TLV3011 TLV3012 SBOS300B – FEBRUARY 2004 – REVISED JUNE 2004 Nanopower, 1.8V, SOT23 Comparator with Voltage Reference FEATURES DESCRIPTION (cid:1) LOW QUIESCENT CURRENT: 5µA (max) The TLV3011 is a low-power, open-drain output comparator; (cid:1) INTEGRATED VOLTAGE REFERENCE: 1.242V the TLV3012 is a push-pull output comparator. Both feature an uncommitted on-chip voltage reference. Both have 5µA (cid:1) INPUT COMMON-MODE RANGE: (max) quiescent current, input common-mode range 200mV 200mV Beyond Rails beyond the supply rails, and single-supply operation from (cid:1) VOLTAGE REFERENCE INITIAL ACCURACY: 1% 1.8V to 5.5V. The integrated 1.242V series voltage reference (cid:1) OPEN-DRAIN LOGIC COMPATIBLE OUTPUT: offers low 100ppm/°C (max) drift, is stable with up to 10nF TLV3011 capacitive load, and can provide up to 0.5mA (typ) of output (cid:1) PUSH-PULL OUTPUT: TLV3012 current. (cid:1) LOW-SUPPLY VOLTAGE: 1.8V to 5.5V The TLV3011 and TLV3012 are available in the tiny SOT23-6 (cid:1) FAST RESPONSE TIME: 6µs Propagation Delay package for space-conservative designs. It is also available in the SC70 package for even greater board area savings. Both with 100mV Overdrive (TLV3011: R = 10kΩ) PULL-UP versions are specified for the temperature range of –40°C to (cid:1) MicroSIZE PACKAGES: SOT23-6 and SC70-6 +125°C. APPLICATIONS TLV3011 and TLV3012 RELATED PRODUCTS PRODUCT FEATURES (cid:1) BATTERY-POWERED LEVEL DETECTION TLV349x 1.2µA, 1.8V to 5.5V Push-Pull Comparator (cid:1) DATA ACQUISITION TLV370x 560nA, 2.5V to 16V Push-Pull CMOS Output Comparator (cid:1) SYSTEM MONITORING TLV340x 550nA, 2.5V to 16V Open-Drain Comparator (cid:1) OSCILLATORS (cid:1) SENSOR SYSTEMS: Smoke Detectors, Light Sensors, Alarms OUT 1 6 V+ V− 2 5 REF IN+ 3 4 IN− TLV3011 TLV3012 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright © 2004, Texas Instruments Incorporated Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com

ABSOLUTE MAXIMUM RATINGS(1) ELECTROSTATIC Supply Voltage....................................................................................+7V DISCHARGE SENSITIVITY Signal Input Terminals, Voltage(2)...........................–0.5V to (V+) + 0.5V Current(2)..................................................±10mA Output Short-Circuit(3)..............................................................Continuous This integrated circuit can be damaged by ESD. Texas Instru- Operating Temperature..................................................–55°C to +150°C ments recommends that all integrated circuits be handled with Storage Temperature.....................................................–55°C to +150°C appropriate precautions. Failure to observe proper handling Junction Temperature....................................................................+150°C Lead Temperature (soldering, 10s)...............................................+300°C and installation procedures can cause damage. ESD Rating (Human Body Model)..................................................2000V ESD damage can range from subtle performance degradation NOTE: (1)Stresses above these ratings may cause permanent damage. to complete device failure. Precision integrated circuits may be Exposure to absolute maximum conditions for extended periods more susceptible to damage because very small parametric may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other changes could cause the device not to meet its published conditions beyond those specified is not implied. specifications. (2) Input terminals are diode-clamped to the power-supply rails. In put signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground. PACKAGE/ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. PIN CONFIGURATIONS Top View TLV3011AIDBV TLV3012AIDBV OUT 1 A 6 V+ OUT 1 A 6 V+ V− 2 L 5 REF V− 2 L 5 REF R S IN+ 3 4 IN− IN+ 3 4 IN− SOT23-6 SOT23-6 TLV3011AIDCK TLV3012AIDCK OUT 1 A 6 V+ OUT 1 A 6 V+ V− 2 J 5 REF V− 2 L 5 REF X T IN+ 3 4 IN− IN+ 3 4 IN− SC70-6 SC70-6 NOTE: Pin 1 is determined by orienting package marking as shown. TLV3011, TLV3012 2 www.ti.com SBOS300B

ELECTRICAL CHARACTERISTICS: V = +1.8V to +5.5V S ° ° Boldface limits apply over the specified temperature range, T = –40 C to +125 C. A At T = +25°C, V = V , unless otherwise noted; for TLV3011, R = 10kΩ connected to V . A OUT S PULL-UP S TLV3011, TLV3012 PARAMETER CONDITION MIN TYP MAX UNITS OFFSET VOLTAGE Input Offset Voltage V V = 0V, I = 0V 0.5 12 mV OS CM O vs Temperature dV /dT T = –40°C to +125°C ±12 µV/°C OS A vs Power Supply PSRR V = 1.8V to 5.5V 100 1000 µV/V S INPUT BIAS CURRENT Input Bias Current I V = V /2 ±1 ±10 pA B CM S Input Offset Current I V = V /2 ±1 ±10 pA OS CM S INPUT VOLTAGE RANGE Common-Mode Voltage Range V (V–) – 0.2V (V+) + 0.2V V CM Common-Mode Rejection Ratio CMRR V = –0.2V to (V+) – 1.5V 60 74 dB CM V = –0.2V to (V+) + 0.2V 54 62 dB CM INPUT IMPEDANCE Common-Mode 1013 2 Ω pF Differential 1013 4 Ω pF SWITCHING CHARACTERISTICS f = 10kHz, V = 1V STEP Propagation Delay Time, Low-to-High t Input Overdrive = 10mV 12 µs (PLH) Input Overdrive = 100mV 6 µs Propagation Delay Time, High-to-Low t Input Overdrive = 10mV 13.5 µs (PHL) Input Overdrive = 100mV 6.5 µs Rise Time, TLV3011 t See Note 1 R Rise Time, TLV3012 C = 10pF 100 ns L Fall Time t C = 10pF 100 ns F L OUTPUT V = 5V S Voltage Output Low from Rail V I = –5mA 160 200 mV OL OUT Voltage Output High From Rail, TLV3012 I = 5mA 90 200 mV OUT Short-Circuit Current, TLV3012 See Typical Characteristics VOLTAGE REFERENCE V = 5V IN Initial Accuracy V 1.230 1.242 1.254 V OUT ±1 % Temperature Drift dV /dT –40°C ≤ T ≤ 125°C 40 100 ppm/°C OUT A Load Regulation Sourcing dV /dI 0mA < I ≤ 0.5mA 0.36 1 mV/mA OUT LOAD SOURCE Sinking 0mA < I ≤ 0.5mA 6.6 mV/mA SINK Output Current I 0.5 mA LOAD Line Regulation dV /dV 1.8V ≤ V ≤ 5.5V 10 100 µV/V OUT IN IN NOISE Reference Voltage Noise f = 0.1Hz to 10Hz 0.2 mV PP POWER SUPPLY Specified Voltage V 1.8 5.5 V S Operating Voltage Range 1.8 5.5 V Quiescent Current I V = 5V, V = High 2.8 5 µA Q S O TEMPERATURE RANGE Specified Range –40 +125 °C Operating Range –55 +150 °C Storage Range –55 +150 °C Thermal Resistance, θ JA SOT23-6 200 °C/W SC70-6 250 °C/W NOTE: (1) t dependent on R and C . R PULL-UP LOAD TLV3011, TLV3012 3 SBOS300B www.ti.com

TYPICAL CHARACTERISTICS At T = +25°C, V = +1.8V to +5.5V, R = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted. A S PULL-UP QUIESCENT CURRENT QUIESCENT CURRENT vs TEMPERATURE vs OUTPUT SWITCHING FREQUENCY 3.8 8 TLV3011 3.6 7 R = 1MΩ PULL-UP V = 5V 3.4 S µnt (A) 3.2 µnt (A) 65 VS = 3V Curre 3.0 Curre 4 nt 2.8 nt Quiesce 22..64 Quiesce 32 VS = 1.8V 2.2 1 2.0 0 –50 –25 0 25 50 75 100 125 1 10 100 1k 10k Temperature (°C) Output Transition Frequency (Hz) QUIESCENT CURRENT vs OUTPUT SWITCHING FREQUENCY INPUT BIAS CURRENT vs TEMPERATURE 14 45 TLV3012 VS = 5V 40 12 35 µA) 10 pA) 30 Current ( 8 VS = 3V Current ( 2250 cent 6 Bias 15 Quies 4 V = 1.8V Input 105 2 S 0 0 –5 1 10 100 1k 10k 100k –50 –25 0 25 50 75 100 125 Output Transition Frequency (Hz) Temperature (°C) OUTPUT LOW vs OUTPUT CURRENT OUTPUT HIGH vs OUTPUT CURRENT 0.25 0.25 TLV3012 V = 3V DD 0.20 0.20 VS = 1.8V VS = 3V VDD = 1.8V V (V)OL 00..1150 VS = 5V – V(V)SOH 00..1150 V V = 5V DD 0.05 0.05 0 0 0 2 4 6 8 10 12 0 2 4 6 8 10 12 Output Current (mA) Output Current (mA) TLV3011, TLV3012 4 www.ti.com SBOS300B

TYPICAL CHARACTERISTICS (Cont.) At T = +25°C, V = +1.8V to +5.5V, R = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted. A S PULL-UP 80 PROPAGATION DELAY (tPLH) vs CAPACITIVE LOAD 80 PROPAGATION DELAY (tPHL) vs CAPACITIVE LOAD TLV3012 70 70 60 60 50 50 µt (s)PLH 4300 VS = 3VVS = 5V µt (s)PHL 4300 VS = 3V VS = 5V V = 1.8V 20 S 20 10 10 V = 1.8V S 0 0 0.01 0.1 1 10 100 1k 0.01 0.1 1 10 100 1k Capacitive Load (nF) Capacitive Load (nF) PROPAGATION DELAY (t ) vs INPUT OVERDRIVE PROPAGATION DELAY (t ) vs INPUT OVERDRIVE PLH PHL 20 20 18 18 16 16 V = 5V S 14 14 s) s) µ (PLH 12 VS = 3V µ (PHL 12 VS = 1.8V t 10 t 10 V = 1.8V V = 3V S S 8 8 6 6 V = 5V S 4 4 0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100 Input Overdrive (mV) Input Overdrive (mV) PROPAGATION DELAY (tPLH) vs TEMPERATURE PROPAGATION DELAY (tPHL) vs TEMPERATURE 8.0 8.0 7.5 7.5 V = 1.8V 7.0 7.0 S V = 1.8V V = 3V S S 6.5 6.5 µt (s)PLH65..05 VS = 3V µt (s)PHL65..05 V = 5V S 5.0 5.0 V = 5V S 4.5 4.5 4.0 4.0 –50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125 Temperature (°C) Temperature (°C) TLV3011, TLV3012 5 SBOS300B www.ti.com

TYPICAL CHARACTERISTICS (Cont.) At T = +25°C, V = +1.8V to +5.5V, R = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted. A S PULL-UP PROPAGATION DELAY (t ) PROPAGATION DELAY (t ) PLH PHL VS = ±2.5V VIN+ VS = ±2.5V v 00mV/di VIN– 0mV/div VIN– 5 0 5 V IN+ TLV3012 V OUT V/div TLV3011 V/div 2 V 2 OUT 2µs/div 2µs/div PROPAGATION DELAY (t ) PROPAGATION DELAY (t ) PLH PHL VS = ±0.9V VIN+ VS = ±0.9V mV/div VIN– mV/div V 500 500 IN– V IN+ V/div V/div VOUT 2 VOUT 2 2µs/div 2µs/div REFERENCE VOLTAGE vs OUTPUT LOAD CURRENT REFERENCE VOLTAGE vs OUTPUT LOAD CURRENT (Sourcing) (Sinking) 1.24205 1.250 1.24200 1.249 1.24195 1.248 V) V) e ( 1.24190 e ( 1.247 g g a a olt 1.24185 olt 1.246 V V e 1.24180 e 1.245 c c n n e e er 1.24175 er 1.244 ef ef R 1.24170 R 1.243 1.24165 1.242 1.24160 1.241 0 0.2 0.4 0.6 0.8 1.0 1.2 0 0.2 0.4 0.6 0.8 1.0 1.2 Output Load Current, Sourcing (mA) Output Load Current, Sinking (mA) TLV3011, TLV3012 6 www.ti.com SBOS300B

TYPICAL CHARACTERISTICS (Cont.) At T = +25°C, V = +1.8V to +5.5V, R = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted. A S PULL-UP REFERENCE VOLTAGE vs TEMPERATURE SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE 1.250 140 TLV3012 1.245 120 V) 1.240 mA) 100 oltage ( 1.235 urrent ( 80 Sink V 1.230 C ce uit 60 Referen 11..222250 hort-Circ 40 Source S 1.215 20 1.210 0 –100 –50 0 50 100 150 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Temperature (°C) Supply Voltage (V) REFERENCE VOLTAGE DISTRIBUTION 500 450 400 e (V) 350 ag 300 olt V 250 e nc 200 e efer 150 R 100 50 0 0 2 4 6 8 0 2 4 6 8 0 2 4 3 3 3 3 3 4 4 4 4 4 5 5 5 2 2 2 2 2 2 2 2 2 2 2 2 2 1. 1. 1. 1. 1. 1. 1. 1. 1. 1. 1. 1. 1. Volts TLV3011, TLV3012 7 SBOS300B www.ti.com

APPLICATIONS INFORMATION may be added by connecting a small amount of feedback to the positive input. Figure 2 shows a typical topology used to The TLV3011 is a low-power, open-drain comparator with introduce hysteresis, described by the equation: on-chip 1.242V series reference. The open-drain output allows multiple devices to be driven by a single pull-up V+ ×R resistor to accomplish an OR function, making the TLV3011 V = 1 HYST R +R useful for logic applications. 1 2 The TLV3012 comparator with on-chip 1.242V series refer- ence has a push-pull output stage optimal for reduced power V+ budget applications and features no shoot-through current. 5.0V A typical supply current of 2.8µA and tiny packaging combine R (1) with 1.8V supply requirements to make the TLV3011 and V PULL-UP IN TLV3012 optimal for battery and portable designs. TLV301x V OUT BOARD LAYOUT REF R 2 Typical connections for the TLV3011 and TLV3012 are 560kΩ shown in Figure 1. The TLV3011 is an open-drain output R device. A pull-up resistor must be connected between the 391kΩ VHYST = 0.38V comparator output and supply to enable operation. V NOTE: (1) Use R with the TLV3011 only. To minimize supply noise, power supplies should be capaci- REF PULL-UP tively decoupled by a 0.01µF ceramic capacitor in parallel FIGURE 2. Adding Hysteresis. with a 10µF electrolytic capacitor. Comparators are sensitive to input noise, and precautions such as proper grounding (use of ground plane), supply bypassing, and guarding of V will set the value of the transition voltage required to HYST high-impedance nodes will minimize the effects of noise and switch the comparator output by increasing the threshold help to ensure specified performance. region, thereby reducing sensitivity to noise. APPLICATIONS V+ BATTERY LEVEL DETECT 0.01µF 10µF R (1) PULL-UP The low power consumption and 1.8V supply voltage of the VIN– 4 6 1 10kΩ TLV3011 make it an excellent candidate for battery-powered TLV301x V 3 V– OUT applications. Figure 3 shows the TLV3011 configured as a VIN+ 5 2 low battery level detector for a 3V battery. REF NOTE: (1) Use RPULL-UP with the TLV3011 only. R +R Battery−OkayTripVoltage=1.242 1 2 R2 FIGURE 1. Basic Connections of the TLV3011 and TLV3012. OPEN-DRAIN OUTPUT (TLV3011) R The open-drain output of the TLV3011 is useful in logic 1M1Ω RPULL-UP(1) applications. The value of the pull-up resistor and supply voltage used will affect current consumption due to additional + TLV301x Battery current drawn when the output is in a low state. This effect Okay − can be seen in the typical curve Quiescent Current vs Output R2M2Ω 1.242V REF Switching Frequency. EXTERNAL HYSTERESIS Comparator inputs have no noise immunity within the range When the battery voltage drops below 1.9V, of specified offset voltage (±12mV). For noisy input signals, the battery-okay output will go low. the comparator output may display multiple switching as input signals move through the switching threshold. The typical comparator threshold of the TLV3011 and TLV3012 is NOTE: (1) Use R with the TLV3011 only. PULL-UP ±0.5mV. To prevent multiple switching within the comparator threshold of the TLV3011 or TLV3012, external hysteresis FIGURE 3. TLV3011 Configured as a Low Battery Level Detector. TLV3011, TLV3012 8 www.ti.com SBOS300B

POWER-ON RESET The reset delay needed depends on the power-up character- istics of the system power supply. R and C are selected to The reset circuit shown in Figure 4 provides a time delayed 1 1 allow enough time for the power supply to stabilize. D release of reset to the MSP430 microcontroller. Operation of 1 provides rapid reset if power is lost. In this example, the the circuit is based on a stabilization time constant of the R • C time constant is 10mS. supply voltage, rather than on a predetermined voltage 1 1 value. The negative input is a reference voltage created by the internal voltage reference. The positive input is an RC RELAXATION OSCILLATOR circuit that provides a power-up delay. When power is ap- The TLV3012 can be configured as a relaxation oscillator as plied, the output of the comparator is low, holding the in Figure 5 to provide a simple and inexpensive clock output. processor in the reset condition. Only after allowing time for The capacitor is charged at a rate of T = 0.69RC. It also the supply voltage to stabilize does the positive input of the discharges at a rate of 0.69RC. Therefore, the period is comparator become higher than the negative input, resulting T = 1.38RC. R may be a different value than R . 1 2 in a high output state, releasing the processor for operation. The stabilization time required for the supply voltage is adjustable by the selection of the RC component values. Use of a lower-valued resistor in this portion of the circuit will not V increase current consumption because no current flows C through the RC circuit after the supply has stabilized. 2/3 (V+) 1/3 (V+) t V+ V+ T1 T2 C V+ R 1 1000pF 1MΩ V OUT R DI 1 1MΩ RPULL-UP(1) MSP430 10kΩ TLV3012 C101nF 1.242V TLV301x RESET 1RM2Ω 1RM2Ω F = 724Hz t V+ REF R 2 1MΩ NOTE: (1) Use R with the TLV3011 only. PULL-UP FIGURE 4. The TLV3011 or TLV3012 Configured as a FIGURE 5. TLV3012 Configured as a Relaxation Oscillator. Power Up Reset Circuit for the MSP430. TLV3011, TLV3012 9 SBOS300B www.ti.com

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLV3011AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ALR & no Sb/Br) TLV3011AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ALR & no Sb/Br) TLV3011AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ALR & no Sb/Br) TLV3011AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 ALR & no Sb/Br) TLV3011AIDCKR ACTIVE SC70 DCK 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AJX & no Sb/Br) TLV3011AIDCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AJX & no Sb/Br) TLV3011AIDCKT ACTIVE SC70 DCK 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AJX & no Sb/Br) TLV3011AIDCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AJX & no Sb/Br) TLV3012AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 ALS & no Sb/Br) TLV3012AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 ALS & no Sb/Br) TLV3012AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 ALS & no Sb/Br) TLV3012AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 ALS & no Sb/Br) TLV3012AIDCKR ACTIVE SC70 DCK 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 ALT & no Sb/Br) TLV3012AIDCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 ALT & no Sb/Br) TLV3012AIDCKT ACTIVE SC70 DCK 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 ALT & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLV3011, TLV3012 : •Automotive: TLV3012-Q1 •Enhanced Product: TLV3011-EP NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects •Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TLV3011AIDBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV3011AIDBVT SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV3011AIDCKR SC70 DCK 6 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV3011AIDCKT SC70 DCK 6 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV3012AIDBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV3012AIDBVT SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV3012AIDCKR SC70 DCK 6 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TLV3012AIDCKT SC70 DCK 6 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TLV3011AIDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 TLV3011AIDBVT SOT-23 DBV 6 250 180.0 180.0 18.0 TLV3011AIDCKR SC70 DCK 6 3000 180.0 180.0 18.0 TLV3011AIDCKT SC70 DCK 6 250 180.0 180.0 18.0 TLV3012AIDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 TLV3012AIDBVT SOT-23 DBV 6 250 180.0 180.0 18.0 TLV3012AIDCKR SC70 DCK 6 3000 180.0 180.0 18.0 TLV3012AIDCKT SC70 DCK 6 250 180.0 180.0 18.0 PackMaterials-Page2

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PACKAGE OUTLINE DBV0006A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 B A 1.45 MAX PIN 1 INDEX AREA 1 6 2X 0.95 3.05 2.75 1.9 5 2 4 3 0.50 6X 0.25 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214840/B 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. 4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation. 5. Refernce JEDEC MO-178. www.ti.com

EXAMPLE BOARD LAYOUT DBV0006A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 6X (1.1) 1 6X (0.6) 6 SYMM 2 5 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214840/B 03/2018 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0006A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 6X (1.1) 1 6X (0.6) 6 SYMM 2 5 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214840/B 03/2018 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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