TJA1055 Enhanced fault-tolerant CAN transceiver Rev. 5 — 6 December 2013 Product data sheet 1. General description The TJA1055 is the interface between the protocol controller and the physical bus wires in a Controller Area Network (CAN). It is primarily intended for low-speed applications up to 125 kBd in passenger cars. The device provides differential receive and transmit capability but will switch to single-wire transmitter and/or receiver in error conditions. The TJA1055 is the enhanced version of the TJA1054 and TJA1054A. TJA1055 has the same functionality but in addition offering a number of improvements. The most important improvements of the TJA1055 with respect to the TJA1054 and TJA1054A are: • Improved ElectroStatic Discharge (ESD) performance • Lower current consumption in sleep mode • Wake-up signalling on RXD and ERR without V active CC • 3V interfacing with microcontroller possible with TJA1055T/3 2. Features and benefits 2.1 Optimized for in-car low-speed communication  Pin-to-pin compatible with TJA1054 and TJA1054A  Baud rate up to 125kBd  Up to 32nodes can be connected  Supports unshielded bus wires  Very low ElectroMagnetic Emission (EME) due to built-in slope control function and a very good matching of the CANL and CANH bus outputs  Very high ElectroMagnetic Immunity (EMI) in normal operating mode and in low power modes  Fully integrated receiver filters  Transmit Data (TxD) dominant time-out function  High ESD robustness: 8 kV Electrostatic Discharge (ESD) protection Human Body Model (HBM) for off-board pins 6 kV Electrostatic Discharge (ESD) protection IEC 61000-4-2 for off-board pins  Low-voltage microcontroller support 2.2 Bus failure management  Supports single-wire transmission modes with ground offset voltages up to1.5V  Automatic switching to single-wire mode in the event of bus failures, even when the CANH bus wire is short-circuited toV CC

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver  Automatic reset to differential mode if bus failure is removed  Full wake-up capability during failure modes 2.3 Protections  Bus pins short-circuit safe to battery and to ground  Thermally protected  Bus lines protected against transients in an automotive environment  An unpowered node does not disturb the bus lines  Microcontroller interface without reverse current paths, if unpowered 2.4 Support for low power modes  Low current sleep mode and standby mode with wake-up via the bus lines  Software accessible power-on reset flag 3. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V supply voltage 4.75 - 5.25 V CC V battery supply voltage no time limit 0.3 - +40 V BAT operating mode 5.0 - 40 V load dump - - 58 V I battery supply current sleep mode at - 25 40 A BAT V =V =V = RTL WAKE INH V =14V; T = BAT amb 40Cto+125C V voltage on pin CANH V 0V; V 0V; 58 - +58 V CANH CC BAT no time limit; with respect to any other pin V voltage on pin CANL V 0V; V 0V; 58 - +58 V CANL CC BAT no time limit; with respect to any other pin V dominant output voltage V =0V; V =V O(dom) TXD EN CC on pinCANH I =40mA V 1.4 - - V CANH CC on pinCANL I =40mA - - 1.4 V CANL t propagation delay TXD no failures; - - 1.5 s PD(L) (LOW) to RXD (LOW) R =R = CAN_L CAN_H 125; C = CAN_L C = 1nF; CAN_H seeFigure4 to Figure6 T virtual junction temperature [1] 40 - +150 C vj [1] Junction temperature in accordance with “IEC60747-1”. An alternative definition is: Tvj=Tamb+PRth(vj-a) where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation(P) and operating ambient temperature (T ). amb TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 2 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 4. Ordering information Table 2. Ordering info rmation Type number Package Name Description Version TJA1055T SO14 plastic small outline package; 14leads; body width 3.9mm SOT108-1 TJA1055T/3 5. Block diagram BAT VCC 14 10 1 INH TEMPERATURE WAKE 7 WAKE-UP PROTECTION 5 STANDBY STB CONTROL 9 RTL 6 EN 11 CANH VCC 12 CANL 8 DRIVER RTH 2 TXD TIMER (1) VCC(2) FAILURE DETECTOR ERR 4 PLUS WAKE-UP PLUS TIME-OUT TJA1055T VCC(2) FILTER 3 RECEIVER RXD FILTER 13 001aac769 GND (1) For TJA1055T/3 current source to GND; for TJA1055T pull-up resistor to V . CC (2) Not within TJA1055T/3. Fig 1. Block diagram TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 3 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 6. Pinning information 6.1 Pinning INH 1 14 BAT TXD 2 13 GND RXD 3 12 CANL TJA1055T ERR 4 11 CANH TJA1055T/3 STB 5 10 VCC EN 6 9 RTL WAKE 7 8 RTH 001aac770 Fig 2. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin Description INH 1 inhibit output for switching an external voltage regulator if a wake-up signal occurs TXD 2 transmit data input for activating the driver to the bus lines RXD 3 receive data output for reading out the data from the bus lines ERR 4 error, wake-up and power-on indication output; active LOW in normal operating mode when a bus failure is detected; active LOW in standby and sleep mode when a wake-up is detected; active LOW in power-on standby when a V power-on event is BAT detected STB 5 standby digital control signal input; together with the input signal on pinEN this input determines the state of the transceiver; seeTable5 andFigure3 EN 6 enable digital control signal input; together with the input signal on pinSTB this input determines the state of the transceiver; seeTable5 andFigure3 WAKE 7 local wake-up signal input (active LOW); both falling and rising edges are detected RTH 8 termination resistor connection; in case of a CANH bus wire error the line is terminated with a predefined impedance RTL 9 termination resistor connection; in case of a CANL bus wire error the line is terminated with a predefined impedance V 10 supply voltage CC CANH 11 HIGH-level CAN bus line CANL 12 LOW-level CAN bus line GND 13 ground BAT 14 battery supply voltage TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 4 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 7. Functional description The TJA1055 is the interface between the CAN protocol controller and the physical wires of the CAN bus (see Figure7 and Figure8). It is primarily intended for low-speed applications, up to 125kBd, in passenger cars. The device provides differential transmit capability to the CAN bus and differential receive capability to the CAN controller. To reduce EME, the rise and fall slopes are limited. This allows the use of an unshielded twisted pair or a parallel pair of wires for the bus lines. Moreover, the device supports transmission capability on either bus line if one of the wires is corrupted. The failure detection logic automatically selects a suitable transmission mode. In normal operating mode (no wiring failures) the differential receiver is output on pinRXD (see Figure1). Thedifferential receiver inputs are connected to pinsCANH andCANL through integrated filters. Thefiltered input signals are also used for the single-wire receivers. The receivers connected to pinsCANH andCANL have threshold voltages that ensure a maximum noise margin in single-wire mode. A timer function (TxD dominant time-out function) has been integrated to prevent the bus lines from being driven into a permanent dominant state (thus blocking the entire network communication) due to a situation in which pinTXD is permanently forced to a LOW level, caused by a hardware and/or software application failure. If the duration of the LOW level on pinTXD exceeds a certain time, the transmitter will be disabled. The timer will be reset by a HIGH level on pinTXD. 7.1 Failure detector The failure detector is fully active in the normal operating mode. After the detection of a single bus failure the detector switches to the appropriate mode (see Table4). The differential receiver threshold voltage is set at 3.2V typical (V =5V). This ensures CC correct reception with a noise margin as high as possible in the normal operating mode and in the event of failures1,2,5and6a. These failures, or recovery from them, do not destroy ongoing transmissions. The output drivers remain active, the termination does not change and the receiver remains in differential mode (see Table4). Failures3, 3aand6 are detected by comparators connected to the CANH and CANL bus lines. Failures3and3a are detected in a two-step approach. Ifthe CANH bus line exceeds a certain voltage level, the differential comparator signals a continuous dominant condition. Because of inter operability reasons with the predecessor products TJA1054 and TJA1054A, after a first time-out the transceiver switches to single-wire operation through CANH. If the CANH bus line is still exceeding the CANH detection voltage for a second time-out, the TJA1055 switches to CANL operation; the CANH driver is switched off and the RTH bias changes to the pull-down current source. The time-outs (delays) are needed to avoid false triggering by external RF fields. TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 5 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver Table 4. Bus failures Failure Description Termination Termination CANH CANL Receiver CANH (RTH) CANL (RTL) driver driver mode 1 CANH wire on on on on differential interrupted 2 CANL wire interrupted on on on on differential 3 CANH short-circuited weak[1] on off on CANL to battery 3a CANH short-circuited weak[1] on off on CANL to V CC 4 CANL short-circuited on weak[2] on off CANH to ground 5 CANH short-circuited on on on on differential to ground 6 CANL short-circuited on weak[2] on off CANH to battery 6a CANL short-circuited on on on on differential to V CC 7 CANL and CANH on weak[2] on off CANH mutually short-circuited [1] A weak termination implies a pull-down current source behavior of 75A typical. [2] A weak termination implies a pull-up current source behavior of 75A typical. Failure6 is detected if the CANL bus line exceeds its comparator threshold for a certain period of time. This delay is needed to avoid false triggering by external RF fields. After detection of failure6, the reception is switched to the single-wire mode through CANH; the CANL driver is switched off and the RTL bias changes to the pull-up current source. Recovery from failures3,3aand6 is detected automatically after reading a consecutive recessive level by corresponding comparators for a certain period of time. Failures4and7 initially result in a permanent dominant level on pinRXD. After a time-out the CANL driver is switched off and the RTL bias changes to the pull-up current source. Reception continues by switching to the single-wire mode via pinsCANH orCANL. When failures4or7 are removed, the recessive bus levels are restored. If the differential voltage remains below the recessive threshold level for a certain period of time, reception and transmission switch back to the differential mode. If any of the wiring failure occurs, the output signal on pinERR will be set to LOW. On error recovery, the output signal on pinERR will be set to HIGH again. In case of an interrupted open bus wire, this failure will be detected and signalled only if there is an open wire between the transmitting and receiving node(s). Thus, during open wire failures, pinERR typically toggles. During all single-wire transmissions, EMC performance (both immunity and emission) is worse than in the differential mode. The integrated receiver filters suppress any HFnoise induced into the bus wires. The cut-off frequency of these filters is a compromise between propagation delay and HFsuppression. In single-wire mode, LFnoise cannot be distinguished from the required signal. TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 6 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 7.2 Low power modes The transceiver provides three low power modes which can be entered and exited via STBandEN (see Table5 andFigure3). The sleep mode is the mode with the lowest power consumption. PinINH is switched to HIGH-impedance for deactivation of the external voltage regulator. PinCANL is biased to the battery voltage via pinRTL. PinsRXD andERR will signal the wake-up interrupt even in case V is not present. CC The standby mode operates in the same way as the sleep mode but with a HIGH level on pinINH. The power-on standby mode is the same as the standby mode, however, in this mode the battery power-on flag is shown on pinERR instead of the wake-up interrupt signal. The output on pinRXD will show the wake-up interrupt. This mode is only for reading out the power-on flag. Table 5. Normal operating and low power modes Mode Pin STB Pin EN Pin ERR Pin RXD Pin RTL switched LOW HIGH LOW HIGH to Goto-sleep LOW HIGH wake-up [2][3] wake-up [2][3] V BAT command interrupt interrupt signal[1] signal[1] Sleep LOW LOW[4] Standby LOW LOW Power-on HIGH LOW V wake-up V BAT BAT standby power-on interrupt flag[5] signal[1] Normal HIGH HIGH error flag no error dominant recessive V CC operating flag received received data data [1] Wake-up interrupts are released when entering normal operating mode. [2] For TJA1055T a diode is added in series with the high-side driver of ERR and RXD to prevent a reverse current from ERR to VCC in the unpowered state. [3] For TJA1055T/3, ERR and RXD are open-drain. [4] In case the goto-sleep command was used before. When V drops, pinEN will become LOW, but due to CC the fail-safe functionality this does not effect the internal functions. [5] V power-on flag will be reset when entering normal operating mode. BAT Wake-up requests are recognized by the transceiver through two possible channels: • The bus lines for remote wake-up • PinWAKE for local wake-up In order to wake-up the transceiver remotely through the bus lines, a filter mechanism is integrated. This mechanism makes sure that noise and any present bus failure conditions do not result into an erroneous wake-up. Because of this mechanism it is not sufficient to simply pull the CANH or CANL bus lines to a dominant level for a certain time. To guarantee a successful remote wake-up under all conditions, a message frame with a dominant phase of at least the maximum specified t or t in it is required. dom(CANH) dom(CANL) TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 7 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver A local wake-up through pinWAKE is detected by a rising or falling edge with a consecutive level exceeding the maximum specified t . WAKE On a wake-up request the transceiver will set the output on pinINH to HIGH which can be used to activate the external supply voltage regulator. A wake-up request is signalled on ERR or RXD with an active LOW signal. So the external microcontroller can activate the transceiver (switch to normal operating mode) via pinsSTB andEN. To prevent a false remote wake-up due to transients or RFfields, the wake-up voltage levels have to be maintained for a certain period of time. In the low power modes the failure detection circuit remains partly active to prevent an increased power consumption in the event of failures3,3a,4and7. To prevent a false local wake-up during an open wire at pinWAKE, this pin has a weak pull-up current source towardsV . However, in order to protect the transceiver against BAT any EMC immunity issues, it is recommended to connect a not used pinWAKE to pin BAT. PinINH is set to floating only if the goto-sleep command is entered successfully. To enter a successful goto-sleep command under all conditions, this command must be kept stable for the maximum specifiedt . d(sleep) PinINH will be set to a HIGH level again by the following events only: • V power-on (cold start) BAT • Rising or falling edge on pinWAKE • A message frame with a dominant phase of at least the maximum specified t dom(CANH) or t , while pinEN or pinSTB is at a LOW level dom(CANL) • PinSTB goes to a HIGH level with V active CC To provide fail-safe functionality, the signals on pinsSTB andEN will internally be set to LOW when V is below a certain threshold voltage (V ). An unused output pin INH CC CC(stb) can simply be left open within the application. 7.3 Power-on After power-on (V switched on) the signal on pinINH will become HIGH and an internal BAT power-on flag will be set. This flag can be read in the power-on standby mode through pinERR (STB=1; EN=0) and will be reset by entering the normal operating mode. 7.4 Protections A current limiting circuit protects the transmitter output stages against short-circuit to positive and negative battery voltage. If the junction temperature exceeds the typical value of 175C, the transmitter output stages are disabled. Because the transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation and hence a lower chip temperature. All other parts of the device will continue to operate. The pinsCANH andCANL are protected against electrical transients which may occur in an automotive environment. TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 8 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver POWER-ON STANDBY 10 GOTO NORMAL (4) SLEEP (5) 11 01 (1) STANDBY SLEEP 00 00 (2) (3) mbk949 Mode10 stands for: Pin STB=HIGH and pin EN=LOW. (1) Mode change via input pinsSTBandEN. (2) Mode change via input pinsSTBandEN; it should be noted that in the sleep mode pin INH is inactive and possibly there is no V . Mode control is only possible if V of the transceiver is CC CC active. (3) Pin INH is activated and pins RXD and ERR are pulled LOW after wake-up via bus or input pinWAKE. (4) Transitions to normal mode clear the internal wake-up: wake-up interrupt flag and power-on flag are cleared. (5) Transitions to sleep mode: pin INH is deactivated. Fig 3. Mode control 8. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit V supply voltage 0.3 +6 V CC V battery supply voltage 0.3 +58 V BAT V voltage on pinTXD 0.3 V +0.3 V TXD CC V voltage on pinRXD 0.3 V +0.3 V RXD CC V voltage on pinERR 0.3 V +0.3 V ERR CC V voltage on pinSTB 0.3 V +0.3 V STB CC V voltage on pinEN 0.3 V +0.3 V EN CC V voltage on pin CANH V 0V; V 0V; 58 +58 V CANH CC BAT no time limit; with respect to any other pin V voltage on pin CANL V 0V; V 0V; 58 +58 V CANL CC BAT no time limit; with respect to any other pin TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 9 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver Table 6. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit V transient voltage on [2] 150 +100 V trt(n) pinsCANH andCANL V input voltage on pinWAKE with respect to any 0.3 +58 V I(WAKE) other pin I input current on pinWAKE [3] 15 - mA I(WAKE) V voltage on pinINH 0.3 V +0.3 V INH BAT V voltage on pinRTH with respect to any 58 +58 V RTH other pin V voltage on pinRTL with respect to any 58 +58 V RTL other pin R termination resistance on 500 16000  RTH pinRTH R termination resistance on 500 16000  RTL pinRTL T virtual junction temperature [4] 40 +150 C vj T storage temperature 55 +150 C stg V electrostatic discharge human body model [5] esd voltage pinsRTH, RTL, 8 +8 kV CANH and CANL all other pins 2 +2 kV IEC 61000-4-2 [6] pinsRTH, RTL, 6 +6 kV CANH and CANL machine model [7] any pin 300 +300 V [1] All voltages are defined with respect to pinGND, unless otherwise specified. Positive current flows into the device. [2] Test set-up according to IEC TS 62228, section 4.2.4. Verified by an external test house to ensure pins can withstand ISO 7637 part 1 & 2 automotive transient test pulses 1, 2a, 3a and 3b. [3] Only relevant if VWAKE<VGND0.3V; current will flow into pinGND. [4] Junction temperature in accordance with “IEC60747-1”. An alternative definition is: Tvj=Tamb+PRth(vj-a) where R is a fixed value to be used for the calculation of T . The rating for T limits the allowable th(vj-a) vj vj combinations of power dissipation(P) and operating ambient temperature (Tamb). [5] Equivalent to discharging a 100pF capacitor through a 1.5k resistor. [6] The ESD performance of pins CANH, CANL, RTH and RTL, with respect to GND, was verified by an external test house in accordance with IEC-61000-4-2 (C = 150 pF, R = 330 ). The results were equal to, or better than, 6kV. [7] Equivalent to discharging a 200pF capacitor through a 10 resistor and a 0.75H coil. TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 10 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 9. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction in free air 120 K/W th(j-a) to ambient R thermal resistance from junction in free air 40 K/W th(j-s) to substrate 10. Static characteristics Table 8. Static charac teristics V =4.75V to5.25V; V =5.0V to40V; V =V ; T =40C to+150C; all voltages are defined with respect to CC BAT STB CC vj ground; positive currents flow into the device; unless otherwise specified.[1] Symbol Parameter Conditions Min Typ Max Unit Supplies (pinsV andBAT) CC V supply voltage 4.75 - 5.25 V CC V supply voltage for forced 3.1 - 4.5 V CC(stb) standby mode (fail-safe) I supply current normal operating mode; 2.5 6 10 mA CC V =V (recessive) TXD CC normal operating mode; 3 13 21 mA V =0V(dominant); no load TXD low power modes at V =V TXD CC T = 40C to+85C 0 0 5 A amb T = +85C to+125C 0 0 25 A amb V battery supply voltage no time limit 0.3 - +40 V BAT operating mode 5.0 - 40 V load dump - - 58 V I battery supply current sleep mode at - 25 40 A BAT V =V =V =V =14V; RTL WAKE INH BAT T = 40Cto+125C amb low power mode at V =V =V =V ; RTL WAKE INH BAT T =40Cto+125C amb V =5V to8V 10 - 100 A BAT V =8V to40V 10 - 75 A BAT normal operating mode at - 150 220 A V =V =V =V =5V RTL WAKE INH BAT to40V V power-on flag voltage on low power modes pof(BAT) pinBAT power-on flag set - - 3.8 V power-on flag not set 5 - - V PinsSTB, ENandTXD V HIGH-level input voltage 2.2 - V +0.3 V IH CC V LOW-level input voltage 0.3 - +0.8 V IL TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 11 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver Table 8. Static characteristics …continued V =4.75V to5.25V; V =5.0V to40V; V =V ; T =40C to+150C; all voltages are defined with respect to CC BAT STB CC vj ground; positive currents flow into the device; unless otherwise specified.[1] Symbol Parameter Conditions Min Typ Max Unit I HIGH-level input current IH pinsSTB andEN V =4V - 11 21 A I pinTXD (TJA1055T) V =3V 160 80 40 A I pinTXD (TJA1055T/3) normal operating mode; V =2.4V 2 11 21 A I low power mode; V =2.4V 0.1 0.9 2 A I I LOW-level input current IL pinsSTB andEN V =1V 2 11 - A I pinTXD (TJA1055T) V =1V 400 240 100 A I pinTXD (TJA1055T/3) normal operating mode; V =1V 2 11 - A I low power mode; V =1V 0.1 0.9 2 A I PinsRXDandERR (TJA1055T) V HIGH-level output voltage OH(norm) in normal mode on pinERR I =100A V 0.9 - V V O CC CC on pinRXD I =1mA V 0.9 - V V O CC CC V HIGH-level output voltage OH(lp) in low-power mode on pinERR I =100A V 1.1 V 0.7 V 0.4 V O CC CC CC on pinRXD I =100A V 1.1 V 0.7 V 0.4 V O CC CC CC V LOW-level output voltage I =1.6mA 0 - 0.4 V OL O I =1.2mA; V <4.75V 0 - 0.4 V O CC I =5mA 0 - 1.5 V O PinsRXDandERR (TJA1055T/3) I LOW-level output current V = 0.4 V 1.3 3.5 - mA OL O I HIGH-level leakage V =3 V 5 0 +8 A LH O current PinWAKE I LOW-level input current V =0V; V =40V 12 4 1 A IL WAKE BAT V wake-up threshold V =0V 2.5 3.2 3.9 V th(wake) STB voltage PinINH V HIGH-level voltage drop I =0.18mA; V  5.5V - - 0.8 V H INH BAT I =0.18mA; V =5.0V - - 1.0 V INH BAT I  leakage current sleep mode; V =0V - - 5 A L INH PinsCANH andCANL V differential receiver no failures and th(dif) threshold voltage busfailures1,2,5and6a; seeFigure4 V =5V 3.5 3.2 2.9 V CC V =4.75V to5.25V 0.70V 0.64V 0.58V V CC CC CC CC TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 12 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver Table 8. Static characteristics …continued V =4.75V to5.25V; V =5.0V to40V; V =V ; T =40C to+150C; all voltages are defined with respect to CC BAT STB CC vj ground; positive currents flow into the device; unless otherwise specified.[1] Symbol Parameter Conditions Min Typ Max Unit V recessive output voltage V =V O(reces) TXD CC on pinCANH R <4k - - 0.2 V RTH on pinCANL R <4k V 0.2 - - V RTL CC V dominant output voltage V =0V; V =V O(dom) TXD EN CC on pinCANH I =40mA V 1.4 - - V CANH CC on pinCANL I =40mA - - 1.4 V CANL I output current on normal operating mode; 110 80 45 mA O(CANH) pinCANH V =0V; V =0V CANH TXD low power modes; V =0V; - 0.25 - A CANH V =5V CC I output current on normal operating mode; 45 70 100 mA O(CANL) pinCANL V =14V; V =0V CANL TXD low power modes; V =14V; - 0 - A CANL V =14V BAT V detection voltage for normal operating mode; V =5V 1.5 1.7 1.85 V det(sc)(CANH) CC short-circuit to battery low power modes 1.1 1.8 2.5 V voltage on pinCANH V detection voltage for normal operating mode det(sc)(CANL) short-circuit to battery V =5V 6.6 7.2 7.8 V CC voltage on pinCANL V =4.75V to5.25V 1.32V 1.44V 1.56V V CC CC CC CC V wake-up threshold th(wake) voltage on pinCANL low power modes 2.5 3.2 3.9 V on pinCANH low power modes 1.1 1.8 2.5 V V difference of wake-up low power modes 0.8 1.4 - V th(wake) threshold voltages (on pins CANL and CANH) V single-ended receiver normal operating mode and th(se)(CANH) threshold voltage on failures4,6and7 pinCANH V =5V 1.5 1.7 1.85 V CC V =4.75V to5.25V 0.30V 0.34V 0.37V V CC CC CC CC V single-ended receiver normal operating mode and th(se)(CANL) threshold voltage on failures3and3a pinCANL V =5V 3.15 3.3 3.45 V CC V =4.75V to5.25V 0.63V 0.66V 0.69V V CC CC CC CC R single-ended input normal operating mode 110 165 270 k i(se)(CANH) resistance on pinCANH R single-ended input normal operating mode 110 165 270 k i(se)(CANL) resistance on pinCANL R differential input normal operating mode 220 330 540 k i(dif) resistance TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 13 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver Table 8. Static characteristics …continued V =4.75V to5.25V; V =5.0V to40V; V =V ; T =40C to+150C; all voltages are defined with respect to CC BAT STB CC vj ground; positive currents flow into the device; unless otherwise specified.[1] Symbol Parameter Conditions Min Typ Max Unit PinsRTH andRTL R switch-on resistance on normal operating mode; switch-on - 40 100  sw(RTL) pinRTL resistance between pin RTL and V ; I <10mA CC O R switch-on resistance on normal operating mode; switch-on - 40 100  sw(RTH) pinRTH resistance between pin RTH and ground; I <10mA O V output voltage on pinRTH low power modes; I =100A - 0.7 1.0 V O(RTH) O I output current on pinRTL low power modes; V =0V 1.5 0.65 0.1 mA O(RTL) RTL I pull-up current on pinRTL normal operating mode and - 75 - A pu(RTL) failures4,6and7 I pull-down current on normal operating mode and - 75 - A pd(RTH) pinRTH failures3and3a Thermal shutdown T shutdown junction 160 175 190 C j(sd) temperature [1] All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at Tamb=125C for dies on wafer level, and above this for cased products 100% tested at Tamb=25C, unless otherwise specified. 11. Dynamic characteristics Table 9. Dynamic cha racteristics V =4.75V to5.25V; V =5.0V to40V; V =V ; T =40C to+150C; R =R = 125; C = CC BAT STB CC vj CAN_L CAN_H CAN_L C = 1nF; all voltages are defined with respect to ground; unless otherwise specified.[1] CAN_H Symbol Parameter Conditions Min Typ Max Unit t transition time for recessive to between 10%and90%; seeFigure5 and 6 0.2 - - s t(reces-dom) dominant (on pins CANL and CANH) t transition time for dominant to between 10%and90%; seeFigure5 and 6 0.2 - - s t(dom-reces) recessive (on pins CANL and CANH) t propagation delay TXD (LOW) to no failures; seeFigure4 to Figure6 - - 1.5 s PD(L) RXD (LOW) all failures except CAN_L shorted to CAN_H; - - 1.9 s seeFigure4 to Figure6 failure 7, CAN_L shorted to CAN_H; - - 1.9 s R = 1 M; seeFigure4 to Figure6 CAN_L t propagation delay TXD (HIGH) to no failures; seeFigure4 to Figure6 - - 1.5 s PD(H) RXD (HIGH) all failures except CAN_L shorted to CAN_H; - - 1.9 s seeFigure4 to Figure6 failure 7, CAN_L shorted to CAN_H; - - 1.9 s R = 1 M; seeFigure4 to Figure6 CAN_L t delay time to sleep [2] 5 - 50 s d(sleep) t disable time of TxD permanent normal operating mode; V =0V 0.75 - 4 ms dis(TxD) TXD dominant timer TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 14 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver Table 9. Dynamic characteristics …continued V =4.75V to5.25V; V =5.0V to40V; V =V ; T =40C to+150C; R =R = 125; C = CC BAT STB CC vj CAN_L CAN_H CAN_L C = 1nF; all voltages are defined with respect to ground; unless otherwise specified.[1] CAN_H Symbol Parameter Conditions Min Typ Max Unit t dominant time on pinCANH low power modes; V =14V [2] 7 - 38 s dom(CANH) BAT t dominant time on pinCANL low power modes; V =14V [2] 7 - 38 s dom(CANL) BAT t local wake-up time on pinWAKE low power modes; V =14V; for wake-up [2] 7 - 38 s WAKE BAT after receiving a falling or rising edge t failure detection time normal operating mode det failures3 and3a 1.6 - 8.0 ms failures4, 6and7 0.3 - 1.6 ms low power modes; V =14V BAT failures3 and3a 1.6 - 8.0 ms failures4 and7 0.1 - 1.6 ms t failure recovery time normal operating mode rec failures3 and3a 0.3 - 1.6 ms failures4 and7 7 - 38 s failure6 125 - 750 s low power modes; V =14V BAT failures3, 3a,4and7 0.3 - 1.6 ms n pulse-count failure detection difference between CANH and CANL; - 4 - det normal operating mode and failures1,2,5 and6a; pinERRbecomes LOW n number of consecutive pulses for on CANH and CANL simultaneously; - 4 - rec failure recovery failures1,2,5and6a [1] All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at Tamb=125C for dies on wafer level, and above this for cased products 100% tested at Tamb=25C, unless otherwise specified. [2] To guarantee a successful mode transition under all conditions, the maximum specified time must be applied. TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 15 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver VTXD 2 V to VCC 0 V VCANL 5 V 3.6 V 1.4 V VCANH 0 V 2.2 V −3.2 V ΔVCAN −5 V VRXD 0.7VCC 0.3VCC tPD(L) tPD(H) mgl424 VCAN=VCANHVCANL Fig 4. Timing diagram for dynamic characteristics 12. Test information VBAT = 5 V to 40 V +5 V INH BAT VCC 1 14 10 8 RTH WAKE 7 RRTH BAT VCC CCAN_L RCAN_L VTXD TXD 500 Ω 2 CANL 12 STB 5 TJA1055T FAILURE CANH GENERATION EN 11 6 RRTL RXD 500 Ω 3 GND 13 4 9 RTL CCAN_H RCAN_H CRXD 10 pF GND ERR 001aac932 V is a rectangular signal of 50 kHz with 50 % duty cycle and slope time < 10 ns. TXD Termination resistorsRCAN_L and RCAN_H (125) are not connected to pinRTL or pinRTH for testing purposes because the minimum load allowed on the CAN bus lines is 500 per transceiver. Fig 5. Test circuit for dynamic characteristics TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 16 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver VBAT = 5 V to 40 V +5 V INH BAT VCC 1 14 10 8 RTH WAKE 7 RRTH BAT VCC CCAN_L RCAN_L VTXD TXD 500 Ω 2 CANL 12 +3.3 V STB 5 TJA1055T/3 FAILURE CANH GENERATION EN 11 2.5 6 kΩ RRTL RXD 500 Ω 3 GND 13 4 9 RTL CCAN_H RCAN_H CRXD 10 pF GND ERR 001aac933 V is a rectangular signal of 50 kHz with 50 % duty cycle and slope time < 10 ns. TXD Termination resistorsRCAN_L and RCAN_H (125) are not connected to pinRTL or pinRTH for testing purposes because the minimum load allowed on the CAN bus lines is 500 per transceiver. Fig 6. Test circuit for dynamic characteristics (TJA1055T/3) (cid:57)(cid:37)(cid:36)(cid:55) (cid:57)(cid:39)(cid:39) (cid:14)(cid:24)(cid:3)(cid:57) (cid:24)(cid:3)(cid:57)(cid:3)(cid:38)(cid:36)(cid:49)(cid:3)(cid:38)(cid:50)(cid:49)(cid:55)(cid:53)(cid:50)(cid:47)(cid:47)(cid:40)(cid:53) (cid:38)(cid:55)(cid:59)(cid:19) (cid:38)(cid:53)(cid:59)(cid:19) (cid:51)(cid:91)(cid:17)(cid:91) (cid:51)(cid:91)(cid:17)(cid:91) (cid:51)(cid:91)(cid:17)(cid:91) (cid:55)(cid:59)(cid:39) (cid:53)(cid:59)(cid:39) (cid:54)(cid:55)(cid:37) (cid:40)(cid:53)(cid:53) (cid:40)(cid:49) (cid:44)(cid:49)(cid:43) (cid:21) (cid:22) (cid:24) (cid:23) (cid:25) (cid:20) (cid:58)(cid:36)(cid:46)(cid:40) (cid:37)(cid:36)(cid:55) (cid:26) (cid:20)(cid:23) (cid:55)(cid:45)(cid:36)(cid:20)(cid:19)(cid:24)(cid:24)(cid:55) (cid:57)(cid:38)(cid:38) (cid:20)(cid:19) (cid:38)(cid:36)(cid:49)(cid:3)(cid:55)(cid:53)(cid:36)(cid:49)(cid:54)(cid:38)(cid:40)(cid:44)(cid:57)(cid:40)(cid:53) (cid:42)(cid:49)(cid:39) (cid:20)(cid:19)(cid:19)(cid:3)(cid:81)(cid:41) (cid:97)(cid:23)(cid:17)(cid:26)(cid:3)(cid:81)(cid:41) (cid:20)(cid:22) (cid:27) (cid:20)(cid:20) (cid:20)(cid:21) (cid:28) (cid:53)(cid:55)(cid:43) (cid:38)(cid:36)(cid:49)(cid:43) (cid:38)(cid:36)(cid:49)(cid:47) (cid:53)(cid:55)(cid:47) (cid:38)(cid:36)(cid:49)(cid:3)(cid:37)(cid:56)(cid:54)(cid:3)(cid:47)(cid:44)(cid:49)(cid:40) (cid:19)(cid:19)(cid:20)(cid:68)(cid:68)(cid:70)(cid:28)(cid:22)(cid:25) For more information: refer to the separate FTCAN information available on our web site. Fig 7. Application diagram TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 17 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver (cid:57)(cid:37)(cid:36)(cid:55) (cid:57)(cid:39)(cid:39) (cid:14)(cid:22)(cid:3)(cid:57) (cid:22)(cid:3)(cid:57)(cid:3)(cid:38)(cid:36)(cid:49)(cid:3)(cid:38)(cid:50)(cid:49)(cid:55)(cid:53)(cid:50)(cid:47)(cid:47)(cid:40)(cid:53) (cid:14)(cid:24)(cid:3)(cid:57) (cid:38)(cid:55)(cid:59)(cid:19) (cid:38)(cid:53)(cid:59)(cid:19) (cid:51)(cid:91)(cid:17)(cid:91) (cid:51)(cid:91)(cid:17)(cid:91) (cid:51)(cid:91)(cid:17)(cid:91) (cid:55)(cid:59)(cid:39) (cid:53)(cid:59)(cid:39) (cid:54)(cid:55)(cid:37) (cid:40)(cid:53)(cid:53) (cid:40)(cid:49) (cid:44)(cid:49)(cid:43) (cid:21) (cid:22) (cid:24) (cid:23) (cid:25) (cid:20) (cid:58)(cid:36)(cid:46)(cid:40) (cid:37)(cid:36)(cid:55) (cid:26) (cid:20)(cid:23) (cid:55)(cid:45)(cid:36)(cid:20)(cid:19)(cid:24)(cid:24)(cid:55)(cid:18)(cid:22) (cid:57)(cid:38)(cid:38) (cid:20)(cid:19) (cid:38)(cid:36)(cid:49)(cid:3)(cid:55)(cid:53)(cid:36)(cid:49)(cid:54)(cid:38)(cid:40)(cid:44)(cid:57)(cid:40)(cid:53) (cid:42)(cid:49)(cid:39) (cid:20)(cid:19)(cid:19)(cid:3)(cid:81)(cid:41) (cid:97)(cid:23)(cid:17)(cid:26)(cid:3)(cid:81)(cid:41) (cid:20)(cid:22) (cid:27) (cid:20)(cid:20) (cid:20)(cid:21) (cid:28) (cid:53)(cid:55)(cid:43) (cid:38)(cid:36)(cid:49)(cid:43) (cid:38)(cid:36)(cid:49)(cid:47) (cid:53)(cid:55)(cid:47) (cid:38)(cid:36)(cid:49)(cid:3)(cid:37)(cid:56)(cid:54)(cid:3)(cid:47)(cid:44)(cid:49)(cid:40) (cid:19)(cid:19)(cid:20)(cid:68)(cid:68)(cid:70)(cid:28)(cid:22)(cid:26) For more information: refer to the separate FTCAN information available on our web site. Fig 8. Application diagram (TJA1055T/3) 12.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q100 Rev-G - Failure mechanism based stress test qualification for integrated circuits, and is suitable for use in automotive applications. TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 18 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 13. Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 14 8 Q A2 A1 (A 3 ) A pin 1 index θ Lp 1 7 L e w M detail X bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mAax. A1 A2 A3 bp c D(1) E(1) e HE L Lp Q v w y Z(1) θ 0.25 1.45 0.49 0.25 8.75 4.0 6.2 1.0 0.7 0.7 mm 1.75 0.25 1.27 1.05 0.25 0.25 0.1 0.10 1.25 0.36 0.19 8.55 3.8 5.8 0.4 0.6 0.3 8o 0.010 0.057 0.019 0.0100 0.35 0.16 0.244 0.039 0.028 0.028 0o inches 0.069 0.01 0.05 0.041 0.01 0.01 0.004 0.004 0.049 0.014 0.0075 0.34 0.15 0.228 0.016 0.024 0.012 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 99-12-27 SOT108-1 076E06 MS-012 03-02-19 Fig 9. Package outline SOT108-1 (SO14) TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 19 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • Board specifications, including the board finish, solder masks and vias • Package footprints, including solder thieves and orientation • The moisture sensitivity level of the packages • Package placement • Inspection and repair • Lead-free soldering versus SnPb soldering 14.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 20 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure10) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table10 and11 Table 10. SnPb eutectic process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350  350 < 2.5 235 220  2.5 220 220 Table 11. Lead-free process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure10. TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 21 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 10. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 15. Appendix 15.1 Overview of differences between the TJA1055 and the TJA1054A Table 12. Limiting valu es Symbol Parameter Conditions TJA1055 TJA1054A Unit Min Max Min Max V voltage on pin CANH 58 +58 27 +40 V CANH V voltage on pin CANL 58 +58 27 +40 V CANL V electrostatic discharge voltage pinsRTH, RTL, CANH, CANL esd human body model 8 +8 4 +4 kV IEC 61000-4-2 [1] [1] The ESD performance of pins CANH, CANL, RTH and RTL, with respect to GND, was verified by an external test house in accordance with IEC-61000-4-2 (C = 150 pF, R = 330 ). The results were equal to, or better than, 6kV for TJA1055 and equal to, or better than, 1.5kV for TJA1054A. TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 22 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 16. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes TJA1055 v.5 20131206 Product data sheet - TJA1055 v.4 Modifications: • Template and legal information (Section17) updated • Table1, Table6: measurement conditions changed for parameters V and V CANH CANL • Table6, Table note2 added; Fig. 7 and Fig. 8 deleted • Table8: parameter I deleted; parameter values changed: V for pins STB, EN and sup(tot) IH TXDV for pin INH H • Table9: parameter values changed: t , t ; table reformatted t(reces-dom) t(dom-reces) • Figure7, Figure8: revised (capacitor added) • Section12.1: text revised TJA1055 v.4 20090217 Product data sheet - TJA1055 v.3 TJA1055 v.3 20070313 Product data sheet - TJA1055 v.2 TJA1055 v.2 20061030 Preliminary data sheet - TJA1055 v.1 TJA1055 v.1 20060801 Objective data sheet - - (9397 750 14908) TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 23 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 17.2 Definitions Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, Draft — The document is a draft version only. The content is still under authorized or warranted to be suitable for use in life support, life-critical or internal review and subject to formal approval, which may result in safety-critical systems or equipment, nor in applications where failure or modifications or additions. NXP Semiconductors does not give any malfunction of an NXP Semiconductors product can reasonably be expected representations or warranties as to the accuracy or completeness of to result in personal injury, death or severe property or environmental information included herein and shall have no liability for the consequences of damage. NXP Semiconductors and its suppliers accept no liability for use of such information. inclusion and/or use of NXP Semiconductors products in such equipment or Short data sheet — A short data sheet is an extract from a full data sheet applications and therefore such inclusion and/or use is at the customer's own with the same product type number(s) and title. A short data sheet is intended risk. for quick reference only and should not be relied upon to contain detailed and Applications — Applications that are described herein for any of these full information. For detailed and full information see the relevant full data products are for illustrative purposes only. NXP Semiconductors makes no sheet, which is available on request via the local NXP Semiconductors sales representation or warranty that such applications will be suitable for the office. In case of any inconsistency or conflict with the short data sheet, the specified use without further testing or modification. full data sheet shall prevail. Customers are responsible for the design and operation of their applications Product specification — The information and data provided in a Product and products using NXP Semiconductors products, and NXP Semiconductors data sheet shall define the specification of the product as agreed between accepts no liability for any assistance with applications or customer product NXP Semiconductors and its customer, unless NXP Semiconductors and design. It is customer’s sole responsibility to determine whether the NXP customer have explicitly agreed otherwise in writing. In no event however, Semiconductors product is suitable and fit for the customer’s applications and shall an agreement be valid in which the NXP Semiconductors product is products planned, as well as for the planned application and use of deemed to offer functions and qualities beyond those described in the customer’s third party customer(s). Customers should provide appropriate Product data sheet. design and operating safeguards to minimize the risks associated with their applications and products. 17.3 Disclaimers NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s Limited warranty and liability — Information in this document is believed to third party customer(s). Customer is responsible for doing all necessary be accurate and reliable. However, NXP Semiconductors does not give any testing for the customer’s applications and products using NXP representations or warranties, expressed or implied, as to the accuracy or Semiconductors products in order to avoid a default of the applications and completeness of such information and shall have no liability for the the products or of the application or use by customer’s third party consequences of use of such information. NXP Semiconductors takes no customer(s). NXP does not accept any liability in this respect. responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC60134) will cause permanent In no event shall NXP Semiconductors be liable for any indirect, incidental, damage to the device. Limiting values are stress ratings only and (proper) punitive, special or consequential damages (including - without limitation - lost operation of the device at these or any other conditions above those given in profits, lost savings, business interruption, costs related to the removal or the Recommended operating conditions section (if present) or the replacement of any products or rework charges) whether or not such Characteristics sections of this document is not warranted. Constant or damages are based on tort (including negligence), warranty, breach of repeated exposure to limiting values will permanently and irreversibly affect contract or any other legal theory. the quality and reliability of the device. Notwithstanding any damages that customer might incur for any reason Terms and conditions of commercial sale — NXP Semiconductors whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards products are sold subject to the general terms and conditions of commercial customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual Right to make changes — NXP Semiconductors reserves the right to make agreement is concluded only the terms and conditions of the respective changes to information published in this document, including without agreement shall apply. NXP Semiconductors hereby expressly objects to limitation specifications and product descriptions, at any time and without applying the customer’s general terms and conditions with regard to the notice. This document supersedes and replaces all information supplied prior purchase of NXP Semiconductors products by customer. to the publication hereof. TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 24 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver No offer to sell or license — Nothing in this document may be interpreted or Translations — A non-English (translated) version of a document is for construed as an offer to sell products that is open for acceptance or the grant, reference only. The English version shall prevail in case of any discrepancy conveyance or implication of any license under any copyrights, patents or between the translated and English versions. other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein 17.4 Trademarks may be subject to export control regulations. Export might require a prior authorization from competent authorities. Notice: All referenced brands, product names, service names and trademarks Quick reference data — The Quick reference data is an extract of the are the property of their respective owners. product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com TJA1055 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 6 December 2013 25 of 26

TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 19. Contents 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 Optimized for in-car low-speed communication. . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Bus failure management. . . . . . . . . . . . . . . . . . 1 2.3 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.4 Support for low power modes. . . . . . . . . . . . . . 2 3 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 Failure detector. . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 Low power modes . . . . . . . . . . . . . . . . . . . . . . 7 7.3 Power-on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.4 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Thermal characteristics . . . . . . . . . . . . . . . . . 11 10 Static characteristics. . . . . . . . . . . . . . . . . . . . 11 11 Dynamic characteristics. . . . . . . . . . . . . . . . . 14 12 Test information. . . . . . . . . . . . . . . . . . . . . . . . 16 12.1 Quality information . . . . . . . . . . . . . . . . . . . . . 18 13 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 19 14 Soldering of SMD packages . . . . . . . . . . . . . . 20 14.1 Introduction to soldering. . . . . . . . . . . . . . . . . 20 14.2 Wave and reflow soldering. . . . . . . . . . . . . . . 20 14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 20 14.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 21 15 Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 15.1 Overview of differences between the TJA1055 and the TJA1054A . . . . . . . . . . . . . 22 16 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 23 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 24 17.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24 17.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 17.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 24 17.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25 18 Contact information. . . . . . . . . . . . . . . . . . . . . 25 19 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 December 2013 Document identifier: TJA1055

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: TJA1055T,512 TJA1055T/3/C,512 TJA1055T/3/C,518 TJA1055T/C,512 TJA1055T/C,518 TJA1055T,518 TJA1055T/CM,118 TJA1055T/1J TJA1055T/3/1J TJA1055T/3/CM,118