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  • 型号: TLV2362IP
  • 制造商: Texas Instruments
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ICGOO电子元器件商城为您提供TLV2362IP由Texas Instruments设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供TLV2362IP价格参考¥1.90-¥4.69以及Texas InstrumentsTLV2362IP封装/规格参数等产品信息。 你可以下载TLV2362IP参考资料、Datasheet数据手册功能说明书, 资料中有TLV2362IP详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
-3db带宽

-

产品目录

集成电路 (IC)半导体

描述

IC OPAMP GP 7MHZ 8DIP运算放大器 - 运放 Dual High Performnce

产品分类

Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps集成电路 - IC

品牌

Texas Instruments

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

放大器 IC,运算放大器 - 运放,Texas Instruments TLV2362IP-

数据手册

点击此处下载产品Datasheet

产品型号

TLV2362IP

产品目录页面

点击此处下载产品Datasheet

产品种类

运算放大器 - 运放

供应商器件封装

8-PDIP

共模抑制比—最小值

85 dB

关闭

No Shutdown

其它名称

296-10526-5
TLV2362IPE4
TLV2362IPE4-ND

包装

管件

单位重量

440.400 mg

压摆率

3 V/µs

商标

Texas Instruments

增益带宽生成

7 MHz

增益带宽积

7MHz

安装类型

通孔

安装风格

Through Hole

封装

Tube

封装/外壳

8-DIP(0.300",7.62mm)

封装/箱体

PDIP-8

工作温度

-40°C ~ 85°C

工作电源电压

+/- 1 V to +/- 2.5 V

工厂包装数量

50

技术

Bipolar

放大器类型

通用

最大双重电源电压

+/- 2.5 V

最大工作温度

+ 85 C

最小双重电源电压

+/- 1 V

最小工作温度

- 40 C

标准包装

50

电压-电源,单/双 (±)

±1 V ~ 2.5 V

电压-输入失调

1mV

电流-电源

1.75mA

电流-输入偏置

20nA

电流-输出/通道

20mA

电源电流

5 mA

电路数

2

系列

TLV2362

转换速度

3 V/us

输入偏压电流—最大

150 nA

输入参考电压噪声

8 nV

输入补偿电压

6 mV

输出电流

20 mA

输出类型

-

通道数量

2 Channel

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PDF Datasheet 数据手册内容提取

(cid:1) TLV2361, TLV2362 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007 (cid:1) Low Supply-Voltage TLV2361...DBV PACKAGE Operation...V = ±1 V Min (TOP VIEW) CC (cid:1) Wide Bandwidth...7 MHz Typ at IN+ 1 5 V V ± = ±2.5 V CC+ CC V 2 CC− (cid:1) High Slew Rate...3 V/µs Typ at IN− 3 4 OUT V ± = ±2.5 V CC (cid:1) Wide Output Voltage Swing...±2.4 V Typ at V ± = ±2.5 V, R = 10 kΩ TLV2362...D, DGK, P, PS, OR PW PACKAGE CC L (TOP VIEW) (cid:1) Low Noise...8 nV/√Hz Typ at f = 1 kHz 1OUT 1 8 VCC+ description/ordering information 1IN− 2 7 2OUT 1IN+ 3 6 2IN− The TLV236x devices are high-performance dual VCC− 4 5 2IN+ operational amplifiers built using an original Texas Instruments bipolar process. These devices can be operated at a very low supply voltage (±1 V), while maintaining a wide output swing. The TLV236x devices offer a dramatically improved dynamic range of signal conditioning in low-voltage systems. The TLV236x devices also provide higher performance than other general-purpose operational amplifiers by combining higher unity-gain bandwidth and faster slew rate. With their low distortion and low-noise performance, these devices are well suited for audio applications. ORDERING INFORMATION ORDERABLE TOP-SIDE TA PACKAGE† PART NUMBER MARKING‡ Reel of 3000 TLV2361CDBVR −00°°CC ttoo 7700°°CC SSOOTT-2233-55 ((DDBBVV)) YYCC33_ Reel of 250 TLV2361CDBVT Reel of 3000 TLV2361IDBVR SSOOTT-2233-55 ((DDBBVV)) YYCC44_ Reel of 250 TLV2361IDBVT MSOP/VSSOP (DGK) Reel of 2500 TLV2362IDGKR YBS PDIP (P) Tube of 50 TLV2362IP TLV2362IP −4400°CC ttoo 8855°CC Tube of 75 TLV2362ID SSOOIICC ((DD)) 22336622II Reel of 2500 TLV2362IDR SOP (PS) Reel of 2000 TLV2362IPSR TY2362 Tube of 150 TLV2362IPW TTSSSSOOPP ((PPWW)) TTYY22336622 Reel of 2000 TLV2362IPWR †Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡DBV: The actual top-side marking has one additional character that designates the wafer fab/assembly site. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright  2007, Texas Instruments Incorporated Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 65•5303 • DALLAS, TEXAS 75265 1 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443

TLV2361, TLV2362 (cid:1) HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007 equivalent schematic (each amplifier) VCC+ IN+ IN− OUT VCC− ACTUAL DEVICE COMPONENT COUNT COMPONENT TLV2361 TLV2362 Transistors 30 46 Resistors 6 11 Diodes 1 1 Capacitors 2 4 JFET 1 1 2 POST OFFICE BOX 65•5303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443

(cid:1) TLV2361, TLV2362 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 V CC+ Supply voltage, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −3.5 V CC− Differential input voltage, V (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3.5 V ID Input voltage, V (any input) (see Notes 1 and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V ± I CC Output voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3.5 V O Output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA O Duration of short-circuit current at (or below) 25°C (output shorted to GND) . . . . . . . . . . . . . . . . . . . Unlimited Package thermal impedance, θ (see Notes 4 and 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W JA DBV package . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W DGK package . . . . . . . . . . . . . . . . . . . . . . . . 172°C/W P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C J Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C stg †Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC−. 2. Differential voltages are at IN+ with respect to IN−. 3. All input voltage values must not exceed VCC. 4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Selecting the maximum of 150°C can affect reliability. 5. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions MIN MAX UNIT VCC Supply voltage ±1 ±2.5 V TLV2361C 0 70 TTA OOppeerraattiinngg ffrreeee-aaiirr tteemmppeerraattuurree °°CC TLV2361I, TLV2362I −40 85 POST OFFICE BOX 65•5303 • DALLAS, TEXAS 75265 3 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443

TLV2361, TLV2362 (cid:1) HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007 TLV2361 and TLV2362 electrical characteristics, V ± = ±1.5 V (unless otherwise noted) CC PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT 25°C 1 6 VVIO IInnppuutt ooffffsseett vvoollttaaggee VVO = 00, VVIC = 00 Full range 7.5 mmVV 25°C 5 100 IIIO IInnppuutt ooffffsseett ccuurrrreenntt VVO = 00, VVIC = 00 Full range 150 nnAA 25°C 20 150 IIIB IInnppuutt bbiiaass ccuurrrreenntt VVO = 00, VVIC = 00 Full range 250 nnAA CCoommmmoonn-mmooddee iinnppuutt 25°C ±0.5 VVIC voltage ||VVIO|| ≤≤ 77.55 mmVV Full range ±0.5 VV MMaaxxiimmuumm ppoossiittiivvee-ppeeaakk RL = 10 kΩ 25°C 1.2 1.4 VVOM+ output voltage RL ≥ 10 kΩ Full range 1.2 VV MMaaxxiimmuumm nneeggaattiivvee-ppeeaakk RL = 10 kΩ 25°C −1.2 −1.4 VVOM− output voltage RL ≥ 10 kΩ Full range −1.2 VV SSuuppppllyy ccuurrrreenntt 25°C 1.4 2.25 mA IICC (per amplifier) VVO = 00, NNoo llooaadd Full range 2.75 mA LLaarrggee-ssiiggnnaall ddiiffffeerreennttiiaall TLV2361 60 80 AAVD voltage amplification VVO = ±±11 VV, RRL = 1100 kkΩΩ TLV2362 2255°°CC 55 ddBB Common-mode rejection CMRR ratio VIC = ±0.5 V 25°C 75 dB Supply-voltage rejection kSVR ratio VCC± = ±1.5 V to ±2.5 V 25°C 80 dB TLV2361 and TLV2362 operating characteristics, VCC± = ±1.5 V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT SR Slew rate AV = 1, VI = ±0.5 V 2.5 V/µs B1 Unity-gain bandwidth AV = 40, RL = 10 kΩ, CL = 100 pF 6 MHz Vn Equivalent input noise voltage RS = 100 Ω, RF = 10 kΩ, f = 1 kHz 9 nV/√Hz 4 POST OFFICE BOX 65•5303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443

(cid:1) TLV2361, TLV2362 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007 TLV2361 and TLV2362 electrical characteristics, V ± = ±2.5 V (unless otherwise noted) CC PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT 25°C 1 6 VVIO IInnppuutt ooffffsseett vvoollttaaggee VVO = 00, VVIC = 00 Full range 7.5 mmVV 25°C 5 100 IIIO IInnppuutt ooffffsseett ccuurrrreenntt VVO = 00, VVIC = 00 Full range 150 nnAA 25°C 20 150 IIIB IInnppuutt bbiiaass ccuurrrreenntt VVO = 00, VVIC = 00 Full range 250 nnAA CCoommmmoonn-mmooddee iinnppuutt 25°C ±1.5 VVIC voltage ||VVIO|| ≤≤ 77.55 mmVV Full range ±1.4 VV MMaaxxiimmuumm ppoossiittiivvee-ppeeaakk RL = 10 kΩ 25°C 2 2.4 VVOM+ output voltage RL ≥ 10 kΩ Full range 2 VV MMaaxxiimmuumm nneeggaattiivvee-ppeeaakk RL = 10 kΩ 25°C −2 −2.4 VVOM− output voltage RL ≥ 10 kΩ Full range −2 VV SSuuppppllyy ccuurrrreenntt 25°C 1.75 2.5 IICC (per amplifier) VVO = 00, NNoo llooaadd Full range 3 mmAA LLaarrggee-ssiiggnnaall ddiiffffeerreennttiiaall TLV2361 60 80 AAVD voltage amplification VVO = ±±11 VV, RRL = 1100 kkΩΩ TLV2362 2255°°CC 60 ddBB Common-mode rejection CMRR ratio VIC = ±0.5 V 25°C 85 dB Supply-voltage rejection kSVR ratio VCC± = ±1.5 V to ±2.5 V 25°C 80 dB TLV2361 and TLV2362 operating characteristics, VCC± = ±2.5 V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT SR Slew rate AV = 1, VI = ±0.5 V 3 V/µs B1 Unity-gain bandwidth AV = 40, RL = 10 kΩ, CL = 100 pF 7 MHz Vn Equivalent input noise voltage RS = 100 Ω, RF = 10 kΩ, f = 1 kHz 8 nV/√Hz THD + N Total harmonic distortion, plus noise AV = 1, VO = ±1.2 V, RL = 10 kΩ, f = 3 kHz 0.004 % POST OFFICE BOX 65•5303 • DALLAS, TEXAS 75265 5 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443

TLV2361, TLV2362 (cid:1) HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007 TYPICAL CHARACTERISTICS Table of Graphs GRAPH TITLE FIGURE Supply current vs Free-air temperature 1 Supply current vs Supply voltage 2 Maximum positive output voltage vs Output current 3 Maximum negative output voltage vs Output current 4 Maximum peak-to-peak output voltage vs Frequency 5 Equivalent input noise voltage vs Frequency 6 Total harmonic distortion vs Frequency 7 Total harmonic distortion vs Output voltage 8 6 POST OFFICE BOX 65•5303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443

(cid:1) TLV2361, TLV2362 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007 TYPICAL CHARACTERISTICS SUPPLY CURRENT SUPPLY CURRENT vs vs FREE-AIR TEMPERATURE SUPPLY VOLTAGE 2.5 2.5 VO = 0 VO = 0 TA = 85°C No Load No Load TA = 75°C Per Channel Per Channel 2 2 TA = 25°C nt − mA VCC = ±2.5 V nt − mA TTAA == −0°4C0°C e 1.5 e 1.5 Curr VCC = ±1.5 V Curr y y pl pl up 1 up 1 S S − − C C C C I I 0.5 0.5 0 0 −50 −25 0 25 50 75 100 0 ±1 ±2 ±3 ±4 ±5 TA − Free-Air Temperature − °C VCC± − Supply Voltage − V Figure 1 Figure 2 MAXIMUM POSITIVE OUTPUT VOLTAGE MAXIMUM NEGATIVE OUTPUT VOLTAGE vs vs OUTPUT CURRENT OUTPUT CURRENT 2.5 0 − V VCC± = ±2.5 V TA = 25°C − V e e g g a 2 a olt olt −0.5 V V ut ut p p Out 1.5 Out −1 sitive VCC± = ±1.5 V sitive VCC± = ±1.5 V o o m P 1 m P −1.5 u u m m xi xi a a M 0.5 M − − −2 + − OM OM VCC± = ±2.5 V V V 0 −2.5 0 −0.4 −0.8 −1.2 −1.8 −2 0 4 8 12 16 20 IO − Output Current − mA IO − Output Current − mA Figure 3 Figure 4 POST OFFICE BOX 65•5303 • DALLAS, TEXAS 75265 7 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443

TLV2361, TLV2362 (cid:1) HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007 TYPICAL CHARACTERISTICS EQUIVALENT INPUT NOISE VOLTAGE MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE vs vs FREQUENCY FREQUENCY V 5 50 ge − VCC± = ±2.5 V Hz VTAC C=± 2 =5 °±C2.5 V put Volta 4 nV/ge − 40 RS = 100 Ω ut a k O Volt 30 o-Pea 3 VCC± = ±1.5 V Noise Peak-t 2 nput 20 m nt I u e m al axi 1 uiv 10 M q − O(PP) TRAL == 2150° kCΩ V− En V 0 0 1 k 10 k 100 k 1 M 10 M 10 100 1 k 10 k f − Frequency − Hz f − Frequency − Hz Figure 5 Figure 6 TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION vs vs FREQUENCY OUTPUT VOLTAGE 10 1 VCC± = ±2.5 V VCC± = ±3 V RS = 10 kΩ RS = 10 kΩ % RL = 10 kΩ % RL = 4 kΩ n − 1 VO = ±1.2 V n − 0.1 AV = 10 V o o rti rti o o st st Di Di c c oni 0.1 AV = 100 oni 0.01 m m r r 20 kHz a a H AV = 10 H al al D − Tot 0.01 AV = 1 D − Tot 0.001 1 kHz 20 Hz H H T T 0.001 0.0001 0 20 40 60 80 100 0 0.5 1 1.5 2 f − Frequency − kHz VO(rms) − Output Voltage − V Figure 7 Figure 8 8 POST OFFICE BOX 65•5303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLV2361CDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM 0 to 70 (YC3B, YC3G, YC3L) & no Sb/Br) TLV2361CDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM 0 to 70 (YC3B, YC3G, YC3L) & no Sb/Br) TLV2361IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 85 (YC4B, YC4G, YC4L) & no Sb/Br) TLV2361IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 85 (YC4B, YC4G, YC4L) & no Sb/Br) TLV2362ID ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2362I & no Sb/Br) TLV2362IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 (YBL, YBS, YBU) & no Sb/Br) TLV2362IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 (YBL, YBS, YBU) & no Sb/Br) TLV2362IDR ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 2362I & no Sb/Br) TLV2362IP ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 TLV2362IP & no Sb/Br) TLV2362IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TY2362 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TLV2361CDBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TLV2361CDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV2361CDBVT SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TLV2361CDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV2361IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TLV2361IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV2361IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV2361IDBVT SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TLV2362IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1 TLV2362IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2362IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TLV2361CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV2361CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV2361CDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV2361CDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV2361IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV2361IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV2361IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV2361IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV2362IDGKR VSSOP DGK 8 2500 370.0 355.0 55.0 TLV2362IDR SOIC D 8 2500 340.5 338.1 20.6 TLV2362IPWR TSSOP PW 8 2000 367.0 367.0 35.0 PackMaterials-Page2

PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 1.45 B A 0.90 PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com

EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE PW0008A TSSOP - 1.2 mm max height SCALE 2.800 SMALL OUTLINE PACKAGE C 6.6 TYP SEATING PLANE 6.2 PIN 1 ID A 0.1 C AREA 6X 0.65 8 1 3.1 2X 2.9 NOTE 3 1.95 4 5 0.30 8X 0.19 4.5 1.2 MAX B 0.1 C A B 4.3 NOTE 4 (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15 0.75 0 - 8 0.05 0.50 DETAIL A TYPICAL 4221848/A 02/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) 8X (0.45) SYMM (R0.05) 1 TYP 8 SYMM 6X (0.65) 5 4 (5.8) LAND PATTERN EXAMPLE SCALE:10X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS NOT TO SCALE 4221848/A 02/2015 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) SYMM (R0.05) TYP 8X (0.45) 1 8 SYMM 6X (0.65) 5 4 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X 4221848/A 02/2015 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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