(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:9) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:4)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:6) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:10)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:11) SLOS362A − JUNE 2001 − REVISED JANUARY 2005 (cid:12)(cid:13)(cid:14)(cid:15)(cid:2)(cid:16) (cid:17)(cid:12) (cid:2)(cid:17)(cid:18)(cid:19)(cid:20)(cid:17)(cid:18)(cid:21)(cid:22) (cid:18)(cid:15)(cid:23)(cid:21) (cid:24)(cid:13)(cid:25)(cid:23)(cid:18)(cid:15)(cid:23)(cid:1)(cid:26) (cid:27)(cid:15)(cid:25)(cid:28)(cid:2)(cid:21) (cid:27)(cid:29)(cid:20)(cid:20)(cid:2)(cid:16) (cid:17)(cid:20)(cid:21)(cid:22)(cid:13)(cid:1)(cid:15)(cid:17)(cid:25)(cid:13)(cid:2) (cid:13)(cid:14)(cid:20)(cid:2)(cid:15)(cid:12)(cid:15)(cid:21)(cid:22)(cid:27) (cid:18)(cid:15)(cid:1)(cid:26) (cid:13)(cid:25)(cid:23) (cid:18)(cid:15)(cid:1)(cid:26)(cid:17)(cid:29)(cid:1) (cid:27)(cid:26)(cid:29)(cid:1)(cid:23)(cid:17)(cid:18)(cid:25) FEATURES DESCRIPTION (cid:1) Rail-To-Rail Output The TLV263x single supply operational amplifiers (cid:1) V Includes Ground provide rail-to-rail output with an input range that ICR (cid:1) Gain-Bandwidth Product...9 MHz includes ground. The TLV263x takes the minimum (cid:1) Supply Current...730 µA/Channel operating supply voltage down to 2.7 V over the extended industrial temperature range (−40°C to (cid:1) Single, Duals, and Quad Versions 125°C) while adding the rail-to-rail output swing feature. (cid:1) Ultralow Power Down Mode The TLV263x also provides a 9 MHz gain-bandwidth I ) = 4 µA/Channel product from only 730 µA of supply current. The DD(SHDN (cid:1) Specified Temperature Range maximum recommended supply voltage is 5.5 V, which, −40°C to 125°C...Industrial Grade when coupled with a 2.7-V minimum, allows the devices (cid:1) to be operated from lithium ion cells. Supply Voltage Range...2.7 V to 5.5 V (cid:1) Ultrasmall Packaging The combination of wide bandwidth, low noise, and low 5 or 6 Pin SOT-23 (TLV2630/1) distortion makes it ideal for high speed and high 8 or 10 Pin MSOP (TLV2632/3) resolution data converter applications. The ground (cid:1) input range allows it to directly interface to ground rail Universal Op-Amp EVM (See SLOU060 referred systems. for More Information) All members are available in PDIP and SOIC with the Operational Amplifier singles in the small SOT-23 package, duals in the MSOP, and quads in the TSSOP package. + − The 2.7-V operation makes it compatible with Li-Ion powered systems and the operating supply voltage range of many micro-power microcontrollers available today including TI’s MSP430. AMPLIFIER SELECTION TABLE DEVICE V[DVD] ID[µDA/c]h V[IVC]R [GMBHWz] SLE[VW/µ RsA]TE V[nnV, 1/√ HkHz]z [mIOA] OPAx343 2.5−5.5 850 −0.3 to VDD + 0.3 5.5 6 25 40 OPAx743 3.5−12 1100 −0.1 to VDD + 0.1 7 10 30 20 TLV278x 1.8−3.6 650 −0.2 to VDD + 0.2 8 5 9 10 TLV263x 2.7−5.5 730 GND to VDD − 1 9 9.5 50 28 TLV262x 2.7−5.5 750 1 V to VDD + 0.2 11 10 27 28 OPAx353 2.7−5.5 8000 −0.1 to VDD + 0.1 44 22 7 40 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet. (cid:20)(cid:22)(cid:17)(cid:23)(cid:29)(cid:30)(cid:1)(cid:15)(cid:17)(cid:25) (cid:23)(cid:13)(cid:1)(cid:13) (cid:31)!"#$%&’(cid:31)#! (cid:31)( )*$$+!’ &( #" ,*-.(cid:31))&’(cid:31)#! /&’+0 Copyright  2001−2005, Texas Instruments Incorporated (cid:20)$#/*)’( )#!"#$% ’# (,+)(cid:31)"(cid:31))&’(cid:31)#!( ,+$ ’1+ ’+$%( #" (cid:1)+2&( (cid:15)!(’$*%+!’( (’&!/&$/ 3&$$&!’40 (cid:20)$#/*)’(cid:31)#! ,$#)+(((cid:31)!5 /#+( !#’ !+)+((&$(cid:31).4 (cid:31)!).*/+ ’+(’(cid:31)!5 #" &.. ,&$&%+’+$(0 www.ti.com 1

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:9) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:4)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:6) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:10)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:11) SLOS362A − JUNE 2001 − REVISED JANUARY 2005 PACKAGE/ORDERING INFORMATION(1) PACKAGE SPECIFIED PRODUCT PACKAGE SYMBOL ORDER NUMBER TRANSPORT MEDIA CODE TEMPERATURE RANGE Single with Shutdown TLV2630ID Tube TLV2630ID SOIC−8 D — TLV2630IDR Tape and Reel −40°C to 125°C TLV2630IDBVR† TLV2630IDBV SOT−23−6 DBV VAYI TLV2630IDBVT‡ Tape and Reel TLV2630IP DIP−8 P — TLV2630IP Tube Single without Shutdown TLV2631ID Tube TLV2631ID SOIC−8 D — TLV2631IDR Tape and Reel −40°C to 125°C TLV2631IDBVR† TLV2631IDBV SOT−23−5 DBV VAZI TLV2631IDBVT‡ Tape and Reel TLV2631IP DIP−8 P — TLV2631IP Tube Dual without Shutdown TLV2632ID Tube TLV2632ID SOIC−8 D — TLV2632IDR Tape and Reel −40°C to 125°C TLV2632IDGK Tube TLV2632IDGK MSOP−8 DGK AKG TLV2632IDGKR Tape and Reel TLV2632IP DIP−8 P — TLV2632IP Tube Dual with Shutdown TLV2633ID Tube TLV2633ID SOIC−14 D — TLV2633IDR Tape and Reel −40°C to 125°C TLV2633IDGS Tube TLV2633IDGS MSOP−10 DGS AKK TLV2633IDGSR Tape and Reel TLV2633IN DIP−14 N — TLV2633IN Tube Quad without Shutdown TLV2634ID Tube TLV2634ID SOIC−14 D — TLV2634IDR Tape and Reel TLV2634IN DIP−14 N — −−4400°CC ttoo 112255°CC TLV2634IN Tube TLV2634IPW Tube TLV2634IPW TSSOP−14 PW — TLV2634IPWR Tape and Reel Quad with Shutdown TLV2635ID Tube TLV2635ID SOIC−16 D — TLV2635IDR Tape and Reel TLV2635IN DIP−16 N — −−4400°CC ttoo 112255°CC TLV2635IN Tube TLV2635IPW Tube TLV2635IPW TSSOP−16 PW — TLV2635IPWR Tape and Reel †The SOT23 package devices are only available taped and reeled. The R Suffix denotes quantities (3,000 pieces per reel). ‡The T Suffix denotes smaller quantities (250 pieces per mini-reel). 1. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 2 www.ti.com

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:9) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:4)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:6) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:10)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:11) SLOS362A − JUNE 2001 − REVISED JANUARY 2005 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V DD Differential input voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±V ID DD Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND to V − 1 V I DD Input current, I (any input). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 10 mA I Output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±40 mA O Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating free-air temperature range, T : I-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C A Maximum junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C J Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C stg Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C †Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 2: All voltage values, except differential voltages, are with respect to GND. recommended operating conditions MIN MAX UNIT Single supply 2.7 5.5 SSuuppppllyy vvoollttaaggee,, VVDDDD Split supply ±1.35 ±2.75 VV Common-mode input voltage range, VICR GND VDD−1 V Operating free-air temperature, TA I-suffix −40 125 °C SShhuuttddoowwnn oonn//ooffff vvoollttaaggee lleevveell‡‡ VIL 0.4 VV VIH 2 ‡Relative to GND. electrical characteristics at specified free-air temperature, V = 2.7 V, 5 V (unless otherwise noted) DD dc performance PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT 25°C 250 3500 µVV Full range 4500 VVIIOO IInnppuutt ooffffsseett vvoollttaaggee VVIICC == VVDDDD//22,, 25°C 250 4200 TTLLVV22663344//55 µVV VVOO == VVDDDD//22 Full range 5200 Temperature coefficient of input offset αVIO voltage 25°C 3 µV/°C 25°C 76 100 VVDDDD == 22..77 VV Full range 67 CCMMRRRR CCoommmmoonn--mmooddee rreejjeeccttiioonn rraattiioo VVIICC == GGNNDD ttoo VVDDDD−−11 VV ddBB 25°C 77 100 VVDDDD == 55 VV Full range 74 LLaarrggee--ssiiggnnaall ddiiffffeerreennttiiaall vvoollttaaggee 25°C 90 100 AAVVDD amplification RRLL == 22 kkΩΩ,, VVOO((PPPP)) == VVDDDD−−11 VV Full range 82 ddBB www.ti.com 3

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:9) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:4)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:6) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:10)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:11) SLOS362A − JUNE 2001 − REVISED JANUARY 2005 electrical characteristics at specified free-air temperature, V = 2.7 V, 5 V (unless otherwise noted) DD (continued) input characteristics PARAMETER TEST CONDITIONS TA† MIN TYP MAX UNIT 25°C 1 50 IIIIOO IInnppuutt ooffffsseett ccuurrrreenntt VVIICC == VVDDDD//22,, Full range 100 ppAA VVOO == VVDDDD//22 25°C 1 50 IIIIBB IInnppuutt bbiiaass ccuurrrreenntt Full range 200 ri(d) Differential input resistance 25°C 1000 GΩ Ci(c) Common-mode input capacitance f = 1 kHz 25°C 12 pF †Full range is −40°C to 125°C for the I-suffix. output characteristics PARAMETER TEST CONDITIONS TA† MIN TYP MAX UNIT 25°C 2.6 2.67 VVDDDD == 22..77 VV Full range 2.55 VVIICC == VVDDDD//22,, IIOOHH == −−11 mmAA 25°C 4.92 4.98 VVDDDD == 55 VV Full range 4.9 VVOOHH HHiigghh--lleevveell oouuttppuutt vvoollttaaggee 25°C 2.25 2.43 VV VVDDDD == 22..77 VV Full range 2.15 VVIICC == VVDDDD//22,, IIOOHH == −−1100 mmAA 25°C 4.7 4.8 VVDDDD == 55 VV Full range 4.65 25°C 0.03 0.1 VVDDDD == 22..77 VV Full range 0.15 VVIICC == VVDDDD//22,, IIOOLL == 11 mmAA 25°C 0.025 0.08 VVDDDD == 55 VV Full range 0.1 VVOOLL LLooww--lleevveell oouuttppuutt vvoollttaaggee 25°C 0.26 0.45 mmVV VVDDDD == 22..77 VV Full range 0.47 VVIICC == VVDDDD//22,, IIOOLL == 1100 mmAA 25°C 0.2 0.3 VVDDDD == 55 VV Full range 0.35 VVDDDD == 22..77 VV,, Sourcing 14 VO = 0.5 V from rail Sinking 19 IIOO OOuuttppuutt ccuurrrreenntt 2255°°CC mmAA VVDDDD == 55 VV,, Sourcing 28 VO = 0.5 V from rail Sinking 28 VDD = 2.7 V 50 SSoouurrcciinngg VDD = 5 V 95 IIOOSS SShhoorrtt--cciirrccuuiitt oouuttppuutt ccuurrrreenntt 2255°°CC mmAA VDD = 2.7 V 50 SSiinnkkiinngg VDD = 5 V 95 †Full range is −40°C to 125°C for the I-suffix. power supply PARAMETER TEST CONDITIONS TA† MIN TYP MAX UNIT 25°C 730 1000 IIDDDD SSuuppppllyy ccuurrrreenntt ((ppeerr cchhaannnneell)) VVOO == VVDDDD//22,, SSHHDDNN == VVDDDD µAA Full range 1350 SSuuppppllyy vvoollttaaggee rreejjeeccttiioonn rraattiioo VVDDDD == 22..77 VV ttoo 55..55 VV,, 25°C 70 90 PPSSRRRR (∆VDD /∆VIO) VIC = VDD/2 NNoo llooaadd Full range 65 ddBB †Full range is −40°C to 125°C for the I-suffix. 4 www.ti.com

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:9) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:4)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:6) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:10)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:11) SLOS362A − JUNE 2001 − REVISED JANUARY 2005 electrical characteristics at specified free-air temperature, V = 2.7 V, 5 V (unless otherwise noted) DD (continued) dynamic performance PARAMETER TEST CONDITIONS TA† MIN TYP MAX UNIT GBWP Gain-bandwidth product RL = 2 kΩ, CL = 10 pF, f = 10 kHz 9 MHz VDD = 2.7 V, 6 VO(PP) = 1.7 V SSRR++ PPoossiittiivvee sslleeww rraattee aatt uunniittyy ggaaiinn RRLL == 22 kkΩΩ, CCLL == 5500 ppFF VV//µss VDD = 5 V, 6 VO(PP) = 3.5 V VDD = 2.7 V, 25°C 10 V/µs VO(PP) = 1.7 V SSRR−− NNeeggaattiivvee sslleeww rraattee aatt uunniittyy ggaaiinn RRLL == 22 kkΩΩ, CCLL == 5500 ppFF VDD = 5 V, 9.5 V/µs VO(PP) = 3.5 V φm Phase margin 50 ° RRLL == 22 kkΩΩ,, CCLL == 1100 ppFF Gain margin 20 dB †Full range is −40°C to 125°C for the I-suffix. noise/distortion performance PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT AV = 1 0.003% TTHHDD ++ NN TToottaall hhaarrmmoonniicc ddiissttoorrttiioonn pplluuss nnooiissee VVRROOLL ((==PP 22PP ))kk ==ΩΩ ,,VV DD ff DD==// 2211,,00 kkHHzz AV = 10 0.02% AV = 100 0.095% 2255°°CC f = 1 kHz 50 VVnn EEqquuiivvaalleenntt iinnppuutt nnooiissee vvoollttaaggee nnVV//√√HHzz f = 10 kHz 30 In Equivalent input noise current f = 1 kHz 0.9 fA/√Hz shutdown characteristics PARAMETER TEST CONDITIONS TA† MIN TYP MAX UNIT SSuuppppllyy ccuurrrreenntt,, ppeerr cchhaannnneell iinn sshhuuttddoowwnn 25°C 4 17 IIDDDD((SSHHDDNN)) mode (TLV2630, TLV2633, TLV2635) SSHHDDNN == 00..44 VV Full range 19 µAA VDD = 2.7 V 4.5 tt((oonn)) AAmmpplliiffiieerr ttuurrnnoonn ttiimmee‡‡ RRLL == 22 kkΩΩ, VDD = 5 V 2255°CC 1.5 µss CCLL == 1100 ppFF t(off) Amplifier turnoff time‡ 200 ns †Full range is −40°C to 125°C for the I-suffix. ‡Disable time and enable time are defined as the interval between application of the logic signal to SHDN and the point at which the supply current has reached half its final value. www.ti.com 5

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:9) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:4)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:6) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:10)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:11) SLOS362A − JUNE 2001 − REVISED JANUARY 2005 DISSIPATION RATING TABLE ΘΘJJCC ΘΘJJAA TTAA ≤≤ 2255°CC TTAA == 112255°CC PPAACCKKAAGGEE (°C/W) (°C/W) POWER RATING POWER RATING D (8) 38.3 176 710 mW 142 mW D (14) 26.9 122.3 1022 mW 204.4 mW D (16) 25.7 114.7 1090 mW 218 mW DBV (5) 55 324.1 385 mW 77.1 mW DBV (6) 55 294.3 425 mW 85 mW DGK (8) 54.2 259.9 481 mW 96.1 mW DGS (10) 54.1 259.7 485 mW 97 mW N (14, 16) 32 78 1600 mW 320.5 mW P (8) 41 104 1200 mW 240.4 mW PW (14) 29.3 173.6 720 mW 144 mW PW (16) 28.7 161.4 774 mW 154.9 mW TYPICAL CHARACTERISTICS Table of Graphs FIGURE VIO Input offset voltage vs Common-mode input voltage 1, 2 CMRR Common-mode rejection ratio vs Frequency 3 VOH High-level output voltage vs High-level output current 4, 6 VOL Low-level output voltage vs Low-level output current 5, 7 IDD Supply current vs Supply voltage 8 IDD Supply current vs Free-air temperature 9 PSRR Power supply rejection ratio vs Frequency 10 AVD Differential voltage amplification & phase vs Frequency 11 vs Supply voltage 12 GGaaiinn--bbaannddwwiiddtthh pprroodduucctt vs Free-air temperature 13 vs Supply voltage 14 SSRR SSlleeww rraattee vs Free-air temperature 15, 16 φm Phase margin vs Load capacitance 17 Vn Equivalent input noise voltage vs Frequency 18 Crosstalk vs Frequency 19 Voltage-follower large-signal pulse response 20 Voltage-follower small-signal pulse response 21 IDD(SHDN) Shutdown supply current vs Free-air temperature 22 IDD(SHDN) Shutdown supply current vs Supply voltage 23 IDD(SHDN) Shutdown supply current/output voltage vs Time 24 6 www.ti.com

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:9) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:4)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:6) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:10)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:11) SLOS362A − JUNE 2001 − REVISED JANUARY 2005 TYPICAL CHARACTERISTICS INPUT OFFSET VOLTAGE INPUT OFFSET VOLTAGE COMMON-MODE REJECTION RATIO vs vs vs COMMON-MODE INPUT VOLTAGE COMMON-MODE INPUT VOLTAGE FREQUENCY 1200 1200 dB120 µV 1000 VTAD D= 2=5 2°. 7C V µV 1000 VTAD D= 2=5 5° VC Ratio − 110100 VTAD D= 2=5 2°. 7C V and 5 V set Voltage − 680000 set Voltage − 680000 de Rejection 67890000 −Input OffVIO 2400000 Input Off−VIO 2400000 RR − Common-Mo 1234500000 −200 −200 CM 0 −0.3 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.42.7 −0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 10 100 1k 10k 100k 1M VICR − Common-Mode Input Voltage − V VICR − Common-Mode Input Voltage − V f − Frequency − Hz Figure 1 Figure 2 Figure 3 HIGH-LEVEL OUTPUT VOLTAGE LOW-LEVEL OUTPUT VOLTAGE HIGH-LEVEL OUTPUT VOLTAGE vs vs vs HIGH-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT CURRENT 2.7 2.7 5.0 V− High-Level Output Voltage − VOH 00011122........36925814 TTTATATA A= A= = =− =2 04 157°02°C0°C5C°°CC VDD = 2.7 V − Low-Level Output Voltage − VOL 00011122........36925814 VDD = T2TT.A7AA = V= T= T− A2 A04 5 =°0=°C °C 1C7205°°CC V− High-Level Output Voltage − VOH 011223344.........505050505 TTAAT T =TA=A A 1 7= =2 0= 5− °2 °04C5C°0°C°CC VDD = 5 V V 0.0 0.0 0.0 0 5 10 15 20 25 30 35 40 45 0 5 10 15 20 25 30 35 40 45 0 10 20 30 40 50 60 70 80 90 100 IOH − High-Level Output Current − mA IOL − Low-Level Output Current − mA IOH − High-Level Output Current − mA Figure 4 Figure 5 Figure 6 LOW-LEVEL OUTPUT VOLTAGE SUPPLY CURRENT SUPPLY CURRENT vs vs vs LOW-LEVEL OUTPUT CURRENT SUPPLY VOLTAGE FREE-AIR TEMPERATURE 5.0 1100 1100 4.5 VDD = 5 V 1000 TA = 125°C 1000 V − Low-Level Output Voltage − OL 01122334........50505050 TTTTATAAA A == == = 1− 72 204055°0°°C°C°CCC µISupply Current − −A/chDD 123456789000000000000000000 TA =T A−T4 A=AV0 °VI=7CC0 =2 ° =51C °VTCDAD =/ 20°C µISupply Current − −A/chDD 123456789000000000000000000 VDD = 5 V VDDAV =VI C2= . =71 VVDD/2 V 0.0 0 0 0 10 20 30 40 50 60 70 80 90 100 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 −40−25−10 5 20 35 50 65 80 95 110125 IOL − Low-Level Output Current − mA VDD − Supply Voltage − V TA − Free-Air Temperature − °C Figure 7 Figure 8 Figure 9 www.ti.com 7

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:9) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:4)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:6) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:10)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:11) SLOS362A − JUNE 2001 − REVISED JANUARY 2005 TYPICAL CHARACTERISTICS POWER SUPPLY REJECTION RATIO DIFFERENTIAL VOLTAGE AMPLIFICATION AND PHASE vs vs FREQUENCY FREQUENCY B 100 B 100 Power Supply Rejection Ratio − d 2345678900000000 PPSSSSRR−+ VTAD D= 2=5 2°. 7C V and 5 V erential Voltage Amplification − d 2345678900000000 Phase GaVRCTinADLL = D== 2 2=1 5k0 2°Ω p. 7CF V 0369100020°Phase − − RR 10 − Diff 100 −−6300 PS 0 VD −10 −90 10 100 1k 10k 100k 1M 10M A 1 k 10 k 100 k 1 M 10 M f − Frequency − Hz f − Frequency − Hz Figure 10 Figure 11 GAIN-BANDWIDTH PRODUCT GAIN-BANDWIDTH PRODUCT SLEW RATE vs vs vs SUPPLY VOLTAGE FREE-AIR TEMPERATURE SUPPLY VOLTAGE 10 10 11 9 9 10 MHz 8 MHz 8 9 SR− Gain-Bandwidth Product − 1234567 RCf =LL 1==0 21 k 0kH ΩpzF Gain-Bandwidth Product − 1234567 V Cf R=DLL D1 ==0 = 1 2k0 2Hk p.Ωz7F and 5 V µSR − Slew Rate − V/s 12345678 SR+ ARCVTAV(LLs =t===e p2125)5 0 k°= Ωp C1F Vpp 0 0 0 2 2.5 3 3.5 4 4.5 5 5.5 6 −40−25−10 5 20 35 50 65 80 95 110125 2.5 3 3.5 4 4.5 5 5.5 6 VDD − Supply Voltage − V TA − Free-Air Temperature − °C VDD − Supply Voltage − V Figure 12 Figure 13 Figure 14 SLEW RATE SLEW RATE PHASE MARGIN vs vs vs FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE LOAD CAPACITANCE 14 13 55 13 12 50 12 11 45 11 µSR − Slew Rate − V/s 100123456789 SR−SR+ VARCVVD(LLs Dt===e p1=25) 0 k2= Ωp. 71F VVpp µSR − Slew Rate − V/s 100123456789 SR−SR+ VAVRCVD(LLs Dt===e p1=25) 0 k5= Ωp V1F Vpp φ°− Phase Margin − m 1122334050505005 VRATADVL D=== =221 5 k2°Ω.C7 RVn aunlld = 5 0 V ΩRnull =R 1n0u0ll =Ω 20 Ω −40−25−10 5 20 35 50 65 80 95110125 −40−25−10 5 20 35 50 65 80 95110125 10 100 1 k TA − Free-Air Temperature − °C TA − Free-Air Temperature − °C CL − Load Capacitance − pF Figure 15 Figure 16 Figure 17 8 www.ti.com

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:9) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:4)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:6) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:10)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:11) SLOS362A − JUNE 2001 − REVISED JANUARY 2005 TYPICAL CHARACTERISTICS EQUIVALENT INPUT NOISE VOLTAGE CROSSTALK vs vs FREQUENCY FREQUENCY Hz 500 0 nV/ 450 VTAD D= 2=5 2°. 7C V and 5 V −20 VRDL D= 2= k 2Ω.7 V and 5 V e − 400 CL = 10 pF ag 350 −40 AV = 1 olt B VO(PP) = VDD/2 e V 300 − d −60 TA = 25°C nt Input Nois 122505000 Crosstalk −−18000 ASlhl uCtdhoawnnne Clsrosstalk e al 100 v ui −120 q 50 − E 0 −140 Crosstalk n V 10 100 1k 10k 100k 10 100 1k 10k 100k f − Frequency − Hz f − Frequency − Hz Figure 18 Figure 19 VOLTAGE-FOLLOWER LARGE-SIGNAL VOLTAGE-FOLLOWER SMALL-SIGNAL PULSE RESPONSE PULSE RESPONSE 8 2 2.80 2.60 V V put Voltage − V 4567 VIC −−0121 Mode Input Voltage − utput Voltage − V 2222....66770505 VIC VVRCATAVDILLC D==== = 2 121 =15 0k 0° 5ΩpC0 FV mV 2222....44550505 Mode Input Voltage − − Out 3 VO VVDICD = =V D5 DV/2 mon- − OO2.55 mon- VO 12 RCAVLL === 121 0k ΩpF − ComC V 22..4550 VO − ComC TA = 25°C VI VI 0 2.40 0 1 2 3 4 5 6 0 0.2 0.4 0.6 0.8 1 1.2 1.4 t − Time − µs t − Time − µs Figure 20 Figure 21 SHUTDOWN SUPPLY CURRENT SHUTDOWN SUPPLY CURRENT vs vs FREE-AIR TEMPERATURE SUPPLY VOLTAGE ch 8 ch 11 µA/ Shutdown = 0 V µA/ 10 Shutdown = 0 V ent − 7 AVVIC = = 1 VDD/2 ent − 9 AVVIC = = 1 VDD/2 upply Curr 56 VDD = 5 V upply Curr 678 TA =T A0 °=C 25°C S 4 S down 3 VDD = 3.6 V down 45 TA = −40°C ut ut Sh− 2 VDD = 2.7 V Sh− 23 TA = 70°C DD(SD) 01 DD(SD) 01 TA = 125°C I −40−25−10 5 20 35 50 65 80 95 110125 I 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 TA − Free-Air Temperature − °C VDD − Supply Voltage − V Figure 22 Figure 23 www.ti.com 9

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:9) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:4)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:6) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:10)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:11) SLOS362A − JUNE 2001 − REVISED JANUARY 2005 TYPICAL CHARACTERISTICS SHUTDOWN SUPPLY CURRENT / OUTPUT VOLTAGE vs TIME V − 5.0 e uls 4.0 n P 3.0 w o 2.0 d hut 1.0 SD S − 0.0 D S VDD = 5 V V m 2.5 AV = 1 e − 2.0 RL = 2 kΩ g olta 1.5 VO CL = 10 pF utput V 01..50 VTAIC = = 2 V5D°CD/2 O − 0.0 O V A µ − 0.0 nt e urr C 0.5 y pl p Su 1.0 IDD(SD) n w o utd 1.5 h S − D) 2.0 D(S 0 1 2 3 4 5 6 7 8 9 ID t − Time − µs Figure 24 10 www.ti.com

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:9) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:4)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:6) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:10)(cid:8) (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:11) SLOS362A − JUNE 2001 − REVISED JANUARY 2005 TLV263x PACKAGE PINOUTS TLV2630 TLV2630 TLV2631 DBV PACKAGE D OR P PACKAGE DBV PACKAGE (TOP VIEW) (TOP VIEW) (TOP VIEW) OUT 1 6 VDD NC 1 8 SHDN OUT 1 5 VDD IN− 2 7 VDD GND 2 5 SHDN IN+ 3 6 OUT GND 2 GND 4 5 NC IN+ 3 4 IN− IN+ 3 4 IN− TLV2631 TLV2632 TLV2633 D OR P PACKAGE D, DGK, OR P PACKAGE DGS PACKAGE (TOP VIEW) (TOP VIEW) (TOP VIEW) NC 1 8 NC 1OUT 1 8 VDD 1OUT 1 10 VDD IN− 2 7 VDD 1IN− 2 7 2OUT 1IN− 2 9 2OUT IN+ 3 6 OUT 1IN+ 3 6 2IN− 1IN+ 3 8 2IN− GND 4 5 NC GND 4 5 2IN+ GND 4 7 2IN+ 1SHDN 5 6 2SHDN TLV2633 TLV2634 TLV2635 D OR N PACKAGE D, N, OR PW PACKAGE D, N, OR PW PACKAGE (TOP VIEW) (TOP VIEW) (TOP VIEW) 1OUT 1 14 VDD 1OUT 1 14 4OUT 1OUT 1 16 4OUT 1IN− 2 13 2OUT 1IN− 2 13 4IN− 1IN− 2 15 4IN− 1IN+ 3 12 2IN− 1IN+ 3 12 4IN+ 1IN+ 3 14 4IN+ GND 4 11 2IN+ VDD 4 11 GND VDD 4 13 GND NC 5 10 NC 2IN+ 5 10 3IN+ 2IN+ 5 12 3IN+ 1SHDN 6 9 2SHDN 2IN− 6 9 3IN− 2IN− 6 11 3IN− NC 7 8 NC 2OUT 7 8 3OUT 2OUT 7 10 3OUT 1/2SHDN 8 9 3/4SHDN NC − No internal connection www.ti.com 11

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLV2630IDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VAYI & no Sb/Br) TLV2631IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VAZI & no Sb/Br) TLV2631IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 VAZI & no Sb/Br) TLV2632IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AKG & no Sb/Br) TLV2632IDR ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 2632I & no Sb/Br) TLV2634ID ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 2634I & no Sb/Br) TLV2634IPWR ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 2634I & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 3-Aug-2017 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TLV2630IDBVR SOT-23 DBV 6 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 TLV2631IDBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 TLV2631IDBVT SOT-23 DBV 5 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 TLV2632IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TLV2632IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2634IPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 3-Aug-2017 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TLV2630IDBVR SOT-23 DBV 6 3000 182.0 182.0 20.0 TLV2631IDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0 TLV2631IDBVT SOT-23 DBV 5 250 182.0 182.0 20.0 TLV2632IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0 TLV2632IDR SOIC D 8 2500 340.5 338.1 20.6 TLV2634IPWR TSSOP PW 14 2000 367.0 367.0 35.0 PackMaterials-Page2

PACKAGE OUTLINE DBV0006A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 B A 1.45 MAX PIN 1 INDEX AREA 1 6 2X 0.95 3.05 2.75 1.9 5 2 4 3 0.50 6X 0.25 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214840/B 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. 4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation. 5. Refernce JEDEC MO-178. www.ti.com

EXAMPLE BOARD LAYOUT DBV0006A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 6X (1.1) 1 6X (0.6) 6 SYMM 2 5 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214840/B 03/2018 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0006A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 6X (1.1) 1 6X (0.6) 6 SYMM 2 5 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214840/B 03/2018 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 1.45 B A 0.90 PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com

EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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