TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000 (cid:0) Ultrafast Operation...7.6 ns (Typ) D AND PW PACKAGE (cid:0) (TOP VIEW) Low Positive Supply Current 10.6 mA (Typ) (cid:0) VCC+ 1 8 Q OUT Operates From a Single 5-V Supply or From IN+ 2 7 Q OUT a Split ±5-V Supply IN– 3 6 GND (cid:0) Complementary Outputs VCC– 4 5 LATCH ENABLE (cid:0) Low Offset Voltage (cid:0) No Minimum Slew Rate Requirement (cid:0) Output Latch Capability (cid:0) symbol (each comparator) Functional Replacement to the LT1016 description IN+ Q OUT The TL3016 is an ultrafast comparator designed IN– Q OUT to interface directly to TTL logic while operating from either a single 5-V power supply or dual ±5-V supplies. It features extremely tight offset voltage and high gain for precision applications. It POSITIVE SUPPLY CURRENT has complementary outputs that can be latched vs using the LATCH ENABLE terminal. Figure 1 FREE-AIR TEMPERATURE shows the positive supply current of this 15 ÎÎÎÎÎ comparator. The TL3016 only requires 10.6 mA (typical) to achieve a propagation delay of 7.6 ns. 14 ÎVÎCC =Î ±5Î V Î A The TL3016 is a pin-for-pin functional replace- m 13 – ment for the LT1016 comparator, offering higher nt 12 speed operation but consuming half the power. re r u C 11 AVAILABLE OPTIONS ply p 10 PACKAGED DEVICES u TA OSUMTLAILNLE† T(SPSWO)P FCCO(HHRYII)MPP‡ sitive S 9 (D) o 8 P 0°C to 70°C TL3016CD TL3016CPWLE TL3016Y – C 7 C –40°C to 85°C TL3016ID TL3016IPWLE — I †The PW packages are available left-ended taped and reeled only. 6 ‡Chip forms are tested at TA = 25°C only. 5 – 50 – 25 0 25 50 75 100 125 TA – Free-Air Temperature – °C Figure 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright  2000, Texas Instruments Incorporated Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1

TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000 TL3016Y chip information This chip displays characteristics similar to the TL3016C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS VCC+ (5) (1) LATCH ENABLE (1) (1) (8) (2) (8) (1) IN+ + Q OUT (3) IN– – (7) Q OUT (7) (4) (2) (6) VCC– GND 55 (6) CHIP THICKNESS: 10 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM (3) (6) TJ max = 150°C TOLERANCES ARE ±10%. (4) (5) (6) ALL DIMENSIONS ARE IN MILS. TERMINALS 1 AND 6 CAN BE CONNECTED TO MULTIPLE PADS. 63 COMPONENT COUNT Bipolars 53 MOSFETs 49 Resistors 46 Capacitors 14 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 7 V to 7 V DD Differential input voltage, V (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V ID Input voltage range, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V I Input voltage, VI (LATCH ENABLE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA O Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating free-air temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 85°C A Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C stg Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C †Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to network ground. 2. Differential voltages are at IN+ with respect to IN–. DISSIPATION RATING TABLE TA ≤ 25°C DERATING FACTOR TA = 70°C PACKAGE POWER RATING ABOVE TA = 25°C POWER RATING D 725 mW 5.8 mW/°C 464 mW PW 525 mW 4.2 mW/°C 336 mW POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3

TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000 electrical characteristics at specified operating free-air temperature, V = ±5 V, V = 0 (unless DD LE otherwise noted) TL3016C TL3016I PPAARRAAMMEETTEERR TTEESSTT CCOONNDDIITTIIOONNSS†† UUNNIITT MIN TYP‡ MAX MIN TYP‡ MAX TA = 25°C 0.5 3 0.5 3 VVIIOO IInnppuutt ooffffsseett vvoollttaaggee mmVV TA = full range 3.5 3.5 Temperature coefficient of a VIO input offset voltage –4.8 –4.5 m V/°C TA = 25°C 0.1 0.6 0.1 0.6 IIIIOO IInnppuutt ooffffsseett ccuurrrreenntt mm AA TA = full range 0.9 1.3 TA = 25°C 6 10 6 10 IIIIBB IInnppuutt bbiiaass ccuurrrreenntt mm AA TA = full range 10 10 Common-mode input VDD = ±5 V –3.75 3.5 –3.75 3.5 VVIICCRR VV voltage range VDD = 5 V 1.25 3.5 1.25 3.5 Common-mode rejection CMRR ratio –3.75 ≤ VIC ≤ 3.5 V, TA = 25°C 80 97 80 97 dB Positive supply: 4.6 V ≤ +VDD ≤ 5.4 V, 60 72 60 72 Supplyy-voltagge rejjection TA = 25°C kkSSVVRR ddBB ratio Negative supply: –7 V ≤ –VDD ≤ –2 V, 80 100 80 100 TA = 25°C I(sink) = 4 mA, V+ ≤ 4.6 V, 500 600 500 600 TA = 25°C VVOOLL LLooww-lleevveell oouuttppuutt vvoollttaaggee mmVV I(sink) = 10 mA, V+ ≤ 4.6 V, 750 750 TA = 25°C V+ ≤ 4.6 V, IO = 1 mA, 3.6 3.9 3.6 3.9 TA = 25°C VVOOHH HHiigghh-lleevveell oouuttppuutt vvoollttaaggee VV V+ ≤ 4.6 V, IO = 10 mA, 3.4 3.7 3.4 3.7 TA = 25°C Positive supply current 10.6 12.5 10.6 12.5 IIDDDD TTAA == ffuullll rraannggee mmAA Negative supply current –1.8 –1.3 –2.4 –1.3 Low-level input voltage VIL (LATCH ENABLE) 0.8 0.8 V High-level input voltage VIH (LATCH ENABLE) 2 2 V Low-level input current VLE = 0 0 1 0 1 IIIILL mm AA (LATCH ENABLE) VLE = 2 V 24 39 24 45 †Full range for the TL3016C is TA = 0°C to 70°C. Full range for the TL3016I is TA = –40°C to 85°C. ‡All typical values are measures with TA = 25°C. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000 switching characteristics, V = ±5 V, V = 0 (unless otherwise noted) DD LE TL3016C TL3016I PPAARRAAMMEETTEERR TTEESSTT CCOONNDDIITTIIOONNSS†† UUNNIITT MIN TYP MAX MIN TYP MAX D VII = 100 mV,, TA = 25°C 7.8 10 7.8 10 VOD = 5 mV TA = full range 7.8 11.2 7.8 12.2 ttpdd11 PPrrooppaaggaattiioonn ddeellaay ttiimmee‡‡‡ nnss D VII = 100 mV,, TA = 25°C 7.6 10 7.6 10 VOD = 20 mV TA = full range 7.6 11.2 7.6 12.2 D VI = 100 mV, VOD = 5 mV, tsk(p) Pulse skew (|tpd+ – tpd–|) TA = 25°C 0.5 0.5 ns tsu Setup time, LATCH ENABLE 2.5 2.5 ns †Full range for the TL3016C is 0°C to 70°C. Full range for the TL3016I is –40°C to 85°C. ‡tpd1 cannot be measured in automatic handling equipment with low values of overdrive. The TL3016 is 100% tested with a 1-V step and 500-mV overdrive at TA = 25°C only. Correlation tests have shown that tpd1 limits given can be ensured with this test, if additional dc tests are performed to ensure that all internal bias conditions are correct. For low overdrive conditions, VOS is added to the overdrive. TYPICAL CHARACTERISTICS Table of Graphs FIGURE vs Input voltage 2 ICC Positive supply current vs Frequency 3 vs Free-air temperature 4 ICC Negative supply current vs Free-air temperature 5 vs Overdrive voltage 6 vs Supply voltage 7 tpd Propagation delay time vs Input impedance 8 vs Load capacitance 9 vs Free-air temperature 10 VIC Common-mode input voltage vs Free-air temperature 11 Input threshold voltage (LATCH ENABLE) vs Free-air temperature 12 vs Output source current 13 VVOO OOuuttppuutt vvoollttaaggee vs Output sink current 14 II Input current (LATCH ENABLE) vs Input voltage 15 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5

TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000 TYPICAL CHARACTERISTICS POSITIVE SUPPLY CURRENT POSITIVE SUPPLY CURRENT vs vs INPUT VOLTAGE FREQUENCY ÎÎÎÎ ÎÎÎÎÎ 20 22 A 18 ÎÎVTACÎÎ C= =25 Îα°C5 VÎÎ 20ÎÎVTÎÎAC C= ÎÎ=25 ±°C5ÎÎ V ÎÎ m A ent – 1164 TA = 85°C nt – m 18 r e upply Cur 1120 TA = 25°C pply Curr 16 TA = 25°TCA = 85°C S u ve 8 e S 14 Positi 6 TA = –40°C ositiv 12 – C – P C 4 C TA = –40°C I IC 10 2 8 0 1 2 3 4 5 6 7 8 0 101 102 VI – Input Voltage – V f – Frequency – MHz Figure 2 Figure 3 POSITIVE SUPPLY CURRENT NEGATIVE SUPPLY CURRENT vs vs FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE 15 0 ÎÎÎÎÎ ÎÎÎÎÎ 14 VCC = ±5 V ÎÎVCCÎ = ±Î5 VÎ A A m – 0.5 nt – m 1132 ent – e r rr ur – 1 u C ply C 11 pply p 10 u – 1.5 u S sitive S 9 gative – 2 Po 8 Ne – – C 7 C C C – 2.5 I I 6 5 – 3 – 50 – 25 0 25 50 75 100 125 – 50 – 25 0 25 50 75 100 125 TA – Free-Air Temperature – °C TA – Free-Air Temperature – °C Figure 4 Figure 5 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000 TYPICAL CHARACTERISTICS PROPAGATION DELAY TIME PROPAGATION DELAY TIME vs vs OVERDRIVE VOLTAGE SUPPLY VOLTAGE ÎÎÎÎÎ ÎÎÎÎÎ 10 12 ÎÎVCCÎ = ±Î5 VÎ ÎÎVCCÎ = ±Î5 VÎ 9 TA = 25°C TA = 25°C ÎÎÎÎÎ ÎÎÎÎÎ s s 10 n 8 n – – me 7 me Falling Edge Ti Ti 8 y y ela 6 ela Rising Edge D D n 5 n 6 o o ati ati g 4 g a a p p o o 4 Pr 3 Pr – – d 2 d p p t t 2 1 0 0 0 10 20 30 40 50 4.4 4.6 4.8 5 5.2 5.4 5.6 Overdrive Voltage – mV VCC – Supply Voltage – V Figure 6 Figure 7 PROPAGATION DELAY TIME PROPAGATION DELAY TIME vs vs INPUT IMPEDANCE LOAD CAPACITANCE 20 10 ÎÎÎÎÎ ÎÎÎÎÎ 18ÎVTÎAC C= Î=25 ±°C5Î V Î 9ÎÎVTAC C=Î =25 ±°ÎC5 VÎtPDHL Delay Time – ns 111462 5 mV Delay Time – ns 786 tPDLH – Propagation 1860 20 mV – Propagation 543 pd 4 pd 2 t t 2 1 0 0 0 50 100 150 200 250 300 0 10 20 30 40 50 ZO – Input Impedance – W CL – Load Capacitance – pF Figure 8 Figure 9 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7

TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000 TYPICAL CHARACTERISTICS PROPAGATION DELAY TIME COMMON-MODE INPUT VOLTAGE vs vs FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE ÎÎÎÎÎ 25 6 ÎVÎCC =Î ±5Î V Î ÎÎVCCÎ = 5Î V (UÎppeÎr LimÎit)Î – ns 20 ge – V 4 ÎÎVCCÎ = ±Î5 V Î(UppÎer LÎimiÎt) e a Tim Volt 2 elay 15 nput ation D Mode I 0 ÎÎÎÎVCCÎÎ = 5ÎÎ V (LÎÎoweÎÎr LimÎÎit)ÎÎ pag 10 Rising Edge on- o m –2 Pr Falling Edge m – Co d 5 – p C –4 t VI ÎÎÎÎÎÎÎÎ ÎVÎCCÎ = ±Î5 V (ÎLowÎer LÎimitÎ) 0 –6 – 50 – 25 0 25 50 75 100 125 – 50 – 25 0 25 50 75 100 125 TA – Free-Air Temperature – °C TA – Free-Air Temperature – °C Figure 10 Figure 11 INPUT THRESHOLD VOLTAGE (LATCH ENABLE) OUTPUT VOLTAGE vs vs FREE-AIR TEMPERATURE OUTPUT SOURCE CURRENT V 2 5 BLE) – 1.8 ÎVCÎC = α5 VÎ 4.8 ÎÎÎÎVTAC C=ÎÎ =25 ±ÎΰC5 VÎÎ A N 1.6 4.6 E H V ATC 1.4 ge – 4.4 TA = 85°C TA = 25°C L 1.2 a 4.2 e ( olt g V hold Volta 0.18 – Output 3.48 TA = –40°C es 0.6 O 3.6 r V h T ut 0.4 3.4 p – In 0.2 3.2 T VI 0 3 –50 –25 0 25 50 75 100 125 150 0 5 10 15 20 TA – Free-Air Temperature – °C IO(source) – Output Source Current – mA Figure 12 Figure 13 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE INPUT CURRENT (LATCH ENABLE) vs vs OUTPUT SINK CURRENT INPUT VOLTAGE ÎÎÎÎÎ ÎÎÎÎÎ 2 30 ÎVÎCC Î= ±5Î V Î ÎÎVCCÎ = ±Î5 VÎ 1.8 ÎTÎA = Î25°CÎÎ A 25ÎÎTA Î= 25ΰC Î 1.6 m– E) 20 – V 1.4 ABL 15 e N oltag 1.2 CH E 10 Output V 0.18 TA = –40°C TA = 25°C ent (LAT 50 – rr O 0.6 TA = 85°C Cu – 5 V ut 0.4 np – 10 – I 0.2 II – 15 0 – 20 0 5 10 15 20 – 0.5 0 0.5 1 1.5 2 IO(sink) – Output Sink Current – mA VI – Input Voltage – V Figure 14 Figure 15 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TL3016CD ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 3016C & no Sb/Br) TL3016CDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 3016C & no Sb/Br) TL3016CDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 3016C & no Sb/Br) TL3016CPW ACTIVE TSSOP PW 8 150 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 T3016 & no Sb/Br) TL3016CPWR ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 T3016 & no Sb/Br) TL3016ID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 3016I & no Sb/Br) TL3016IDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 3016I & no Sb/Br) TL3016IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 3016I & no Sb/Br) TL3016IPW ACTIVE TSSOP PW 8 150 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 Z3016 & no Sb/Br) TL3016IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 Z3016 & no Sb/Br) TL3016IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 Z3016 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 26-Feb-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TL3016CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL3016CPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TL3016IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL3016IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 26-Feb-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TL3016CDR SOIC D 8 2500 350.0 350.0 43.0 TL3016CPWR TSSOP PW 8 2000 367.0 367.0 35.0 TL3016IDR SOIC D 8 2500 350.0 350.0 43.0 TL3016IPWR TSSOP PW 8 2000 367.0 367.0 35.0 PackMaterials-Page2

PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

PACKAGE OUTLINE PW0008A TSSOP - 1.2 mm max height SCALE 2.800 SMALL OUTLINE PACKAGE C 6.6 TYP SEATING PLANE 6.2 PIN 1 ID A 0.1 C AREA 6X 0.65 8 1 3.1 2X 2.9 NOTE 3 1.95 4 5 0.30 8X 0.19 4.5 1.2 MAX B 0.1 C A B 4.3 NOTE 4 (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15 0.75 0 - 8 0.05 0.50 DETAIL A TYPICAL 4221848/A 02/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) 8X (0.45) SYMM (R0.05) 1 TYP 8 SYMM 6X (0.65) 5 4 (5.8) LAND PATTERN EXAMPLE SCALE:10X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS NOT TO SCALE 4221848/A 02/2015 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) SYMM (R0.05) TYP 8X (0.45) 1 8 SYMM 6X (0.65) 5 4 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X 4221848/A 02/2015 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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