Product Sample & Technical Tools & Support & Folder Buy Documents Software Community TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 SLVS038I–JANUARY1989–REVISEDJULY2016 TLx84x Current-Mode PWM Controllers 1 Features 3 Description • OptimizedforOff-LineandDC-to-DCConverters The TL284x and TL384x series of control integrated 1 circuits provide the features that are necessary to • LowStart-UpCurrent(<1mA) implement off-line or DC-to-DC fixed-frequency • AutomaticFeed-forwardcompensation current-mode control schemes, with a minimum • Pulse-by-PulseCurrentLimiting number of external components. Some of the internally implemented circuits are an undervoltage • EnhancedLoad-ResponseCharacteristics lockout (UVLO), featuring a start-up current of less • UndervoltageLockoutWithHysteresis than 1 mA, and a precision reference trimmed for • Double-PulseSuppression accuracy at the error amplifier input. Other internal circuits include logic to ensure latched operation, a • High-CurrentTotem-PoleOutput pulse-width modulation (PWM) comparator (that also • InternallyTrimmedBandgapReference provides current-limit control), and a totem-pole • 500-kHzOperation output stage designed to source or sink high-peak • ErrorAmplifierWithLowOutputResistance current. The output stage, suitable for driving N- channelMOSFETs,islowwhenitisintheoffstate. • DesignedtobeInterchangeablewithUC2842and UC3842Series DeviceInformation(1) 2 Applications PARTNUMBER PACKAGE BODYSIZE(NOM) SOIC(8) 4.90mm×3.91mm • Switchingregulatorsofanypolarity TLx84x SOIC(14) 8.65mm×3.91mm • Transformer-coupledDC/DCconvertors PDIP(8) 9.81mm×6.35mm (1) For all available packages, see the orderable addendum at theendofthedatasheet. DevicePinoutDrawingSOIC(14) DevicePinoutDrawingSOICorPDIP(8) COMP 1 14 REF COMP 1 8 REF NC 2 13 NC VFB 2 7 VCC VFB 3 12 VCC ISENSE 3 6 OUTPUT NC 4 11 VC RT/CT 4 5 GND ISENSE 5 10 OUTPUT NC 6 9 GND Not to scale RT/CT 7 8 POWER_GROUND NC—Nointernalconnection Not to scale 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 SLVS038I–JANUARY1989–REVISEDJULY2016 www.ti.com Table of Contents 1 Features.................................................................. 1 7.4 DeviceFunctionalModes..........................................9 2 Applications........................................................... 1 8 ApplicationandImplementation........................ 10 3 Description............................................................. 1 8.1 TypicalApplication..................................................10 4 RevisionHistory..................................................... 2 9 PowerSupplyRecommendations...................... 12 5 PinConfigurationandFunctions......................... 3 10 Layout................................................................... 13 6 Specifications......................................................... 4 10.1 LayoutGuidelines.................................................13 6.1 AbsoluteMaximumRatings......................................4 10.2 LayoutExample....................................................14 6.2 ESDRatings..............................................................4 11 DeviceandDocumentationSupport................. 15 6.3 RecommendedOperatingConditions.......................4 11.1 ReceivingNotificationofDocumentationUpdates15 6.4 ThermalInformation..................................................4 11.2 RelatedLinks........................................................15 6.5 ElectricalCharacteristics...........................................5 11.3 CommunityResources..........................................15 6.6 TypicalCharacteristics..............................................6 11.4 Trademarks...........................................................15 7 DetailedDescription.............................................. 8 11.5 ElectrostaticDischargeCaution............................15 7.1 Overview...................................................................8 11.6 Glossary................................................................15 7.2 FunctionalBlockDiagram.........................................8 12 Mechanical,Packaging,andOrderable Information........................................................... 15 7.3 FeatureDescription...................................................8 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionH(January2015)toRevisionI Page • Updatedpinoutimages........................................................................................................................................................... 3 • ChangedTL984xtoTL384xinRecommendedOperatingConditions................................................................................... 4 • ChangedTLx842,TLx844toTLx842,TLx843andTLx843,TLx845toTLx844,TLx845inPulse-Width-Modulator Section.................................................................................................................................................................................... 6 • AddedReceivingNotificationofDocumentationUpdatessectionandCommunityResourcessection.............................. 15 ChangesfromRevisionG(February2008)toRevisionH Page • AddedApplications,DeviceInformationtable,PinFunctionstable,ESDRatingstable,ThermalInformationtable, TypicalCharacteristics,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection.................................................................................................. 1 • DeletedOrderingInformationtable........................................................................................................................................ 1 2 SubmitDocumentationFeedback Copyright©1989–2016,TexasInstrumentsIncorporated ProductFolderLinks:TL2842 TL2843 TL2844 TL2845TL3842 TL3843 TL3844 TL3845

TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 www.ti.com SLVS038I–JANUARY1989–REVISEDJULY2016 5 Pin Configuration and Functions DPackage 14-PinSOIC DorPPackage TopView 8-PinSOICorPDIP TopView COMP 1 14 REF COMP 1 8 REF NC 2 13 NC VFB 2 7 VCC VFB 3 12 VCC ISENSE 3 6 OUTPUT NC 4 11 VC RT/CT 4 5 GND ISENSE 5 10 OUTPUT NC 6 9 GND Not to scale RT/CT 7 8 POWER_GROUND NC—Nointernalconnection Not to scale PinFunctions PIN TYPE DESCRIPTION NAME D DorP COMP 1 1 I/O Erroramplifiercompensationpin GND 9 5 — Devicepowersupplygroundterminal ISENSE 5 3 I Currentsensecomparatorinput NC 2,4,6,13 — — Donotconnect OUTPUT 10 6 O PWMOutput POWER 8 — — OutputPWMgroundterminal GROUND REF 14 8 O Oscillatorvoltagereference RT/CT 7 4 I/O OscillatorRCinput VC 11 — — OutputPWMpositivevoltagesupply V 12 7 — Devicepositivevoltagesupply CC VFB 3 2 I Erroramplifierinput Copyright©1989–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:TL2842 TL2843 TL2844 TL2845TL3842 TL3843 TL3844 TL3845

TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 SLVS038I–JANUARY1989–REVISEDJULY2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V SupplyVoltage(2) Selflimiting — CC V Analoginputvoltagerange,VFBandISENSE –0.3 6.3 V I V OutputVoltage 35 V O V InputVoltage,VCandDPackageonly 35 V I I Supplycurrent 30 mA CC I Outputcurrent ±1 A O erroramplifieroutputsinkcurrent 10 mA T Virtualjunctiontemperature 150 °C J Outputenergy(capacitiveload) 5 µJ T Storagetemperature –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagesarewithrespecttothedeviceGNDpin. 6.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001,allpins(1) 3000 V(ESD) Electrostaticdischarge Chargeddevicemodel(CDM),perJEDECspecificationJESD22-C101,allpins(2) 3000 V (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN TYP MAX UNIT V andVC(1) SupplyVoltage 30 V CC V,RT/CT InputVoltage 0 5.5 V I V,VFBandISENSE InputVoltage 0 5.5 V I V ,OUTPUT Outputvoltage 0 30 V O V ,POWER GOROUND(1) Outputvoltage –0.1 1 V I Supplycurrent,externallylimited 25 mA CC I Averageoutputcurrent 200 mA O I Referenceoutputcurrent –20 mA O(ref) f Oscillatorfrequency 100 500 kHz OSC TL284x –40 85 T Operatingfree-airtemperature °C A TL384x 0 70 (1) TheserecommendedvoltagesforVCandPOWERGROUNDapplyonlytotheDpackage. 6.4 Thermal Information TLx84x THERMALMETRIC(1) D(SOIC) D(SOIC) P(PDIP) UNIT 8PINS 14PINS 8PINS R Junction-to-ambientthermalresistance 97 86 85 °C/W θJA (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. 4 SubmitDocumentationFeedback Copyright©1989–2016,TexasInstrumentsIncorporated ProductFolderLinks:TL2842 TL2843 TL2844 TL2845TL3842 TL3843 TL3844 TL3845

TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 www.ti.com SLVS038I–JANUARY1989–REVISEDJULY2016 6.5 Electrical Characteristics overoperatingfree-airtemperaturerange,V =15V(1),R =10kΩ,C =3.3nF(unlessotherwisenoted) CC T T TL284x TL384x PARAMETER TESTCONDITIONS(2) UNIT MIN TYP(2) MAX MIN TYP(2) MAX ReferenceSection Outputvoltage IO=1mA,TA=25°C 4.95 5 5.05 4.9 5 5.1 V Lineregulation VCC=12Vto25V 6 20 6 20 mV Loadregulation IO=1mAto20mA 6 25 6 25 mV Temperaturecoefficientofoutputvoltage 0.2 0.4 0.2 0.4 mV/°C Outputvoltagewithworst-casevariation VCC=12Vto25V,IO=1 4.9 5.1 4.82 5.18 V mAto20mA Outputnoisevoltage f=10Hzto10kHz,TA= 50 50 µV 25°C Output-voltagelong-termdrift After1000hatTA=25°C 5 25 5 25 mV Short-circuitoutputcurrent –30 –100 –180 –30 –100 –180 mA OscillatorSection Oscillatorfrequency(3) TA=25°C 47 52 57 47 52 57 kHz Frequencychangewithsupplyvoltage VCC=12Vto25V 2 10 2 10 Hz/kHz Frequencychangewithtemperature 50 50 Hz/kHz peak-to-peakamplitudeatRT/CT 1.7 1.7 V Error-AmplifierSection Feedbackinputvoltage COMPat2.5V 2.45 2.50 2.55 2.42 2.50 2.58 V Inputbiascurrent –0.3 –1 –0.3 –2 µA Open-loopvoltageamplification VO=2Vto4V 65 90 65 90 dB Gain-bandwidthproduct 0.7 1 0.7 1 MHz Supply-voltagerejectionratio VCC=12Vto25V 60 70 60 70 dB VFB,at2.7V,COMPat1.1 Outputsinkcurrent 2 6 2 6 mA V Outputsourcecurrent VFB,at2.3V,COMPat5V –0.5 –0.8 –0.5 –0.8 mA Hihg-leveloutputvoltage VFB,at2.3V,RL=15kΩto 5 6 5 6 V GND Low-leveloutputvoltage VFB,at2.7V,RL=15kΩto 0.7 1.1 0.7 1.1 V GND Current-senseSection Voltageamplification See(4)(5) 2.85 3 3.13 2.85 3 3.15 V/V Current-sensecomparatorthreshold COMPat5V,see(4) 0.9 1 1.1 0.9 1 1.1 V Supply-voltagerejectionratio VCC=12Vto25V,see(4) 70 70 dB Inputbiascurrent –2 –10 –2 –10 µA Delaytimetooutput 150 300 150 300 ns OutputSection IOH=–20mA 13 13.5 13 13.5 High-leveloutputvoltage V IOH=–200mA 12 13.5 13 13.5 IOH=20mA 0.1 0.4 0.1 0.4 Low-leveloutputvoltage V IOH=200mA 1.5 2.2 1.5 2.2 Risetime CL=1nF,TA=25°C 50 150 50 150 ns falltime CL=1nF,TA=25°C 50 150 50 150 ns Undervoltage-LockoutSection TLx842,TLx844 15 16 17 14.5 16 17.5 Startthresholdvoltage V TLx843,TLx845 7.8 8.4 9 7.8 8.4 9 (1) AdjustV abovethestartthresholdbeforesettingitto15V. CC (2) AlltypicalvaluesareatTA=25°C. (3) OutputfrequencyequalsoscillatorfrequencyfortheTLx842andTLx843.Outputfrequencyisone-halftheoscillatorfrequencyforthe TLx844andTLx845. (4) Theseparametersaremeasuredatthetrippointofthelatch,withVFBat0V. (5) VoltageamplificationismeasuredbetweenISENSEandCOMP,withtheinputchangingfrom0Vto0.8V. Copyright©1989–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:TL2842 TL2843 TL2844 TL2845TL3842 TL3843 TL3844 TL3845

TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 SLVS038I–JANUARY1989–REVISEDJULY2016 www.ti.com Electrical Characteristics (continued) overoperatingfree-airtemperaturerange,V =15V(1),R =10kΩ,C =3.3nF(unlessotherwisenoted) CC T T TL284x TL384x PARAMETER TESTCONDITIONS(2) UNIT MIN TYP(2) MAX MIN TYP(2) MAX Minimumoperatingvoltage TLx842,TLx844 9 10 11 8.5 10 11.5 V afterstartup TLx843,TLx845 7 7.6 8.2 7 7.6 8.02 Pulse-Width-ModulatorSection TLx842,TLx843 95% 97% 100% 95% 97% 100% Maximumdutycycle TLx844,TLx845 46% 48% 50% 46% 48% 50% Minimumdutycycle 0% 0% SupplyVoltage Start-upcurrent 0.5 1 0.5 1 mA Operatingsupplycurrent VFBandISENSEat0V 11 17 11 17 mA Limitingvoltage ICC=25mA 34 34 V 6.6 Typical Characteristics 9.2 1.2 9 old (A) 1 8.8 h s e A) 8.6 Thr 0.8 I (mDISCHARGE 88..248 nt Sense Input 00..46 e 7.8 urr C 0.2 Ta = 125 C 7.6 , H Ta = 25 C VT Ta = -55 C 7.4 0 -75 -50 -25 0 25 50 75 100 125 150 0 2 4 6 8 Temperature (C) D001 VO, Error Amp Output Voltage (V) D002 Figure1.OscillatorDischargeCurrent Figure2.CurrentSenseInputThreshold vs vs TemperatureforV =15VandV =2V ErrorAmplifierOutputVoltageforV =15V IN OSC IN 100 200 100 Gain %) 80 Phase 150 e ( 90 cl y C 60 100 uty 80 D Gain (dB) 40 50 m Output 70 20 0 mu 60 xi a M 0 -50 , X 50 A M D -20 -100 40 10 100 1000 10000 100000 1000000 1E+7 0.1 0.2 0.3 0.5 0.7 1 2 3 4 5 678 10 Freq (Hz) D003 RT, Timing Resistor (kOhm) D004 Figure3.ErrorAmplifierOpen-LoopGainandPhase Figure4.MaxOutputDutyCycle vs vs FrequencyV =15V,R =100kΩ,andT =25°C TimingResistorforV =15,C =3.3nF,T =25°C CC L A CC T A 6 SubmitDocumentationFeedback Copyright©1989–2016,TexasInstrumentsIncorporated ProductFolderLinks:TL2842 TL2843 TL2844 TL2845TL3842 TL3843 TL3844 TL3845

TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 www.ti.com SLVS038I–JANUARY1989–REVISEDJULY2016 Typical Characteristics (continued) 0 10 180 -1 9 160 age (V) --32 78 ge (V) 140 Saturation Volt ---654 SSSSooiinnuukkrr ccSSeeaa ttSSuuaarraattuuttiirrooaannttii ooaanntt -2aa55tt5 2-C 5C55 C C 456 aturation Volta I (mA)SC 110200 ce -7 3 k S 80 our -8 2 Sin S 60 -9 1 -10 0 40 0 100 200 300 400 500 600 700 800 -75 -50 -25 0 25 50 75 100 125 150 IO, Output Load Current (mA) D005 Temperature (C) D006 Figure5.OutputSaturationVoltage Figure6.ReferenceShortCircuitCurrent vs vs LoadCurrentforV =15Vwith5-msInputPulses TemperatureforV =15V CC IN 0 5.2 Ta = 125 C Ta = 25 C 5.15 V) -10 Ta = -40 C m a ( 5.1 Delt -20 5.05 Voltage -30 V (V)REF 5 e 4.95 nc -40 e er 4.9 ef R -50 4.85 -60 4.8 0 20 40 60 80 100 120 140 160 -75 -50 -25 0 25 50 75 100 125 150 Source Current (mA) Temperature (C) D007 D008 Figure7.ReferenceVoltagevsSourceCurrent Figure8.ReferenceVoltagevsTemperature Figure9.DeadTimevsTimingCapacitance Figure10.TimingResistancevsFrequency Copyright©1989–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:TL2842 TL2843 TL2844 TL2845TL3842 TL3843 TL3844 TL3845

TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 SLVS038I–JANUARY1989–REVISEDJULY2016 www.ti.com 7 Detailed Description 7.1 Overview TheTL284xandTL384xseriesofcontrolintegratedcircuitsprovidethefeaturesthatarenecessarytoimplement off-line or DC-to-DC fixed-frequency current-mode control schemes, with a minimum number of external components. Some of the internally implemented circuits are an undervoltage lockout (UVLO), featuring a start- up current of less than 1 mA, and a precision reference trimmed for accuracy at the error amplifier input. Other internal circuits include logic to ensure latched operation, a pulse-width modulation (PWM) comparator (that also provides current-limit control), and a totem-pole output stage designed to source or sink high-peak current. The outputstage,suitablefordrivingN-channelMOSFETs,islowwhenitisintheoffstate. Major differences between members of these series are the UVLO thresholds and maximum duty-cycle ranges. Typical UVLO thresholds of 16 V (on) and 10 V (off) on the TLx842 and TLx844 devices make them ideally suited to off-line applications. The corresponding typical thresholds for the TLx843 and TLx845 devices are 8.4 V (on) and 7.6 V (off). The TLx842 and TLx843 devices can operate to duty cycles approaching 100%. A duty- cycle range of 0 to 50% is obtained by the TLx844 and TLx845 by the addition of an internal toggle flip-flop, whichblankstheoutputoffeveryotherclockcycle. The TL284x-series devices are characterized for operation from −40°C to +85°C. The TL384x devices are characterizedforoperationfrom0°Cto70°C. 7.2 Functional Block Diagram A A. Thetoggleflip-flopispresentonlyinTL2844,TL2845,TL3844,andTL3845.PinnumbersshownarefortheD(14- pin)package. 7.3 Feature Description 7.3.1 Pulse-by-PulseCurrentLimiting Pulse-by-pulse limiting is inherent in the control scheme. An upper limit on the peak current can be established by simply clamping the error voltage. Accurate current limiting allows optimization of magnetic and power semiconductorelementswhileensuringreliablesupplyoperation 8 SubmitDocumentationFeedback Copyright©1989–2016,TexasInstrumentsIncorporated ProductFolderLinks:TL2842 TL2843 TL2844 TL2845TL3842 TL3843 TL3844 TL3845

TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 www.ti.com SLVS038I–JANUARY1989–REVISEDJULY2016 Feature Description (continued) 7.3.2 ErrorAmplifierWithLowOutputResistance With a low output resistance, various impedance networks may be used on the compensation pin input for error amplifierfeedback. 7.3.3 High-CurrentTotem-PoleOutput TheoutputoftheTLx84xdevicescansinkorsourceupto1Aofcurrent. 7.4 Device Functional Modes 7.4.1 ShutdownTechnique The PWM controller (see Figure 11) can be shut down by two methods: either raise the voltage at ISENSE above 1 V or pull the COMP terminal below a voltage two diode drops above ground. Either method causes the output of the PWM comparator to be high (see Functional Block Diagram). The PWM latch is reset dominant so that the output remains low until the next clock cycle after the shutdown condition at the COMP or ISENSE terminal is removed. In one example, an externally latched shutdown can be accomplished by adding an SCR that resets by cycling VCC below the lower UVLO threshold. At this point, the reference turns off, allowing the SCRtoreset. Figure11. ShutdownTechniques 7.4.2 SlopeCompensation A fraction of the oscillator ramp can be summed resistively with the current-sense signal to provide slope compensationforconvertersrequiringdutycyclesover50%(seeFigure12). NOTE CapacitorCformsafilterwithR2tosuppresstheleading-edgeswitchspikes. Figure12. SlopeCompensation Copyright©1989–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:TL2842 TL2843 TL2844 TL2845TL3842 TL3843 TL3844 TL3845

TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 SLVS038I–JANUARY1989–REVISEDJULY2016 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 8.1 Typical Application The following application is an open-loop laboratory test fixture. This circuit demonstrates the setup and use of theTL284xandTL384xdevicesandtheirinternalcircuitry. In the open-loop laboratory test fixture (see Figure 13), high peak currents associated with loads necessitate careful grounding techniques. Timing and bypass capacitors should be connected close to the GND terminal in a single-point ground. The transistor and 5-kΩ potentiometer sample the oscillator waveform and apply an adjustableramptotheISENSEterminal. Figure13. Open-LoopLaboratoryTestFixture 8.1.1 DesignRequirements ThedesigntechniquesinthefollowingsectionsmaybeusedforpowersupplyPWMapplicationswhichfallwithin thefollowingrequirements. • 500-kHzorloweroperation • 30-Vorlessoutputvoltage • 200-mAorlessoutputcurrent 10 SubmitDocumentationFeedback Copyright©1989–2016,TexasInstrumentsIncorporated ProductFolderLinks:TL2842 TL2843 TL2844 TL2845TL3842 TL3843 TL3844 TL3845

TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 www.ti.com SLVS038I–JANUARY1989–REVISEDJULY2016 Typical Application (continued) 8.1.2 DetailedDesignProcedure 8.1.2.1 Current-SenseCircuit 1V I = A. Peak current (IS) is determined by the formula: S(max) RS A small RC filter formed by resistor Rf and capacitor Cf mayberequiredtosuppressswitchtransients. Figure14. Current-SenseCircuitSchematic 8.1.2.2 Error-AmplifierConfiguration A. Erroramplifiercansourceorsinkupto0.5mA. Figure15. Error-AmplifierConfigurationSchematic 8.1.2.3 OscillatorSection 1.72 f» A. ForRT>5kΩ: RTCT Figure16. OscillatorSectionSchematic Copyright©1989–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:TL2842 TL2843 TL2844 TL2845TL3842 TL3843 TL3844 TL3845

TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 SLVS038I–JANUARY1989–REVISEDJULY2016 www.ti.com Typical Application (continued) 8.1.3 ApplicationCurve Theapplicationcurveshowsoscillatorcharacteristicsforchosencapacitorandresistorvalues. 25 TL2845 where VCC is swept 37 V to 0 V TL2845 where VCC is swept 0 V to 37 V 20 TL2842 where VCC is swept 37 V to 0 V A) TL2842 where VCC is swept 0 V to 37 V m ent ( 15 urr C y ppl 10 u S , C C I 5 0 0 5 10 15 20 25 30 35 40 VCC, Supply Voltage (V) D009 Figure17.SupplyCurrentvsSupplyVoltage 9 Power Supply Recommendations See Recommended Operating Conditions for the recommended power supply voltages for the TL284x and TL384x devices. TI also recommends to have a decoupling capacitor on the output of the device's power supply tolimitnoiseonthedeviceinput. 12 SubmitDocumentationFeedback Copyright©1989–2016,TexasInstrumentsIncorporated ProductFolderLinks:TL2842 TL2843 TL2844 TL2845TL3842 TL3843 TL3844 TL3845

TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 www.ti.com SLVS038I–JANUARY1989–REVISEDJULY2016 10 Layout 10.1 Layout Guidelines Always try to use a low EMI inductor with a ferrite type closed core. Some examples would be toroid and encased E core inductors. Open core can be used if they have low EMI characteristics and are located a bit moreawayfromthelowpowertracesandcomponents.MakethepolesperpendiculartothePCBaswellifusing anopencore.Stickcoresusuallyemitthemostunwantednoise. 10.1.1 FeedbackTraces Try to run the feedback trace as far from the inductor and noisy power traces as possible. Also, keep the feedback trace to be as direct as possible and somewhat thick. These two sometimes involve a trade-off, but keepingitawayfrominductorEMIandothernoisesourcesisthemorecriticalofthetwo.Runthefeedbacktrace onthesideofthePCBoppositeoftheinductorwithagroundplaneseparatingthetwo. 10.1.2 Input/OutputCapacitors When using a low value ceramic input filter capacitor, it should be located as close to the V pin of the IC as CC possible. This will eliminate as much trace inductance effects as possible and give the internal IC rail a cleaner voltage supply. Some designs require the use of a feed-forward capacitor connected from the output to the feedback pin as well, usually for stability reasons. In this case it should also be positioned as close to the IC as possible. Using surface mount capacitors also reduces lead length and lessens the chance of noise coupling into theeffectiveantennacreatedbythrough-holecomponents. 10.1.3 CompensationComponents External compensation components for stability should also be placed close to the IC. Surface mount components are recommended here as well for the same reasons discussed for the filter capacitors. These shouldnotbelocatedveryclosetotheinductoreither. 10.1.4 TracesandGroundPlanes Make all of the power (high current) traces as short, direct, and thick as possible. It is good practice on a standard PCB board to make the traces an absolute minimum of 15 mils (0.381 mm) per Ampere. The inductor, output capacitors, and output diode should be as close to each other possible. This helps reduce the EMI radiated by the power traces due to the high switching currents through them. This will also reduce lead inductance and resistance as well, which in turn reduces noise spikes, ringing, and resistive losses that produce voltageerrors. The grounds of the IC, input capacitors, output capacitors, and output diode (if applicable) should be connected close together directly to a ground plane. It would also be a good idea to have a ground plane on both sides of the PCB. This will reduce noise as well by reducing ground loop errors as well as by absorbing more of the EMI radiated by the inductor. For multi-layer boards with more than two layers, a ground plane can be used to separate the power plane (where the power traces and components are) and the signal plane (where the feedback and compensation and components are) for improved performance. On multi-layer boards the use of vias will be required to connect traces and different planes. It is good practice to use one standard via per 200 mAofcurrentifthetracewillneedtoconductasignificantamountofcurrentfromoneplanetotheother. Arrange the components so that the switching current loops curl in the same direction. Due to the way switching regulators operate, there are two power states. One state when the switch is on and one when the switch is off. During each state there will be a current loop made by the power components that are currently conducting. Place the power components so that during each of the two states the current loop is conducting in the same direction. This prevents magnetic field reversal caused by the traces between the two half-cycles and reduces radiatedEMI. Copyright©1989–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:TL2842 TL2843 TL2844 TL2845TL3842 TL3843 TL3844 TL3845

TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 SLVS038I–JANUARY1989–REVISEDJULY2016 www.ti.com 10.2 Layout Example LEGEND Power or GND Plane VIA to Power Plane V CC VIA to GND Plane 1 COMP REF 16 Error signal 2 VFB VCC 15 TLx84x Current Sense 3 ISENSE OUTPUT 14 Output 4 RT/CT GND 13 Figure18. LayoutofD-8orPPackageforTLx84xDevices 14 SubmitDocumentationFeedback Copyright©1989–2016,TexasInstrumentsIncorporated ProductFolderLinks:TL2842 TL2843 TL2844 TL2845TL3842 TL3843 TL3844 TL3845

TL2842,TL2843,TL2844,TL2845 TL3842,TL3843,TL3844,TL3845 www.ti.com SLVS038I–JANUARY1989–REVISEDJULY2016 11 Device and Documentation Support 11.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed.Forchangedetails,reviewtherevisionhistoryincludedinanyreviseddocument. 11.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table1.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY TL2842 Clickhere Clickhere Clickhere Clickhere Clickhere TL2843 Clickhere Clickhere Clickhere Clickhere Clickhere TL2844 Clickhere Clickhere Clickhere Clickhere Clickhere TL2845 Clickhere Clickhere Clickhere Clickhere Clickhere TL3842 Clickhere Clickhere Clickhere Clickhere Clickhere TL3843 Clickhere Clickhere Clickhere Clickhere Clickhere TL3844 Clickhere Clickhere Clickhere Clickhere Clickhere TL3845 Clickhere Clickhere Clickhere Clickhere Clickhere 11.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 11.4 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 11.5 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 11.6 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©1989–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:TL2842 TL2843 TL2844 TL2845TL3842 TL3843 TL3844 TL3845

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TL2842D ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 TL2842 & no Sb/Br) TL2842D-8 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 TL2842 & no Sb/Br) TL2842DR ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 TL2842 & no Sb/Br) TL2842DR-8 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 TL2842 & no Sb/Br) TL2842P ACTIVE PDIP P 8 50 Pb-Free NIPDAU N / A for Pkg Type -40 to 85 TL2842P (RoHS) TL2843D-8 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2843 & no Sb/Br) TL2843DG4-8 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2843 & no Sb/Br) TL2843DR ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2843 & no Sb/Br) TL2843DR-8 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2843 & no Sb/Br) TL2843DRE4 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2843 & no Sb/Br) TL2843DRG4-8 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2843 & no Sb/Br) TL2843P ACTIVE PDIP P 8 50 Pb-Free NIPDAU N / A for Pkg Type -40 to 85 TL2843P (RoHS) TL2844D ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2844 & no Sb/Br) TL2844D-8 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2844 & no Sb/Br) TL2844DR ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2844 & no Sb/Br) TL2844DR-8 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2844 & no Sb/Br) TL2844DRG4 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2844 & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TL2844P ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 TL2844P & no Sb/Br) TL2844PE4 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 TL2844P & no Sb/Br) TL2845D ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2845 & no Sb/Br) TL2845D-8 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2845 & no Sb/Br) TL2845DG4-8 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2845 & no Sb/Br) TL2845DR ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2845 & no Sb/Br) TL2845DR-8 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2845 & no Sb/Br) TL2845DRG4 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TL2845 & no Sb/Br) TL2845P ACTIVE PDIP P 8 50 Pb-Free NIPDAU N / A for Pkg Type -40 to 85 TL2845P (RoHS) TL3842D-8 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 TL3842 & no Sb/Br) TL3842DR ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 TL3842 & no Sb/Br) TL3842DR-8 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 TL3842 & no Sb/Br) TL3842DRE4-8 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR 0 to 70 TL3842 & no Sb/Br) TL3842P ACTIVE PDIP P 8 50 Pb-Free NIPDAU N / A for Pkg Type 0 to 70 TL3842P (RoHS) TL3842PE4 ACTIVE PDIP P 8 50 Pb-Free NIPDAU N / A for Pkg Type 0 to 70 TL3842P (RoHS) TL3843D ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 TL3843 & no Sb/Br) TL3843D-8 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 TL3843 & no Sb/Br) TL3843DR ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 TL3843 & no Sb/Br) Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TL3843DR-8 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 TL3843 & no Sb/Br) TL3843P ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 TL3843P & no Sb/Br) TL3844D ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 TL3844 & no Sb/Br) TL3844D-8 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 TL3844 & no Sb/Br) TL3844DR ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 TL3844 & no Sb/Br) TL3844DR-8 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 TL3844 & no Sb/Br) TL3844P ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 TL3844P & no Sb/Br) TL3844PE4 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 TL3844P & no Sb/Br) TL3845D ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 TL3845 & no Sb/Br) TL3845D-8 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 TL3845 & no Sb/Br) TL3845DR ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 TL3845 & no Sb/Br) TL3845DR-8 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 TL3845 & no Sb/Br) TL3845P ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 TL3845P & no Sb/Br) TL3845PE4 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 TL3845P & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 17-Jun-2016 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TL2842DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL2842DR-8 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL2843DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL2843DR-8 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL2844DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL2844DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL2844DR-8 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL2845DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL2845DR-8 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL3842DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL3842DR-8 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL3843DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL3843DR-8 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL3844DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL3844DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL3844DR-8 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL3845DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL3845DR-8 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 17-Jun-2016 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TL2842DR SOIC D 14 2500 367.0 367.0 38.0 TL2842DR-8 SOIC D 8 2500 340.5 338.1 20.6 TL2843DR SOIC D 14 2500 367.0 367.0 38.0 TL2843DR-8 SOIC D 8 2500 340.5 338.1 20.6 TL2844DR SOIC D 14 2500 367.0 367.0 38.0 TL2844DR SOIC D 14 2500 333.2 345.9 28.6 TL2844DR-8 SOIC D 8 2500 340.5 338.1 20.6 TL2845DR SOIC D 14 2500 367.0 367.0 38.0 TL2845DR-8 SOIC D 8 2500 340.5 338.1 20.6 TL3842DR SOIC D 14 2500 367.0 367.0 38.0 TL3842DR-8 SOIC D 8 2500 340.5 338.1 20.6 TL3843DR SOIC D 14 2500 367.0 367.0 38.0 TL3843DR-8 SOIC D 8 2500 340.5 338.1 20.6 TL3844DR SOIC D 14 2500 333.2 345.9 28.6 TL3844DR SOIC D 14 2500 367.0 367.0 38.0 TL3844DR-8 SOIC D 8 2500 340.5 338.1 20.6 TL3845DR SOIC D 14 2500 367.0 367.0 38.0 TL3845DR-8 SOIC D 8 2500 340.5 338.1 20.6 PackMaterials-Page2

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PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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