Product Order Technical Tools & Support & Folder Now Documents Software Community TLV707,TLV707P SBVS153F–FEBRUARY2011–REVISEDMAY2018 TLV707, TLV707P 200-mA, Low-I , Low-Noise, Low-Dropout Regulator for Portable Devices Q 1 Features 3 Description • 0.5%TypicalAccuracy The TLV707 series (TLV707 and TLV707P) of low- 1 dropout linear regulators (LDOs) are low quiescent • Supports200-mAOutput current devices with excellent line and load transient • LowIQ:25μA performance for power-sensitive applications. These • Fixed-OutputVoltageCombinationsPossiblefrom devices provide a typical accuracy of 0.5%. All 0.85Vto5.0V(1) versions have thermal shutdown and overcurrent protectionforsafety. • HighPSRR: Furthermore, these devices are stable with an – 70dBat100Hz effective output capacitance of only 0.1 µF. This – 50dBat1MHz feature enables the use of cost-effective capacitors • StableWithEffectiveCapacitanceof0.1 μF(2) that have higher bias voltages and temperature • ThermalShutdownandOvercurrentProtection derating. These devices also regulate to the specified accuracywithnooutputload. • Package:1-mm×1-mmDQN(X2SON) The TLV707P also provides an active pulldown circuit (1) Forallavailablevoltageoptions,seethepackageoption addendumattheendofthedatasheet. toquicklydischargetheoutputs. (2) SeetheMechanical,Packaging,andOrderableInformation The TLV707 series of LDOs are available in a 1-mm sectionformoredetails. × 1-mm DQN (X2SON) package that makes them desirableforhandheldapplications. 2 Applications DeviceInformation(1) • SmartPhonesandWirelessHandsets PARTNUMBER PACKAGE BODYSIZE(NOM) • GamingandToys TLV707 • WLANandOtherPCAdd-OnCards X2SON(4) 1.00mm×1.00mm TLV707P • TVsandSet-TopBoxes (1) Forallavailablepackages,seethepackageoptionaddendum • WearableElectronics attheendofthedatasheet. TypicalApplicationCircuit VIN IN OUT VOUT C C 1mF IN OUT Ceramic TLV707 Series On Off EN GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

TLV707,TLV707P SBVS153F–FEBRUARY2011–REVISEDMAY2018 www.ti.com Table of Contents 1 Features.................................................................. 1 8.2 TypicalApplication..................................................20 2 Applications........................................................... 1 8.3 Do'sandDon'ts.......................................................23 3 Description............................................................. 1 9 PowerSupplyRecommendations...................... 24 4 RevisionHistory..................................................... 2 10 Layout................................................................... 24 5 PinConfigurationandFunctions......................... 4 10.1 LayoutGuidelines.................................................24 10.2 LayoutExample....................................................24 6 Specifications......................................................... 5 10.3 ThermalConsiderations........................................24 6.1 AbsoluteMaximumRatings......................................5 10.4 PowerDissipation.................................................25 6.2 ESDRatings..............................................................5 11 DeviceandDocumentationSupport................. 26 6.3 RecommendedOperatingConditions.......................5 6.4 ThermalInformation..................................................5 11.1 DeviceSupport......................................................26 6.5 ElectricalCharacteristics...........................................6 11.2 DocumentationSupport........................................26 6.6 TypicalCharacteristics..............................................7 11.3 RelatedLinks........................................................26 11.4 ReceivingNotificationofDocumentationUpdates26 7 DetailedDescription............................................ 17 11.5 CommunityResources..........................................27 7.1 Overview.................................................................17 11.6 Trademarks...........................................................27 7.2 FunctionalBlockDiagrams.....................................17 11.7 ElectrostaticDischargeCaution............................27 7.3 FeatureDescription.................................................18 11.8 Glossary................................................................27 7.4 DeviceFunctionalModes........................................19 12 Mechanical,Packaging,andOrderable 8 ApplicationandImplementation........................ 20 Information........................................................... 27 8.1 ApplicationInformation............................................20 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionE(February2016)toRevisionF Page • ChangedV HBMvaluefrom±2000Vto±4000VinESDRatingstable......................................................................... 5 (ESD) ChangesfromRevisionD(January2015)toRevisionE Page • ChangeddevicenametoTLV707,TLV707PandchangedV ,V ,I symbolsthroughoutdocument....................1 IN OUT(nom) OUT • ChangedDQNpackagedesignatornameinPackageFeaturesbullet................................................................................. 1 • ChangedApplicationsbullets ................................................................................................................................................ 1 • DeletedfirstsentencefromlastparagraphofDescriptionsection ........................................................................................ 1 • Changedcaptionoffront-pagefigure .................................................................................................................................... 1 • ChangedThermalInformationtable....................................................................................................................................... 5 • ChangedT toT inconditionsofElectricalCharacteristicstable ........................................................................................ 6 A J • DeletedtemperaturetestconditionsfromV parameterinElectricalCharacteristicstable .............................................. 6 OUT • DeletedUVLOparameterfromElectricalCharacteristicstable ............................................................................................ 6 • DeletedUVLOblockfromFigure58 ................................................................................................................................... 18 • Addedcross-referenceforEquation1................................................................................................................................. 19 • ChangedDeviceFunctionalModessection ........................................................................................................................ 19 • DeletedUndervoltageLockout(UVLO)section .................................................................................................................. 19 • ChangedtitleofFigure59 ................................................................................................................................................... 20 • Addedcross-referenceforTable1 ...................................................................................................................................... 20 • Addedcross-referenceforFigure68................................................................................................................................... 24 2 SubmitDocumentationFeedback Copyright©2011–2018,TexasInstrumentsIncorporated ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P www.ti.com SBVS153F–FEBRUARY2011–REVISEDMAY2018 ChangesfromRevisionC(November2012)toRevisionD Page • ChangedreferencestoDFN(SON)packagetoDQN(X2SON)throughoutdocument........................................................ 1 • ChangedFeatureslistbullets ................................................................................................................................................ 1 • ChangedfourthparagraphofDescriptionsection ................................................................................................................. 1 • AddedESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection ................................................................................................. 1 • ChangedPinDescriptionstablecontents ............................................................................................................................. 4 • ChangedOverviewsection.................................................................................................................................................. 17 • ChangedInternalCurrentLimitsection ............................................................................................................................... 18 • ChangedInputandOutputCapacitorRequirementssection .............................................................................................. 20 ChangesfromRevisionB(October2011)toRevisionC Page • ChangedvoltagerangeinfourthFeaturesbullet................................................................................................................... 1 • Changedfrontpagepinoutdrawing....................................................................................................................................... 1 • ChangedOutputvoltagerangeparameterminimumspecificationinElectricalCharacteristicstable................................... 6 • ChangedDCoutputaccuracyparametertestconditionsinElectricalCharacteristicstable................................................. 6 • Changedvoltagerangeinfootnote2ofOrderingInformationtable.................................................................................... 26 ChangesfromRevisionA(August2011)toRevisionB Page • DeletedreferencetoDCKpackagefromFeatures................................................................................................................ 1 • DeletedDCKpackagepinoutdrawing.................................................................................................................................... 1 • DeletedcolumnforDCKpackagefromPinDescriptionstable.............................................................................................. 4 • DeletedDCKpackagefromThermalInformationtable.......................................................................................................... 5 ChangesfromOriginal(February2011)toRevisionA Page • AddedfootnotetoFeaturestoshowavailablevoltageoptions.............................................................................................. 1 • AddedpreviewbanneroverDCKpinoutdrawing.................................................................................................................. 1 Copyright©2011–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P SBVS153F–FEBRUARY2011–REVISEDMAY2018 www.ti.com 5 Pin Configuration and Functions DQNPackage 4-PinX2SON TopView IN EN 4 3 Thermal Pad 1 2 OUT GND PinFunctions PIN I/O DESCRIPTION NAME NO. Enablepin.DrivingENover0.9Vturnsontheregulator.DrivingENbelow0.4Vputsthe regulatorintoshutdownmode. EN 3 I ForTLV707P,outputvoltageisdischargedthroughaninternal120-Ωresistorwhendeviceis shutdown. GND 2 — Groundpin Inputpin.Forgoodtransientperformance,placeasmall1-µFceramiccapacitorfromthispinto IN 4 I ground.SeeInputandOutputCapacitorRequirementsformoredetails. Regulatedoutputvoltagepin.Asmall1-μFceramiccapacitorisrequiredfromthispintoground OUT 1 O toassurestability.SeeInputandOutputCapacitorRequirementsformoredetails. 4 SubmitDocumentationFeedback Copyright©2011–2018,TexasInstrumentsIncorporated ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P www.ti.com SBVS153F–FEBRUARY2011–REVISEDMAY2018 6 Specifications 6.1 Absolute Maximum Ratings overoperatingjunctiontemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT IN –0.3 6.0 V Voltage(2) EN –0.3 6.0 V OUT –0.3 6.0 V Current(source) OUT Internallylimited Outputshort-circuitduration Indefinite Operatingjunction,T –55 150 °C J Temperature Storage,T –55 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmyaffectdevicereliability. (2) Allvoltagesarewithrespecttonetworkgroundpin. 6.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM)QSS009-105(JESD22-A114A)(1) ±4000 V Electrostaticdischarge V (ESD) Chargeddevicemodel(CDM)QSS009-147(JESD22-C101B.01)(2) ±500 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingjunctiontemperaturerange(unlessotherwisenoted) MIN NOM MAX UNIT V Inputvoltage 2.0 5.5 V IN I Outputcurrent 0 200 mA OUT T Operatingjunctiontemperature –40 125 °C J 6.4 Thermal Information TLV707,TLV707P THERMALMETRIC(1) DQN(X2SON) UNIT 4PINS R Junction-to-ambientthermalresistance 208.1 °C/W θJA R Junction-to-case(top)thermalresistance 108.8 °C/W θJC(top) R Junction-to-boardthermalresistance 159.4 °C/W θJB ψ Junction-to-topcharacterizationparameter 3.8 °C/W JT ψ Junction-to-boardcharacterizationparameter 159.4 °C/W JB R Junction-to-case(bottom)thermalresistance 110.2 °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. Copyright©2011–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P SBVS153F–FEBRUARY2011–REVISEDMAY2018 www.ti.com 6.5 Electrical Characteristics AtV =V +0.5Vor2.0V(whicheverisgreater);I =1mA,V =V ,C =0.47μF,andT =–40°Cto+85°C IN OUT(nom) OUT EN IN OUT J (unlessotherwisenoted).TypicalvaluesareatT =25°C. J PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Outputvoltagerange 0.85 5 V V 0.5% OUT DCoutputaccuracy V ≥0.85V –1.5% 1.5% OUT ΔV Lineregulation 1 5 mV O(ΔVI) ΔV Loadregulation 0mA≤I ≤150mA 10 20 mV O(ΔIO) OUT I =30mA 65 OUT 2.0V<V ≤2.4V OUT I =150mA 325 360 OUT I =30mA 50 OUT 2.4V<V ≤2.8V OUT V Dropoutvoltage VIN=0.98x IOUT=150mA 250 300 mV (DO) VOUT(nom) IOUT=30mA 45 2.8V<V ≤3.3V OUT I =150mA 220 270 OUT I =30mA 40 OUT 3.3V<V ≤5.0V OUT I =150mA 200 250 OUT I Outputcurrentlimit V =0.9×V 240 300 450 mA CL OUT OUT(nom) I Groundpincurrent I =0mA 25 50 µA (GND) OUT I ENpincurrent V =5.5V 0.01 µA (EN) EN I Shutdowncurrent V ≤0.4V,2.0V≤V ≤4.5V 1 µA SHUTDOWN EN IN ENpinlow-levelinput V 0 0.4 V IL(EN) voltage(disabledevice) ENpinhigh-levelinput V 0.9 V V IH(EN) voltage(enabledevice) IN f=100Hz 70 Power-supplyrejection V =3.3V,V =2.8V, PSRR IN OUT f=10kHz 55 dB ratio I =30mA OUT f=1MHz 50 BW=100Hzto100kHz,V =2.3V,V =1.8V, V Outputnoisevoltage IN OUT 45 µV n I =10mA RMS OUT t Startuptime(1) C =1.0µF,I =150mA 100 µs STR OUT OUT Pulldownresistance R 120 Ω PULLDOWN (TLV707Ponly) (1) Startuptime=timefromENassertionto0.98×Vout. 6 SubmitDocumentationFeedback Copyright©2011–2018,TexasInstrumentsIncorporated ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P www.ti.com SBVS153F–FEBRUARY2011–REVISEDMAY2018 6.6 Typical Characteristics AtT =–40°Cto+85°C,V =V +0.5Vor2.0V(whicheverisgreater),I =10mA,V =V ,andC =1μF, J IN OUT(nom) OUT EN IN OUT unlessotherwisenoted.TypicalvaluesareatT =25°C. J 1.3 2.9 1.28 2.88 1.26 2.86 V) 1.24 V) 2.84 ge ( 1.22 ge ( 2.82 a a olt 1.2 olt 2.8 V V ut 1.18 ut 2.78 p p Out 1.16 Out 2.76 1.14 85°C 2.74 85°C 25°C 25°C 1.12 -40°C 2.72 -40°C 1.1 2.7 0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 Output Current (mA) Output Current (mA) V =1.2V V =2.8V OUT OUT Figure1.LoadRegulation Figure2.LoadRegulation 5.1 1.3 5.08 1.28 5.06 1.26 V) 5.04 V) 1.24 ge ( 5.02 ge ( 1.22 a a olt 5 olt 1.2 V V ut 4.98 ut 1.18 p p Out 4.96 Out 1.16 4.94 85°C 1.14 85°C 25°C 25°C 4.92 -40°C 1.12 -40°C 4.9 1.1 0 20 40 60 80 100 120 140 160 180 200 2 2.5 3 3.5 4 4.5 5 5.5 Output Current (mA) Input Voltage (V) V =5.0V V =1.2V,I =10mA OUT OUT OUT Figure3.LoadRegulation Figure4.LineRegulation 2.9 5.1 2.88 5.08 2.86 5.06 V) 2.84 V) 5.04 ge ( 2.82 ge ( 5.02 a a olt 2.8 olt 5 V V ut 2.78 ut 4.98 p p Out 2.76 Out 4.96 2.74 85°C 4.94 85°C 25°C 25°C 2.72 -40°C 4.92 -40°C 2.7 4.9 3.1 3.7 4.3 4.9 5.5 5.3 5.35 5.4 5.45 5.5 Input Voltage (V) Input Voltage (V) V =2.8V,I =10mA V =5.0V,I =10mA OUT OUT OUT OUT Figure5.LineRegulation Figure6.LineRegulation Copyright©2011–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P SBVS153F–FEBRUARY2011–REVISEDMAY2018 www.ti.com Typical Characteristics (continued) AtT =–40°Cto+85°C,V =V +0.5Vor2.0V(whicheverisgreater),I =10mA,V =V ,andC =1μF, J IN OUT(nom) OUT EN IN OUT unlessotherwisenoted.TypicalvaluesareatT =25°C. J 1.3 2.9 1.28 2.88 1.26 2.86 V) 1.24 V) 2.84 ge ( 1.22 ge ( 2.82 a a olt 1.2 olt 2.8 V V ut 1.18 ut 2.78 p p Out 1.16 Out 2.76 1.14 85°C 2.74 85°C 25°C 25°C 1.12 -40°C 2.72 -40°C 1.1 2.7 2 2.5 3 3.5 4 4.5 5 5.5 3.1 3.7 4.3 4.9 5.5 Input Voltage (V) Input Voltage (V) V =1.2V,I =150mA V =2.8V,I =150mA OUT OUT OUT OUT Figure7.LineRegulation Figure8.LineRegulation 5.1 1.3 5.08 1.28 5.06 1.26 V) 5.04 V) 1.24 ge ( 5.02 ge ( 1.22 a a olt 5 olt 1.2 V V ut 4.98 ut 1.18 p p Out 4.96 Out 1.16 4.94 85°C 1.14 4.92 2-450°C°C 1.12 IIOOUUTT== 1105 0m mAA 4.9 1.1 5.3 5.35 5.4 5.45 5.5 -40 -15 10 35 60 85 Input Voltage (V) Temperature (°C) V =5.0V,I =150mA V =1.2V OUT OUT OUT Figure9.LineRegulation Figure10.OutputVoltagevsTemperature 2.9 5.1 2.88 5.08 2.86 5.06 V) 2.84 V) 5.04 ge ( 2.82 ge ( 5.02 a a olt 2.8 olt 5 V V ut 2.78 ut 4.98 p p Out 2.76 Out 4.96 2.74 4.94 I = 10 mA I = 10 mA 2.72 OUT 4.92 OUT I = 150 mA I = 150 mA OUT OUT 2.7 4.9 -40 -15 10 35 60 85 -40 -15 10 35 60 85 Temperature (°C) Temperature (°C) V =2.8V V =5.0V OUT OUT Figure11.OutputVoltagevsTemperature Figure12.OutputVoltagevsTemperature 8 SubmitDocumentationFeedback Copyright©2011–2018,TexasInstrumentsIncorporated ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P www.ti.com SBVS153F–FEBRUARY2011–REVISEDMAY2018 Typical Characteristics (continued) AtT =–40°Cto+85°C,V =V +0.5Vor2.0V(whicheverisgreater),I =10mA,V =V ,andC =1μF, J IN OUT(nom) OUT EN IN OUT unlessotherwisenoted.TypicalvaluesareatT =25°C. J 400 600 350 500 V) 300 V) e (m 250 e (m 400 g g a a olt 200 olt 300 V V out 150 out p p 200 o o Dr 100 Dr 85°C 85°C 50 25°C 100 25°C -40°C -40°C 0 0 2 2.5 3 3.5 4 4.5 5 2 2.5 3 3.5 4 4.5 5 Input Voltage (V) Input Voltage (V) I =150mA I =200mA OUT OUT Figure13.DropoutVoltagevsInputVoltage Figure14.DropoutVoltagevsInputVoltage 350 350 300 300 V) 250 V) 250 m m e ( e ( g 200 g 200 a a olt olt V V ut 150 ut 150 o o p p Dro 100 Dro 100 85°C 85°C 50 25°C 50 25°C -40°C -40°C 0 0 0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 Output Current (mA) Output Current (mA) V =2.8V V =5.0V OUT OUT Figure15.DropoutVoltagevsOutputCurrent Figure16.DropoutVoltagevsOutputCurrent 35 35 30 30 A) A) nt (m 25 nt (m 25 e e urr 20 urr 20 C C n n Pi 15 Pi 15 d d n n ou 10 ou 10 Gr 85°C Gr 85°C 5 25°C 5 25°C -40°C -40°C 0 0 2 2.5 3 3.5 4 4.5 5 5.5 3.1 3.7 4.3 4.9 5.5 Input Voltage (V) Input Voltage (V) V =1.2V,I =0mA V =2.8V,I =0mA OUT OUT OUT OUT Figure17.GroundPinCurrentvsInputVoltage Figure18.GroundPinCurrentvsInputVoltage Copyright©2011–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P SBVS153F–FEBRUARY2011–REVISEDMAY2018 www.ti.com Typical Characteristics (continued) AtT =–40°Cto+85°C,V =V +0.5Vor2.0V(whicheverisgreater),I =10mA,V =V ,andC =1μF, J IN OUT(nom) OUT EN IN OUT unlessotherwisenoted.TypicalvaluesareatT =25°C. J 35 40 30 35 Pin Current (A)m 221505 Pin Current (A)m 322050 Ground 10 85°C Ground 1150 5 25°C 5 -40°C 0 0 5.3 5.35 5.4 5.45 5.5 -40 -15 10 35 60 85 Input Voltage (V) Temperature (°C) VOUT=5.0V,IOUT=0mA VOUT=1.2V,IOUT=0mA Figure19.GroundPinCurrentvsInputVoltage Figure20.GroundPinCurrentvsTemperature 40 40 35 35 A) 30 A) 30 m m ent ( 25 ent ( 25 urr urr C 20 C 20 n n Pi Pi d 15 d 15 n n u u Gro 10 Gro 10 5 5 0 0 -40 -15 10 35 60 85 -40 -15 10 35 60 85 Temperature (°C) Temperature (°C) V =2.8V,I =0mA V =5.0V,I =0mA OUT OUT OUT OUT Figure21.GroundPinCurrentvsTemperature Figure22.GroundPinCurrentvsTemperature 1200 1200 1000 1000 A) A) m m nt ( 800 nt ( 800 e e urr urr C 600 C 600 n n Pi Pi d d n 400 n 400 u u o o Gr 85°C Gr 85°C 200 200 25°C 25°C -40°C -40°C 0 0 0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 Output Current (mA) Output Current (mA) V =1.2V V =2.8V OUT OUT Figure23.GroundPinCurrentvsOutputCurrent Figure24.GroundPinCurrentvsOutputCurrent 10 SubmitDocumentationFeedback Copyright©2011–2018,TexasInstrumentsIncorporated ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P www.ti.com SBVS153F–FEBRUARY2011–REVISEDMAY2018 Typical Characteristics (continued) AtT =–40°Cto+85°C,V =V +0.5Vor2.0V(whicheverisgreater),I =10mA,V =V ,andC =1μF, J IN OUT(nom) OUT EN IN OUT unlessotherwisenoted.TypicalvaluesareatT =25°C. J 1200 2 1.8 1000 Ground Pin Current (A)m 864000000 85°C Shutdown Current (A)m 111000......6421864 85°C 200 25°C 25°C 0.2 -40°C -40°C 0 0 0 20 40 60 80 100 120 140 160 180 200 2 2.5 3 3.5 4 4.5 5 5.5 Output Current (mA) Input Voltage (V) V =5.0V V =1.2V OUT OUT Figure25.GroundPinCurrentvsOutputCurrent Figure26.ShutdownCurrentvsInputVoltage 2 2 1.8 1.8 1.6 1.6 A) A) m 1.4 m 1.4 nt ( nt ( e 1.2 e 1.2 urr urr C 1 C 1 n n w 0.8 w 0.8 o o d d ut 0.6 ut 0.6 h h S 0.4 85°C S 0.4 85°C 25°C 25°C 0.2 0.2 -40°C -40°C 0 0 2 2.5 3 3.5 4 4.5 5 5.5 2 2.5 3 3.5 4 4.5 5 5.5 Input Voltage (V) Input Voltage (V) V =2.8V V =5.0V OUT OUT Figure27.ShutdownCurrentvsInputVoltage Figure28.ShutdownCurrentvsInputVoltage 450 450 425 425 400 400 A) A) mit (m 375 mit (m 375 Li 350 Li 350 nt nt urre 325 urre 325 C C 300 300 275 25°C 275 25°C -40°C -40°C 250 250 2 2.5 3 3.5 4 4.5 5 5.5 3.1 3.7 4.3 4.9 5.5 Input Voltage (V) Input Voltage (V) V =1.2V V =2.8V OUT OUT Figure29.CurrentLimitvsInputVoltage Figure30.CurrentLimitvsInputVoltage Copyright©2011–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P SBVS153F–FEBRUARY2011–REVISEDMAY2018 www.ti.com Typical Characteristics (continued) AtT =–40°Cto+85°C,V =V +0.5Vor2.0V(whicheverisgreater),I =10mA,V =V ,andC =1μF, J IN OUT(nom) OUT EN IN OUT unlessotherwisenoted.TypicalvaluesareatT =25°C. J 450 90 425 dB) 80 mit (mA) 430705 e Rejection ( 765000 nt Li 350 Rippl 40 Curre 332050 Supply 30 275 2-450°C°C Power- 2100 IIOUT== 3105 0m mAA OUT 250 0 3.1 3.7 4.3 4.9 5.5 10 100 1k 10k 100k 1M 10M Input Voltage (V) Frequency (Hz) VOUT=5.0V VOUT=1.2V Figure31.CurrentLimitvsInputVoltage Figure32.Power-SupplyRippleRejectionvsFrequency 90 90 dB) 80 dB) 80 on ( 70 on ( 70 cti cti eje 60 eje 60 R R e 50 e 50 pl pl p p Ri 40 Ri 40 y y ppl 30 ppl 30 u u S S er- 20 er- 20 w I = 30 mA w I = 30 mA o 10 OUT o 10 OUT P I = 150 mA P I = 150 mA OUT OUT 0 0 10 100 1k 10k 100k 1M 10M 10 100 1k 10k 100k 1M 10M Frequency (Hz) Frequency (Hz) V =2.8V V =5.0V OUT OUT Figure33.Power-SupplyRippleRejectionvsFrequency Figure34.Power-SupplyRippleRejectionvsFrequency 70 70 B) B) n (d 60 n (d 60 o o cti 50 cti 50 e e ej ej R R e 40 e 40 pl pl p p Ri 30 Ri 30 y y pl pl up 20 up 20 S S er- er- w 10 1 kHz w 10 1 kHz o o P 1 MHz P 1 MHz 0 0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 Input Voltage (V) Input Voltage (V) V =2.8V,I =30mA V =2.8V,I =150mA OUT OUT OUT OUT Figure35.Power-SupplyRippleRejectionvsInputVoltage Figure36.Power-SupplyRippleRejectionvsInputVoltage 12 SubmitDocumentationFeedback Copyright©2011–2018,TexasInstrumentsIncorporated ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P www.ti.com SBVS153F–FEBRUARY2011–REVISEDMAY2018 Typical Characteristics (continued) AtT =–40°Cto+85°C,V =V +0.5Vor2.0V(whicheverisgreater),I =10mA,V =V ,andC =1μF, J IN OUT(nom) OUT EN IN OUT unlessotherwisenoted.TypicalvaluesareatT =25°C. J 70 70 B) B) n (d 60 n (d 60 o o cti 50 cti 50 e e ej ej R R e 40 e 40 pl pl p p Ri 30 Ri 30 y y pl pl up 20 up 20 S S er- er- w 10 1 kHz w 10 1 kHz o o P 1 MHz P 1 MHz 0 0 3.6 3.7 3.8 3.9 4 4.1 4.2 4.3 3.6 3.7 3.8 3.9 4 4.1 4.2 4.3 Input Voltage (V) Input Voltage (V) V =3.3V,I =30mA V =3.3V,I =150mA OUT OUT OUT OUT Figure37.Power-SupplyRippleRejectionvsInputVoltage Figure38.Power-SupplyRippleRejectionvsInputVoltage 100 y (V/)HzmÖ 10 152. .2V8 VV 00 mA/div 150 m5A0 mA IOUT sit 1 n De 1 e al Nois 0.1 mV/div VOUT ctr 0 e 5 p S 0.01 ut p ut O 0.001 10 100 1k 10k 100k 1M 10M Time (100ms/div) Frequency (Hz) VOUT=1.2V Figure39.OutputSpectralNoiseDensityvsFrequency Figure40.LoadTransientResponse mA/div 150 m1A mA IOUT mA/div 100 m5A0 mA IOUT 200 50 v v V/di VOUT V/di VOUT m m 0 0 5 5 Time (100ms/div) Time (100ms/div) V =1.2V V =2.8V OUT OUT Figure41.LoadTransientResponse Figure42.LoadTransientResponse Copyright©2011–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P SBVS153F–FEBRUARY2011–REVISEDMAY2018 www.ti.com Typical Characteristics (continued) AtT =–40°Cto+85°C,V =V +0.5Vor2.0V(whicheverisgreater),I =10mA,V =V ,andC =1μF, J IN OUT(nom) OUT EN IN OUT unlessotherwisenoted.TypicalvaluesareatT =25°C. J v 100 mA di 0 mA/div 150 m1A mA IOUT 50 mA/ 50 mA IOUT 0 1 50 mV/div VOUT 50 mV/div VOUT Time (100ms/div) Time (100ms/div) V =2.8V V =5.0V OUT OUT Figure43.LoadTransientResponse Figure44.LoadTransientResponse 150 mA v di A/ 100 m 1 mA IOUT 1 V/div VIN v V/di VOUT 00 m V/div VOUT 1 m 0 1 Time (100ms/div) Time (100ms/div) V =5.0V V =1.2V,I =150mA OUT OUT OUT Figure45.LoadTransientResponse Figure46.LineTransientResponse v V/di VIN div 1 V/ V 2 IN mV/div VOUT V/div VOUT 20 0 m 2 Time (100ms/div) Time (100ms/div) V =1.2V,I =200mA V =1.2V,I =150mA OUT OUT OUT OUT Figure47.LineTransientResponse Figure48.LineTransientResponse 14 SubmitDocumentationFeedback Copyright©2011–2018,TexasInstrumentsIncorporated ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P www.ti.com SBVS153F–FEBRUARY2011–REVISEDMAY2018 Typical Characteristics (continued) AtT =–40°Cto+85°C,V =V +0.5Vor2.0V(whicheverisgreater),I =10mA,V =V ,andC =1μF, J IN OUT(nom) OUT EN IN OUT unlessotherwisenoted.TypicalvaluesareatT =25°C. J v div VIN V/di VIN V/ 1 2 V/div VOUT mV/div VOUT 0 m 10 2 Time (100ms/div) Time (100ms/div) V =1.2V,I =200mA V =2.8V,I =150mA OUT OUT OUT OUT Figure49.LineTransientResponse Figure50.LineTransientResponse v di v V/ V/di VIN 1 VIN 1 mV/div VOUT V/div VOUT 10 0 m 2 Time (100ms/div) Time (100ms/div) V =2.8V,I =200mA V =2.8V,I =200mA OUT OUT OUT OUT Figure51.LineTransientResponse Figure52.LineTransientResponse v di V/ 1 VI VIN v di 2 V/ VOUT div VO V/ m 0 2 Time (100ms/div) Time (100 ms/div) V =2.8V,I =200mA V =1.2V,I =30mA OUT OUT OUT OUT Figure53.LineTransientResponse Figure54.V RampUp,RampDownResponse IN Copyright©2011–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P SBVS153F–FEBRUARY2011–REVISEDMAY2018 www.ti.com Typical Characteristics (continued) AtT =–40°Cto+85°C,V =V +0.5Vor2.0V(whicheverisgreater),I =10mA,V =V ,andC =1μF, J IN OUT(nom) OUT EN IN OUT unlessotherwisenoted.TypicalvaluesareatT =25°C. J V IN V IN v v di di V/ V/ 1 VOUT 1 V OUT Time (100 ms/div) Time (100 ms/div) V =2.8V,I =30mA V =5V,I =30mA OUT OUT OUT OUT Figure55.V RampUp,RampDownResponse Figure56.V RampUp,RampDownResponse IN IN 16 SubmitDocumentationFeedback Copyright©2011–2018,TexasInstrumentsIncorporated ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P www.ti.com SBVS153F–FEBRUARY2011–REVISEDMAY2018 7 Detailed Description 7.1 Overview The TLV707 series (TLV707 and TLV707P) belongs to a family of low-dropout regulators (LDOs). This device consumes low quiescent current and delivers excellent line and load transient performance. These characteristics,combinedwithlownoiseandverygoodPSRRwithlittle(V –V )headroom,makethisdevice IN OUT idealforportableRFapplications. 7.2 Functional Block Diagrams IN OUT Current Limit Thermal Shutdown EN Bandgap LOGIC TLV707 GND Figure57. TLV707BlockDiagram Copyright©2011–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P SBVS153F–FEBRUARY2011–REVISEDMAY2018 www.ti.com Functional Block Diagrams (continued) IN OUT Current Limit Thermal Shutdown 120W EN Bandgap LOGIC TLV707P GND Figure58. TLV707PBlockDiagram 7.3 Feature Description This LDO regulator offers current limit and thermal protection. The operating junction temperature of this device is–40°Cto125°C. 7.3.1 InternalCurrentLimit The internal current limit helps to protect the regulator during fault conditions. During current limit, the output sources a fixed amount of current that is largely independent of the output voltage. In such a case, the output voltage is not regulated, and is V = I × R . The PMOS pass transistor dissipates (V – V ) × I OUT LIMIT LOAD IN OUT LIMIT until thermal shutdown is triggered and the device turns off. When the device cools, the internal thermal shutdown circuit turns the device back on. If the fault condition continues, the device cycles between current limit andthermalshutdown;seetheThermalInformationtableformoredetails. The PMOS pass element has a built-in body diode that conducts current when the voltage at OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is anticipated, external limiting to5%oftheratedoutputcurrentisrecommended. 18 SubmitDocumentationFeedback Copyright©2011–2018,TexasInstrumentsIncorporated ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P www.ti.com SBVS153F–FEBRUARY2011–REVISEDMAY2018 Feature Description (continued) 7.3.2 Shutdown The enable pin (EN) is active high. The device is enabled when voltage at the EN pin goes above 0.9 V. This relatively lower voltage value required to turn on the LDO can also be used to power the device when it is connected to a GPIO of a newer processor, where the GPIO Logic 1 voltage level is lower than that of traditional microcontrollers. The device is turned off when the EN pin is held at less than 0.4 V. When shutdown capability isnotrequired,ENcanbeconnectedtotheINpin. The TLV707P version has internal active pulldown circuitry that discharges the output with a time constant as givenbyEquation1: (120·R ) t= L ·C (120 + R ) OUT L where: • R =Loadresistance L • C =Outputcapacitor (1) OUT 7.4 Device Functional Modes The TLV707 series is specified over the recommended operating conditions (see the Recommended Operating Conditions table). The specifications may not be met when exposed to conditions outside of the recommended operatingrange. In order to turn on the regulator, the EN pin must be driven over 0.9 V. Driving the EN pin below 0.4 V causes theregulatortoentershutdownmode. Inshutdown,thecurrentconsumptionofthedeviceisreducedto1 µA,typically. Copyright©2011–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P SBVS153F–FEBRUARY2011–REVISEDMAY2018 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 8.1 Application Information The TLV707 series is a low-dropout regulator (LDO) with low quiescent current that delivers excellent line and load transient performance. This LDO regulator offers current limit and thermal protection. The operating junction temperatureofthisdeviceseriesis –40°Cto125°C. 8.2 Typical Application VIN IN OUT VOUT C C 1mF IN OUT Ceramic TLV707 Series On Off EN GND Figure59. TypicalApplicationCircuit 8.2.1 DesignRequirements Provide an input supply with adequate headroom to meet minimum VIN requirements (as shown in Table 1), compensatefortheGNDpincurrent,andtopowertheload. Table1.DesignParameters PARAMETER DESIGNREQUIREMENT Inputvoltage 1.8V-3.6V Outputvoltage 1.2V Outputcurrent 100-mA 8.2.2 DetailedDesignProcedure 8.2.2.1 InputandOutputCapacitorRequirements Generally, 1.0-µF X5R- and X7R-type ceramic capacitors are recommended because these capacitors have minimalvariationinvalueandequivalentseriesresistance(ESR)overtemperature. However, the TLV707 is designed to be stable with an effective capacitance of 0.1 µF or larger at the output. Thus, the device is stable with capacitors of other dielectric types as well, as long as the effective capacitance under operating bias voltage and temperature is greater than 0.1 µF. This effective capacitance refers to the capacitance that the LDO detects under operating bias voltage and temperature conditions; that is, the capacitance after taking both bias voltage and temperature derating into consideration. In addition to allowing the useoflessexpensivedielectrics,thiscapabilityofbeingstablewith0.1-µFeffectivecapacitancealsoenablesthe useofsmallerfootprintcapacitorsthathavehigherderatinginsize-andspace-constrainedapplications. Using a 0.1-µF rated capacitor at the output of the LDO does not ensure stability because the effective capacitance under the specified operating conditions is less than 0.1 µF. Maximum ESR must be less than 200mΩ. 20 SubmitDocumentationFeedback Copyright©2011–2018,TexasInstrumentsIncorporated ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P www.ti.com SBVS153F–FEBRUARY2011–REVISEDMAY2018 Although an input capacitor is not required for stability, good analog design practice is to connect a 0.1-μF to 1.0-μF, low ESR capacitor across the IN pin and GND pin of the regulator. This capacitor counteracts reactive input sources and improves transient response, noise rejection, and ripple rejection. A higher-value capacitor maybenecessaryiflarge,fastrise-timeloadtransientsareanticipated,orifthedeviceisnotlocatedclosetothe power source. If source impedance is more than 2-Ω, a 0.1-μF input capacitor may be necessary to ensure stability. 8.2.2.2 DropoutVoltage The TLV707 series of LDOs use a PMOS pass transistor to achieve low dropout. When (V – V ) is less than IN OUT the dropout voltage (V ), the PMOS pass device is in the linear region of operation and the input-to-output DO resistance is the R of the PMOS pass element. V scales approximately with output current because the DS(ON) DO PMOSdevicefunctionssimilartoaresistorindropout. Aswithanylinearregulator,PSRRandtransientresponsearedegradedwhen(V –V )approachesdropout. IN OUT 8.2.2.3 TransientResponse As with any regulator, increasing the size of the output capacitor reduces over- and undershoot magnitude but increasesthedurationofthetransientresponse. Copyright©2011–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 21 ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P SBVS153F–FEBRUARY2011–REVISEDMAY2018 www.ti.com 8.2.3 ApplicationCurves 90 100 Ripple Rejection (dB) 8765400000 Noise Density (V/)HzmÖ 101 152. .2V8 VV ower-Supply 321000 IOUT= 30 mA put Spectral 0.00.11 P IOUT= 150 mA Out 0 0.001 10 100 1k 10k 100k 1M 10M 10 100 1k 10k 100k 1M 10M Frequency (Hz) Frequency (Hz) V =1.2V OUT Figure60.Power-SupplyRippleRejectionvsFrequency Figure61.OutputSpectralNoiseDensityvsFrequency v di 150 mA A/ m 1 mA IOUT 200 div V V/ IN 1 v V/di VOUT 50 m V/div VOUT m 0 1 Time (100ms/div) Time (100ms/div) V =1.2V V =1.2V,I =150mA OUT OUT OUT Figure62.LoadTransientResponse Figure63.LineTransientResponse v V/di VIN div 1 V/ V 2 IN mV/div VOUT V/div VOUT 20 0 m 2 Time (100ms/div) Time (100ms/div) V =1.2V,I =200mA V =1.2V,I =150mA OUT OUT OUT OUT Figure64.LineTransientResponse Figure65.LineTransientResponse 22 SubmitDocumentationFeedback Copyright©2011–2018,TexasInstrumentsIncorporated ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P www.ti.com SBVS153F–FEBRUARY2011–REVISEDMAY2018 div VIN VIN V/ 2 div 2 V/ VOUT div VOUT V/ m 0 2 Time (100ms/div) Time (100 ms/div) V =1.2V,I =200mA V =1.2V,I =30mA OUT OUT OUT OUT Figure66.LineTransientResponse Figure67.V RampUp,RampDownResponse IN 8.3 Do's and Don'ts Placeatleastone1.0-µFceramiccapacitorascloseaspossibletotheOUTpinoftheregulator. Donotplacetheoutputcapacitormorethan10mmawayfromtheregulator. Connect a 1.0-μF low equivalent series resistance (ESR) capacitor across the IN pin and GND input of the regulatorforimprovedtransientperformance. Donotexceedtheabsolutemaximumratings. Copyright©2011–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 23 ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P SBVS153F–FEBRUARY2011–REVISEDMAY2018 www.ti.com 9 Power Supply Recommendations The device is designed to operate from an input voltage supply range between 2.0 V and 5.5 V. The input voltage range provides adequate headroom in order for the device to have a regulated output. This input supply must be well regulated (see Figure 46 through Figure 53). If the input supply is noisy, additional input capacitors withlowESRhelpimprovetheoutputnoiseperformance. 10 Layout 10.1 Layout Guidelines 10.1.1 BoardLayoutRecommendationstoImprovePSRRandNoisePerformance Place input and output capacitors as close to the device pins as possible. To improve ac performance (such as PSRR, output noise, and transient response), TI recommends that the board be designed with separate ground planes for V and V , with the ground plane connected only at the GND pin of the device, as shown in IN OUT Figure 68. In addition, connect the ground connection for the output capacitor directly to the GND pin of the device.HighESRcapacitorsmaydegradePSRRperformance. 10.1.2 PackageMounting Solder pad footprint recommendations are available from TI's website at www.ti.com. The recommended land patternfortheDQN(X2SON-4)packageisprovidedinMechanical,Packaging,andOrderableInformation. 10.2 Layout Example VOUT VIN 1 4 COUT CIN 2 3 GND PLANE Represents via used for application specific connections Copyright © 2016, Texas Instruments Incorporated Figure68. RecommendedLayoutExample 10.3 Thermal Considerations Thermal protection disables the output when the junction temperature rises to approximately 160°C, allowing the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits the dissipation of the regulator, thus protecting the regulator from damageasaresultofoverheating. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. For reliable operation, limit junction temperature to 125°C (maximum). To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered;useworst-caseloadsandsignalconditions. For good reliability, thermal protection triggers at least 35°C above the maximum expected ambient condition of the particular application. This configuration produces a worst-case junction temperature of 125°C at the highest expectedambienttemperatureandworst-caseload. 24 SubmitDocumentationFeedback Copyright©2011–2018,TexasInstrumentsIncorporated ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P www.ti.com SBVS153F–FEBRUARY2011–REVISEDMAY2018 Thermal Considerations (continued) The internal protection circuitry of the LDO is designed to protect against overload conditions. This circuitry is not intended to replace proper heatsinking. Continuously running the LDO into thermal shutdown degrades device reliability. 10.4 Power Dissipation The ability to remove heat from the die is different for each package type, presenting different considerations in the printed-circuit-board (PCB) layout. The PCB area around the device that is free of other components moves theheatfromthedevicetotheambientair. Performance data for JEDEC low- and high-K boards are given in the Thermal Information table. Using heavier copper increases the effectiveness in removing heat from the device. The addition of plated through-holes to heat-dissipatinglayersalsoimprovesheatsinkeffectiveness. Powerdissipationdependsoninputvoltageandloadconditions.Powerdissipation(P )isequaltotheproductof D theoutputcurrentandthevoltagedropacrosstheoutputpasselement,asshowninEquation2. P = (V -V )´I D IN OUT OUT (2) Copyright©2011–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 25 ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P SBVS153F–FEBRUARY2011–REVISEDMAY2018 www.ti.com 11 Device and Documentation Support 11.1 Device Support 11.1.1 DevelopmentSupport 11.1.1.1 EvaluationModules An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TLV707 andTLV707P.SLVU416 detailsthedesignkitsandevaluationmodulesforTLV70728EVM-612. The EVM can be requested at the Texas Instruments web site through the TLV707 and TLV707P product folders,orpurchaseddirectlyfromtheTIeStore. 11.1.1.2 SpiceModels Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TLV707 and TLV707P is available through the respective deviceproductfoldersunderSimulationModels. 11.1.2 DeviceNomenclature Table2. OrderingInformation(1) PRODUCT V (2) OUT TLV707xx(x)Pyyyz XX(X)isthenominaloutputvoltage.Foroutputvoltageswitharesolutionof100mV,twodigitsareusedinthe orderingnumber;otherwise,threedigitsareused(forexample,18=1.8V,285=2.85V). Pisoptional;deviceswithPhaveanLDOregulatorwithanactiveoutputdischarge. YYYisthepackagedesignator. Zispackagequantity.UseRforreel(3000pieces),andTfortape(250pieces). (1) ForthemostcurrentpackageandorderinginformationseethePackageOptionAddendumattheendofthisdocument,orvisitthe deviceproductfolderatwww.ti.com. (2) Outputvoltagesfrom0.85Vto5.0Vin50-mVincrementsareavailable.Contactfactoryfordetailsandavailability. 11.2 Documentation Support 11.2.1 RelatedDocumentation Forrelateddocumentationseethefollowing: TLV70728EVM-612EvaluationModule 11.3 Related Links Table 3 lists quick access links. Categories include technical documents, support and community resources, toolsandsoftware,andquickaccesstoordernow. Table3.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER ORDERNOW DOCUMENTS SOFTWARE COMMUNITY TLV707 Clickhere Clickhere Clickhere Clickhere Clickhere TLV707P Clickhere Clickhere Clickhere Clickhere Clickhere 11.4 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed.Forchangedetails,reviewtherevisionhistoryincludedinanyreviseddocument. 26 SubmitDocumentationFeedback Copyright©2011–2018,TexasInstrumentsIncorporated ProductFolderLinks:TLV707 TLV707P

TLV707,TLV707P www.ti.com SBVS153F–FEBRUARY2011–REVISEDMAY2018 11.5 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 11.6 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 11.7 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 11.8 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated family of devices. This data is subject to change without notice and revisionofthisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©2011–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 27 ProductFolderLinks:TLV707 TLV707P

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLV707085DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BY & no Sb/Br) TLV707085DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BY & no Sb/Br) TLV70710DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 BB & no Sb/Br) TLV70710DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 BB & no Sb/Br) TLV70710PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 BC & no Sb/Br) TLV70710PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 BC & no Sb/Br) TLV707115DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 B3 & no Sb/Br) TLV707115DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 B3 & no Sb/Br) TLV70711PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C3 & no Sb/Br) TLV70711PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C3 & no Sb/Br) TLV70712PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 WJ & no Sb/Br) TLV70712PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 WJ & no Sb/Br) TLV707135DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 BD & no Sb/Br) TLV707135DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 BD & no Sb/Br) TLV70715PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 WI & no Sb/Br) TLV70715PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 WI & no Sb/Br) TLV70717DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 GD & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLV70717DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 GD & no Sb/Br) TLV707185DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 ZN & no Sb/Br) TLV707185DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 ZN & no Sb/Br) TLV707185PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 B1 & no Sb/Br) TLV707185PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 B1 & no Sb/Br) TLV70718DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 ZC & no Sb/Br) TLV70718DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 ZC & no Sb/Br) TLV70718PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 SB & no Sb/Br) TLV70718PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 SB & no Sb/Br) TLV70719PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 ZM & no Sb/Br) TLV70719PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 ZM & no Sb/Br) TLV70725DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BM & no Sb/Br) TLV70725DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BM & no Sb/Br) TLV70725PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 85 AT & no Sb/Br) TLV70725PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 AT & no Sb/Br) TLV70726DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 RF & no Sb/Br) TLV70726DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 RF & no Sb/Br) TLV70726PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 85 SC & no Sb/Br) Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLV70726PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 SC & no Sb/Br) TLV70727PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C6 & no Sb/Br) TLV70727PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C6 & no Sb/Br) TLV707285DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 RZ & no Sb/Br) TLV707285DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 RZ & no Sb/Br) TLV707285PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 XE & no Sb/Br) TLV707285PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 XE & no Sb/Br) TLV70728PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 SD & no Sb/Br) TLV70728PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 SD & no Sb/Br) TLV70729DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 BF & no Sb/Br) TLV70729DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 BF & no Sb/Br) TLV70729PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 BG & no Sb/Br) TLV70729PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 BG & no Sb/Br) TLV70730DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 HJ & no Sb/Br) TLV70730DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 HJ & no Sb/Br) TLV70730PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 SE & no Sb/Br) TLV70730PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 SE & no Sb/Br) TLV70731DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 DI & no Sb/Br) Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLV70731DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 DI & no Sb/Br) TLV70732DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C8 & no Sb/Br) TLV70732DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C8 & no Sb/Br) TLV707335DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 F6 & no Sb/Br) TLV707335DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 F6 & no Sb/Br) TLV70733DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 YH & no Sb/Br) TLV70733DQNR1 ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BN & no Sb/Br) TLV70733DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 YH & no Sb/Br) TLV70733PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 TI & no Sb/Br) TLV70733PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 TI & no Sb/Br) TLV70734DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 AQ & no Sb/Br) TLV70734DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 AQ & no Sb/Br) TLV70734PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AP & no Sb/Br) TLV70734PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AP & no Sb/Br) TLV70736DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 CC & no Sb/Br) TLV70736DQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 CC & no Sb/Br) TLV70736PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ZO & no Sb/Br) TLV70736PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ZO & no Sb/Br) Addendum-Page 4

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 5

PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TLV707085DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV707085DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70710DQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70710DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70710DQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70710DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70710PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70710PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70710PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70710PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV707115DQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV707115DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV707115DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV707115DQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70711PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70711PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70712PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV70712PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2020 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TLV707135DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV707135DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70715PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70715PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70715PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70715PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70717DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70717DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV707185DQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV707185DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV707185DQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV707185DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV707185PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV707185PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV707185PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV707185PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70718DQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70718DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70718DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70718DQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70718PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV70718PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV70719PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV70719PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV70725DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70725DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70725PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV70725PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV70726DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70726DQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70726DQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70726DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70726PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70726PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70726PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70726PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70727PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV70727PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV707285DQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV707285DQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV707285PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV707285PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV70728PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 PackMaterials-Page2

PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2020 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TLV70728PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70728PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70728PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70729DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70729DQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70729DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70729DQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70729PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70729PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70729PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70729PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70730DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70730DQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70730DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70730DQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70730PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70730PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70730PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70730PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70731DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70731DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70732DQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV70732DQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 TLV707335DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV707335DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70733DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70733DQNR1 X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 2.0 8.0 Q1 TLV70733DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70733PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70733PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70733PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70733PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70734DQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70734DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70734DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70734DQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70734PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70734PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70736DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70736DQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70736DQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV70736DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 TLV70736PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 PackMaterials-Page3

PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2020 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TLV70736PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.5 4.0 8.0 Q2 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TLV707085DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV707085DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70710DQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV70710DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70710DQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70710DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70710PDQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV70710PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70710PDQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70710PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV707115DQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV707115DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV707115DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV707115DQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70711PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70711PDQNT X2SON DQN 4 250 184.0 184.0 19.0 PackMaterials-Page4

PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2020 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TLV70712PDQNR X2SON DQN 4 3000 210.0 185.0 35.0 TLV70712PDQNT X2SON DQN 4 250 210.0 185.0 35.0 TLV707135DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV707135DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70715PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70715PDQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV70715PDQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70715PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70717DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70717DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV707185DQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV707185DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV707185DQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV707185DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV707185PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV707185PDQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV707185PDQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV707185PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70718DQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV70718DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70718DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70718DQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70718PDQNR X2SON DQN 4 3000 210.0 185.0 35.0 TLV70718PDQNT X2SON DQN 4 250 210.0 185.0 35.0 TLV70719PDQNR X2SON DQN 4 3000 210.0 185.0 35.0 TLV70719PDQNT X2SON DQN 4 250 210.0 185.0 35.0 TLV70725DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70725DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70725PDQNR X2SON DQN 4 3000 210.0 185.0 35.0 TLV70725PDQNT X2SON DQN 4 250 210.0 185.0 35.0 TLV70726DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70726DQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV70726DQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70726DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70726PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70726PDQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV70726PDQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70726PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70727PDQNR X2SON DQN 4 3000 210.0 185.0 35.0 TLV70727PDQNT X2SON DQN 4 250 210.0 185.0 35.0 TLV707285DQNR X2SON DQN 4 3000 210.0 185.0 35.0 TLV707285DQNT X2SON DQN 4 250 210.0 185.0 35.0 TLV707285PDQNR X2SON DQN 4 3000 210.0 185.0 35.0 TLV707285PDQNT X2SON DQN 4 250 210.0 185.0 35.0 PackMaterials-Page5

PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2020 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TLV70728PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70728PDQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV70728PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70728PDQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70729DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70729DQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV70729DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70729DQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70729PDQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV70729PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70729PDQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70729PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70730DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70730DQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV70730DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70730DQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70730PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70730PDQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV70730PDQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70730PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70731DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70731DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70732DQNR X2SON DQN 4 3000 210.0 185.0 35.0 TLV70732DQNT X2SON DQN 4 250 210.0 185.0 35.0 TLV707335DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV707335DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70733DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70733DQNR1 X2SON DQN 4 3000 184.0 184.0 19.0 TLV70733DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70733PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70733PDQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV70733PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70733PDQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70734DQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV70734DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70734DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70734DQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70734PDQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70734PDQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70736DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TLV70736DQNR X2SON DQN 4 3000 183.0 183.0 20.0 TLV70736DQNT X2SON DQN 4 250 183.0 183.0 20.0 TLV70736DQNT X2SON DQN 4 250 184.0 184.0 19.0 TLV70736PDQNR X2SON DQN 4 3000 210.0 185.0 35.0 PackMaterials-Page6

PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2020 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TLV70736PDQNT X2SON DQN 4 250 210.0 185.0 35.0 PackMaterials-Page7

None

PACKAGE OUTLINE DQN0004A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD B 1.05 A 0.95 1 1.05 PIN 1 0.95 INDEX AREA C 0.4 MAX SEATING PLANE 0.08 NOTE 6 0.48+0.12 0.05 (0.05) TYP -0.1 0.00 2 NOTE 6 3 EXPOSED 5 THERMAL PAD 2X 0.65 (0.07) TYP NOTE 5 1 4 PIN 1 ID 4X 0.28 0.15 (OPTIONAL) (0.11) NOTE 4 0.3 0.1 C A B 0.2 0.05 C 3X 0.30 0.15 4215302/E 12/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. 4. Features may not exist. Recommend use of pin 1 marking on top of package for orientation purposes. 5. Shape of exposed side leads may differ. 6. Number and location of exposed tie bars may vary. www.ti.com

EXAMPLE BOARD LAYOUT DQN0004A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD (0.86) SYMM 4X (0.36) 4X SEE DETAIL (0.03) 4 4X (0.21) 1 SYMM 5 (0.65) 4X (0.18) 2 3 ( 0.48) (0.22) TYP EXPOSED METAL CLEARANCE LAND PATTERN EXAMPLE SCALE: 40X 0.05 MIN ALL AROUND SOLDER MASK EXPOSED METAL OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED SOLDER MASK DETAIL 4215302/E 12/2016 NOTES: (continued) 7. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 8. If any vias are implemented, it is recommended that vias under paste be filled, plugged or tented. www.ti.com

EXAMPLE STENCIL DESIGN DQN0004A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD (0.9) SYMM 4X (0.4) 4X (0.03) 4 1 4X (0.21) 5 SYMM (0.65) SOLDER MASK 4X (0.22) EDGE 2 3 ( 0.45) 4X (0.235) SOLDER PASTE EXAMPLE BASED ON 0.075 - 0.1mm THICK STENCIL EXPOSED PAD 88% PRINTED SOLDER COVERAGE BY AREA SCALE: 60X 4215302/E 12/2016 NOTES: (continued) 9. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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