TL760M33-Q1 www.ti.com SGLS284I–OCTOBER2005–REVISEDDECEMBER2010 LOW-DROPOUT FIXED-VOLTAGE REGULATORS CheckforSamples:TL760M33-Q1 FEATURES 1 KTT(TO-263)PACKAGE • QualifiedforAutomotiveApplications (TOPVIEW) • ±3%OutputVoltageVariationAcrossLoad OUTPUT andTemperature D • Load-DumpProtection N GND G • 500-mVMaximumDropoutVoltageat500mA INPUT • Fixed3.3-VOutput • InternalThermal-OverloadProtection • InternalOvervoltageProtection KVU (TO-252) PACKAGE (TOPVIEW) • Customer-SpecificConfigurationControlCan OUTPUT BeSupportedAlongWithMajor-Change D Approval N GND G INPUT DESCRIPTION/ORDERING INFORMATION The TL760M33-Q1 low-dropout regulator offers a variety of fixed-voltage options that offer a maximum continuous input voltage of 26 V. Utilizing a pnp pass element, this regulator is capable of sourcing 500 mA of current, with a specified maximum dropout of 500 mV, making the TL760M33-Q1 ideal for low-voltage applications. Additionally, the TL760M33-Q1 regulator offers very tight output accuracy of ±3% across operating load and temperature ranges. Other convenient features the regulators provide are internal overcurrent limiting, thermal-overload protection, and overvoltage protection. The TL760M33-Q1 is load-dump protected to its maximum operating condition of 45 V. Stability has been optimized for typical automotive applications and low-costcapacitors. ORDERINGINFORMATION(1) T V (TYP) PACKAGE(2) ORDERABLEPARTNUMBER TOP-SIDEMARKING A O TO-263–KTT Reelof500 TL760M33QKTTRQ1 TL760M33Q1 –40°Cto125°C 3.3V TO-252–KVU Reelof2500 TL760M33QKVURQ1 760M33Q1 (1) Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTI websiteatwww.ti.com. (2) Packagedrawings,thermaldata,andsymbolizationareavailableatwww.ti.com/packaging. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. UNLESS OTHERWISE NOTED this document contains Copyright©2005–2010,TexasInstrumentsIncorporated PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

TL760M33-Q1 SGLS284I–OCTOBER2005–REVISEDDECEMBER2010 www.ti.com ABSOLUTE MAXIMUM RATINGS(1) overoperatingvirtualjunctiontemperaturerange(unlessotherwisenoted) V Maximuminputvoltage 45V I T Operatingvirtualjunctiontemperature 150°C J T Storagetemperaturerange –65°Cto150°C stg (1) Stressesbeyondthoselistedunderabsolutemaximumratingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderrecommendedoperating conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. PACKAGE THERMAL DATA(1) PACKAGE BOARD q JA TO-252(KVU) HighK,JESD51-5 30.3°C/W TO-263(KTT) HighK,JESD51-5 26.9°C/W (1) MaximumpowerdissipationisafunctionofT(max),q ,andT .Themaximumallowablepowerdissipationatanyallowableambient J JA A temperatureisP =(T(max)–T )/q .OperatingattheabsolutemaximumT of150°Ccanimpactreliability. D J A JA J THERMAL RESISTANCE 1-ozcopper,one-layerPCB THERMALRESISTANCE VALUE R 55°C/W(area=240mm2) JA R 5.5°C/WfromFETtotab JC R 0.1°C/Wfromdiecentertotab JC RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT V Inputvoltage 3.8 26 V I I Outputcurrent 0 500 mA O T Operatingvirtual-junctiontemperature –40 150 °C J ELECTRICAL CHARACTERISTICS V =6V,I =500mA,T =–40°Cto150°C(unlessotherwisenoted) I O J PARAMETER TESTCONDITIONS(1) MIN TYP MAX UNIT I =5mAto500mA,V =3.8Vto26V,T =125°C 3.2 3.3 3.4 O I J V Outputvoltage V O T =150°C,I =5mAto300mA,V =3.8Vto26V 3.2 3.3 3.4 J O I I =250mA 8 15 O I Currentconsumption,I =I –I V =6V mA Q Q I O I I =500mA 20 30 O Lineregulation V =3.8Vto28V 10 25 mV I PSRR Power-supplyripplerejection f=100Hz,V =0.5V ,V =6V 62 dB ripple PP I Loadregulation I =5mAto500mA 5 30 mV O I =250mA 400 V Dropoutvoltage(2) O mV DO I =500mA 500 O (1) Pulse-testingtechniquesareusedtomaintainthevirtualjunctiontemperatureasclosetotheambienttemperatureaspossible.Thermal effectsmustbetakenintoaccountseparately.Allcharacteristicsaremeasuredwitha0.1-mFcapacitoracrosstheinputanda22-mF tantalumcapacitor,withequivalentseriesresistanceof1.5Ωontheoutput. (2) Measuredwhentheoutputvoltage,V ,hasdropped100mVfromthenominalvalueobtainedwhenV =6V O I 2 SubmitDocumentationFeedback Copyright©2005–2010,TexasInstrumentsIncorporated

TL760M33-Q1 www.ti.com SGLS284I–OCTOBER2005–REVISEDDECEMBER2010 COMPENSATION-CAPACITOR SELECTION INFORMATION The TL760M is a low-dropout regulator. This means that the capacitance loading is important to the performance of the regulator because it is a vital part of the control loop. The capacitor value and the equivalent series resistance (ESR) both affect the control loop and must be defined for the load range. Figure 1 can be used to establishthecapacitancevalueandESRrangeforthebestregulatorperformance. = 22mF = 0.1mF )W R ( 1000mF S E e, c n a st si 400mF e R s rie 0.015 200mF e S nt e al v ui q 22mF E 10mF Load Current,I (A) L DI L DV L DV = ESRxDI L L Figure1. Figure2. TYPICAL APPLICATION SCHEMATIC 22 Figure3. Copyright©2005–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3

TL760M33-Q1 SGLS284I–OCTOBER2005–REVISEDDECEMBER2010 www.ti.com TYPICAL CHARACTERISTICS Figure4. Figure5. 4 SubmitDocumentationFeedback Copyright©2005–2010,TexasInstrumentsIncorporated

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TL760M33QKTTRQ1 ACTIVE DDPAK/ KTT 3 500 Green (RoHS SN Level-3-245C-168 HR -40 to 125 TL760M33Q1 TO-263 & no Sb/Br) TL760M33QKVURQ1 ACTIVE TO-252 KVU 3 2500 Green (RoHS SN Level-3-260C-168 HR -40 to 125 760M33Q1 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2013 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TL760M33QKVURQ1 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2013 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TL760M33QKVURQ1 TO-252 KVU 3 2500 340.0 340.0 38.0 PackMaterials-Page2

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PACKAGE OUTLINE KVU0003A TO-252 - 2.52 mm max height SCALE 1.500 TO-252 10.41 9.40 6.22 1.27 B A 5.97 0.89 1 2.29 6.70 2 5.460 6.35 4.58 4.953 3 0.890 3X 1.02 0.635 OPTIONAL NOTE 3 0.61 0.25 C A B 0.61 2.52 MAX C 0.46 0.61 0.46 SEE DETAIL A 5.21 MIN 3 4.32 2 4 MIN 1 EXPOSED 0.51 THERMAL PAD GAGE PLANE NOTE 3 0.13 0 -8 1.78 0.00 1.40 DETA 7.000AIL A TYPICAL 4218915/A 02/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Shape may vary per different assembly sites. 4. Reference JEDEC registration TO-252. www.ti.com

EXAMPLE BOARD LAYOUT KVU0003A TO-252 - 2.52 mm max height TO-252 2X (2.75) (6.15) 2X (1) 1 4 SYMM (4.58) (5.55) 3 (R0.05) TYP (4.2) (2.5) PKG LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:6X 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND EXPOSED METAL EXPOSED METAL SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS NOT TO SCALE 4218915/A 02/2017 NOTES: (continued) 5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004). 6. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented. www.ti.com

EXAMPLE STENCIL DESIGN KVU0003A TO-252 - 2.52 mm max height TO-252 (1.18) TYP 2X (2.75) 2X (1) (0.14) 1 (R0.05) (1.33) TYP SYMM (4.58) 4 3 20X (1.13) (4.2) 20X (0.98) PKG SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 65% PRINTED SOLDER COVERAGE BY AREA SCALE:8X 4218915/A 02/2017 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

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