Product Sample & Technical Tools & Support & Folder Buy Documents Software Community TLV700 SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 TLV700 200-mA, Low-I , Low-Dropout Regulator for Portable Devices Q 1 Features 3 Description • VeryLowDropout: The TLV700 series of low-dropout (LDO) linear 1 regulators are low quiescent current devices with – 43mVatI =50mA,V =2.8V OUT OUT excellent line and load transient performance. These – 85mVatI =100mA,V =2.8V LDOs are designed for power-sensitive applications. OUT OUT – 175mVatI =200mA,V =2.35V A precision bandgap and error amplifier provides OUT OUT overall 2% accuracy. Low output noise, very high • 2%Accuracy power-supply rejection ratio (PSRR), and low dropout • LowIQ:31μA voltage make this series of devices ideal for most • AvailableinFixed-OutputVoltagesfrom1.2Vto battery-operated handheld equipment. All device 4.8V versions have thermal shutdown and current limit for safety. • HighPSRR:68dBat1kHz • StableWithEffectiveCapacitanceof0.1 μF(1) Furthermore, these devices are stable with an effective output capacitance of only 0.1 μF. This • ThermalShutdownandOvercurrentProtection feature enables the use of cost-effective capacitors • Availablein1.5-mm×1.5-mmSON-6,SOT23-5, that have higher bias voltages and temperature andSC-70Packages derating. The devices regulate to specified accuracy (1) SeetheInputandOutputCapacitorRequirements. withnooutputload. The TLV700 series of LDOs are available in 1.5-mm 2 Applications ×1.5-mmSON-6,SOT-5,andSC70packages. • WirelessHandsets DeviceInformation(1) • SmartPhones,PDAs PARTNUMBER PACKAGE BODYSIZE(NOM) • ZigBee®Networks SC70(5) 2.00mm×1.25mm • Bluetooth®Devices TL700xx SOT(5) 2.90mm×1.60mm • Li-IonOperatedHandheldProducts WSON(6) 1.50mm×1.50mm • WLANandOtherPCAdd-onCards (1) For all available packages, see the orderable addendum at theendofthedatasheet. TypicalApplicationCircuit VIN IN OUT VOUT C C 1mF IN OUT Ceramic TLV700xx On Off EN GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

TLV700 SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 www.ti.com Table of Contents 1 Features.................................................................. 1 8 ApplicationandImplementation........................ 13 2 Applications........................................................... 1 8.1 ApplicationInformation............................................13 3 Description............................................................. 1 8.2 TypicalApplication..................................................13 4 RevisionHistory..................................................... 2 9 PowerSupplyRecommendations...................... 14 5 PinConfigurationandFunctions......................... 4 10 Layout................................................................... 15 6 Specifications......................................................... 5 10.1 LayoutGuidelines.................................................15 6.1 AbsoluteMaximumRatings......................................5 10.2 LayoutExamples...................................................15 6.2 ESDRatings..............................................................5 10.3 ThermalProtection................................................15 6.3 RecommendedOperatingConditions.......................5 10.4 PowerDissipation.................................................16 6.4 ThermalInformation..................................................5 11 DeviceandDocumentationSupport................. 17 6.5 ElectricalCharacteristics...........................................6 11.1 DeviceSupport ....................................................17 6.6 TypicalCharacteristics..............................................7 11.2 DocumentationSupport........................................17 7 DetailedDescription............................................ 11 11.3 Trademarks...........................................................17 7.1 Overview.................................................................11 11.4 ElectrostaticDischargeCaution............................17 7.2 FunctionalBlockDiagram.......................................11 11.5 Glossary................................................................17 7.3 FeatureDescription.................................................11 12 Mechanical,Packaging,andOrderable Information........................................................... 18 7.4 DeviceFunctionalModes........................................12 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionD(October2012)toRevisionE Page • AddedESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection ................................................................................................. 1 • DeletedApplicationsbulletforMP3Players.......................................................................................................................... 1 • Changedfront-pagegraphic .................................................................................................................................................. 1 • ChangedPinConfigurationandFunctionssection;updatedtableformat ............................................................................ 4 • Changed"free-airtemperature"to"junctiontemperature"inAbsoluteMaximumRatingsconditionstatement....................5 • DeletedDissipationRatingstable.......................................................................................................................................... 5 • ChangedThermalInformationtable;updatedthermalresistancevaluesforallpackages................................................... 5 ChangesfromRevisionC(July2011)toRevisionD Page • UpdatedFigure5.................................................................................................................................................................... 7 ChangesfromRevisionB(December,2010)toRevisionC Page • Addedfootnote2toAbsoluteMaximumRatingstable.......................................................................................................... 5 • Changedoutputcurrentlimittypicalandmaximumspecifications......................................................................................... 6 • DeletedpreviousFigure12,CurrentLimitvsInputVoltagetypicalcharacteristic................................................................. 7 ChangesfromRevisionA(April,2010)toRevisionB Page • RemovedTLV701xxdevicereferencesthroughoutdocument.............................................................................................. 1 • Changedminimumoutputvoltageavailablefrom0.7Vto1.2V........................................................................................... 1 • Addedfootnote(1).................................................................................................................................................................. 1 • DeletedV <1Vspecification............................................................................................................................................ 6 OUT • DeletedActivepulldownresistanceparameter...................................................................................................................... 6 2 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLV700

TLV700 www.ti.com SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 • ChangedFigure4title............................................................................................................................................................ 7 • ChangedFigure5title............................................................................................................................................................ 7 • RemovedTLV701xxblockdiagram...................................................................................................................................... 11 • RevisedShutdownsection................................................................................................................................................... 11 • UpdatedApplicationInformationsectiontoreflectminimumoutputvoltageavailabilityof1.2V........................................ 13 • DeletedreferencestoTLV701xxthroughoutApplicationInformation.................................................................................. 13 • Changedfootnote2forOrderingInformationtabletoreflectminimumoutputvoltageof1.2V ......................................... 17 Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:TLV700

TLV700 SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 www.ti.com 5 Pin Configuration and Functions DSEPackage 6-PinWSON DCKPackage TopView 5-PinSC70 TopView IN 1 6 EN GND 2 5 N/C(1) IN 1 5 OUT OUT 3 4 N/C(1) GND 2 (1) EN 3 4 N/C DDCPackage 5-PinSOT TopView IN 1 5 OUT GND 2 (1) EN 3 4 N/C (1) Noconnection. PinFunctions PIN I/O DESCRIPTION NAME WSON SC70 SOT Inputpin.Asmall,1-μFceramiccapacitorisrecommendedfromthispintoground IN 1 1 1 I toassurestabilityandgoodtransientperformance.SeeInputandOutput CapacitorRequirementsformoredetails. GND 2 2 2 — Groundpin Enablepin.DrivingENover0.9Vturnsontheregulator.DrivingENbelow0.4V EN 6 3 3 I putstheregulatorintoshutdownmodeandreducesoperatingcurrentto1μA, nominal. NC 4,5 4 4 — Noconnection.Thispincanbetiedtogroundtoimprovethermaldissipation. Regulatedoutputvoltagepin.Asmall,1-μFceramiccapacitorisneededfromthis OUT 3 5 5 O pintogroundtoassurestability.SeeInputandOutputCapacitorRequirementsfor moredetails. 4 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLV700

TLV700 www.ti.com SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 6 Specifications 6.1 Absolute Maximum Ratings overoperatingjunctiontemperaturerange(unlessotherwisenoted) (1) MIN MAX UNIT V –0.3 6 IN Voltage V –0.3 6(2) V EN V –0.3 6 OUT Maximumoutputcurrent I Internallylimited OUT Outputshort-circuitduration Indefinite Operatingjunction,T –55 150 J Temperature °C Storage,T –55 150 stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) V absolutemaximumratingisV +0.3Vor6V,whicheverisless. EN IN 6.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001,allpins(1) ±2000 V(ESD) Electrostaticdischarge Chargeddevicemodel(CDM),perJEDECspecificationJESD22-C101, V allpins(2) ±500 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN NOM MAX UNIT V 2 5.5 V IN V 1.2 4.8 V OUT I 0 200 mA OUT 6.4 Thermal Information TLV700 THERMALMETRIC(1) DCK[SC70] DDC[SOT] DSE[WSON] UNIT 5PINS 5PINS 6PINS R Junction-to-ambientthermalresistance 307.6 235.9 321.3 θJA R Junction-to-case(top)thermalresistance 79.1 61.9 207.9 θJC(top) R Junction-to-boardthermalresistance 93.7 54 281.5 θJB °C/W ψ Junction-to-topcharacterizationparameter 1.3 0.8 42.4 JT ψ Junction-to-boardcharacterizationparameter 92.8 53.4 284.8 JB R Junction-to-case(bottom)thermalresistance n/a n/a 142.3 θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953. Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:TLV700

TLV700 SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 www.ti.com 6.5 Electrical Characteristics AtV =V +0.3Vor2V(whicheverisgreater);I =10mA,V =0.9V,C =1μF,andT =–40°Cto+125°C, IN OUT(nom) OUT EN OUT J unlessotherwisenoted.TypicalvaluesareatT =25°C. J PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V Inputvoltagerange 2 5.5 V IN V DCoutputaccuracy –40°C≤T ≤+125°C –2% 2% OUT J V +0.3V≤V ≤5.5V, ΔV Lineregulation OUT(nom) IN 1 5 mV OUT(ΔVIN) I =10mA OUT ΔV Loadregulation 0mA≤I ≤200mA 1 15 mV OUT(ΔIOUT) OUT V =0.98×V ,I =50mA, IN OUT(nom) OUT 43 V =2.8V OUT V Dropoutvoltage(1) VIN=0.98×VOUT(nom),IOUT=100mA, 85 mV DO V =2.8V OUT V =0.98×V ,I =200mA, IN OUT(nom) OUT 175 250 V =2.35V OUT I Outputcurrentlimit V =0.9×V 220 860 mA CL OUT OUT(nom) I =0mA 31 55 OUT I Groundpincurrent μA GND I =200mA,V =V +0.5V 270 OUT IN OUT V ≤0.4V,V =2V 400 nA EN IN I Groundpincurrent(shutdown) SHDN V ≤0.4V,2V≤V ≤4.5V 1 2 μA EN IN V =2.3V,V =1.8V, PSRR Power-supplyrejectionratio IN OUT 68 dB I =10mA,f=1kHz OUT BW=100Hzto100kHz, V Outputnoisevoltage 48 μV n V =2.3V,V =1.8V,I =10mA RMS IN OUT OUT t Start-uptime(2) C =1μF,I =200mA 100 μs STR OUT OUT V Enablepinhigh(enabled) 0.9 V V EN(high) IN V Enablepinlow(disabled) 0 0.4 V EN(low) I Enablepincurrent V =V =5.5V 0.04 0.5 μA EN IN EN UVLO Undervoltagelockout V rising 1.9 V IN Shutdown,temperatureincreasing 160 T Thermalshutdowntemperature °C sd Reset,temperaturedecreasing 140 T Operatingjunctiontemperature –40 125 °C J (1) V ismeasuredfordeviceswithV ≥2.35V. DO OUT(nom) (2) Start-uptime=timefromENassertionto0.98×V . OUT(nom) 6 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLV700

TLV700 www.ti.com SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 6.6 Typical Characteristics Overoperatingtemperaturerange(T =–40°Cto+125°C),V =V +0.5Vor2V,whicheverisgreater;I =10mA, J IN OUT(nom) OUT V =V ,C =1μF,unlessotherwisenoted.TypicalvaluesareatT =25°C. EN IN OUT J 1.90 1.90 I = 10 mA I = 200 mA OUT OUT 1.88 1.88 1.86 1.86 V) 1.84 V) 1.84 ge ( 1.82 ge ( 1.82 a a olt 1.80 olt 1.80 V V ut 1.78 ut 1.78 p p Out 1.76 +125°C Out 1.76 +125°C 1.74 +85°C 1.74 +85°C +25°C +25°C 1.72 -40°C 1.72 -40°C 1.70 1.70 2.1 2.6 3.1 3.6 4.1 4.6 5.1 5.6 2.1 2.6 3.1 3.6 4.1 4.6 5.1 5.6 Input Voltage (V) Input Voltage (V) Figure1.TLV70018LineRegulation Figure2.TLV70018LineRegulation 1.90 250 I = 200 mA 1.88 OUT 1.86 200 V) 1.84 mV) ge ( 1.82 ge ( 150 a a Volt 1.80 Volt ut 1.78 ut 100 p o Out 1.76 +125°C Drop +125°C 1.74 +85°C 50 +85°C +25°C +25°C 1.72 -40°C -40°C 1.70 0 0 20 40 60 80 100 120 140 160 180 200 2.25 2.75 3.25 3.75 4.25 4.75 Output Current (mA) Input Voltage (V) Figure3.TLV70018LoadRegulation Figure4.DropoutVoltagevsInputVoltage 180 1.90 160 1.88 140 1.86 Dropout Voltage (mV) 112086400000 ++12855°°CC Output Voltage (V) 111111......888777420864 IOUT= 200 mA 20 +-2450°°CC 1.72 IOIUOTUT== 1 5100 mmAA 0 1.70 0 30 60 90 120 150 180 210 -40 -25 -10 5 20 35 50 65 80 95 110 125 Output Current (mA) Temperature (°C) Figure5.DropoutVoltagevsOutputCurrent,VOUT=4.8V Figure6.TLV70018OutputVoltagevsTemperature Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:TLV700

TLV700 SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 www.ti.com Typical Characteristics (continued) Overoperatingtemperaturerange(T =–40°Cto+125°C),V =V +0.5Vor2V,whicheverisgreater;I =10mA, J IN OUT(nom) OUT V =V ,C =1μF,unlessotherwisenoted.TypicalvaluesareatT =25°C. EN IN OUT J 50 300 I = 0 mA OUT 45 250 A) 40 A) mnt ( 35 nt (m 200 urre 30 urre n C 25 n C 150 d Pi 20 d Pi n n 100 ou 15 +125°C ou +125°C Gr 10 +85°C Gr +85°C 50 +25°C +25°C 5 -40°C -40°C 0 0 2.1 2.6 3.1 3.6 4.1 4.6 5.1 5.6 0 20 40 60 80 100 120 140 160 180 200 Input Voltage (V) Output Current (mA) Figure7.TLV70018GroundPinCurrentvsInputVoltage Figure8.TLV70018GroundPinCurrentvsLoad 40 2.0 35 1.8 d Pin Current (A)m 32210505 mown Current (A) 11110.....64208 n d Grou 10 Shut 00..64 +125°C 5 +85°C 0.2 I = 0 mA +25°C OUT 0 0 -40 -25 -10 5 20 35 50 65 80 95 110 125 2.1 2.6 3.1 3.6 4.1 4.6 5.1 5.6 Temperature (°C) Input Voltage (V) Figure9.TLV70018GroundPinCurrentvsTemperature Figure10.TLV70018ShutdownCurrentvsInputVoltage 100 80 90 IOUT= 10 mA 70 1 kHz 80 I = 150 mA OUT 60 70 10 kHz B) 60 B) 50 R (d 50 R (d 40 100 kHz R R PS 40 PS 30 30 20 20 10 V -V = 0.5 V 10 IN OUT 0 0 10 100 1 k 10 k 100 k 1 M 10 M 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 Frequency (Hz) Input Voltage (V) Figure11.TLV70018Power-SupplyRippleRejectionvs Figure12.TLV70018Power-SupplyRippleRejectionvs Frequency InputVoltage 8 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLV700

TLV700 www.ti.com SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 Typical Characteristics (continued) Overoperatingtemperaturerange(T =–40°Cto+125°C),V =V +0.5Vor2V,whicheverisgreater;I =10mA, J IN OUT(nom) OUT V =V ,C =1μF,unlessotherwisenoted.TypicalvaluesareatT =25°C. EN IN OUT J 10 )Hz tR= tF= 1ms 200 mA Ö mV/ div Density ( 1 100 mA/ IOUT 0 mA e s 0.1 oi N Spectral 0.01 mV/div VOUT Output ICOIUNT== C 1O0U mT=A 1mF 50 VIN= 2.1 V 0 10 100 1 k 10 k 100 k 1 M 10 M 10ms/div Frequency (Hz) Figure13.TLV70018OutputSpectralNoiseDensityvs Figure14.TLV70018LoadTransientResponse OutputVoltage tR= tF= 1ms tR= tF= 1ms 10 mA A/div 0 mA div IOUT 50 mA 0 m IOUT mA/ 0 mA 2 0 5 mV/div VOUT mV/div VOUT 5 20 V = 2.3 V V = 2.3 V IN IN 10ms/div 10ms/div Figure15.TLV70018LoadTransientResponse Figure16.TLV70018LoadTransientResponse Slew Rate = 1 V/ms V Slew Rate = 1 V/ms IN 2.7 V v div 2.9 V VIN 1 V/di 2.3 V V/ 1 2.3 V div VOUT div VOUT V/ V/ m m 5 5 I =200 mA I =1 mA OUT OUT 1 ms/div 1 ms/div Figure17.TLV70018LineTransientResponse Figure18.TLV70018LineTransientResponse Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:TLV700

TLV700 SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 www.ti.com Typical Characteristics (continued) Overoperatingtemperaturerange(T =–40°Cto+125°C),V =V +0.5Vor2V,whicheverisgreater;I =10mA, J IN OUT(nom) OUT V =V ,C =1μF,unlessotherwisenoted.TypicalvaluesareatT =25°C. EN IN OUT J Slew Rate = 1 V/ms IOUT=1 mA v 5.5 V VIN VIN di V/ 1 2.1 V v di V/ 1 div VOUT V/ m 0 1 I =200 mA V OUT OUT 1 ms/div 200 ms/div Figure19.TLV70018LineTransientResponse Figure20.TLV70018V Ramp-Up,Ramp-DownResponse IN 10 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLV700

TLV700 www.ti.com SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 7 Detailed Description 7.1 Overview The TLV700 series of LDO linear regulators are low quiescent current devices with excellent line and load transient performance. These LDOs are designed for power-sensitive applications. A precision bandgap and error amplifier provides overall 2% accuracy. Low output noise, very high PSRR, and low dropout voltage make this series of devices ideal for most battery-operated handheld equipment. All device versions have integrated thermalshutdown,currentlimit,andundervoltagelockout(UVLO). 7.2 Functional Block Diagram IN OUT Current Limit Thermal Shutdown UVLO EN Bandgap LOGIC TLV700xx Series GND 7.3 Feature Description 7.3.1 InternalCurrentLimit The TLV700 internal current limit helps to protect the regulator during fault conditions. During current limit, the output sources a fixed amount of current that is largely independent of the output voltage. In such a case, the output voltage is not regulated, and is V = I × R . The PMOS pass transistor dissipates (V – V ) × OUT CL LOAD IN OUT I until thermal shutdown is triggered and the device turns off. As the device cools down, it is turned on by the CL internal thermal shutdown circuit. If the fault condition continues, the device cycles between current limit and thermalshutdown.SeeThermalProtectionformoredetails. The PMOS pass element in the TLV700 has a built-in body diode that conducts current when the voltage at OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is anticipated, externallimitingto5%oftheratedoutputcurrentisrecommended. 7.3.2 Shutdown The enable pin (EN) is active high. The device is enabled when voltage at EN pin goes above 0.9 V. The device is turned off when the EN pin is held at less than 0.4 V. When shutdown capability is not required, EN can be connectedtotheINpin. Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:TLV700

TLV700 SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 www.ti.com Feature Description (continued) 7.3.3 DropoutVoltage The TLV700 uses a PMOS pass transistor to achieve low dropout. When (V – V ) is less than the dropout IN OUT voltage (V ), the PMOS pass device is in the linear region of operation and the input-to-output resistance is the DO R of the PMOS pass element. V scales approximately with output current because the PMOS device DS(on) DO behavesasaresistorindropout. As with any linear regulator, PSRR and transient response are degraded as (V – V ) approaches dropout. IN OUT ThiseffectisshowninFigure12inTypicalCharacteristics. 7.3.4 UndervoltageLockout(UVLO) TheTLV700usesaUVLOcircuittokeeptheoutputshutoffuntilinternalcircuitryisoperatingproperly. 7.4 Device Functional Modes 7.4.1 NormalOperation Thedeviceregulatestothenominaloutputvoltageunderthefollowingconditions: • Theinputvoltageisgreaterthanthenominaloutputvoltageaddedtothedropoutvoltage. • Theoutputcurrentislessthanthecurrentlimit. • TheinputvoltageisgreaterthantheUVLOvoltage. 7.4.2 DropoutOperation If the input voltage is lower than the nominal output voltage plus the specified dropout voltage, but all other conditions are met for normal operation, the device operates in dropout mode. In this condition, the output voltage is the same the input voltage minus the dropout voltage. The transient performance of the device is significantly degraded because the pass device is in a triode state and no longer regulates the output voltage of theLDO.Lineorloadtransientsindropoutmayresultinlargeoutputvoltagedeviations. Table1liststheconditionsthatleadtothedifferentmodesofoperation. Table1.DeviceFunctionalModeComparison PARAMETER OPERATINGMODE V I IN OUT Normalmode V >V +V I <I IN OUT(nom) DO OUT CL Dropoutmode V <V +V I <I IN OUT(nom) DO OUT CL Currentlimit V >UVLO I >I IN OUT CL 12 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLV700

TLV700 www.ti.com SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 8.1 Application Information The TLV700 belongs to a new family of next-generation value LDO regulators. These devices consume low quiescent current and deliver excellent line and load transient performance. These characteristics, combined with low noise, very good PSRR with little (V – V ) headroom, make this family of devices ideal for RF portable IN OUT applications. This family of regulators offers current limit and thermal protection, and is specified from –40°C to +125°C. 8.2 Typical Application Figure21showsatypicalapplicationcircuit. VIN IN OUT VOUT C C 1mF IN OUT Ceramic TLV700xx On Off EN GND Figure21. TypicalApplicationCircuit 8.2.1 DesignRequirements Table2liststhedesignparameters. Table2.DesignParameters PARAMETER DESIGNREQUIREMENT Inputvoltage 2.5Vto3.3V Outputvoltage 1.8V Outputcurrent 100mA 8.2.2 DetailedDesignProcedure 8.2.2.1 InputandOutputCapacitorRequirements TI recommends using 1-μF X5R- and X7R-type ceramic capacitors because these capacitors have minimal variationinvalueandequivalentseriesresistance(ESR)overtemperature. However, the TLV700 is designed to be stable with an effective capacitance of 0.1 μF or larger at the output. Thus, the device is stable with capacitors of other dielectric types as well, as long as the effective capacitance under operating bias voltage and temperature is greater than 0.1 μF. This effective capacitance refers to the capacitance that the LDO sees under operating bias voltage and temperature conditions; that is, the capacitance after taking both bias voltage and temperature derating into consideration. In addition to allowing the use of cheaper dielectrics, this capability of being stable with 0.1-μF effective capacitance also enables the use of smallerfootprintcapacitorsthathavehigherderatinginsize-andspace-constrainedapplications. Using a 0.1-μF rated capacitor at the output of the LDO does not ensure stability because the effective capacitance under the specified operating conditions must not be less than 0.1 μF. Maximum ESR should be lessthan200mΩ. Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:TLV700

TLV700 SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 www.ti.com Althoughaninputcapacitorisnotrequiredforstability,itisgoodanalogdesignpracticetoconnecta0.1-μFto1- μF, low ESR capacitor across the IN pin and GND in of the regulator. This capacitor counteracts reactive input sources and improves transient response, noise rejection, and ripple rejection. A higher-value capacitor may be necessary if large, fast rise-time load transients are anticipated, or if the device is not located close to the power source.Ifsourceimpedanceismorethan2Ω,a0.1-μFinputcapacitormaybenecessarytoensurestability. 8.2.2.2 TransientResponse As with any regulator, increasing the size of the output capacitor reduces overshoot and undershoot magnitude butincreasesthedurationofthetransientresponse. 8.2.3 ApplicationCurves tR= tF= 1ms Slew Rate = 1 V/ms 0 mA/div IOUT 50 m0A mA 1 V/div 2.9 V 2.3 V VIN 5 div VOUT div VOUT V/ V/ m m 0 5 2 VIN= 2.3 V IOUT=200 mA 10ms/div 1 ms/div Figure22.TLV70018LoadTransientResponse Figure23.TLV70018LineTransientResponse 9 Power Supply Recommendations Connect a low output impedance power supply directly to the INPUT pin of the TLV700. Inductive impedances between the input supply and the INPUT pin can create significant voltage excursions at the INPUT pin during start-uporloadtransientevents. 14 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLV700

TLV700 www.ti.com SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 10 Layout 10.1 Layout Guidelines Input and output capacitors should be placed as close to the device pins as possible. To improve AC performance such as PSRR, output noise, and transient response, TI recommends designing the printed-circuit- boards with separate ground planes for V and V , with the ground plane connected only at the GND pin of IN OUT the device. In addition, the ground connection for the output capacitor should be connected directly to the GND pinofthedevice.HighESRcapacitorsmaydegradePSRRperformance. 10.2 Layout Examples VIN VOUT IN OUT CIN GND COUT E N NC GND PLANE Represents via used for application specific connections Figure24. LayoutExamplefortheDCKandDDCPackage VIN IN EN CIN GND NC GND PLANE O UT NC VOUT COUT Represents via used for application specific connections Figure25. LayoutExamplefortheDSEPackage 10.3 Thermal Protection Thermal protection disables the output when the junction temperature rises to approximately 160°C, allowing the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a resultofoverheating. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. For reliable operation, junction temperature should be limited to 125°C maximum. To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protectionistriggered;useworst-caseloadsandsignalconditions. For good reliability, thermal protection should trigger at least 35°C above the maximum expected ambient condition of the particular application. This configuration produces a worst-case junction temperature of 125°C at thehighestexpectedambienttemperatureandworst-caseload. Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:TLV700

TLV700 SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 www.ti.com Thermal Protection (continued) The internal protection circuitry of the TLV700 has been designed to protect against overload conditions. The protectioncircuitrywasnotintendedtoreplaceproperheatsinking.ContinuouslyrunningtheTLV700intothermal shutdowndegradesdevicereliability. 10.4 Power Dissipation The ability to remove heat from the die is different for each package type, presenting different considerations in the PCB layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. Performance data for JEDEC low and high-K boards are given in Thermal Information. Using heavier copper increases the effectiveness in removing heat from the device. The addition of plated through-holestoheat-dissipatinglayersalsoimprovesheatsinkeffectiveness. Powerdissipationdependsoninputvoltageandloadconditions.Powerdissipation(P )isequaltotheproductof D theoutputcurrentandthevoltagedropacrosstheoutputpasselement,asshowninEquation1. P = (V -V )´I D IN OUT OUT (1) 16 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLV700

TLV700 www.ti.com SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 11 Device and Documentation Support 11.1 Device Support 11.1.1 DevelopmentSupport 11.1.1.1 EvaluationModules Three evaluation modules (EVMs) are available to assist in the initial circuit performance evaluation using the TLV700: • TLV70033EVM-503 • TLV70018EVM-503 • TLV70028EVM-463 These EVMs can be requested at the Texas Instruments website through the product folders or purchased directlyfromtheTIeStore. 11.1.1.2 SpiceModels Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TLV700 is available through the product folders under Tools &Software. 11.1.2 DeviceNomenclature Table3.OrderingInformation(1) PRODUCT V (2) OUT TLV700xxyyyz XXisnominaloutputvoltage(forexample,28=2.8V). YYYisthepackagedesignator. Zistapeandreelquantity(R=3000,T=250). (1) ForthemostcurrentpackageandorderinginformationseethePackageOptionAddendumattheendofthisdocument,orvisitthe deviceproductfolderatwww.ti.com. (2) Outputvoltagesfrom1.2Vto4.8Vin50-mVincrementsareavailable.Contactfactoryfordetailsandavailability. 11.2 Documentation Support 11.2.1 RelatedDocumentation • UsingtheTLV700xxEVM-463EvaluationModule,SLUU390 • UsingtheTLV700xxEVM-503EvaluationModule,SLUU391 11.3 Trademarks BluetoothisaregisteredtrademarkofBluetoothSIG. ZigBeeisaregisteredtrademarkoftheZigBeeAlliance. Allothertrademarksarethepropertyoftheirrespectiveowners. 11.4 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 11.5 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. Copyright©2009–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:TLV700

TLV700 SLVSA00E–SEPTEMBER2009–REVISEDAPRIL2015 www.ti.com 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 18 SubmitDocumentationFeedback Copyright©2009–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLV700

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLV70012DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ODT & no Sb/Br) TLV70012DCKT ACTIVE SC70 DCK 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ODT & no Sb/Br) TLV70012DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ODO & no Sb/Br) TLV70012DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ODO & no Sb/Br) TLV70012DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 NH & no Sb/Br) TLV70012DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 NH & no Sb/Br) TLV70013DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 SAH & no Sb/Br) TLV70013DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 SAH & no Sb/Br) TLV70015DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ODU & no Sb/Br) TLV70015DCKT ACTIVE SC70 DCK 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ODU & no Sb/Br) TLV70015DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ODP & no Sb/Br) TLV70015DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ODP & no Sb/Br) TLV70015DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 NJ & no Sb/Br) TLV70015DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 NJ & no Sb/Br) TLV70018DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ODV & no Sb/Br) TLV70018DCKT ACTIVE SC70 DCK 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ODV & no Sb/Br) TLV70018DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ODK & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLV70018DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ODK & no Sb/Br) TLV70018DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 NK & no Sb/Br) TLV70018DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 NK & no Sb/Br) TLV70019DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 SCJ & no Sb/Br) TLV70019DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 SCJ & no Sb/Br) TLV70022DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 SCI & no Sb/Br) TLV70022DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 SCI & no Sb/Br) TLV70025DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 QTP & no Sb/Br) TLV70025DCKT ACTIVE SC70 DCK 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 QTP & no Sb/Br) TLV70025DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 DAU & no Sb/Br) TLV70025DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 DAU & no Sb/Br) TLV70025DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 QY & no Sb/Br) TLV70025DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 QY & no Sb/Br) TLV70028DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ODW & no Sb/Br) TLV70028DCKT ACTIVE SC70 DCK 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ODW & no Sb/Br) TLV70028DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ODL & no Sb/Br) TLV70028DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ODL & no Sb/Br) TLV70028DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 NL & no Sb/Br) Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLV70028DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 NL & no Sb/Br) TLV70029DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 QJ & no Sb/Br) TLV70029DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 QJ & no Sb/Br) TLV70030DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ODR & no Sb/Br) TLV70030DCKT ACTIVE SC70 DCK 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ODR & no Sb/Br) TLV70030DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ODM & no Sb/Br) TLV70030DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ODM & no Sb/Br) TLV70030DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 NP & no Sb/Br) TLV70030DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 NP & no Sb/Br) TLV70031DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C4 & no Sb/Br) TLV70031DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C4 & no Sb/Br) TLV70032DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 SCH & no Sb/Br) TLV70032DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 SCH & no Sb/Br) TLV70033DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ODS & no Sb/Br) TLV70033DCKT ACTIVE SC70 DCK 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 ODS & no Sb/Br) TLV70033DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ODN & no Sb/Br) TLV70033DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ODN & no Sb/Br) TLV70033DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 NR & no Sb/Br) Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLV70033DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 NR & no Sb/Br) TLV70036DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 SCG & no Sb/Br) TLV70036DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 SCG & no Sb/Br) TLV70036DSER ACTIVE WSON DSE 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 UG & no Sb/Br) TLV70036DSET ACTIVE WSON DSE 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 UG & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 4

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLV700 : •Automotive: TLV700-Q1 NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 5

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TLV70012DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV70012DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 TLV70012DCKT SC70 DCK 5 250 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 TLV70012DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV70012DDCR SOT- DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70012DDCR SOT- DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70012DDCT SOT- DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70012DDCT SOT- DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70012DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70012DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70013DDCR SOT- DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70013DDCT SOT- DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70015DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 TLV70015DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TLV70015DCKT SC70 DCK 5 250 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 TLV70015DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV70015DDCR SOT- DDC 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70015DDCR SOT- DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70015DDCT SOT- DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70015DDCT SOT- DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70015DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70015DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70018DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV70018DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 TLV70018DCKR SC70 DCK 5 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 TLV70018DCKT SC70 DCK 5 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 TLV70018DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV70018DCKT SC70 DCK 5 250 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 TLV70018DDCR SOT- DDC 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70018DDCR SOT- DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70018DDCT SOT- DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70018DDCT SOT- DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70018DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70018DSER WSON DSE 6 3000 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TLV70018DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70019DDCR SOT- DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70019DDCT SOT- DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70022DDCR SOT- DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70022DDCT SOT- DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70025DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV70025DCKR SC70 DCK 5 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 TLV70025DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV70025DCKT SC70 DCK 5 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 TLV70025DDCR SOT- DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70025DDCR SOT- DDC 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70025DDCT SOT- DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN PackMaterials-Page2

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TLV70025DDCT SOT- DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70025DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70025DSER WSON DSE 6 3000 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TLV70025DSET WSON DSE 6 250 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2 TLV70025DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70028DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 TLV70028DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV70028DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV70028DCKT SC70 DCK 5 250 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 TLV70028DDCR SOT- DDC 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70028DDCR SOT- DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70028DDCT SOT- DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70028DDCT SOT- DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70028DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70028DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TLV70028DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70028DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TLV70029DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70029DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70030DCKR SC70 DCK 5 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 TLV70030DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 TLV70030DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV70030DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV70030DCKT SC70 DCK 5 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 TLV70030DCKT SC70 DCK 5 250 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 TLV70030DDCR SOT- DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70030DDCR SOT- DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70030DDCT SOT- DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70030DDCT SOT- DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70030DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70030DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70031DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70031DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70032DDCR SOT- DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70032DDCT SOT- DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN PackMaterials-Page3

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TLV70033DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 TLV70033DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV70033DCKT SC70 DCK 5 250 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 TLV70033DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV70033DDCR SOT- DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70033DDCR SOT- DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70033DDCT SOT- DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70033DDCT SOT- DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 23-THIN TLV70033DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TLV70033DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70033DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70033DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2 TLV70036DDCR SOT- DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70036DDCT SOT- DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3 23-THIN TLV70036DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70036DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 PackMaterials-Page4

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TLV70012DCKR SC70 DCK 5 3000 180.0 180.0 18.0 TLV70012DCKR SC70 DCK 5 3000 183.0 183.0 20.0 TLV70012DCKT SC70 DCK 5 250 183.0 183.0 20.0 TLV70012DCKT SC70 DCK 5 250 180.0 180.0 18.0 TLV70012DDCR SOT-23-THIN DDC 5 3000 195.0 200.0 45.0 TLV70012DDCR SOT-23-THIN DDC 5 3000 406.0 348.0 63.0 TLV70012DDCT SOT-23-THIN DDC 5 250 202.0 201.0 28.0 TLV70012DDCT SOT-23-THIN DDC 5 250 195.0 200.0 45.0 TLV70012DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70012DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70013DDCR SOT-23-THIN DDC 5 3000 202.0 201.0 28.0 TLV70013DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0 TLV70015DCKR SC70 DCK 5 3000 183.0 183.0 20.0 TLV70015DCKR SC70 DCK 5 3000 180.0 180.0 18.0 TLV70015DCKT SC70 DCK 5 250 183.0 183.0 20.0 TLV70015DCKT SC70 DCK 5 250 180.0 180.0 18.0 TLV70015DDCR SOT-23-THIN DDC 5 3000 195.0 200.0 45.0 TLV70015DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0 TLV70015DDCT SOT-23-THIN DDC 5 250 195.0 200.0 45.0 TLV70015DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0 TLV70015DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70015DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70018DCKR SC70 DCK 5 3000 180.0 180.0 18.0 TLV70018DCKR SC70 DCK 5 3000 183.0 183.0 20.0 TLV70018DCKR SC70 DCK 5 3000 203.0 203.0 35.0 TLV70018DCKT SC70 DCK 5 250 203.0 203.0 35.0 TLV70018DCKT SC70 DCK 5 250 180.0 180.0 18.0 TLV70018DCKT SC70 DCK 5 250 183.0 183.0 20.0 TLV70018DDCR SOT-23-THIN DDC 5 3000 195.0 200.0 45.0 TLV70018DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0 TLV70018DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0 TLV70018DDCT SOT-23-THIN DDC 5 250 195.0 200.0 45.0 TLV70018DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70018DSER WSON DSE 6 3000 203.0 203.0 35.0 TLV70018DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70019DDCR SOT-23-THIN DDC 5 3000 195.0 200.0 45.0 TLV70019DDCT SOT-23-THIN DDC 5 250 195.0 200.0 45.0 TLV70022DDCR SOT-23-THIN DDC 5 3000 195.0 200.0 45.0 TLV70022DDCT SOT-23-THIN DDC 5 250 195.0 200.0 45.0 TLV70025DCKR SC70 DCK 5 3000 180.0 180.0 18.0 TLV70025DCKR SC70 DCK 5 3000 203.0 203.0 35.0 TLV70025DCKT SC70 DCK 5 250 180.0 180.0 18.0 PackMaterials-Page5

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TLV70025DCKT SC70 DCK 5 250 203.0 203.0 35.0 TLV70025DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0 TLV70025DDCR SOT-23-THIN DDC 5 3000 195.0 200.0 45.0 TLV70025DDCT SOT-23-THIN DDC 5 250 195.0 200.0 45.0 TLV70025DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0 TLV70025DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70025DSER WSON DSE 6 3000 203.0 203.0 35.0 TLV70025DSET WSON DSE 6 250 203.0 203.0 35.0 TLV70025DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70028DCKR SC70 DCK 5 3000 183.0 183.0 20.0 TLV70028DCKR SC70 DCK 5 3000 180.0 180.0 18.0 TLV70028DCKT SC70 DCK 5 250 180.0 180.0 18.0 TLV70028DCKT SC70 DCK 5 250 183.0 183.0 20.0 TLV70028DDCR SOT-23-THIN DDC 5 3000 195.0 200.0 45.0 TLV70028DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0 TLV70028DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0 TLV70028DDCT SOT-23-THIN DDC 5 250 195.0 200.0 45.0 TLV70028DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70028DSER WSON DSE 6 3000 205.0 200.0 33.0 TLV70028DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70028DSET WSON DSE 6 250 205.0 200.0 33.0 TLV70029DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70029DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70030DCKR SC70 DCK 5 3000 203.0 203.0 35.0 TLV70030DCKR SC70 DCK 5 3000 183.0 183.0 20.0 TLV70030DCKR SC70 DCK 5 3000 180.0 180.0 18.0 TLV70030DCKT SC70 DCK 5 250 180.0 180.0 18.0 TLV70030DCKT SC70 DCK 5 250 203.0 203.0 35.0 TLV70030DCKT SC70 DCK 5 250 183.0 183.0 20.0 TLV70030DDCR SOT-23-THIN DDC 5 3000 195.0 200.0 45.0 TLV70030DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0 TLV70030DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0 TLV70030DDCT SOT-23-THIN DDC 5 250 195.0 200.0 45.0 TLV70030DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70030DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70031DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70031DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70032DDCR SOT-23-THIN DDC 5 3000 202.0 201.0 28.0 TLV70032DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0 TLV70033DCKR SC70 DCK 5 3000 183.0 183.0 20.0 TLV70033DCKR SC70 DCK 5 3000 180.0 180.0 18.0 TLV70033DCKT SC70 DCK 5 250 183.0 183.0 20.0 TLV70033DCKT SC70 DCK 5 250 180.0 180.0 18.0 TLV70033DDCR SOT-23-THIN DDC 5 3000 195.0 200.0 45.0 PackMaterials-Page6

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TLV70033DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0 TLV70033DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0 TLV70033DDCT SOT-23-THIN DDC 5 250 195.0 200.0 45.0 TLV70033DSER WSON DSE 6 3000 205.0 200.0 33.0 TLV70033DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70033DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70033DSET WSON DSE 6 250 205.0 200.0 33.0 TLV70036DDCR SOT-23-THIN DDC 5 3000 202.0 201.0 28.0 TLV70036DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0 TLV70036DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70036DSET WSON DSE 6 250 183.0 183.0 20.0 PackMaterials-Page7

None

None

None

None

None

None

IMPORTANTNOTICEANDDISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2020, Texas Instruments Incorporated