continuous Pulses 10 000 V max. Ui, e g olta1000V TNPW1206 e3 v se TNPW0805 e3 ul p TNPW0603 e3 e bl 100V si s mi er Conditions: P P≤P i i, max. 10V 10 µs 100 µs 1 ms 10 ms 100 ms 1 s 10 s Pulse Duration t i Maximum Pulse Voltage U i, max. Revision: 23-Oct-2020 9 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPW e3 www.vishay.com Vishay TEST AND REQUIREMENTS All tests are carried out in accordance with the following The testing also covers most of the requirements specifie d specifications: by EIA / ECA-703 and JIS-C-5201-1. EN 60115-1, generic specification The tests are carried out under standard atmospheri c EN 60115-8 (successor of EN 140400), sectional conditions in accordance with IEC 60068-1, 4.3, whereupon specification the following values are applied: EN 140401-801, detail specification Temperature: 15 °C to 35 °C IEC 60068-2-xx, test methods Relative humidity: 25 % to 75 % The parameters stated in the Test Procedures an d Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar) Requirements table are based on the required tests and A climatic category LCT / UCT / 56 is applied, defined by the permitted limits of EN 140401-801. The detail specification lower category temperature (LCT), the upper categor y EN 140401-801 does not cover case size 0201. The table temperature (UCT), and the duration of exposure in th e damp heat, steady state test (56 days). presents only the most important tests, for the full test schedule refer to the documents listed above. However, The components are mounted for testing on printed circuit boards in accordance with EN 60115-8, 2.4.2, unless some additional tests and a number of improvements otherwise specified. against those minimum requirements have been included. TEST PROCEDURES AND REQUIREMENTS EN 60115-1 IEC 60068-2 (1) REQUIREMENTS TEST PROCEDURE CLAUSE TEST METHOD PERMISSIBLE CHANGE (R) Stability for product types: TNPW0201 e3 22  to 40 k TNPW0402 e3 10  to 100 k TNPW0603 e3 1  to 332 k TNPW0805 e3 1  to 1 M TNPW1206 e3 1  to 2 M TNPW1210 e3 10  to 3.01 M 4.5 - Resistance - ± 1 %; ± 0.5 %; ± 0.1 % Temperature At (20 / -55 / 20) °C ± 50 ppm/K; ± 25 ppm/K; 4.8 - coefficient and (20 / 125 / 20) °C ± 15 ppm/K; ± 10 ppm/K U = P x R or U = U ; Endurance 70 max. whichever is the less severe; at 70 °C: 1.5 h on; 0.5 h off; standard operation 70 °C; 1000 h ± (0.05 % R + 0.01 ) mode 70 °C; 8000 h ±(0.1 % R + 0.02 ) 4.25.1 - U = P x R or U = U ; Endurance 70 max. whichever is the less severe; at 70 °C: 1.5 h on; 0.5 h off; power operation 70 °C; 1000 h ± (0.1 % R + 0.01 ) mode 70 °C; 8000 h ±(0.2 % R + 0.02 ) Endurance at 125 °C; 1000 h ± (0.05 % R + 0.01 ) 4.25.3 - upper category temperature 155 °C; 1000 h ± (0.1 % R + 0.02 ) Damp heat, (40 ± 2) °C; 56 days; 4.24 78 (Cab) ± (0.1 % R + 0.01 ) steady state (93 ± 3) % RH Damp heat, steady state (85 ± 2) °C accelerated: (85 ± 5) % RH 4.37 67 (Cy) ± (0.25 % R + 0.05 ) Standard U = 0.1 x P x R; 70 operation U  0.3 x Umax.; 1000 h mode - 1 (Ab) Cold -55 °C; 2 h ± (0.05 % R + 0.01 ) Revision: 23-Oct-2020 10 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPW e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 IEC 60068-2 (1) REQUIREMENTS TEST PROCEDURE CLAUSE TEST METHOD PERMISSIBLE CHANGE (R) Stability for product types: TNPW0201 e3 22  to 40 k TNPW0402 e3 10  to 100 k TNPW0603 e3 1  to 332 k TNPW0805 e3 1  to 1 M TNPW1206 e3 1  to 2 M TNPW1210 e3 10  to 3.01 M 30 min at LCT and 30 min at UCT; Rapid change 4.19 14 (Na) LCT = - 55 °C; UCT = 125 °C; ± (0.1 % R + 0.01 ) of temperature 1000 cycles Short time U = 2.5 x P x R overload: 70 or U = 2 x U ; standard max. ± (0.05 % R + 0.01 ) whichever is the less severe; operation 5 s mode 4.13 - Short time U = 2.5 x P x R overload: 70 or U = 2 x U ; power max. ± (0.1 % R + 0.01 ) whichever is the less severe; operation 5 s mode Single pulse Severity no. 4: high voltage U = 10 x P x R or overload: 70 ± (0.5 % R + 0.02 ) U = 2 x U ; standard max. no visible damage operation whichever is the less severe; mode 10 pulses 10 μs/700 μs 4.27 - Single pulse Severity no. 4: high voltage U = 10 x P x R or overload: 70 ± (1 % R + 0.02 ) U = 2 x U ; power max. no visible damage operation whichever is the less severe; mode 10 pulses 10 μs/700 μs Periodic U = 15 x P x R electric 70 or U = 2 x U ; overload: max. ± (0.5 % R + 0.05 ) 0.1 s on; 2.5 s off; standard no visible damage whichever is the less severe; operation 1000 cycles mode 4.39 - Periodic U = 15 x P x R electric 70 or U = 2 x U ; overload: max. ± (1 % R + 0.05 ) 0.1 s on; 2.5 s off; power no visible damage whichever is the less severe; operation 1000 cycles mode IEC 61340-3-1 (1); 3 pos. + 3 neg. (equivalent to MIL-STD-883, method Electro static 3015) discharge 4.38 - TNPW0201 e3: 200 V ±(0.5 % R + 0.05 ) (human body TNPW0402 e3: 400 V model) TNPW0603 e3: 1000 V TNPW0805 e3: 1500 V TNPW 1206 e3: 2000 V Endurance by sweeping; 10 Hz to 2000 Hz; ± (0.05 % R + 0.01 ) 4.22 6 (Fc) Vibration no resonance; no visible damage amplitude  1.5 mm or  200 m/s2; 7.5 h Revision: 23-Oct-2020 11 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPW e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 IEC 60068-2 (1) REQUIREMENTS TEST PROCEDURE CLAUSE TEST METHOD PERMISSIBLE CHANGE (R) Stability for product types: TNPW0201 e3 22  to 40 k TNPW0402 e3 10  to 100 k TNPW0603 e3 1  to 332 k TNPW0805 e3 1  to 1 M TNPW1206 e3 1  to 2 M TNPW1210 e3 10  to 3.01 M Solder bath method; SnPb40; non-activated flux (215 ± 3) °C; (3 ± 0.3) s Good tinning ( 95 % covered); 4.17 58 (Td) Solderability Solder bath method; no visible damage SnAg3Cu0.5 or SnAg3.5; non-activated flux (235 ± 3) °C; (2 ± 0.2) s Resistance to Solder bath method; 4.18 58 (Td) ± (0.02 % R + 0.01 ) soldering heat (260 ± 5) °C; (10 ± 1) s (2) Component 4.29 45 (XA) solvent Isopropyl alcohol + 50 °C; method 2 No visible damage resistance TNPW0201 e3: 2 N Shear TNPW0402 e3 and TNPW0603 e3: 9 N 4.32 21 (Ue ) No visible damage 3 (adhesion) TNPW0805 e3, TNPW1206 e3, and TNPW1210 e3: 45 N ± (0.05 % R + 0.01 ) Substrate 4.33 21 (Ue ) Depth 2 mm, 3 times no visible damage, 1 bending no open circuit in bent position 4.7 - Voltage proof U = U ; 60 ± 5 s No flashover or breakdown RMS ins IEC 60695-11-5 (1), 4.35 - Flammability No burning after 30 s needle flame test; 10 s Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) For TNPW0201 e3 only similar to DIN EN 60115-8 test procedure. Due to the components small size they were fixed by glue previous to testing instead of applying tweezers Revision: 23-Oct-2020 12 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TNPW e3 www.vishay.com Vishay DIMENSIONS L T t W H T b DIMENSIONS AND MASS L W H T / T MASS TYPE / SIZE t b (mm) (mm) (mm) (mm) (mg) TNPW0201 e3 0.6 ± 0.05 0.3 ± 0.05 0.23 ± 0.03 0.12 ± 0.05 0.14 TNPW0402 e3 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.2 ± 0.10 0.65 TNPW0603 e3 1.55 ± 0.05 0.85 ± 0.10 0.45 ± 0.10 0.3 ± 0.20 2 TNPW0805 e3 2.0 ± 0.1 1.25 ± 0.15 0.45 ± 0.10 0.4 ± 0.20 5.5 TNPW1206 e3 3.2 + 0.1 / - 0.2 1.6 ± 0.15 0.55 ± 0.10 0.5 ± 0.25 10 TNPW1210 e3 3.2 + 0.1 / - 0.2 2.45 ± 0.15 0.60 ± 0.15 0.5 ± 0.25 16 SOLDER PAD DIMENSIONS l b a RECOMMENDED SOLDER PAD DIMENSIONS REFLOW SOLDERING WAVE SOLDERING TYPE / SIZE a b l a b l (mm) (mm) (mm) (mm) (mm) (mm) TNPW0201 e3 0.28 0.43 0.23 - - - TNPW0402 e3 0.4 0.6 0.5 - - - TNPW0603 e3 0.5 0.9 1.0 0.9 0.9 1.0 TNPW0805 e3 0.7 1.3 1.2 0.9 1.3 1.3 TNPW1206 e3 0.9 1.7 2.0 1.1 1.7 2.3 TNPW1210 e3 0.9 2.5 2.0 1.1 2.5 2.3 Notes • The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1), or in publication IPC-7351 (1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 23-Oct-2020 13 Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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