Product Sample & Technical Tools & Support & Folder Buy Documents Software Community TLC5925 SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 TLC5925 Low-Power 16-Channel Constant-Current LED Sink Driver 1 Features 3 Description • 16Constant-CurrentOutputChannels The TLC5925 is designed for LED displays and LED 1 lighting applications. The TLC5925 contains a 16-bit • ConstantOutputCurrentInvarianttoLoadVoltage shift register and data latches, which convert serial Change input data into parallel output format. At the TLC5925 • ExcellentOutputCurrentAccuracy: output stage, 16 regulated-current ports provide – BetweenChannels:< ±4%(Max) uniformandconstantcurrentfordrivingLEDswithina wide range of VF variations. Used in system design – BetweenICs: <±6%(Max) for LED display applications (such as, LED panels), • ConstantOutputCurrentRange: the TLC5925 provides great flexibility and device 3mAto45mA performance. Users can adjust the output current • OutputCurrentAdjustedByExternalResistor from 3 mA to 45 mA through an external resistor, R , which gives flexibility in controlling the light • FastResponseofOutputCurrent, OE(Min): ext intensity of LEDs. TLC5925 is designed for up to 100ns 17 V at the output port. The high clock frequency, 30 • 30-MHzClockFrequency MHz, also satisfies the system requirements of high- • Schmitt-TriggerInputs volumedatatransmission. • 3.3-Vto5-VSupplyVoltage The serial data is transferred into TLC5925 via SDI, • ThermalShutdownforOvertemperature shifted in the shift register, and transferred out via SDO. LE can latch the serial data in the shift register Protection to the output latch. OE enables the output drivers to • ESDPerformance:1-kVHBM sinkcurrent. 2 Applications DeviceInformation (1) • GamingMachineandEntertainment PARTNUMBER PACKAGE BODYSIZE(NOM) • GeneralLEDApplications SSOP(24) 8.65mm×3.90mm • LEDDisplaySystems TLC5925 SOIC(24) 15.40mm×7.50mm • SignsLEDLighting TSSOP(24) 7.80mm×4.40mm • WhiteGoods (1) For all available packages, see the orderable addendum at theendofthedatasheet. TypicalApplication 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

TLC5925 SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 www.ti.com Table of Contents 1 Features.................................................................. 1 8 DetailedDescription............................................ 12 2 Applications........................................................... 1 8.1 Overview.................................................................12 3 Description............................................................. 1 8.2 FunctionalBlockDiagram.......................................12 4 RevisionHistory..................................................... 2 8.3 FeatureDescription.................................................12 8.4 DeviceFunctionalModes........................................13 5 PinConfigurationandFunctions......................... 3 9 ApplicationandImplementation........................ 14 6 Specifications......................................................... 4 9.1 ApplicationInformation............................................14 6.1 AbsoluteMaximumRatings......................................4 9.2 TypicalApplication .................................................15 6.2 ESDRatings..............................................................4 10 PowerSupplyRecommendations..................... 16 6.3 RecommendedOperatingConditions.......................4 6.4 ThermalInformation..................................................5 11 Layout................................................................... 16 6.5 ElectricalCharacteristics:V =3V.........................5 11.1 LayoutGuidelines.................................................16 DD 6.6 ElectricalCharacteristics:V =5.5V.....................6 11.2 LayoutExample....................................................17 DD 6.7 PowerDissipationandThermalImpedance.............6 12 DeviceandDocumentationSupport................. 18 6.8 TimingRequirements................................................7 12.1 CommunityResources..........................................18 6.9 SwitchingCharacteristics:V =3V........................7 12.2 Trademarks...........................................................18 DD 6.10 SwitchingCharacteristics:V =5.5V...................8 12.3 ElectrostaticDischargeCaution............................18 DD 6.11 TypicalCharacteristics............................................9 12.4 Glossary................................................................18 7 ParameterMeasurementInformation................10 13 Mechanical,Packaging,andOrderable Information........................................................... 18 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionA(March2013)toRevisionB Page • AddedPinConfigurationandFunctionssection,ESDRatingstable,FeatureDescriptionsection,DeviceFunctional Modes,ApplicationandImplementationsection,PowerSupplyRecommendationssection,Layoutsection,Device andDocumentationSupportsection,andMechanical,Packaging,andOrderableInformationsection .............................. 1 2 SubmitDocumentationFeedback Copyright©2008–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLC5925

TLC5925 www.ti.com SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 5 Pin Configuration and Functions DBQ,DW,orPWPPackage 24-PinSSOP,SOIC,orTSSOP TopView GND 1 24 VDD SDI 2 23 R-EXT CLK 3 22 SDO LE 4 21 OE OUT0 5 20 OUT15 OUT1 6 19 OUT14 OUT2 7 18 OUT13 OUT3 8 17 OUT12 OUT4 9 16 OUT11 OUT5 10 15 OUT10 OUT6 11 14 OUT9 OUT7 12 13 OUT8 PinFunctions PIN I/O DESCRIPTION NAME NO. CLK 3 I Clockinputfordatashiftonrisingedge GND 1 — Groundforcontrollogicandcurrentsink Datastrobeinput SerialdataistransferredtotherespectivelatchwhenLEishigh. LE 4 I ThedataislatchedwhenLEgoeslow. LEhasaninternalpull-downresistor. Outputenable WhenOEisactive(low),theoutputdriversareenabled. OE 21 I WhenOEishigh,alloutputdriversareturnedOFF(blanked). OEhasaninternalpullupresistor. OUT0 5 OUT1 6 OUT2 7 OUT3 8 OUT4 9 OUT5 10 OUT6 11 OUT7 12 O Constant-currentoutputs OUT8 13 OUT9 14 OUT10 15 OUT11 16 OUT12 17 OUT13 18 OUT14 19 OUT15 20 R-EXT 23 I Inputusedtoconnectanexternalresistor(R )forsettingoutputcurrents ext SDI 2 I Serial-datainputtotheShiftregister SDO 22 O Serial-dataoutputtothefollowingSDIofnextdriverICortothemicrocontroller VDD 24 I Supplyvoltage Copyright©2008–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:TLC5925

TLC5925 SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted) (1) MIN MAX UNIT V Supplyvoltage 0 7 V DD V Inputvoltage –0.4 V +0.4 V I DD V Outputvoltage –0.5 20 V O I Outputcurrent 45 mA OUT I GNDterminalcurrent 750 mA GND T Free-airoperatingtemperaturerange –40 125 °C A T Operatingjunctiontemperaturerange –40 150 °C J T Storagetemperaturerange –55 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. 6.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001 (1) ±1000 V Electrostaticdischarge V (ESD) Charged-devicemodel(CDM),perJEDECspecificationJESD22-C101 (2) ±500 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltage 3 5.5 V DD V Outputvoltage OUT0toOUT15 17 V O V ≥0.6V 3 O I Outputcurrent DCtestcircuit mA O V ≥1V 45 O I High-leveloutputcurrent SDO –1 mA OH I Low-leveloutputcurrent SDO 1 mA OL V High-levelinputvoltage CLK,OE,LE,andSDI 0.7×V V V IH DD DD V Low-levelinputvoltage CLK,OE,LE,andSDI GND 0.3×V V IL DD t RiseTime CLK 500 ns R t FallTime CLK 500 ns F 4 SubmitDocumentationFeedback Copyright©2008–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLC5925

TLC5925 www.ti.com SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 6.4 Thermal Information TLC5925 THERMALMETRIC (1) DBQ DW PW UNIT (SSOP) (SOIC) (TSSOP) 24PINS 24PINS 24PINS Junction-to- MountedonJEDEC1-layerboard(JESD51-3),Noairflow 99.8 80.5 118.8 °C/W R ambientthermal θJA resistance MountedonJEDEC4-layerboard(JESD51-7),Noairflow 61 45.5 87.9 °C/W R Junction-to-case(top)thermalresistance 52.9 45.0 44.9 °C/W θJC(top) R Junction-to-boardthermalresistance 41.5 44.8 52.9 °C/W θJB ψ Junction-to-topcharacterizationparameter 16.4 21.7 6.7 °C/W JT ψ Junction-to-boardcharacterizationparameter 41.2 44.4 52.5 °C/W JB R Junction-to-case(bottom)thermalresistance n/a n/a n/a °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report,SPRA953. 6.5 Electrical Characteristics: V = 3 V DD V =3V,T =–40°Cto125°C(unlessotherwisenoted) DD J PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V Inputvoltage 3 5.5 V DD V Outputvoltage 17 V O V ≥0.6V 3 O I Outputcurrent mA O V ≥1V 45 O I High-leveloutputcurrent,source -1 OH mA I Low-leveloutputcurrent,sink 1 OL V High-levelinputvoltage 0.7×V V IH DD DD V V Low-levelinputvoltage GND 0.3×V IL DD T =25°C 0.5 J I Outputleakagecurrent V =17V μA leak OH T =125°C 2 J V High-leveloutputvoltage SDO,I =–1mA V –0.4 V OH OL DD V Low-leveloutputvoltage SDO,I =1mA 0.4 V OL OH Outputcurrent1 V =0.6V,R =1680Ω 13 mA OUT ext I =13mA,V =0.6V,R =1680Ω, Outputcurrenterror,die-die OL O ext ±3% ±6% I T =25°C O(1) J Outputcurrenterror,channel-to- I =13mA,V =0.6V,R =1680Ω, OL O ext ±1.5% ±4% channel T =25°C J Outputcurrent2 V =0.8V,R =840Ω 26 mA O ext I =26mA,V =0.8V,R =840Ω, Outputcurrenterror,die-die OL O ext ±3% ±6% I T =25°C O(2) J Outputcurrenterror,channel-to- I =26mA,V =0.8V,R =840Ω, OL O ext ±1.5% ±4% channel T =25°C J IOUTvs Outputcurrentvs VO=1Vto3 V,IO=13mA ±0.1 %/V VOUT outputvoltageregulation VDD=3.0Vto5.5V,IO=13mAto45mA ±1 Pullupresistance OE 500 kΩ Pulldownresistance LE 500 kΩ T Overtemperatureshutdown (1) 150 175 200 °C sd T Restarttemperaturehysteresis 15 °C hys R =Open 7 10 ext I Supplycurrent R =1680Ω 9 12 mA DD ext R =840Ω 11 13 ext C Inputcapacitance V =V orGND,CLK,SDI,SDO,OE 10 pF IN I DD (1) Specifiedbydesign Copyright©2008–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:TLC5925

TLC5925 SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 www.ti.com 6.6 Electrical Characteristics: V = 5.5 V DD V =5.5V,T =–40°Cto125°C(unlessotherwisenoted) DD J PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V Inputvoltage 3 5.5 V DD V Outputvoltage 17 V O V ≥0.6V 3 O I Outputcurrent mA O V ≥1V 45 O I High-leveloutputcurrent,source -1 OH mA I Low-leveloutputcurrent,sink 1 OL V High-levelinputvoltage 0.7×V V IH DD DD V V Low-levelinputvoltage GND 03×V IL DD T =25°C 0.5 J I Outputleakagecurrent V =17V μA leak OH T =125°C 2 J V High-leveloutputvoltage SDO,I =–1mA V –0.4 V OH OL DD V Low-leveloutputvoltage SDO,I =1mA 0.4 V OL OH Outputcurrent1 V =0.6V,R =1680Ω 13 mA OUT ext I =13mA,V =0.6V,R =1680Ω, Outputcurrenterror,die-die OL O ext ±3$ ±6$ I T =25°C O(1) J Outputcurrenterror,channel-to- I =13mA,V =0.6V,R =1680Ω, OL O ext ±1.5$ ±4$ channel T =25°C J Outputcurrent2 V =0.8V,R =840Ω 26 mA O ext I =26mA,V =0.8V,R =840Ω, Outputcurrenterror,die-die OL O ext ±3% ±6% I T =25°C O(2) J Outputcurrenterror,channel-to- I =26mA,V =0.8V,R =840Ω, OL O ext ±1.5% ±4% channel T =25°C J IOUTvs Outputcurrentvs VO=1Vto3V,IO=26mA ±0.1 %/V VOUT outputvoltageregulation VDD=3.0Vto5.5V,IO=13mAto45mA ±1 Pullupresistance OE 500 kΩ Pulldownresistance LE 500 kΩ T Overtemperatureshutdown (1) 150 175 200 °C sd T Restarttemperaturehysteresis 15 °C hys R =Open 9 11 ext I Supplycurrent R =1680Ω 12 14 mA DD ext R =840Ω 14 16 ext C Inputcapacitance V =V orGND,CLK,SDI,SDO,OE 10 pF IN I DD (1) Specifiedbydesign 6.7 Power Dissipation and Thermal Impedance MIN MAX UNIT DBQpackage 1.6 MountedonJEDEC4-layerboard(JESD51-7), P Powerdissipation DWpackage 2.2 W D Noairflow,T =25°C,T =125°C A J PWpackage 1.1 6 SubmitDocumentationFeedback Copyright©2008–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLC5925

TLC5925 www.ti.com SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 6.8 Timing Requirements V =3Vto5.5V(unlessotherwisenoted) DD MIN MAX UNIT t LEpulseduration 15 ns w(L) t CLKpulseduration 15 ns w(CLK) t OEpulseduration 300 ns w(OE) t SetuptimeforSDI 3 ns su(D) t HoldtimeforSDI 2 ns h(D) t SetuptimeforLE 5 ns su(L) t HoldtimeforLE 5 ns h(L) f Clockfrequency,Cascadeoperation 30 MHz CLK 6.9 Switching Characteristics: V = 3 V DD V =3V,T =–40°Cto125°C(unlessotherwisenoted) DD J PARAMETER TESTCONDITIONS MIN TYP MAX UNIT t Low-to-highpropagationdelaytime,CLKtoOUTn 30 45 60 ns PLH1 t Low-to-highpropagationdelaytime,LEtoOUTn 30 45 60 ns PLH2 t Low-to-highpropagationdelaytime,OEtoOUTn 30 45 60 ns PLH3 t Low-to-highpropagationdelaytime,CLKtoSDO 30 40 ns PLH4 t High-to-lowpropagationdelaytime,CLKtoOUTn 40 65 100 ns PHL1 t High-to-lowpropagationdelaytime,LEtoOUTn 40 65 100 ns PHL2 t High-to-lowpropagationdelaytime,OEtoOUTn 40 65 100 ns PHL3 t High-to-lowpropagationdelaytime,CLKtoSDO 30 40 ns PHL4 t Pulseduration,CLK 15 ns w(CLK) V =V ,V =GND, IH DD IL t PulsedurationLE R =840Ω,V =4V, 15 ns w(L) ext L R =88Ω,C =10pF t Pulseduration,OE L L 300 ns w(OE) t Holdtime,SDI 2 ns h(D) t Setuptime,SDI 3 ns su(D) t Holdtime,LE 5 ns h(L) t Setuptime,LE 5 ns su(L) t Risetime,CLK (1) 500 ns r t Falltime,CLK (1) 500 ns f t Risetime,outputs(off) 35 50 70 ns or t Risetime,outputs(on) 15 50 120 ns of f Clockfrequency Cascadeoperation 30 MHz CLK (1) Ifthedevicesareconnectedincascadeandt ort islarge,itmaybecriticaltoachievethetimingrequiredfordatatransferbetweentwo r f cascadeddevices. Copyright©2008–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:TLC5925

TLC5925 SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 www.ti.com 6.10 Switching Characteristics: V = 5.5 V DD V =5.5V,T =–40°Cto125°C(unlessotherwisenoted) DD J PARAMETER TESTCONDITIONS MIN TYP MAX UNIT t Low-to-highpropagationdelaytime,CLKtoOUTn 20 35 55 ns PLH1 t Low-to-highpropagationdelaytime,LEtoOUTn 20 35 55 ns PLH2 t Low-to-highpropagationdelaytime,OEtoOUTn 20 35 55 ns PLH3 t Low-to-highpropagationdelaytime,CLKtoSDO 20 30 ns PLH4 t High-to-lowpropagationdelaytime,CLKtoOUTn 15 28 42 ns PHL1 t High-to-lowpropagationdelaytime,LEtoOUTn 15 28 42 ns PHL2 t High-to-lowpropagationdelaytime,OEtoOUTn 15 28 42 ns PHL3 t High-to-lowpropagationdelaytime,CLKtoSDO 20 30 ns PHL4 t Pulseduration,CLK 10 ns w(CLK) V =V ,V =GND, IH DD IL t PulsedurationLE R =840Ω,V =4V, 10 ns w(L) ext L R =88Ω,C =10pF t Pulseduration,OE L L 200 ns w(OE) t Holdtime,SDI 2 ns h(D) t Setuptime,SDI 3 ns su(D) t Holdtime,LE 5 ns h(L) t Setuptime,LE 5 ns su(L) t Risetime,CLK (1) 500 ns r t Falltime,CLK (1) 500 ns f t Risetime,outputs(off) 25 45 65 ns or t Risetime,outputs(on) 7 12 20 ns of f Clockfrequency Cascadeoperation 30 MHz CLK (1) Ifthedevicesareconnectedincascadeandt ort islarge,itmaybecriticaltoachievethetimingrequiredfordatatransferbetweentwo r f cascadeddevices. 8 SubmitDocumentationFeedback Copyright©2008–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLC5925

TLC5925 www.ti.com SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 CLK OE 1 LE 0 SDI off OUT0 on off OUT1 on off OUT2 on off OUT3 on off OUT15 on SDO Don't care Figure1. TimingDiagram 6.11 Typical Characteristics 50 Temperature=25°C IO=45mA 40 IO=38mA A) IO=31mA m ( 30 nt urre IO=24mA C ut utp 20 IO=17mA O IO=10mA 10 IO=3mA 0 0 0.5 1 1.5 2 2.5 3 OutputVoltage(V) Figure2.OutputCurrentvsOutputVoltage Copyright©2008–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:TLC5925

TLC5925 SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 www.ti.com 7 Parameter Measurement Information I DD V DD I OE OUT0 OUT I ,I IH IL CLK LE OUT15 SDI V ,V IH IL R-EXT GND SDO I ref Figure3. TestCircuitforElectricalCharacteristics I DD I OUT V ,V V IH IL DD OUT0 OE CLK Function Generator LE OUT15 R L SDI C L SDO R-EXT GND Logic input waveform I C V V =V ref L L IH DD V = 0V IL Figure4. TestCircuitforSwitchingCharacteristics 10 SubmitDocumentationFeedback Copyright©2008–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLC5925

TLC5925 www.ti.com SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 Parameter Measurement Information (continued) t w(CLK) CLK 50% 50% 50% t t su(D) h(D) SDI 50% 50% t ,t PLH4 PHL4 SDO 50% t w(L) 50% LE t t h(L) su(L) LOW OE t ,t w PLH2 PHL2 Outputoff o L E O OUTn 50% Output on t ,t PLH1 PHL1 t w(OE) HIGH OE 50% 50% d e uls tPHL3 tPLH3 P E Output off O 90% 90% OUTn 50% 50% 10% 10% t t of or Figure5. NormalModeTimingWaveforms Copyright©2008–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:TLC5925

TLC5925 SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 www.ti.com 8 Detailed Description 8.1 Overview TheTLC5925isa16-channelLEDdriverdesignedforLEDdisplaysandLEDlightingapplications.TheTLC5925 contains a 16-bit shift register and data latches, which convert serial input data into parallel output format. At the TLC5925 output stage, 16 regulated-current ports provide uniform and constant current for driving LEDs within a wide range of VF variations. Used in system design for LED display applications (for example, LED panels), the TLC5925 provides great flexibility and device performance. Users can adjust the output current from 3 mA to 45 mA through an external resistor, REXT, which gives flexibility in controlling the light intensity of LEDs. TLC59025 is designed for up to 17 V at the output port. The high clock frequency, 30 MHz, also satisfies the system requirementsofhigh-volumedatatransmission. 8.2 Functional Block Diagram OUT0 OUT1 OUT14 OUT15 R-EXT I/O REGULATOR VDD 8 OE OUTPUT DRIVER CONTROL LOGIC 16 16 LE 16-BIT OUTPUT LATCH CONFIGURATION LATCHES 16 CLK 8 16-BIT SHIFT SDI REGISTER SDO 16 8.3 Feature Description 8.3.1 ConstantCurrent In LED display applications, TLC5925 provides nearly no current variations from channel to channel and from IC to IC. While I ≤ 45 mA, the maximum current skew between channels is less than ±5% and between ICs is OUT lessthan±6%. 12 SubmitDocumentationFeedback Copyright©2008–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLC5925

TLC5925 www.ti.com SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 8.4 Device Functional Modes ThetablebelowliststhefunctionalmodesfortheTLC5925. Table1.TruthTableinNormalOperation CLK LE OE SDI OUT0...OUT15...OUT15 SDO ↑ H L Dn Dn...Dn–7...Dn–15 Dn–15 ↑ L L Dn+1 Nochange Dn–14 ↑ H L Dn+2 Dn+2...Dn–5...Dn–13 Dn–13 ↓ X L Dn+3 Dn+2...Dn–5...Dn–13 Dn–13 ↓ X H Dn+3 off Dn–13 Copyright©2008–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:TLC5925

TLC5925 SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 9.1 Application Information 9.1.1 TurningontheLEDs To turn on an LED connected to one of the outputs of the device, the output must be pulled low. To do this, the SDI signal must let the device know which outputs should be activated. Using the rising edge of CLK, the logic level of the SDI signal latches the desired state of each output into the shift register. Once this is complete, the LE signal must be toggled from low to high then back to low. Once /OE is pulled down, the corresponding outputs will be pulled low and the LEDs will be turned on. The below diagram shows outputs 0, 3, 4, 5, 10, 13, and15beingactivated. 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 CLK OE 1 LE 0 SDI off OUT0 on off OUT1 on off OUT2 on off OUT3 on off OUT15 on SDO Don't care Figure6. TimingDiagram 14 SubmitDocumentationFeedback Copyright©2008–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLC5925

TLC5925 www.ti.com SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 Application Information (continued) 9.1.2 PropagationDelayTimes Figure7.CLKtoOUT7 Figure8. OEtoOUT1 Figure9. OEtoOUT7 9.2 Typical Application Copyright©2008–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:TLC5925

TLC5925 SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 www.ti.com Typical Application (continued) 9.2.1 DesignRequirements Forthefollowingdesignprocedure,theinputvoltage(VDD)isbetween3Vand5.5V. 9.2.2 DetailedDesignProcedure 9.2.2.1 AdjustingOutputCurrent TLC5925 sets I based on the external resistor R . Users can follow the below formulas to calculate the OUT ext targetoutputcurrentI inthesaturationregion: OUT,target I =(1.21V/R )×18,whereR istheexternalresistanceconnectedbetweenR-EXTandGND. OUT,target ext ext Therefore,thedefaultcurrentisapproximately26mAat840 Ω and13mAat1680 Ω. 9.2.3 ApplicationCurve ThedefaultrelationshipafterpoweronbetweenI andR isshowninFigure10. OUT,target ext 45 40 35 A 30 m 25 – 20 T U O 15 I 10 5 0 0 500 1000 1500 2000 2500 3000 3500 4000 R –8W ext Figure10. DefaultRelationshipCurveBetweenI andR AfterPowerUp OUT,target ext 10 Power Supply Recommendations TheTLC5925isdesignedtooperatewithaVDDrangebetween3Vand5.5V. 11 Layout 11.1 Layout Guidelines TheSDI,CLK,SDO,LE,andOEsignalsshouldallbekeptfrompotentialnoisesources. AlltracescarryingpowerthroughtheLEDsshouldbewideenoughtohandlenecessarycurrents. All LED current passes through the device and into the ground node. There must be a strong connection betweenthedevicegroundandthecircuitboardground. 16 SubmitDocumentationFeedback Copyright©2008–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLC5925

TLC5925 www.ti.com SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 11.2 Layout Example Copyright©2008–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:TLC5925

TLC5925 SLVS765B–OCTOBER2008–REVISEDSEPTEMBER2015 www.ti.com 12 Device and Documentation Support 12.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 12.2 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 12.3 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 12.4 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 18 SubmitDocumentationFeedback Copyright©2008–2015,TexasInstrumentsIncorporated ProductFolderLinks:TLC5925

PACKAGE OPTION ADDENDUM www.ti.com 25-Feb-2015 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TLC5925IDBQR ACTIVE SSOP DBQ 24 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 TLC5925I & no Sb/Br) TLC5925IDWR ACTIVE SOIC DW 24 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLC5925I & no Sb/Br) TLC5925IDWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLC5925I & no Sb/Br) TLC5925IPWR ACTIVE TSSOP PW 24 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 Y5925 & no Sb/Br) TLC5925IPWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 Y5925 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 25-Feb-2015 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 14-Feb-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TLC5925IDBQR SSOP DBQ 24 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLC5925IDWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 TLC5925IPWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 14-Feb-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TLC5925IDBQR SSOP DBQ 24 2500 367.0 367.0 38.0 TLC5925IDWR SOIC DW 24 2000 350.0 350.0 43.0 TLC5925IPWR TSSOP PW 24 2000 367.0 367.0 38.0 PackMaterials-Page2

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PACKAGE OUTLINE PW0024A TSSOP - 1.2 mm max height SCALE 2.000 SMALL OUTLINE PACKAGE SEATING PLANE C 6.6 TYP 6.2 A 0.1 C PIN 1 INDEX AREA 22X 0.65 24 1 2X 7.9 7.15 7.7 NOTE 3 12 13 0.30 24X B 4.5 0.19 1.2 MAX 4.3 0.1 C A B NOTE 4 0.25 GAGE PLANE 0.15 0.05 (0.15) TYP SEE DETAIL A 0.75 0 -8 0.50 DETA 20AIL A TYPICAL 4220208/A 02/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. www.ti.com

EXAMPLE BOARD LAYOUT PW0024A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 24X (1.5) SYMM (R0.05) TYP 1 24X (0.45) 24 22X (0.65) SYMM 12 13 (5.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDE15.000R MASK DETAILS 4220208/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN PW0024A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 24X (1.5) SYMM (R0.05) TYP 1 24X (0.45) 24 22X (0.65) SYMM 12 13 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4220208/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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