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ICGOO电子元器件商城为您提供TN815-600B-TR由STMicroelectronics设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 TN815-600B-TR价格参考¥2.17-¥2.17。STMicroelectronicsTN815-600B-TR封装/规格:晶闸管 - SCR, SCR 600V 8A Standard Recovery Surface Mount DPAK。您可以下载TN815-600B-TR参考资料、Datasheet数据手册功能说明书,资料中有TN815-600B-TR 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

SCR 8A 15MA 600V DPAKSCR 8.0 Amp 600 Volt

产品分类

SCR - 单个分离式半导体

GateTriggerCurrent-Igt

15 mA

GateTriggerVoltage-Vgt

1.3 V

品牌

STMicroelectronics

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

晶体闸流管,SCR,STMicroelectronics TN815-600B-TR-

数据手册

点击此处下载产品Datasheet

产品型号

TN815-600B-TR

SCR类型

标准恢复型

不重复通态电流

73 A

产品培训模块

http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=26297http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=26298

产品目录页面

点击此处下载产品Datasheet

产品种类

SCR

供应商器件封装

D-Pak

保持电流Ih最大值

40 mA

关闭状态漏泄电流(在VDRMIDRM下)

5 uA

其它名称

497-6770-6

其它有关文件

http://www.st.com/web/catalog/sense_power/FM144/CL1220/SC127/PF70445?referrer=70071840

包装

Digi-Reel®

商标

STMicroelectronics

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

TO-252-3,DPak(2 引线+接片),SC-63

封装/箱体

TO-252

工作温度

-40°C ~ 125°C

工厂包装数量

2500

最大工作温度

+ 125 C

最大栅极峰值反向电压

5 V

最小工作温度

- 40 C

栅极触发电压-Vgt

1.3 V

栅极触发电流-Igt

15 mA

标准包装

1

正向电压下降

1.6 V

电压-断态

600V

电压-栅极触发(Vgt)(最大值)

1.3V

电压-通态(Vtm)(最大值)

1.6V

电流-不重复浪涌50、60Hz(Itsm)

70A,73A

电流-保持(Ih)(最大值)

40mA

电流-断态(最大值)

5µA

电流-栅极触发(Igt)(最大值)

15mA

电流-通态(It(AV))(最大值)

5A

电流-通态(It(RMS))(最大值)

8A

系列

TN815

额定重复关闭状态电压VDRM

600 V

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PDF Datasheet 数据手册内容提取

TN805, TN815, TS820, TYN608 Sensitive and standard 8 A SCRs Datasheet - production data Description A K Available either in sensitive (TS8) or standard (TN8 / TYN) gate triggering levels, the 8 A SCR G series is suitable to fit all modes of control found A in applications such as overvoltage crowbar protection, motor control circuits in power tools and kitchen aids, inrush current limiting circuits, capacitive discharge ignition and voltage regulation circuits. G G TO-220AB KA TO-220FPAB KA Apavcakilaagbeles ,in th tehyro purgohv-idheo laen o or pstuimrfaizceed- mpeorufonrtm ance A in a limited space. A Table 1. Device summary Voltage (x00) KA Order code VDRM/VRRM Sensitivity Package G IPAK KAG TO-220AB 600 V 800 V IGT A TS820-600B X 0.2 mA DPAK TS820-600H X 0.2 mA IPAK K A TO- TS820-600T X 0.2 mA 220AB G DPAK TO- TS820-600FP X 0.2 mA 220FPA Features B TN805-600B X 5 mA DPAK • On-state rms current, I 8 A T(RMS) TN815-x00B X X 15 mA DPAK • Repetitive peak off-state voltage, V /V DRM RRM 600 and 800 V TYN608RG X 15 mA TO- 220AB • Triggering gate current, I 0.2 to 15 mA GT May 2014 DocID7476 Rev 8 1/17 This is information on a product in full production. www.st.com

Characteristics TN805, TN815, TS820, TYN608 1 Characteristics Table 2. Absolute ratings (limiting values) Value TN805 Symbol Parameter Unit TN815 TYN608 TS820 T = 110 °C c I On-state rms current (180° conduction angle) 8 A T(RMS) T0-220FPAB, T = 91 °C c T = 110 °C c I Average on-state current (180° conduction angle) 5 A T(AV) T0-220FPAB, T = 91 °C c Non repetitive surge peak tp = 8.3 ms 73 100 I T = 25 °C A TSM on-state current j t = 10 ms 70 95 p I2t I2t value for fusing t = 10 ms T = 25 °C 24.5 45 A2S p j Critical rate of rise of on-state dI/dt F = 60 Hz T = 125 °C 50 A/µs current I = 2 x I , t ≤ 100 ns j G GT r I Peak gate current t = 20 µs T = 125 °C 4 A GM p j P Average gate power dissipation T = 125 °C 1 W G(AV) j T Storage junction temperature range - 40 to + 150 stg °C T Operating junction temperature range - 40 to + 125 j V Maximum peak reverse gate voltage (for TN8x5 and TYN608 only) 5 V RGM Table 3. Sensitive electrical characteristics (T = 25 °C, unless otherwise specified) j Symbol Test conditions TS820 Unit I MAX. 200 µA GT V = 12 V, R = 140 Ω D L V MAX. 0.8 V GT V V = V R = 3.3 kΩ, R = 220 Ω T = 125 °C MIN. 0.1 V GD D DRM, L GK j V I = 10 µA MIN. 8 V RG RG I I = 50 mA, R = 1 kΩ MAX. 5 mA H T GK I I = 1 mA ,, R = 1 kΩ MAX. 6 mA L G GK dV/dt V = 65% V , R = 220 Ω T = 125 °C MIN. 5 V/µs D DRM GK j V I = 16 A, t = 380 µs T = 25 °C MAX. 1.6 V TM TM p j V Threshold voltage T = 125 °C MAX. 0.85 V t0 j R Dynamic resistance T = 125 °C MAX. 46 mΩ d j IDRM V = V , R = 220 Ω Tj = 25 °C MAX. 5 µA IRRM DRM RRM GK Tj = 125 °C 1 mA 2/17 DocID7476 Rev 8

TN805, TN815, TS820, TYN608 Characteristics Table 4. Standard electrical characteristics (T = 25 °C, unless otherwise specified) j Symbol Test conditions TN805 TN815 TYN608 Unit MIN. 0.5 2 2 I mA GT V = 12 V, R = 33 Ω MAX. 5 15 15 D L V MAX. 1.3 V GT V V = V R = 3.3 kΩ T = 125 °C MIN. 0.2 V GD D DRM, L j I I = 100 mA , gate open MAX. 25 40 30 mA H T I I = 1.2 I MAX. 30 50 70 mA L G GT dV/dt V = 67% V gate open T =125 °C MIN. 50 150 150 V/µs D DRM, j V I = 16 A t = 380 µs T = 25 °C MAX. 1.6 V TM TM p j V Threshold voltage T = 125 °C MAX. 0.85 V t0 j R Dynamic resistance T = 125 °C MAX. 46 mΩ d j IDRM V = V Tj = 25 °C MAX. 5 µA IRRM DRM RRM Tj = 125 °C 2 mA Table 5. Thermal resistance Symbol Parameter Value Unit DPAK, IPAK, TO-220AB 1.3 R Junction to case (DC) °C/W th(j-c) TO-220FPAB 4.6 S(1) = 0.5 cm2 DPAK 70 R Junction to ambient (DC) IPAK 100 °C/W th(j-a) TO-220AB, TO-220FPAB 60 1. S = Copper surface under tab Figure 1. Maximum average power dissipation Figure 2. Average and DC on-state current versus average on-state current versus case temperature P(W) IT(AV)(A) 8 10 DPAK IPAK 7 α= 180° 9 TO-220AB D.C. 8 6 7 5 6 α= 180° 4 5 3 4 TO-220FPAB 360° 3 2 2 1 IT(AV)(A) α 1 Tcase(°C) 0 0 0 1 2 3 4 5 6 0 25 50 75 100 125 DocID7476 Rev 8 3/17 17

Characteristics TN805, TN815, TS820, TYN608 Figure 3. A verage and DC on-state current Figure 4. Relative variation of thermal versus ambient temperature impedance junction to case versus pulse duration IT(AV)(A) K=[Zth(j-c)/Rth(j-c)] 2,5 1.0 D.C. Recommended pad layout, α= 180° FR4 printed circuit board 2,0 0.5 TO-220AB 1,5 TO-220FPAB 1,0 0.2 DPAK 0,5 IPAK Tamb(°C) tp(s) 0,0 0.1 0 25 50 75 100 125 1E-3 1E-2 1E-1 1E+0 Figure 5. Relative variation of thermal Figure 6. Relative variation of gate trigger impedance junction to ambient versus pulse current and holding current versus junction duration temperature for TS820 K=[Zth(j-a)/Rth(j-a)] IGT,IH,IL[Tj] /IGT,IH,IL[Tj=25°C] 1.00 2.0 Recommended pad layout, 1.8 FR4 printed circuit board IGT 1.6 1.4 DPAK 1.2 0.10 1.0 RGIKH&= 1ILkΩ TO-220AB / IPAK 0.8 TO-220FPAB 0.6 0.4 tp(s) 0.2 Tj(°C) 0.01 0.0 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 -40 -20 0 20 40 60 80 100 120 140 Figure 7. Relative variation of gate trigger and Figure 8. Relative variation of holding current holding current versus junction temperature versus gate-cathode resistance (typical values) IGT,IH,IL[Tj] /IGT,IH,IL[Tj=25°C] IH[RGK] / IH[RGK=1kΩ] 6.0 22..24 5.5 TS8 Tj= 25°C TN8 andTYNx8 2.0 IGT 5.0 1.8 4.5 1.6 4.0 1.4 3.5 1.2 IH& IL 3.0 1.0 2.5 0.8 2.0 0.6 1.5 0.4 1.0 00..02 Tj(°C) 0.5 RGK(kΩ) 0.0 -40 -20 0 20 40 60 80 100 120 140 1E-2 1E-1 1E+0 1E+1 4/17 DocID7476 Rev 8

TN805, TN815, TS820, TYN608 Characteristics Figure 9. R e lative variation of dV/dt immunity Figure 10. Relative variation of dV/dt immunity versus gate-cathode resistance (typical values) versus gate-cathode capacitance (typical for TS820 values) for TS820 dV/dt[RGK] / dV/dt[RGK=220Ω] dV/dt[CGK] / dV/dt[RGK=220Ω] 10.00 15.0 Tj= 125°C VD= 0.67 xVDRM VD= 0.67 xVDRM Tj= 125°C 12.5 RGK= 220Ω 1.00 10.0 7.5 0.10 5.0 2.5 RGK(kΩ) CGK(nF) 0.01 0.0 0 200 400 600 800 1000 1200 1400 1600 1800 2000 0 20 40 60 80 100 120 140 160 180 200 220 Figure 11. Surge peak on-state current versus Figure 12. Non-repetitive surge peak on-state number of cycles current and corresponding values of I2t ITSM(A) ITSM(A),I 2t (A 2s) 100 1000 Tjinitial = 25°C 90 80 TYN08 tp=10ms ITSM 70 One cycle TYN08 Non repetitive dI/dt limitation 60 Tjinitial=25°C 50 TN8 /TS8 100 Sinusoidal pulse width tp < 10 ms TN8 /TS8 40 TYN08 30 20 TRCe=p1e1ti0ti°vCe I 2t 10 TN8 /TS8 Number of cycles tp(ms) 0 10 1 10 100 1000 0.01 0.10 1.00 10.00 Figure 13. On-state characteristics (maximum Figure 14. Thermal resistance junction to values) ambient versus copper surface under tab (DPAK) ITM(A) Rth(j-a)(°C/W) 50.0 100 Tjmax.: Epoxy printed circuit board FR4 VRtd0==406.8m5ΩV 80 copper thickness = 35 µm 10.0 Tj=max 60 40 1.0 Tj=25°C 20 VTM(V) S(cm²) 0.1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 2 4 6 8 10 12 14 16 18 20 DocID7476 Rev 8 5/17 17

Package information TN805, TN815, TS820, TYN608 2 Package information • Epoxy meets UL94, V0 • Lead-free packages • Recommended torque: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 15. DPAK dimension definitions A E b4 c2 E1 L2 D1 D D H A1 E1 L4 b e1 c V2 A2 L Note: this package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. 6/17 DocID7476 Rev 8

TN805, TN815, TS820, TYN608 Package information Table 6. DPAK dimension values Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 2.18 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.195 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 5.10 0.201 E 6.35 6.73 0.250 0.264 E1 4.32 0.170 e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.00 1.78 0.039 0.070 L2 1.27 0.05 L4 0.60 1.02 0.023 0.040 V2 0° 8° 0° 8° Figure 16. Footprint (dimensions in mm) 6.7 3.0 3.0 A 5.094 6.7 B 1.6 The device must be positioned within 0.05 AB DocID7476 Rev 8 7/17 17

Package information TN805, TN815, TS820, TYN608 Figure 17. IPAK dimension definitions E A b4 c2 L2 V1 (cid:2) 1.20 ±0.010 Top E-MARK D L1 H A1 b2 L e b c e1 Note: this package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. Table 7. IPAK dimension values Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 b 0.64 0.90 0.025 0.035 b2 0.95 0.037 b4 5.20 5.43 0.204 0.213 c 0.45 0.60 0.017 0.023 c2 0.46 0.60 0.018 0.023 D 6 6.20 0.236 0.244 E 6.40 6.70 0.252 0.263 e 2.28 0.090 e1 4.40 4.60 0.173 0.181 H 16.10 0.634 L 9 9.60 0.354 0.377 L1 0.8 1.20 0.031 0.047 8/17 DocID7476 Rev 8

TN805, TN815, TS820, TYN608 Package information Table 7. IPAK dimension values L2 0.80 1.25 0.031 0.049 V1 10° 10° Figure 18. TO-220AB dimension definitions E A ∅P F Resin gate 0.5 mm max. protrusion(1) Q H1 D D1 L20 L30 J1 b1 L1 L b e Resin gate c 0.5 mm max. protrusion(1) e1 (1) Resin gate position accepted in each of the two position shown as well as the symmetrical opposites DocID7476 Rev 8 9/17 17

Package information TN805, TN815, TS820, TYN608 Table 8. TO-220AB dimension values Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.17 0.18 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.045 0.067 c 0.48 0.70 0.019 0.027 D 15.25 15.75 0.60 0.62 D1 1.27 typ. 0.05 typ. E 10 10.40 0.39 0.41 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.19 0.20 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.24 0.26 J1 2.40 2.72 0.094 0.107 L 13 14 0.51 0.55 L1 3.50 3.93 0.137 0.154 L20 16.40 typ. 0.64 typ. L30 28.90 typ. 1.13 typ. ∅P 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 10/17 DocID7476 Rev 8

TN805, TN815, TS820, TYN608 Package information Figure 19. TO-220AB (NIns. & Ins. 20-up) dimension definitions B C Ø I b2 L F A I4 l3 c2 a1 l2 a2 M c1 b1 e DocID7476 Rev 8 11/17 17

Package information TN805, TN815, TS820, TYN608 Table 9. TO-220AB (NIns. & Ins. 20-up) dimension values Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 15.20 15.90 0.598 0.625 a1 3.75 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 F 6.20 6.60 0.244 0.259 ØI 3.75 3.85 0.147 0.151 I4 15.80 16.40 16.80 0.622 0.646 0.661 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 M 2.60 0.102 12/17 DocID7476 Rev 8

TN805, TN815, TS820, TYN608 Package information Figure 20. TO-220FPAB dimension definitions A H B Dia L6 L2 L7 L3 L5 D F1 L4 F2 F E G1 G DocID7476 Rev 8 13/17 17

Package information TN805, TN815, TS820, TYN608 Table 10. TO-220FPAB dimension values Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 16 0.63 L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 14/17 DocID7476 Rev 8

TN805, TN815, TS820, TYN608 Ordering information 3 Ordering information Figure 21. TN8 series TN 8 05 - 600 B -TR Standard SCR series Current 8 = 8 A Sensitivity 05 = 5 mA 15 = 15 mA Voltage 600 = 600V 800 = 800V Package B = DPAK Packing mode -TR =Tape and reel Figure 22. TS8 series TS 8 20 - 600 B (-TR) Sensitive SCR series Current 8 = 8 A Sensitivity 20 = 200 µA Voltage 600 = 600V Package B = DPAK H = IPAK T =TO-220AB FP =TO220FPAB Packing mode Blank =Tube -TR =Tape and reel Figure 23. TYNx08 series TYN 6 08 RG Standard SCR series Voltage 6 = 600V Current 8 = 8 A Packing mode RG =Tube DocID7476 Rev 8 15/17 17

Revision history TN805, TN815, TS820, TYN608 Table 11. Ordering information Order code Marking Package Weight Base qty Delivery mode TN805-600B-TR TN805600 DPAK 0.3 g 2500 Tape and reel TN815-600B-TR TN815600 DPAK 0.3 g 2500 Tape and reel TN815-800B-TR TN815800 DPAK 0.3 g 2500 Tape and reel TS820-600B TS820600 DPAK 0.3 g 75 Tube TS820-600B-TR TS820600 DPAK 0.3 g 2500 Tape and reel TS820-600H TS820600 IPAK 0.4 g 75 Tube TS820-600T TS820600T TO-220AB 2.3 g 50 Tube TS820-600FP TS820600 TO-220FPAB 2.0 g 50 Tube TYN608RG TYN608 TO-220AB 2.3 g 50 Tube 4 Revision history Table 12. Document revision history Date Revision Changes Apr-2002 4A Last update. TO-220AB delivery mode changed from bulk to tube. 13-Feb-2006 5 ECOPACK statement added. Alpha definition updated in Figure1. Thermal resistance, 22-Jan-2010 6 junction to case, updated in Table5. Added TO-220FPAB package. Removed 700 V and 10-Oct-2011 7 1000 V products. Updated DPAK and IPAK package information and 14-May-2014 8 reformatted to current standard. 16/17 DocID7476 Rev 8

TN805, TN815, TS820, TYN608 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2014 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com DocID7476 Rev 8 17/17 17

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: S TMicroelectronics: TN805-600B TS820-700T TN815-600B TS820-600B TS820-600H TS820-600T TN805-800B TS820-600B-TR TN815-600B-TR TYN608RG TN805-600B-TR TN815-800B-TR TS820-600FP TN815-800B TN805-600H TN815- 800H