Product Order Technical Tools & Support & Folder Now Documents Software Community TLV713 SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 TLV713 Capacitor-Free, 150-mA, Low-Dropout Regulator With Foldback Current Limit for Portable Devices 1 Features 3 Description • StableOperationWithorWithoutCapacitors The TLV713 series of low-dropout (LDO) linear 1 regulators are low quiescent current LDOs with • FoldbackOvercurrentProtection excellent line and load transient performance and are • Packages: designed for power-sensitive applications. These – 1-mm ×1-mm4-PinX2SON devicesprovideatypicalaccuracyof1%. – 5-PinSOT-23 The TLV713 series of devices is designed to be • VeryLowDropout:230mVat150mA stablewithoutanoutputcapacitor.The removal of the output capacitor allows for a very small solution size. • Accuracy:1% However, the TLV713 series is also stable with any • LowIQ:50µA outputcapacitorifanoutputcapacitorisused. • InputVoltageRange:1.4Vto5.5V The TLV713 also provides inrush current control • AvailableinFixed-OutputVoltages: during device power up and enabling. The TLV713 1Vto3.3V limits the input current to the defined current limit to • HighPSRR:65dBat1kHz avoid large currents from flowing from the input power source. This functionality is especially • ActiveOutputDischarge(PVersionOnly) importantinbattery-operateddevices. 2 Applications The TLV713 series is available in standard DQN and DBV packages. The TLV713P provides an active • PDAsandBattery-PoweredPortableDevices pulldowncircuittoquicklydischargeoutputloads. • MP3PlayersandOtherHand-HeldProducts • WLANandOtherPCAdd-OnCards DeviceInformation(1) DEVICENAME PACKAGE BODYSIZE X2SON(4) 1.00mm×1.00mm TLV713 SOT-23(5) 2.90mm×1.60mm (1) For all available packages, see the orderable addendum at theendofthedatasheet. space space space TypicalApplicationCircuit DropoutVoltagevsOutputCurrent 350 IN OUT VOUT = 1.8V 300 VOUT = 3.3V CIN TLV713 COUT V) 250 m Optional EN GND Optional e ( ON ag 200 olt OFF ut V 150 o p o Dr 100 50 0 0 15 30 45 60 75 90 105 120 135 150 Output Current (mA) 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

TLV713 SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 www.ti.com Table of Contents 1 Features.................................................................. 1 8 ApplicationandImplementation........................ 16 2 Applications........................................................... 1 8.1 ApplicationInformation............................................16 3 Description............................................................. 1 8.2 TypicalApplication..................................................17 4 RevisionHistory..................................................... 2 8.3 WhattoDoandWhatNottoDo.............................18 5 PinConfigurationsandFunctions....................... 5 9 PowerSupplyRecommendations...................... 18 6 Specifications......................................................... 6 10 Layout................................................................... 19 6.1 AbsoluteMaximumRatings .....................................6 10.1 LayoutGuidelines.................................................19 6.2 ESDRatings..............................................................6 10.2 LayoutExamples...................................................20 6.3 RecommendedOperatingConditions.......................6 11 DeviceandDocumentationSupport................. 21 6.4 ThermalInformation..................................................6 11.1 DeviceSupport......................................................21 6.5 ElectricalCharacteristics...........................................7 11.2 DocumentationSupport........................................21 6.6 TypicalCharacteristics..............................................8 11.3 ReceivingNotificationofDocumentationUpdates21 7 DetailedDescription............................................ 12 11.4 CommunityResources..........................................21 7.1 Overview.................................................................12 11.5 Trademarks...........................................................22 7.2 FunctionalBlockDiagrams.....................................12 11.6 ElectrostaticDischargeCaution............................22 7.3 FeatureDescription.................................................13 11.7 Glossary................................................................22 7.4 DeviceFunctionalModes........................................15 12 Mechanical,Packaging,andOrderable Information........................................................... 22 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionE(March2015)toRevisionF Page • AddedlastsentencetoUndervoltageLockout(UVLO)section........................................................................................... 13 • AddedUVLOCircuitLimitationsection ............................................................................................................................... 16 ChangesfromRevisionD(July2013)toRevisionE Page • Changedformattomeetlatestdatasheetstandards;addednewsections,andmovedexistingsections........................... 1 • ChangedFeaturesbulletaboutdevicepackageoptions ...................................................................................................... 1 • Changedfront-pagefigure..................................................................................................................................................... 1 • ChangedPinConfigurationandFunctionssection;updatedtableformat............................................................................. 5 • ChangedAbsoluteMaximumRatingstableconditions.......................................................................................................... 6 • ChangedOutputvoltagerangeandJunctiontemperaturerangeparametermaximumspecificationsinAbsolute MaximumRatingstable ......................................................................................................................................................... 6 • AddedESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection.................................................................................................. 6 • CorrectedDBVdatainThermalInformationtable................................................................................................................. 6 • ChangedconditionsofElectricalCharacteristicstable:changedV toV ;changedT toT;correctedoperating IN IN(nom) A J temperaturerange ................................................................................................................................................................. 7 • ChangedT toT and85°Cto125°CthroughoutElectricalCharacteristicstable................................................................ 7 A J • Addedtestconditionsforlineregulationparameter .............................................................................................................. 7 • ChangedV parameterinElectricalCharacteristicstable:allrowschanged ..................................................................... 7 DO • ChangedV parametertypicalspecificationinElectricalCharacteristicstable .................................................................... 7 n • DeletedT parameterfromElectricalCharacteristicstable ................................................................................................... 7 J • AddedT condiitontoI parameterinElectricalCharacteristicstableforclarification ....................................................... 7 J LIM • ChangedTypicalCharacteristicsconditions........................................................................................................................... 8 • ChangedFigure1throughFigure11inTypicalCharacteristicstoshowimprovedperformancedefinition ......................... 8 2 SubmitDocumentationFeedback Copyright©2012–2019,TexasInstrumentsIncorporated ProductFolderLinks:TLV713

TLV713 www.ti.com SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 • AddednewFigure3............................................................................................................................................................... 8 • ChangedFigure4................................................................................................................................................................... 8 • ChangedFigure5................................................................................................................................................................... 8 • ChangedFigure9graphandfiguretitle................................................................................................................................. 8 • AddednewFigure10 ............................................................................................................................................................ 8 • 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ChangedFigure22;correctednotationonaxistitlestoshowunitspergraphdivision(units/div)...................................... 10 • ChangedFigure23;correctednotationonaxistitlestoshowunitspergraphdivision(units/div)...................................... 10 • ChangedShutdownsection:clarifieddescription ................................................................................................................ 13 • ChangedFoldbackCurrentLimitsection:adjustedflowandclarifieddescription............................................................... 14 • Changedparagraph1ofThermalProtection ...................................................................................................................... 14 • ChangedTable2 ................................................................................................................................................................. 17 • MovedOrderingInformationtoDeviceNomenclaturesection ............................................................................................ 21 ChangesfromRevisionC(July2013)toRevisionD Page • ChangeddocumentstatusfromMixedStatustoProductionData........................................................................................ 1 • DeletedDPWpackagefromdocument.................................................................................................................................. 1 • DeletedreferencetoDPWpackagefromlastsentenceofDescriptionsection..................................................................... 1 • DeletedDPWpinoutdrawingfromfront-pagegraphic.......................................................................................................... 1 • Deletedfootnoteforpage1graphic....................................................................................................................................... 1 • DeletedDPWpinoutdrawingfromPinConfigurationssection.............................................................................................. 5 • DeletedreferencetoDPWpackagefromPinDescriptionstable........................................................................................... 5 • DeletedDPWdatafromThermalInformationtable............................................................................................................... 6 • Deletedfootnote3ofOrderingInformationtable................................................................................................................. 21 ChangesfromRevisionB(December2012)toRevisionC Page • ChangedlastFeaturesbullet.................................................................................................................................................. 1 • AddedTypicalApplicationCircuit........................................................................................................................................... 1 • ChangedlasttworowsoftheV parameterintheElectricalCharacteristicstable............................................................. 7 DO ChangesfromRevisionA(October2012)toRevisionB Page • Changedfootnoteforpage1graphic..................................................................................................................................... 1 • AddedDBVdatatoThermalInformationtable....................................................................................................................... 6 • Changedfootnote3ofOrderingInformationtable............................................................................................................... 21 Copyright©2012–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:TLV713

TLV713 SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 www.ti.com ChangesfromOriginal(September2012)toRevisionA Page • ReorderedFeaturesbullets.................................................................................................................................................... 1 • ChangeddropoutrangeinfourthFeaturesbullet................................................................................................................... 1 • ChangedPackageandFixed-OutputVoltageFeaturesbullets............................................................................................. 1 • AddedsecondandthirdparagraphstoDescriptionsection................................................................................................... 1 • UpdatedDQNpinoutdrawing................................................................................................................................................ 1 • ChangedDQNpinoutcaptioninPinConfigurationssection.................................................................................................. 5 • Changed1.2Vto0.9VindescriptionofENpininPinDescriptionstable............................................................................ 5 • ChangedDQNheaderrowinThermalInformationtable....................................................................................................... 6 • ChangedV maximumspecificationinElectricalCharacteristicstable.............................................................................. 7 OUT • CombinedallV rowstogetherinElectricalCharacteristicstable....................................................................................... 7 DO • ChangedV specificationsinElectricalCharacteristicstable.............................................................................................. 7 DO • ChangedI testconditionsinElectricalCharacteristicstable........................................................................................... 7 SHDN • ChangedTypicalCharacteristicsconditions........................................................................................................................... 8 • Addedcurves.......................................................................................................................................................................... 8 • ChangedjunctiontemperaturerangeinsecondparagraphofOverviewsection................................................................ 12 • UpdatedFigure24................................................................................................................................................................ 12 • DeletedthirdparagraphfromThermalInformationsection.................................................................................................. 14 • ChangedsecondparagraphofInputandOutputCapacitorConsiderationssection........................................................... 16 • DeletedcurvereferencefromDropoutVoltagesection....................................................................................................... 16 4 SubmitDocumentationFeedback Copyright©2012–2019,TexasInstrumentsIncorporated ProductFolderLinks:TLV713

TLV713 www.ti.com SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 5 Pin Configurations and Functions DQNPackage 4-PinX2SON DBVPackage TopView 5-PinSOT-23 TopView IN EN 4 3 IN 1 5 OUT GND 2 EN 3 4 NC 1 2 OUT GND PinFunctions PIN NO. I/O DESCRIPTION NAME X2SON SOT-23 Enablepin.DrivingENover0.9Vturnsontheregulator. EN 3 3 I DrivingENbelow0.4Vputstheregulatorintoshutdownmode. GND 2 2 — Groundpin Inputpin.Asmallcapacitorisrecommendedfromthispintoground.SeetheInputand IN 4 1 I OutputCapacitorConsiderationssectionintheFeatureDescriptionformoredetails. NC — 4 — Nointernalconnection Regulatedoutputvoltagepin.Forbesttransientresponse,asmall1-μFceramiccapacitoris OUT 1 5 O recommendedfromthispintoground.SeetheInputandOutputCapacitorConsiderations sectionintheFeatureDescriptionformoredetails. ThethermalpadiselectricallyconnectedtotheGNDnode.ConnecttotheGNDplanefor Thermalpad — — improvedthermalperformance. Copyright©2012–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:TLV713

TLV713 SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings Overoperatingjunctiontemperaturerange(T =25°C),unlessotherwisenoted.AllvoltagesarewithrespecttoGND.(1) J MIN MAX UNIT Input,V –0.3 6 IN Voltage Enable,V –0.3 V +0.3 V EN IN Output,V –0.3 3.6 OUT Current Maximumoutput,I Internallylimited OUT(max) Outputshort-circuitduration Indefinite Totalpowerdissipation Continuous,P SeeThermalInformation D(tot) Storage,T –55 150 °C stg Temperature Junction,T –55 125 °C J (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. 6.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001,allpins(1) ±2000 V(ESD) Electrostaticdischarge Chargeddevicemodel(CDM),perJEDECspecificationJESD22-C101, V allpins(2) ±500 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingjunctiontemperaturerange(unlessotherwisenoted). MIN NOM MAX UNIT V Inputvoltage 1.4 5.5 V IN V Enablerange 0 V V EN IN I Outputcurrent 0 150 mA OUT C Inputcapacitor 0 1 µF IN C Outputcapacitor 0 0.1 100 µF OUT T Operatingjunctiontemperaturerange –40 125 °C J 6.4 Thermal Information TLV713,TLV713P THERMALMETRIC(1) DQN(X2SON) DBV(SOT23) UNIT 4PINS 5PINS R Junction-to-ambientthermalresistance 255.8 249 °C/W θJA R Junction-to-case(top)thermalresistance 159.3 172.7 °C/W θJC(top) R Junction-to-boardthermalresistance 208.2 76.7 °C/W θJB ψ Junction-to-topcharacterizationparameter 16.2 49.7 °C/W JT ψ Junction-to-boardcharacterizationparameter 208.1 75.8 °C/W JB R Junction-to-case(bottom)thermalresistance 148.6 n/a °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. 6 SubmitDocumentationFeedback Copyright©2012–2019,TexasInstrumentsIncorporated ProductFolderLinks:TLV713

TLV713 www.ti.com SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 6.5 Electrical Characteristics Overoperatingtemperaturerange(T =–40°Cto125°C),V =V +0.5VorV =2V(whicheverisgreater), J IN(nom) OUT(nom) IN(nom) I =1mA,V =V ,andC =0.47µF,unlessotherwisenoted.TypicalvaluesareatT =25°C. OUT EN IN OUT J PARAMETER TESTCONDITIONS MIN TYP MAX UNIT VIN Inputvoltagerange 1.4 5.5 V Outputvoltage VOUT range 1 3.3 V VOUT≥1.8V,TJ=25°C –1% 1% VOUT<1.8V,TJ=25°C –20 20 mV DCoutputaccuracy VOUT≥1.2V,–40°C≤TJ≤125°C –1.5% 1.5% VOUT<1.2V,–40°C≤TJ≤125°C –50 50 mV ΔVOUT(ΔVIN) Lineregulation Max{VOUT(nom)+0.5V,VIN=2.0V}≤VIN≤5.5V 1 5 mV ΔVOUT(ΔIOUT) Loadregulation 0mA≤IOUT≤150mA 10 30 mV 1V≤VOUT<1.8V,IOUT=150mA 600 900 VOUT=1.1V,IOUT=100mA 470 600 1.8V≤VOUT<2.1V,IOUT=30mA 70 1.8V≤VOUT<2.1V,IOUT=150mA 350 575 VOUT=0.98×VOUT(nom), 2.1V≤VOUT<2.5V,IOUT=30mA 90 TJ=–40°Cto85°C 2.1V≤VOUT<2.5V,IOUT=150mA 290 481 2.5V≤VOUT<3V,IOUT=30mA 50 2.5V≤VOUT<3V,IOUT=150mA 246 445 VDO Dropoutvoltage mV 3V≤VOUT<3.6V,IOUT=30mA 46 3V≤VOUT<3.6V,IOUT=150mA 230 420 1V≤VOUT<1.8V,IOUT=150mA 600 1020 VOUT=1.1V,IOUT=100mA 470 720 VOUT=0.98×VOUT(nom), 1.8V≤VOUT<2.1V,IOUT=150mA 350 695 TJ=–40°Cto125°C 2.1V≤VOUT<2.5V,IOUT=150mA 290 601 2.5V≤VOUT<3V,IOUT=150mA 246 565 3V≤VOUT<3.6V,IOUT=150mA 230 540 IGND Groundpincurrent IOUT=0mA 50 75 µA ISHUTDOWN Shutdowncurrent VEN≤0.4V,2.0V≤VIN≤5.5V,TJ=25°C 0.1 1 µA f=100Hz 70 Power-supply VIN=3.3V, PSRR rejectionratio VOUT=2.8V, f=10kHz 55 dB IOUT=30mA f=1MHz 55 Vn Outputnoisevoltage BW=100Hzto100kHz,VIN=2.3V,VOUT=1.8V,IOUT=10mA 73 µVRMS tSTR Start-uptime(1) COUT=1.0μF,IOUT=150mA 100 µs Enablehigh VHI (enabled) 0.9 VIN V Enablelow VLO (disabled) 0 0.4 V IEN ENpincurrent EN=5.5V 0.01 µA Pulldownresistor RPULLDOWN (TLV713Ponly) VIN=4V 120 Ω VIN=3.8V,VOUT=3.3V,TJ=–40to85°C 180 ILIM Outputcurrentlimit VIN=2.25V,VOUT=1.8V,TJ=–40to85°C 180 mA VIN=2.0V,VOUT=1.2V,TJ=–40to85°C 180 ISC Short-circuitcurrent VOUT=0V 40 mA Shutdown,temperatureincreasing 158 TSD Thermalshutdown °C Reset,temperaturedecreasing 140 (1) Start-uptimeisthetimefromENassertionto(0.98×V ). OUT(nom) Copyright©2012–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:TLV713

TLV713 SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 www.ti.com 6.6 Typical Characteristics Overoperatingtemperaturerange(T =–40°Cto125°C),V =V +0.5Vor2.0V(whicheverisgreater),I = J IN OUT(nom) OUT 10mA,V =V ,C =1µF,andV =1.8V,unlessotherwisenoted.TypicalvaluesareatT =25°C. EN IN OUT OUT(nom) J 1.802 1.8 TJ = -40qC TJ = -40qC 1.801 TJ = 0qC 1.798 TJ = 0qC TJ = 25qC TJ = 25qC 1.8 TJ = 85qC TJ = 85qC V) 1.799 TJ = 125qC V) 1.796 TJ = 125qC e ( e ( ag 1.798 ag 1.794 olt olt ut V 1.797 ut V 1.792 p p ut 1.796 ut O O 1.79 1.795 1.788 1.794 1.793 1.786 2 2.5 3 3.5 4 4.5 5 5.5 0 20 40 60 80 100 120 140 160 Input Voltage (V) Output Current (mA) Figure1.1.8-VLineRegulationvs Figure2.1.8-VLoadRegulationvs V andTemperature I andTemperature IN OUT 1.798 500 TJ = -40qC 1.7975 TJ = 0qC 400 TJ = 25qC V) 1.797 mV) TTJJ == 81525qCqC Voltage ( 11.7.799665 Voltage ( 300 Output 11.7.799555 Dropout 200 100 1.7945 1.794 0 -40 -20 0 20 40 60 80 100 120 140 0 25 50 75 100 125 150 Temperature (qC) Output Current (mA) Figure3.1.8-VOutputVoltageOverTemperature Figure4.1.8-VDropoutVoltagevs I andTemperature OUT 400 65 TJ = -40qC 62.5 TJ = -40qC e (mV) 233505000 TTTTJJJJ ==== 0281552qC5qqCCqC ent (A)P 552756..5055 TTTTJJJJ ==== 0281q552Cqq5CCqC Voltag 200 n Curr 475.05 pout 150 nd Pi 424.55 o u Dr 100 Gro 374.05 50 35 32.5 0 30 0 25 50 75 100 125 150 2 2.5 3 3.5 4 4.5 5 5.5 Output Current (mA) Input Voltage (V) Figure5.3.3-VDropoutVoltagevs Figure6.GroundPinCurrentvs I andTemperature V andTemperature OUT IN 8 SubmitDocumentationFeedback Copyright©2012–2019,TexasInstrumentsIncorporated ProductFolderLinks:TLV713

TLV713 www.ti.com SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 Typical Characteristics (continued) Overoperatingtemperaturerange(T =–40°Cto125°C),V =V +0.5Vor2.0V(whicheverisgreater),I = J IN OUT(nom) OUT 10mA,V =V ,C =1µF,andV =1.8V,unlessotherwisenoted.TypicalvaluesareatT =25°C. EN IN OUT OUT(nom) J 80 500 300 75 200 A) 70 A) 100 P n nt ( 65 nt ( 50 e e urr 60 urr 30 C C Pin 55 Pin 20 Ground 4550 TTTJJJ === -0245q0CqqCC Ground 150 TTTJJJ === -0245q0CqqCC TJ = 85qC 3 TJ = 85qC 40 TJ = 125qC 2 TJ = 125qC 35 1 0 20 40 60 80 100 120 140 160 2 2.5 3 3.5 4 4.5 5 5.5 Output Current (mA) Input Voltage (V) Figure7.GroundPinCurrentvs Figure8.ShutdownCurrentvs I andTemperature V andTemperature OUT IN 100 90 85 90 80 80 75 70 70 65 R (dB) 5600 R (dB) 556050 SR 40 SR 45 P 30 P 40 35 20 COUT = 0 PF, IOUT = 150 mA 30 IOUT = 10 mA 10 COUT = 0 PF, IOUT = 30 mA 25 IOUT = 50 mA 0 COUT = 1 PF, IOUT = 150 mA 20 IOUT = 100 mA COUT = 1 PF, IOUT = 30 mA 15 IOUT = 150 mA -10 10 1E+1 1E+2 1E+3 1E+4 1E+5 1E+6 1E+7 1E+1 1E+2 1E+3 1E+4 1E+5 1E+6 1E+7 Frequency (Hz) Frequency (Hz) Figure9.Power-SupplyRejectionRatioOverC Figure10.Power-SupplyRejectionRatioOverI OUT OUT 55 3 COUT = 0 PF VIN 2 COUT = 1 PF Channel 1 Hz) 1 1 V/div VIN= 3 V to 4 V V/(cid:151) 0.5 VOUT= 1.8 V P 0.3 I = 0 mA oise ( 0.2 COIUNT=COUT=0mF N 0.1 age 0.05 Channel 3 VOUT Volt 0.03 200 mV/div 0.02 0.01 Time (200 ms/div) 0.005 1E+1 1E+2 1E+3 1E+4 1E+5 1E+6 1E+7 G016 Frequency (Hz) Figure11.OutputSpectralNoiseDensity Figure12.LineTransient Copyright©2012–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:TLV713

TLV713 SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 www.ti.com Typical Characteristics (continued) Overoperatingtemperaturerange(T =–40°Cto125°C),V =V +0.5Vor2.0V(whicheverisgreater),I = J IN OUT(nom) OUT 10mA,V =V ,C =1µF,andV =1.8V,unlessotherwisenoted.TypicalvaluesareatT =25°C. EN IN OUT OUT(nom) J V = 5 V, V = 1.8 V V IN OUT IN C = C =1mF IN OUT Channel 1 Channel 1 1 V/div 20 mV/div V OUT V = 3 V to 4 V V I Channel 3 IN OUT Channel 4 OUT V = 1.8 V 0.5 V/div OUT 20 mA/div I = 150 mA OUT C = C =0mF IN OUT Time (200 ms/div) Time (200 ms/div) G017 G012 Figure13.LineTransient Figure14.0-mAto20-mALoadTransient V = 5 V, V = 1.8 V 3.5 IN OUT C = C =0mF IN OUT 3 Channel 3 200 mV/div VOUT e (V) 2.5 ag 2 olt V ut 1.5 p Channel 4 IOUT Out 1 20 mA/div 0.5 TLV71333P 0 Time (200 ms/div) 0 50 100 150 200 250 300 Output Current (mA) G015 G010 Figure15.0-mAto20-mALoadTransient Figure16.3.3-VOutputVoltagevsOutputCurrent (FoldbackCurrentLimit) V = 5 V, V = 1.8 V 2 IN OUT CIN= COUT=0mF 1.75 Channel 3 0.5 V/div VOUT e (V) 1.12.55 g a olt 1 V put 0.75 Channel 4 IOUT Out 50 mA/div 0.5 0.25 TLV71318P 0 Time (200 ms/div) 0 50 100 150 200 250 300 350 Output Current (mA) G013 G011 Figure17.0-mAto100-mALoadTransient Figure18.1.8-VOutputVoltagevsOutputCurrent (FoldbackCurrentLimit) 10 SubmitDocumentationFeedback Copyright©2012–2019,TexasInstrumentsIncorporated ProductFolderLinks:TLV713

TLV713 www.ti.com SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 Typical Characteristics (continued) Overoperatingtemperaturerange(T =–40°Cto125°C),V =V +0.5Vor2.0V(whicheverisgreater),I = J IN OUT(nom) OUT 10mA,V =V ,C =1µF,andV =1.8V,unlessotherwisenoted.TypicalvaluesareatT =25°C. EN IN OUT OUT(nom) J 4 V = 5 V, V = 1.8 V IN OUT IOUT = 150 mA VIN CIN= COUT=0mF TPS71318P VOUT Channel 3 200 mV/div 3 V OUT V) e ( g 2 a olt V I Channel 4 OUT 50 mA/div 1 0 Time (200 ms/div) 0 0.5 1 1.5 2 Time (s) G014 G020 Figure19.10-mAto150-mALoadTransient Figure20.V Power-UpandPower-Down IN Channel 1 Channel 1 V 2 V/div V 100 mV/div IN IN EN Channel 2 Channel 2 EN 2 V/div 1 V/div VOUT Channel 3 1 V/div V = 3 V IN Channel 3 VOUT IOUT VOUT= 1.8 V C50h amnAne/dl i4v VIN= 2.3 V, VOUT= 1.8 V 1 V/div CIN= COUT=0mF CIN= 1mF, COUT= 10mF Channel 4 IOUTTL=V 7115301 m8PA ILOAD TLV71318P, IFOrUoTm= D9e0s migAn 50 mA/div Time (50 ms/div) Time (100ms/div) G021 G022 Figure21.Start-upWithEN Figure22.Start-upWithEN Channel 1 2 V/div VIN VIN= 3 V V = 1.8 V OUT C = C =1mF IN OUT Channel 2 EN TPS71318P 2 V/div No Load V Channel 3 OUT 1 V/div Channel 4 I 100 mA/div OUT Time (50 ms/div) G019 Figure23.ShutdownResponseWithEnable Copyright©2012–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:TLV713

TLV713 SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 www.ti.com 7 Detailed Description 7.1 Overview These devices belong to a new family of next-generation value low-dropout (LDO) regulators. These devices consume low quiescent current and deliver excellent line and load transient performance. These characteristics, combined with low noise, very good PSRR with little (V – V ) headroom, make this family of devices ideal for IN OUT RFportableapplications. This family of regulators offers current limit and thermal protection. Device operating junction temperature is –40°Cto125°C. 7.2 Functional Block Diagrams IN OUT Current Limit Thermal Shutdown UVLO EN Bandgap Logic TLV713 GND Figure24. TLV713BlockDiagram 12 SubmitDocumentationFeedback Copyright©2012–2019,TexasInstrumentsIncorporated ProductFolderLinks:TLV713

TLV713 www.ti.com SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 Functional Block Diagrams (continued) IN OUT Current Limit Thermal Shutdown UVLO 120W EN Bandgap Logic TLV713P GND Figure25. TLV713PBlockDiagram 7.3 Feature Description 7.3.1 UndervoltageLockout(UVLO) The TLV713 uses a UVLO circuit that disables the output until the input voltage is greater than the rising UVLO voltage. This circuit ensures that the device does not exhibit any unpredictable behavior when the supply voltage is lower than the operational range of the internal circuitry, V . During UVLO disable, the output of the IN(min) TLV713P version is connected to ground with a 120-Ω pulldown resistor. Fast rising and falling voltage changes near UVLO levels require at least a 1-ms delay before the rising and falling edges; see the UVLO Circuit Limitationsection. 7.3.2 Shutdown The enable pin (EN) is active high. Enable the device by forcing the EN pin to exceed V (0.9 V, minimum). EN(high) Turn off the device by forcing the EN pin to drop below 0.4 V. If shutdown capability is not required, connect EN toIN. The TLV713P has an internal pulldown MOSFET that connects a 120-Ω resistor to ground when the device is disabled. The discharge time after disabling depends on the output capacitance (C ) and the load resistance OUT (R )inparallelwiththe120-Ωpulldownresistor.ThetimeconstantiscalculatedinEquation1. L 120 · R t= L · C 120 + R OUT L (1) Copyright©2012–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:TLV713

TLV713 SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 www.ti.com Feature Description (continued) 7.3.3 FoldbackCurrentLimit The TLV713 has an internal foldback current limit that helps protect the regulator during fault conditions. The current supplied by the device is gradually reducedwhile the output voltage decreases. When the output is shorted, the LDO supplies a typical current of 40 mA. Output voltage is not regulated when the device is in currentlimit,andiscalculatedbyEquation2: V =I ×R (2) OUT LIMIT LOAD The PMOS pass transistor dissipates [(V – V ) × I ] until thermal shutdown is triggered and the device IN OUT LIMIT turns off. The device is turned on by the internal thermal shutdown circuit during cool down. If the fault condition continues, the device cycles between current limit and thermal shutdown. See the Thermal Information section formoredetails. The TLV713 PMOS pass element has a built-in body diode that conducts current when the voltage at OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is anticipated, externallimitingto5%oftheratedoutputcurrentisrecommended. 7.3.4 ThermalProtection Thermal protection disables the output when the junction temperature rises to approximately 158°C, allowing the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits regulator dissipation, protecting the device from damage as a resultofoverheating. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink.Forreliableoperation,junctiontemperaturemust be limited to 125°C maximum. To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection istriggered;useworst-caseloadsandsignalconditions. The TLV713 internal protection circuitry is designed to protect against overload conditions. This circuitry is not intendedtoreplaceproperheatsinking.ContinuouslyrunningtheTLV713intothermal shutdown degrades device reliability. 14 SubmitDocumentationFeedback Copyright©2012–2019,TexasInstrumentsIncorporated ProductFolderLinks:TLV713

TLV713 www.ti.com SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 7.4 Device Functional Modes 7.4.1 NormalOperation Thedeviceregulatestothenominaloutputvoltageunderthefollowingconditions: • TheinputvoltageisatleastashighasV . IN(min) • Theinputvoltageisgreaterthanthenominaloutputvoltageaddedtothedropoutvoltage. • The enable voltage has previously exceeded the enable rising threshold voltage and has not decreased belowtheenablefallingthreshold. • Theoutputcurrentislessthanthecurrentlimit. • Thedevicejunctiontemperatureislessthanthemaximumspecifiedjunctiontemperature. 7.4.2 DropoutOperation If the input voltage is lower than the nominal output voltage plus the specified dropout voltage, but all other conditions are met for normal operation, the device operates in dropout mode. In this mode of operation, the output voltage is the same as the input voltage minus the dropout voltage. The transient performance of the deviceissignificantlydegradedbecause the pass device is in the linear region and no longer controls the current throughtheLDO.Lineorloadtransientsindropoutcanresultinlargeoutputvoltagedeviations. 7.4.3 Disabled Thedeviceisdisabledunderthefollowingconditions: • The enable voltage is less than the enable falling threshold voltage or has not yet exceeded the enable rising threshold. • Thedevicejunctiontemperatureisgreaterthanthethermalshutdowntemperature. Table1showstheconditionsthatleadtothedifferentmodesofoperation. Table1.DeviceFunctionalModeComparison PARAMETER OPERATINGMODE V V I T IN EN OUT J V >V +V and Normalmode IN OUT(nom) DO V >V I <I T <125°C V >V EN EN(high) OUT LIM J IN IN(min) Dropoutmode V <V <V +V V >V — T <125°C IN(min) IN OUT(nom) DO EN EN(high) J Disabledmode (anytrueconditiondisablesthe — V <V — T >158°C EN EN(low) J device) Copyright©2012–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:TLV713

TLV713 SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 8.1 Application Information 8.1.1 InputandOutputCapacitorConsiderations The TLV713 uses an advanced internal control loop to obtain stable operation both with and without the use of inputor output capacitors. The TLV713 dynamic performance is improved with the use of an output capacitor. An output capacitance of 0.1 μF or larger generally provides good dynamic response. X5R- and X7R-type ceramic capacitors are recommended because these capacitors have minimal variation in value and equivalent series resistance(ESR)overtemperature. Although an input capacitor is not required for stability, it is good analog design practice to connect a 0.1-µF to 1-µF capacitor from IN to GND. This capacitor counteracts reactive input sources and improves transient response, input ripple, and PSRR. An input capacitor is recommended if the source impedance is more than 0.5 Ω. A higher-value capacitor may be necessary if large, fast, rise-time load transients are anticipated or if the deviceislocatedseveralinchesfromtheinputpowersource. 8.1.2 DropoutVoltage The TLV713 uses a PMOS pass transistor to achieve low dropout. When (V – V ) is less than the dropout IN OUT voltage (V ), the PMOS pass device is in the linear region of operation and the input-to-output resistance is the DO R of the PMOS pass element. V scales approximately with output current because the PMOS device DS(on) DO behaves like a resistor in dropout. As with any linear regulator, PSRR and transient response are degraded as (V –V )approachesdropout. IN OUT 8.1.3 TransientResponse As with any regulator, increasing the size of the output capacitor reduces over- and undershoot magnitude but increasesthedurationofthetransientresponse. 8.1.4 UVLOCircuitLimitation The TLV713 UVLO circuit is sensitive to fast rising and falling input voltage changes that result in the device turning on and off. When the input voltage drops below the minimum V and the device is turned off, provide a IN minimum 1-ms delay before turning on the device again. This minimum 1-ms delay allows the internal circuit to reset to the correct state. If the TLV713 is turned on again before the delay elapses, an EN toggle is required for theinternalcircuittoresettothecorrectstate. 16 SubmitDocumentationFeedback Copyright©2012–2019,TexasInstrumentsIncorporated ProductFolderLinks:TLV713

TLV713 www.ti.com SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 8.2 Typical Application SeveralversionsoftheTPS713areidealforpoweringtheMSP430microcontroller. Figure 26 shows a diagram of the TLV713 powering an MSP430 microcontroller. Table 2 shows potential applicationsofsomevoltageversions. V O (1.8 V to 3.6 V) VI IN OUT MSP430 0.1mF 0.1mF EN GND Figure26. TLV713PoweringaMicrocontroller Table2.TypicalMSP430Applications DEVICE V (Typ) APPLICATION OUT TLV71318P 1.8V AllowsforlowestpowerconsumptionwithmanyMSP430s TLV71325P 2.5V 2.2-VsupplyrequiredbymanyMSP430sforflashprogramminganderasing 8.2.1 DesignRequirements Table3liststhedesignrequirements. Table3.DesignParameters PARAMETER DESIGNREQUIREMENT Inputvoltage 4.2Vto3V(LithiumIonbattery) Outputvoltage 1.8V,±1% DCoutputcurrent 10mA Peakoutputcurrent 75mA Maximumambienttemperature 65°C 8.2.2 DetailedDesignProcedure Aninputcapacitorisnotrequiredforthisdesignbecauseofthelowimpedanceconnectiondirectlytothebattery. No output capacitor allows for the minimal possible inrush current during start-up, ensuring the 180-mA maximuminputcurrentlimitisnotexceeded. VerifythatthemaximumjunctiontemperatureisnotexceededbyreferringtoFigure30. Copyright©2012–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:TLV713

TLV713 SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 www.ti.com 8.2.3 ApplicationCurves 100 4 90 VIOOUUTT = = 1 10. 8m VA 80 3 70 z ) H SRR (dB) 456000 mage ( V / 2 P 30 olt V 1 20 COUT = 0 PF, IOUT = 150 mA 10 COUT = 0 PF, IOUT = 30 mA 0 CCOOUUTT == 11 PPFF,, IIOOUUTT == 13500 m mAA 010 100 1k 10k 100k -10 Frequency (Hz) 1E+1 1E+2 1E+3 1E+4 1E+5 1E+6 1E+7 G009 Frequency (Hz) Figure27.Power-SupplyRejectionRatiovsFrequency Figure28.OutputSpectralNoiseDensity 4 IOUT = 150 mA VIN TPS71318P VOUT 3 V) e ( g 2 a olt V 1 0 0 0.5 1 1.5 2 Time (s) G020 Figure29.V PowerUpandPowerDown IN 8.3 What to Do and What Not to Do Place at least one 0.1-µF ceramic capacitor as close as possible to the OUT pin of the regulator for best transientperformance. Placeatleastone1-µFcapacitorascloseaspossibletotheINpinforbesttransientperformance. Donotplacetheoutputcapacitormorethan10mmawayfromtheregulator. Donotexceedtheabsolutemaximumratings. Donotcontinuouslyoperatethedeviceincurrentlimitornearthermalshutdown. 9 Power Supply Recommendations These devices are designed to operate from an input voltage supply range from 1.4 V to 5.5 V. The input voltage range must provide adequate headroom for the device to have a regulated output. This input supply must be well-regulated and stable. If the input supply is noisy, additional input capacitors with low ESR can help improve theoutputnoiseperformance. 18 SubmitDocumentationFeedback Copyright©2012–2019,TexasInstrumentsIncorporated ProductFolderLinks:TLV713

TLV713 www.ti.com SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 10 Layout 10.1 Layout Guidelines 10.1.1 BoardLayoutRecommendationstoImprovePSRRandNoisePerformance Input and output capacitors must be placed as close to the device pins as possible. To improve AC performance (such as PSRR, output noise, and transient response), TI recommends that the board be designed with separate ground planes for V and V , with the ground plane connected only at the device GND pin. In addition, the IN OUT output capacitor ground connection must be connected directly to the device GND pin. High-ESR capacitors may degradePSRRperformance. 10.1.2 PowerDissipation The ability to remove heat from the die is different for each package type, presenting different considerations in the printed-circuit-board (PCB) layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. Performance data for JEDEC low- and high-K boards are given in Thermal Information. Using heavier copper increases the effectiveness in removing heat from the device. The additionofplatedthrough-holestoheat-dissipatinglayersalsoimprovestheheatsinkeffectiveness. Power dissipation depends on input voltage and load conditions. Power dissipation (P ) can be approximated by D the product of the output current times the voltage drop across the output pass element (V to V ), as shown IN OUT inEquation3. P =(V –V )×I (3) D IN OUT OUT Figure 30 shows the maximum ambient temperature versus the power dissipation of the TLV713. This figure assumes the device is soldered on a JEDEC standard, high-K layout with no airflow over the board. Actual board thermal impedances vary widely. If the application requires high power dissipation, having a thorough understanding of the board temperature and thermal impedances is helpful to ensure the TLV713 does not operateaboveajunctiontemperatureof125°C. 130 TLV713 DQN, High-K Layout C) 120 TLV713 DBV, High-K Layout e (° ur 110 at er p 100 m e T nt 90 e bi m 80 A m u 70 m xi a 60 M 50 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 Power Dissipation (W) Figure30. MaximumAmbientTemperaturevsDevicePowerDissipation Estimatingthejunctiontemperaturecanbedonebyusingthethermalmetrics Ψ and Ψ ,shownin the Thermal JT JB Information table.Thesemetrics are a more accurate representation of the heat transfer characteristics of the die andthepackagethanR .ThejunctiontemperaturecanbeestimatedwithEquation4. θJA Copyright©2012–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLinks:TLV713

TLV713 SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 www.ti.com Layout Guidelines (continued) Y : T = T +Y ·P JT J T JT D Y : T = T +Y ·P JB J B JB D where • P isthepowerdissipationshownbyEquation3, D • T isthetemperatureatthecenter-topoftheICpackage, T • T isthePCBtemperaturemeasured1mmawayfromtheICpackageonthePCBsurface. (4) B NOTE Both T and T can be measured on actual application boards using a thermo-gun (an T B infraredthermometer). For more information about measuring T and T , see the Using New Thermal Metrics application note, available T B fordownloadatwww.ti.com. 10.2 Layout Examples VOUT OUT TLV713 IN VIN COUT(1) CIN(1) GND EN GND PLANE Represents via used for application-specific connections (1) Notrequired. Figure31. X2SONLayoutExample VIN VOUT IN OUT CIN GND COUT E N NC GND PLANE Represents via used for application-specific connections (1) Notrequired. Figure32. SOT-23LayoutExample 20 SubmitDocumentationFeedback Copyright©2012–2019,TexasInstrumentsIncorporated ProductFolderLinks:TLV713

TLV713 www.ti.com SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 11 Device and Documentation Support 11.1 Device Support 11.1.1 DevelopmentSupport 11.1.1.1 EvaluationModules Three evaluation modules (EVMs) are available to assist in the initial circuit performance evaluation using the TLV713: • TLV71312PEVM-171 • TLV71318PEVM-171 • TLV71333PEVM-171 These EVMs can be requested at the Texas Instruments website through the device product folders or purchaseddirectlyfromtheTIeStore. 11.1.1.2 SpiceModels Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TLV713 is available through the product folders under Tools &Software. 11.1.2 DeviceNomenclature Table4.OrderingInformation(1)(2) PRODUCT V O XX(X)isthenominaloutputvoltage.Foroutputvoltageswitharesolutionof100mV,twodigitsareused intheorderingnumber;otherwise,threedigitsareused(forexample,28=2.8V;475=4.75V). TLV713xx(x)Pyyyz Pisoptional;deviceswithPhaveanLDOregulatorwithanactiveoutputdischarge. YYYisthepackagedesignator. Zisthepackagequantity.Risforreel(3000pieces),Tisfortape(250pieces). (1) ForthemostcurrentpackageandorderinginformationseethePackageOptionAddendumattheendofthisdocument,orvisitthe deviceproductfolderonwww.ti.com. (2) Outputvoltagesfrom1.0Vto3.3Vin50-mVincrementsareavailable.Contactthefactoryfordetailsandavailability. 11.2 Documentation Support 11.2.1 RelatedDocumentation Forrelateddocumentationseethefollowing: • TexasInstruments,UsingNewThermalMetricsapplicationreport • TexasInstruments,TLV713xxEVM-171User'sGuideuser'sguide 11.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed.Forchangedetails,reviewtherevisionhistoryincludedinanyreviseddocument. 11.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. Copyright©2012–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 21 ProductFolderLinks:TLV713

TLV713 SBVS195F–SEPTEMBER2012–REVISEDAUGUST2019 www.ti.com 11.5 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 11.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. 11.7 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 22 SubmitDocumentationFeedback Copyright©2012–2019,TexasInstrumentsIncorporated ProductFolderLinks:TLV713

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLV71310PDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUQI & no Sb/Br) TLV71310PDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUQI & no Sb/Br) TLV71310PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ET & no Sb/Br) TLV71310PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ET & no Sb/Br) TLV71311PDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUPI & no Sb/Br) TLV71311PDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUPI & no Sb/Br) TLV71312PDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUEI & no Sb/Br) TLV71312PDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUEI & no Sb/Br) TLV71312PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AF & no Sb/Br) TLV71312PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AF & no Sb/Br) TLV71315PDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUGI & no Sb/Br) TLV71315PDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUGI & no Sb/Br) TLV71315PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AY & no Sb/Br) TLV71315PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AY & no Sb/Br) TLV713185PDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUII & no Sb/Br) TLV713185PDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUII & no Sb/Br) TLV713185PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 A1 & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLV713185PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 A1 & no Sb/Br) TLV71318PDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUDI & no Sb/Br) TLV71318PDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUDI & no Sb/Br) TLV71318PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AW & no Sb/Br) TLV71318PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AW & no Sb/Br) TLV71320DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 B2 & no Sb/Br) TLV71320DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 B2 & no Sb/Br) TLV71325PDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUJI & no Sb/Br) TLV71325PDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUJI & no Sb/Br) TLV71325PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AZ & no Sb/Br) TLV71325PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AZ & no Sb/Br) TLV713285PDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VULI & no Sb/Br) TLV713285PDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VULI & no Sb/Br) TLV713285PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 A2 & no Sb/Br) TLV713285PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 A2 & no Sb/Br) TLV71328PDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUKI & no Sb/Br) TLV71328PDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUKI & no Sb/Br) TLV71328PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AK & no Sb/Br) Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLV71328PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AK & no Sb/Br) TLV71330PDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUMI & no Sb/Br) TLV71330PDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUMI & no Sb/Br) TLV71330PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AL & no Sb/Br) TLV71330PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AL & no Sb/Br) TLV71333PDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUFI & no Sb/Br) TLV71333PDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VUFI & no Sb/Br) TLV71333PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AH & no Sb/Br) TLV71333PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AH & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLV713P : •Automotive: TLV713P-Q1 NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 27-Aug-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TLV71310PDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV71310PDBVT SOT-23 DBV 5 250 178.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 TLV71310PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71310PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71311PDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV71311PDBVT SOT-23 DBV 5 250 178.0 8.4 3.3 3.2 1.4 4.0 8.0 Q3 TLV71312PDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV71312PDBVT SOT-23 DBV 5 250 178.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 TLV71312PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71312PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71315PDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV71315PDBVT SOT-23 DBV 5 250 178.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 TLV71315PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71315PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV713185PDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV713185PDBVT SOT-23 DBV 5 250 178.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 TLV713185PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV713185PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 27-Aug-2019 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TLV71318PDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV71318PDBVT SOT-23 DBV 5 250 178.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 TLV71318PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71318PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71320DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71320DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71325PDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV71325PDBVT SOT-23 DBV 5 250 178.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 TLV71325PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71325PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV713285PDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV713285PDBVT SOT-23 DBV 5 250 178.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 TLV713285PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV713285PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71328PDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV71328PDBVT SOT-23 DBV 5 250 178.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 TLV71328PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71328PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71330PDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV71330PDBVT SOT-23 DBV 5 250 178.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 TLV71330PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71330PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71333PDBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TLV71333PDBVT SOT-23 DBV 5 250 178.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 TLV71333PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV71333PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 PackMaterials-Page2

PACKAGE MATERIALS INFORMATION www.ti.com 27-Aug-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TLV71310PDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV71310PDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV71310PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV71310PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV71311PDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV71311PDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV71312PDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV71312PDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV71312PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV71312PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV71315PDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV71315PDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV71315PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV71315PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV713185PDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV713185PDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV713185PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV713185PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV71318PDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV71318PDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 PackMaterials-Page3

PACKAGE MATERIALS INFORMATION www.ti.com 27-Aug-2019 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TLV71318PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV71318PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV71320DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV71320DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV71325PDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV71325PDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV71325PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV71325PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV713285PDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV713285PDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV713285PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV713285PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV71328PDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV71328PDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV71328PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV71328PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV71330PDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV71330PDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV71330PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV71330PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV71333PDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV71333PDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV71333PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV71333PDQNT X2SON DQN 4 250 184.0 184.0 19.0 PackMaterials-Page4

PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 1.45 B A 0.90 PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com

EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE DQN0004A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD B 1.05 A 0.95 1 1.05 PIN 1 0.95 INDEX AREA C 0.4 MAX SEATING PLANE 0.08 NOTE 6 0.48+0.12 0.05 (0.05) TYP -0.1 0.00 2 NOTE 6 3 EXPOSED 5 THERMAL PAD 2X 0.65 (0.07) TYP NOTE 5 1 4 PIN 1 ID 4X 0.28 0.15 (OPTIONAL) (0.11) NOTE 4 0.3 0.1 C A B 0.2 0.05 C 3X 0.30 0.15 4215302/E 12/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. 4. Features may not exist. Recommend use of pin 1 marking on top of package for orientation purposes. 5. Shape of exposed side leads may differ. 6. Number and location of exposed tie bars may vary. www.ti.com

EXAMPLE BOARD LAYOUT DQN0004A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD (0.86) SYMM 4X (0.36) 4X SEE DETAIL (0.03) 4 4X (0.21) 1 SYMM 5 (0.65) 4X (0.18) 2 3 ( 0.48) (0.22) TYP EXPOSED METAL CLEARANCE LAND PATTERN EXAMPLE SCALE: 40X 0.05 MIN ALL AROUND SOLDER MASK EXPOSED METAL OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED SOLDER MASK DETAIL 4215302/E 12/2016 NOTES: (continued) 7. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 8. If any vias are implemented, it is recommended that vias under paste be filled, plugged or tented. www.ti.com

EXAMPLE STENCIL DESIGN DQN0004A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD (0.9) SYMM 4X (0.4) 4X (0.03) 4 1 4X (0.21) 5 SYMM (0.65) SOLDER MASK 4X (0.22) EDGE 2 3 ( 0.45) 4X (0.235) SOLDER PASTE EXAMPLE BASED ON 0.075 - 0.1mm THICK STENCIL EXPOSED PAD 88% PRINTED SOLDER COVERAGE BY AREA SCALE: 60X 4215302/E 12/2016 NOTES: (continued) 9. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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