INTEGRATED CIRCUITS DATA SHEET TDA8551 1 W BTL audio amplifier with digital volume control Product specification 1998 Feb 23 Supersedes data of 1997 May 07

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control FEATURES GENERAL DESCRIPTION • One pin digital volume control The TDA8551; TDA8551T is a one channel 1W Bridge-Tied Load (BTL) audio power amplifier capable of • Volume setting with UP/DOWN pulses delivering 1W output power to an 8Ω load at THD=10% • Flexibility in use using a 5V power supply. The circuit contains a BTL • Few external components power amplifier, a digital volume control and standby/mute • Low saturation voltage of output stage logic. The TDA8551T comes in an 8pin SO package and the TDA8551 in a 8pin DIP package. • Standby mode controlled by CMOS compatible levels • Low standby current APPLICATIONS • No switch-on/switch-off plops • Portable consumer products • High supply voltage ripple rejection • Personal computers • Protected against electrostatic discharge • Telephony. • Outputs short circuit safe to ground, V and across the P load • Thermally protected. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V supply voltage 2.7 5 5.5 V P I quiescent current V =5V − 6 10 mA q P I standby current − − 10 μA stb P output power THD=10%; R =8Ω; V =5V 1 1.4 − W o L P G voltage gain −60 − +20 dB v n number of volume steps − 64 − vol THD total harmonic distortion P =0.5W − 0.15 − % o SVRR supply voltage ripple rejection 48 − − dB ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION TDA8551T SO8 plastic small outline package; 8leads; body width 3.9mm SOT96-1 TDA8551 DIP8 plastic dual in-line package; 8leads (300mil) SOT97-1 1998Feb23 2

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control BLOCK DIAGRAM handbook, full pagewidth VP 6 1 UP/DOWN INTERFACE up down TDA8551 UP/DOWN COUNTER MASTER 4 VOLUME IN 8 CONTROL OUT+ VP 20 kΩ 5 kΩ 15 kΩ R 3 SVR R STANDBY/ 15 kΩ 5 MUTE/ OUT− OPERATING SLAVE 2 7 MGK363 MODE GND Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION UP/DOWN 1 digital trinary input for volume control MODE 2 digital trinary input for mode handbook, halfpage UP/DOWN 1 8 OUT+ selection (standby, mute, operating) SVR 3 half supply voltage, decoupling MODE 2 7 GND TDA8551 ripple rejection SVR 3 6 VP IN 4 audio input IN 4 5 OUT− OUT− 5 negative loudspeaker output MGK362 terminal V 6 supply voltage P GND 7 ground OUT+ 8 positive loudspeaker output Fig.2 Pin configuration. terminal 1998Feb23 3

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control FUNCTIONAL DESCRIPTION Each pulse on the UP/DOWN pin results in a change in gain of 80/64=1.25dB (typical value). In the basic The TDA8551; TDA8551T is a 1W BTL audio power application the UP/DOWN pin is switched to ground or V amplifier capable of delivering 1W output power to an 8Ω P by a double push-button. When the supply voltage is load at THD=10% using a 5V power supply. The gain of initially connected, after a complete removal of the supply, the amplifier can be set by the digital volume control. In the the initial state of the volume control is an attenuation of maximum volume setting the gain is 20dB. Using the 40dB (low volume), so the gain of the total amplifier is MODE pin the device can be switched to the standby −20dB. After powering-up, some positive pulses have to condition, the mute condition and the normal operating be applied to the UP/DOWN pin for turning up to listening condition. The device is protected by an internal thermal volume. When the device is switched with the MODE shutdown protection mechanism. select pin to the mute or the standby condition, the volume control attenuation setting remains on its value, assumed Power amplifier that the voltage on pinV does not fall below the minimum P The power amplifier is a Bridge Tied Load (BTL) amplifier supply voltage. After switching the device back to the with a complementary CMOS output stage. The total operation mode, the previous volume setting is voltage loss for both output power MOS transistors is maintained. within 1V and with a 5V supply and an 8Ω loudspeaker an output power of 1W can be delivered. The total gain of Mode select pin this power amplifier is internally fixed at 20dB. The device is in the standby mode (with a very low current consumption) if the voltage at the MODE pin is between V Volume control P and V −0.5V. At a mode select voltage level of less than P The volume control operates as a digital controlled 0.5V the amplifier is fully operational. In the range attenuator between the audio input pin and the power between 1V and V −1.4V the amplifier is in the mute P amplifier. In the maximum volume control setting the condition. The mute condition is useful for using it as a ‘fast attenuation is 0dB and in the minimum volume control mute’; in this mode output signal is suppressed, while the setting the typical attenuation is 80dB. The attenuation volume setting remains at its value. It is advised to keep can be set in 64steps by the UP/DOWN pin. the device in the mute condition while the input capacitor ThisUP/DOWN pin is a trinary input: is being charged. This can be done by holding the MODE pin at a level of 0.5V , or by waiting approximately 100ms • Floating UP/DOWN pin: volume remains unchanged P before giving the first volume-UP pulses. • Negative pulses: setting volume towards minimum • Positive pulses: setting volume towards maximum. 1998Feb23 4

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V supply voltage −0.3 +5.5 V P V input voltage −0.3 V +0.3 V I P I repetitive peak output current − 1 A ORM T storage temperature −55 +150 °C stg T operating temperature −40 +85 °C amb V AC and DC short-circuit safe voltage − 5.5 V sc P maximum power dissipation SO8 − 0.8 W tot DIP8 − 1.2 W QUALITY SPECIFICATION Quality according to “SNW-FQ-611partE”, if this type is used as an audio amplifier. Quality specifications are listed in the “Quality reference handbook”, order number 939775000192. THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT R thermal resistance from junction to ambient in free air thj-a SO8 160 K/W DIP8 100 K/W 1998Feb23 5

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control CHARACTERISTICS V =5V; T =25°C; R =8Ω; V =0V; total gain setting at +7dB (unless otherwise specified); measured in P amb L MODE test circuit of Fig.4. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT DC characteristics V supply voltage 2.7 5 5.5 V P I quiescent current R =∞; note1 − 6 10 mA q L I standby current V =V − − 10 μA stb MODE P V DC output voltage note2 − 2.5 − V O ⎪V −V ⎪ differential output offset − − 50 mV OUT+ OUT− Mode select pin V input voltage standby mode V −0.5 − V V MODE P P mute mode 1 − V −1.4 V P operating mode 0 − 0.5 V I input current 0<V <V − − 100 nA MODE MODE P α mute attenuation note3 80 90 − dB Volume control t pulse repetition time 100 − − ns rep V UP/DOWN pin up threshold level 4.2 − V V th(UP) P V UP/DOWN pin floating high level − − 3.4 V float(max) V ) UP/DOWN pin floating low level 1.0 − − V float(min V UP/DOWN pin down threshold level 0 − 0.6 V th(DOWN) I input current UP/DOWN pin 0<V <V − − 200 μA UP/DOWN UP/DOWN P G maximum voltage gain (including 19 20 21 dB v(max) power amplifier) G minimum voltage gain (including −62 −60 −58 dB v(min) power amplifier) n number of volume steps − 64 − vol ΔG voltage gain variation per step − 1.25 − dB v Z input impedance 14 20 − kΩ i V maximum input voltage (RMS value) − − 2.0 V i(rms)(max) AC characteristics (f=1kHz) P output power THD=10% 1 1.4 − W o THD=0.5% 0.6 1.0 − W THD total harmonic distortion P =0.5W; note4 − 0.15 0.5 % o V noise output voltage note5 − 60 100 μV n(o) SVRR supply voltage ripple rejection note6 48 53 − dB V maximum input voltage on pinIN THD=1%; − − 2.0 V i(IN)(max) G =−50dB v to0dB 1998Feb23 6

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control Notes to the Characteristics 1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC output offset voltage divided by R . L 2. The DC output voltage with respect to ground is approximately 0.5V . P 3. Output voltage in mute position is measured with an input of 1V(RMS), including noise, in a bandwidth of 20kHz. 4. Total gain setting at +20dB. 5. The noise output voltage is measured at the output in a frequency band from 20Hzto20kHz (unweighted), input source impedance R =0Ω. source 6. Supply voltage ripple rejection is measured at the output, with a source impedance of R =0Ω at the input. source The ripple voltage is a sine wave with frequency of 1kHz and an amplitude of 100mV(RMS) is applied to the positive supply rail. handbook, full pagewidth tr trep tw VP increasing volume Vth(UP) Vfloat(max) floating VUP/DOWN Vfloat(min) Vth(DOWN) decreasing volume 0 t tr trep tw MGK365 The rise time (tr) and the width of the pulse (tw) are not critical. Fig.3 Timing UP/DOWN pin. 1998Feb23 7

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control TEST AND APPLICATION INFORMATION handbook, full pagewidth VP UP R1 volume control DOWN 2.2 kΩ C5 100 nF VP = 5 V UP/DOWN VP C3 C4 100 220 1 6 MASTER nF μF C1 IN 4 VOLUME 8 OUT+ CONTROL 330 nF VP 20 kΩ Vi TDA8551 5 kΩ 15 kΩ R SVR 3 8 Ω R C2 1μ0F0 STANDBY/ 15 kΩ 5 OUT− MUTE/ OPERATING VP SLAVE 2 7 standby MODE GND mute operating MGM560 Fig.4 Test and application circuit. Reduction of the value of capacitor C2 results in a The measured thermal resistance of the IC package is decrease of the SVRR performance at low frequencies highly dependent on the configuration and size of the (see Fig.9). application board. Data may not be comparable between different semiconductor manufacturers because the The UP/DOWN pin can be driven by a 3-state logic output application boards and test methods are not standardized stage (microcontroller) without extra external components. yet. In addition, the thermal performance of packages for a If the UP/DOWN pin is driven by push-buttons, then it is specific application may be different than presented here, advised to have an RC filter between the buttons and the because the configuration of the application boards UP/DOWN pin. Advised values for the RC filter are 2.2kΩ (copper area) may be different. NXP Semiconductors uses and 100nF. FR-4 type application boards with 1oz. copper traces with The volume control circuit responds to the trailing edge of solder coating. The measurements have been carried out the pulse on the volume pin; connecting to V results in a with vertical placed boards. P one step (1.25dB) higher gain; connecting to ground results in a one step lower gain. To avoid audible plops while switching the supply voltage on and off pinMODE has to be connected to V (standby P condition) during charge or discharge of the input and SVRR capacitors. 1998Feb23 8

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control When a practical PCB layout is used with wider copper tracks and some extra copper added both to the IC pin connections and underneath the IC, the thermal resistance from junction to ambient can be reduced. Without these measures Rthj-a=160K/W for the SO8 package; see 10 MGM554 handbook, halfpage Chapter “Thermal characteristics”. Thepower dissipation IP can be calculated as follows: (mA) 8 T P = -----a---m----b-- R th j-a For a maximum ambient temperature of 50°C, V =5V 6 P and R =8Ω this results in a worst case sine wave L dissipation of 0.63W. 4 Figures5to15 represent test results obtained while using the test circuit given in Fig.4. The following test conditions 2 apply: T =25°C; V =5V; f=1kHz; R =8Ω; amb P L G =20dB; audio bandwidth from 22Hzto22kHz v (except for Figs8and9); unless otherwise specified. 0 0 2 4 VP (V) 6 Fig.5 Supply current as a function of supply voltage. MGM551 MGM552 10 10 handbook, halfpage handbook, halfpage THD THD (%) (%) (1) 1 1 (1) (2) (2) 10−1 10−1 (3) (3) 10−2 10−2 10−2 10−1 1 10 10−2 10−1 1 10 Po (W) Po (W) f=1kHz. (1) f=10kHz. (1) Gv=0dB. (2) f=1kHz. (2) Gv=7dB. (3) f=100Hz. (3) Gv=20dB. Fig.6 Total harmonic distortion as a function of Fig.7 Total harmonic distortion as a function of output power at different frequencies. output power at different gains. 1998Feb23 9

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control MGM550 MGM549 10 0 handbook, halfpage handbook, halfpage THD SVRR (%) (dB) (1) 1 −20 (2) (1) (3) 10−1 −40 (2) (4) (3) (5) (6) 10−2 −60 10 102 103 104 105 10 102 103 104 105 f (Hz) f (Hz) Vripple=100mV. (3) C2=100μF; Gv=20dB. P(1o)=G0.v1=W0.dB. ((23)) GGvv==720dBdB.. R((12s))ourCCce22===011Ω00.μμFF;; GGvv==720ddBB.. (((456))) CCC222===11100000μμμFFF; ;;G GGvvv===−17−01d0dBBd.B.. Fig.8 Total harmonic distortion as a function of Fig.9 Supply voltage ripple rejection as a function frequency at different gains. of frequency. MGM559 MGM555 2.4 1 handboVoik, halfpage handbooVko, halfpage (V) (V) 2.0 10−1 1.6 10−2 1.2 10−3 0.8 10−4 0.4 (1) (2) 0 10−5 −60 −40 −20 0 20 0 1 2 3 4 5 Gv (dB) VMODE (1) VP=3V. THD=1%. (2) VP=5V. Fig.10 Input voltage as a function of voltage gain. Fig.11 Output voltage as a function of mode select input voltage at different supply voltages. 1998Feb23 10

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control MGM553 MGM558 20 3 handbook, halfpage handbook, halfpage Gv (dB) Po 0 (W) 2 −20 (1) −40 (2) 1 −60 −80 0 0 20 40 60 nvol 80 0 2 4 VP (V) 6 THD=10%. Po(max) is limited by Ptot and a (1) RL=4Ω. mpeaaxkim ouumtp uatv cauilrarbelnet roefp 1etAit.ive (2) RL=8Ω. Fig.12 Volume gain as a function of volume steps. Fig.13 Output power as a function of supply voltage. MGM556 MGM557 1.5 1.5 handbook, halfpage handbook, halfpage P P (1) (W) (W) (1) 1 1 (2) (2) 0.5 0.5 (3) (4) (3) (5) 0 0 0 2 4 VP (V) 6 0 0.4 0.8 1.2 1.6Po (W)2.0 (1) RL=4Ω. (1) VP=5V; RL=4Ω. (4) VP=5V; RL=16Ω. (2) RL=8Ω. (2) VP=5V; RL=8Ω. (5) VP=3.3V; RL=8Ω. (3) RL=16Ω. (3) VP=3.3V; RL=4Ω. Fig.14 Power dissipation as a function of supply Fig.15 Power dissipation as a function of output voltage. power. 1998Feb23 11

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control handbook, full pagewidth 51.2 51.1 top view bottom view VOLUME +VP GND CONTROL DOWN UP C4 S1 S2 C3 C5 R1 1 8 OUT+ C2 TDA8551 OUT− Vi C1 AUDIO POWER TDA J1 CIC NIJMEGEN 8551 stand-by operating mute MGM561 Dimensions in mm. Fig.16 Layout of printed-circuit board. 1998Feb23 12

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control PACKAGE OUTLINES SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 8 5 Q A2 A1 (A 3 ) A pin 1 index θ Lp 1 4 L e w M detail X bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mAax. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ 0.25 1.45 0.49 0.25 5.0 4.0 6.2 1.0 0.7 0.7 mm 1.75 0.25 1.27 1.05 0.25 0.25 0.1 0.10 1.25 0.36 0.19 4.8 3.8 5.8 0.4 0.6 0.3 8o 0.010 0.057 0.019 0.0100 0.20 0.16 0.244 0.039 0.028 0.028 0o inches 0.069 0.01 0.05 0.041 0.01 0.01 0.004 0.004 0.049 0.014 0.0075 0.19 0.15 0.228 0.016 0.024 0.012 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 99-12-27 SOT96-1 076E03 MS-012 03-02-18 1998Feb23 13

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 D ME e n a pl g n eati A2 A s L A1 c Z w M b1 e (e ) 1 MH b b2 8 5 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mAax. mAi n1 . mAa 2x . b b1 b2 c D(1) E(1) e e1 L ME MH w mZa(1x). 1.73 0.53 1.07 0.36 9.8 6.48 3.60 8.25 10.0 mm 4.2 0.51 3.2 2.54 7.62 0.254 1.15 1.14 0.38 0.89 0.23 9.2 6.20 3.05 7.80 8.3 inches 0.17 0.02 0.13 0.068 0.021 0.042 0.014 0.39 0.26 0.1 0.3 0.14 0.32 0.39 0.01 0.045 0.045 0.015 0.035 0.009 0.36 0.24 0.12 0.31 0.33 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 99-12-27 SOT97-1 050G01 MO-001 SC-504-8 03-02-13 1998Feb23 14

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control SOLDERING Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary Introduction between 50and300seconds depending on heating There is no soldering method that is ideal for all IC method. Typical reflow temperatures range from packages. Wave soldering is often preferred when 215to250°C. through-hole and surface mounted components are mixed Preheating is necessary to dry the paste and evaporate on one printed-circuit board. However, wave soldering is the binding agent. Preheating duration: 45minutes at not always suitable for surface mounted ICs, or for 45°C. printed-circuits with high population densities. In these situations reflow soldering is often used. WAVE SOLDERING This text gives a very brief insight to a complex technology. Wave soldering techniques can be used for all SO A more in-depth account of soldering ICs can be found in packages if the following conditions are observed: our “IC Package Databook” (order code 939865290011). • A double-wave (a turbulent wave with high upward DIP pressure followed by a smooth laminar wave) soldering technique should be used. SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be The maximum permissible temperature of the solder is parallel to the solder flow. 260°C; solder at this temperature must not be in contact • The package footprint must incorporate solder thieves at with the joint for more than 5seconds. The total contact the downstream end. time of successive solder waves must not exceed 5seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be The device may be mounted up to the seating plane, but applied by screen printing, pin transfer or syringe the temperature of the plastic body must not exceed the dispensing. The package can be soldered after the specified maximum storage temperature (T ). If the stgmax adhesive is cured. printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the Maximum permissible solder temperature is 260°C, and temperature within the permissible limit. maximum duration of package immersion in solder is 10seconds, if cooled to less than 150°C within REPAIRING SOLDERED JOINTS 6seconds. Typical dwell time is 4seconds at 250°C. Apply a low voltage soldering iron (less than24V) to the A mildly-activated flux will eliminate the need for removal lead(s) of the package, below the seating plane or not of corrosive residues in most applications. more than 2mm above it. If the temperature of the soldering iron bit is less than 300°C it may remain in REPAIRING SOLDERED JOINTS contact for up to 10seconds. If the bit temperature is Fix the component by first soldering two diagonally- between 300and400°C, contact may be up to 5seconds. opposite end leads. Use only a low voltage soldering iron (less than24V) applied to the flat part of the lead. Contact SO time must be limited to 10seconds at up to 300°C. When REFLOW SOLDERING using a dedicated tool, all other leads can be soldered in one operation within 2 to 5seconds between Reflow soldering techniques are suitable for all SO 270and320°C. packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1998Feb23 15

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control DATA SHEET STATUS DOCUMENT PRODUCT DEFINITION STATUS(1) STATUS(2) Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. DISCLAIMERS property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Limited warranty and liability ⎯ Information in this Semiconductors products in such equipment or document is believed to be accurate and reliable. applications and therefore such inclusion and/or use is at However, NXP Semiconductors does not give any the customer’s own risk. representations or warranties, expressed or implied, as to the accuracy or completeness of such information and Applications ⎯ Applications that are described herein for shall have no liability for the consequences of use of such any of these products are for illustrative purposes only. information. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the In no event shall NXP Semiconductors be liable for any specified use without further testing or modification. indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost Customers are responsible for the design and operation of savings, business interruption, costs related to the their applications and products using NXP removal or replacement of any products or rework Semiconductors products, and NXP Semiconductors charges) whether or not such damages are based on tort accepts no liability for any assistance with applications or (including negligence), warranty, breach of contract or any customer product design. It is customer’s sole other legal theory. responsibility to determine whether the NXP Semiconductors product is suitable and fit for the Notwithstanding any damages that customer might incur customer’s applications and products planned, as well as for any reason whatsoever, NXP Semiconductors’ for the planned application and use of customer’s third aggregate and cumulative liability towards customer for party customer(s). Customers should provide appropriate the products described herein shall be limited in design and operating safeguards to minimize the risks accordance with the Terms and conditions of commercial associated with their applications and products. sale of NXP Semiconductors. NXP Semiconductors does not accept any liability related Right to make changes ⎯ NXP Semiconductors to any default, damage, costs or problem which is based reserves the right to make changes to information on any weakness or default in the customer’s applications published in this document, including without limitation or products, or the application or use by customer’s third specifications and product descriptions, at any time and party customer(s). Customer is responsible for doing all without notice. This document supersedes and replaces all necessary testing for the customer’s applications and information supplied prior to the publication hereof. products using NXP Semiconductors products in order to Suitability for use ⎯ NXP Semiconductors products are avoid a default of the applications and the products or of not designed, authorized or warranted to be suitable for the application or use by customer’s third party use in life support, life-critical or safety-critical systems or customer(s). NXP does not accept any liability in this equipment, nor in applications where failure or malfunction respect. of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe 1998Feb23 16

NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume TDA8551 control Limiting values ⎯ Stress above one or more limiting Quick reference data ⎯ The Quick reference data is an values (as defined in the Absolute Maximum Ratings extract of the product data given in the Limiting values and System of IEC60134) will cause permanent damage to Characteristics sections of this document, and as such is the device. Limiting values are stress ratings only and not complete, exhaustive or legally binding. (proper) operation of the device at these or any other Non-automotive qualified products ⎯ Unless this data conditions above those given in the Recommended sheet expressly states that this specific NXP operating conditions section (if present) or the Semiconductors product is automotive qualified, the Characteristics sections of this document is not warranted. product is not suitable for automotive use. It is neither Constant or repeated exposure to limiting values will qualified nor tested in accordance with automotive testing permanently and irreversibly affect the quality and or application requirements. NXP Semiconductors accepts reliability of the device. no liability for inclusion and/or use of non-automotive Terms and conditions of commercial sale ⎯ NXP qualified products in automotive equipment or Semiconductors products are sold subject to the general applications. terms and conditions of commercial sale, as published at In the event that customer uses the product for design-in http://www.nxp.com/profile/terms, unless otherwise and use in automotive applications to automotive agreed in a valid written individual agreement. In case an specifications and standards, customer (a) shall use the individual agreement is concluded only the terms and product without NXP Semiconductors’ warranty of the conditions of the respective agreement shall apply. NXP product for such automotive applications, use and Semiconductors hereby expressly objects to applying the specifications, and (b) whenever customer uses the customer’s general terms and conditions with regard to the product for automotive applications beyond NXP purchase of NXP Semiconductors products by customer. Semiconductors’ specifications such use shall be solely at No offer to sell or license ⎯ Nothing in this document customer’s own risk, and (c) customer fully indemnifies may be interpreted or construed as an offer to sell products NXP Semiconductors for any liability, damages or failed that is open for acceptance or the grant, conveyance or product claims resulting from customer design and use of implication of any license under any copyrights, patents or the product for automotive applications beyond NXP other industrial or intellectual property rights. Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 1998Feb23 17

NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2010 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545102/25/02/pp18 Date of release: 1998Feb23 Document order number: 939775003173