TDA1308 Class-AB stereo headphone driver Rev. 5 — 14 March 2011 Product data sheet 1. General description The TDA1308 is an integrated class-AB stereo headphone driver contained in an SO8 or a TSSOP8 plastic package. The device is fabricated in a 1μm Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily developed for portable digital audio applications. 2. Features and benefits (cid:132) Wide temperature range (cid:132) No switch ON/OFF clicks (cid:132) Excellent power supply ripple rejection (cid:132) Low power consumption (cid:132) Short-circuit resistant (cid:132) High performance (cid:139)High signal-to-noise ratio (cid:139)High slew rate (cid:139)Low distortion (cid:132) Large output voltage swing 3. Quick reference data Table 1. Quick reference data V =5V; V =0V; T =25°C; f =1kHz; R =32Ω; unless otherwise specified. DD SS amb i L Symbol Parameter Conditions Min Typ Max Unit V supply voltage single supply 3.0 5.0 7.0 V DD dual supply 1.5 2.5 3.5 V V negative supply dual supply −1.5 −2.5 −3.5 V SS voltage I supply current no load - 3 5 mA DD P total power no load - 15 25 mW tot dissipation P output power maximum; THD+N < 0.1% [1] - 40 80 mW o THD+N total harmonic [1] - 0.03 0.06 % distortion-plus-noise [1] - −70 −65 dB R =5kΩ - −101 - dB L S/N signal-to-noise ratio 100 110 - dB

TDA1308 NXP Semiconductors Class-AB stereo headphone driver Table 1. Quick reference data …continued V =5V; V =0V; T =25°C; f =1kHz; R =32Ω; unless otherwise specified. DD SS amb i L Symbol Parameter Conditions Min Typ Max Unit α channel separation - 70 - dB cs R =5kΩ [1] - 105 - dB L PSRR power supply ripple f =100Hz; - 90 - dB i rejection V =100mV ripple(p-p) T ambient temperature −40 - +85 °C amb [1] V =5V; V =3.5V (at 0dB). DD o(p-p) 4. Ordering information Table 2. Ordering information Type number Package Name Description Version TDA1308T SO8 plastic small outline package; 8 leads; body width SOT96-1 3.9mm TDA1308TT TSSOP8 plastic thin shrink small outline package; 8 leads; SOT505-1 body width 3mm 5. Block diagram TDA1308 1 8 OUTA VDD 2 INA- INA+ 3 7 OUTB 6 4 INB- VSS 5 INB+ mka779 Fig 1. Block diagram TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 2 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver 6. Pinning information 6.1 Pinning TDA1308 OUTA 1 8 VDD INA- 2 7 OUTB INA+ 3 6 INB- VSS 4 5 INB+ 001aaf782 Fig 2. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin Description OUTA 1 outputA INA− 2 inverting inputA INA+ 3 non-inverting inputA V 4 negative supply SS INB+ 5 non-inverting inputB INB− 6 inverting inputB OUTB 7 outputB V 8 positive supply DD 7. Internal circuitry VDD I1 INA/B+ M1 M2 A1 M3 INA/B- OUTA/B Cm M4 M5 D1 D2 D3 D4 A2 M6 VSS mka781 Fig 3. Equivalent schematic diagram TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 3 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V supply voltage 0 8.0 V DD t short-circuit duration time output; T =25°C; 20 - s sc amb P =1W tot T storage temperature −65 +150 °C stg T ambient temperature −40 +85 °C amb V electrostatic discharge HBM [1] −2 +2 kV ESD voltage MM [2] −200 +200 V [1] Human body model (HBM): C=100pF; R=1500Ω; 3pulses positive plus 3pulses negative. [2] Machine model (MM): C=200pF; L=0.5mH; R=0Ω; 3pulses positive plus 3pulses negative. 9. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction SO8 210 K/W th(j-a) to ambient TSSOP8 220 K/W TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 4 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver 10. Characteristics Table 6. Characterist ics V =5V; V =0V; T =25°C; f =1kHz; R =32Ω; unless otherwise specified. DD SS amb i L Symbol Parameter Conditions Min Typ Max Unit Supplies V supply voltage single supply 3.0 5.0 7.0 V DD dual supply 1.5 2.5 3.5 V V negative supply voltage dual supply −1.5 −2.5 −3.5 V SS I supply current no load - 3 5 mA DD P total power dissipation no load - 15 25 mW tot Static characteristics |V | input offset voltage - 10 - mV I(offset) I input bias current - 10 - pA IB V common-mode voltage 0 - 3.5 pA cm G open-loop voltage gain R =5kΩ - 70 - dB v(ol) L I output current maximum - 60 - mA O R output resistance THD+N < 0.1% - 0.25 - Ω o ΔV output voltage variation [1] 0.75 - 4.25 V O R =16Ω [1] 1.5 - 3.5 V L R =5kΩ [1] 0.1 - 4.9 V L α channel separation - 70 - dB cs R =5kΩ [1] - 105 - dB L PSRR power supply ripple rejection f =100Hz; V =100mV - 90 - dB i ripple(p-p) C load capacitance - - 200 pF L Dynamic characteristics THD+N total harmonic [2] - 0.03 0.06 % distortion-plus-noise [2] - −70 −65 dB R =5kΩ [2] - −101 - dB L R =5kΩ [2] - 0.0009 - % L S/N signal-to-noise ratio 100 110 - dB f unity gain frequency open-loop; R =5kΩ - 5.5 - MHz 1 L P output power maximum; THD+N < 0.1% - 40 80 mW o C input capacitance - 3 - pF i SR slew rate unity gain inverting - 5 - V/μs B bandwidth unity gain inverting - 20 - kHz [1] Values are proportional to V ; THD+N < 0.1%. DD [2] V =5V; V =3.5V (at 0dB). DD o(p-p) TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 5 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver 11. Application information R6 C4 VOUTA 3.9 kΩ 100 μF/6 V RL 1 8 C7 R5 2 VINA R101 kΩ 1 μF 3.9 kΩ 3 C2 TDA1308 C5 100 μF 5 0.1 μF C1 10 V R2 262 V μF 10 kΩ VINB C6 R3 6 1 μF 3.9 kΩ 7 4 R4 C3 VOUTB 3.9 kΩ 100 μF/6 V RL 001aan758 Fig 4. Typical application 12. Test information VDD 3.9 kΩ 100 μF VOUTA RL 1 8 3.9 kΩ 2 VINA 3 Vref TDA1308 C1060 μF (typ. 2.5 V) 5 3.9 kΩ 6 VINB 7 4 3.9 kΩ 100 μF VOUTB RL mka782 Fig 5. Measurement circuit for inverting application TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 6 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver mka784 -70 mka785 Xtalk 80 (dB) Gv -90 (dB) RL = 32 Ω 40 RL = 16 Ω no load -110 32 Ω 0 5 kΩ -130 10−2 10−3 10−4 10−5 10−6 10−f7i (Hz)10−8 10-1 10-2 10-3 10-4 fi (Hz) 10-5 Fig 6. Open-loop gain as a function of input frequency Fig 7. Crosstalk as a function of input frequency 100 mka786 -50 mka787 (mPWo) RL = 16 Ω THD+N (dB) 60 RL = 16 Ω; Po = 50 mW 32 Ω -70 40 RL = 32 Ω; Po = 50 mW 8 Ω -90 20 RL = 5 kΩ; Vo(p-p) = 3.5 V 10 -110 3 4 5 10-1 10-2 10-3 10-4 10-5 VDD (V) fi (Hz) Fig 8. Output power as a function of supply voltage Fig 9. Total harmonic distortion plus noise ratio as a function of input frequency TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 7 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver mka788 -40 THD+N (dB) RL = 8 Ω -60 16 Ω 32 Ω -80 5 kΩ fi = 1 kHz -100 10-2 10-1 1 10 Vo(p-p) (V) Fig 10. Total harmonic distortion plus noise ratio as a function of output voltage level TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 8 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver 13. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 8 5 Q A2 A1 (A 3 ) A pin 1 index θ Lp 1 4 L e w M detail X bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mAax. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ 0.25 1.45 0.49 0.25 5.0 4.0 6.2 1.0 0.7 0.7 mm 1.75 0.25 1.27 1.05 0.25 0.25 0.1 0.10 1.25 0.36 0.19 4.8 3.8 5.8 0.4 0.6 0.3 8o 0.010 0.057 0.019 0.0100 0.20 0.16 0.244 0.039 0.028 0.028 0o inches 0.069 0.01 0.05 0.041 0.01 0.01 0.004 0.004 0.049 0.014 0.0075 0.19 0.15 0.228 0.016 0.024 0.012 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 99-12-27 SOT96-1 076E03 MS-012 03-02-18 Fig 11. Package outline SOT96-1 (SO8) TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 9 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 D E A X c y HE v M A Z 8 5 A2 A1 (A3) A pin 1 index θ Lp L 1 4 detail X e w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mAax. A1 A2 A3 bp c D(1) E(2) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.95 0.25 0.45 0.28 3.1 3.1 0.65 5.1 0.94 0.7 0.1 0.1 0.1 0.70 6° 0.05 0.80 0.25 0.15 2.9 2.9 4.7 0.4 0.35 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 99-04-09 SOT505-1 03-02-18 Fig 12. Package outline SOT505-1 (TSSOP8) TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 10 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • Board specifications, including the board finish, solder masks and vias • Package footprints, including solder thieves and orientation • The moisture sensitivity level of the packages • Package placement • Inspection and repair • Lead-free soldering versus SnPb soldering 14.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 11 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure13) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table7 and8 Table 7. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 8. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure13. TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 12 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 13. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 13 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver 15. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes TDA1308 v.5 20110314 Product data sheet - TDA1308_A_4 Modifications: • Removed all references to type numbers TDA1308, TDA1308A, TDA1308AUK • Changed pin names INA(neg), INA(pos), INB(pos), INB(neg) to INA−, INA+, INB+ and INB− • Updated parameter symbols in Tables 4 and 6, and Figures 7, 9 and 10 • Replaced Figure4 TDA1308_A_4 20070125 Product data sheet - TDA1308_A_3 TDA1308_A_3 20020719 Product specification - TDA1308_A_2 TDA1308_A_2 20020227 Product specification - TDA1308_1 TDA1308_1 19940905 Product specification - - TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 14 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 16.2 Definitions malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of Draft — The document is a draft version only. The content is still under NXP Semiconductors products in such equipment or applications and internal review and subject to formal approval, which may result in therefore such inclusion and/or use is at the customer’s own risk. modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of Applications — Applications that are described herein for any of these information included herein and shall have no liability for the consequences of products are for illustrative purposes only. NXP Semiconductors makes no use of such information. representation or warranty that such applications will be suitable for the specified use without further testing or modification. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended Customers are responsible for the design and operation of their applications for quick reference only and should not be relied upon to contain detailed and and products using NXP Semiconductors products, and NXP Semiconductors full information. For detailed and full information see the relevant full data accepts no liability for any assistance with applications or customer product sheet, which is available on request via the local NXP Semiconductors sales design. It is customer’s sole responsibility to determine whether the NXP office. In case of any inconsistency or conflict with the short data sheet, the Semiconductors product is suitable and fit for the customer’s applications and full data sheet shall prevail. products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate Product specification — The information and data provided in a Product design and operating safeguards to minimize the risks associated with their data sheet shall define the specification of the product as agreed between applications and products. NXP Semiconductors and its customer, unless NXP Semiconductors and NXP Semiconductors does not accept any liability related to any default, customer have explicitly agreed otherwise in writing. In no event however, damage, costs or problem which is based on any weakness or default in the shall an agreement be valid in which the NXP Semiconductors product is customer’s applications or products, or the application or use by customer’s deemed to offer functions and qualities beyond those described in the third party customer(s). Customer is responsible for doing all necessary Product data sheet. testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and 16.3 Disclaimers the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limited warranty and liability — Information in this document is believed to Limiting values — Stress above one or more limiting values (as defined in be accurate and reliable. However, NXP Semiconductors does not give any the Absolute Maximum Ratings System of IEC60134) will cause permanent representations or warranties, expressed or implied, as to the accuracy or damage to the device. Limiting values are stress ratings only and (proper) completeness of such information and shall have no liability for the operation of the device at these or any other conditions above those given in consequences of use of such information. the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or In no event shall NXP Semiconductors be liable for any indirect, incidental, repeated exposure to limiting values will permanently and irreversibly affect punitive, special or consequential damages (including - without limitation - lost the quality and reliability of the device. profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such Terms and conditions of commercial sale — NXP Semiconductors damages are based on tort (including negligence), warranty, breach of products are sold subject to the general terms and conditions of commercial contract or any other legal theory. sale, as published at http://www.nxp.com/profile/terms, unless otherwise Notwithstanding any damages that customer might incur for any reason agreed in a valid written individual agreement. In case an individual whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards agreement is concluded only the terms and conditions of the respective customer for the products described herein shall be limited in accordance agreement shall apply. NXP Semiconductors hereby expressly objects to with the Terms and conditions of commercial sale of NXP Semiconductors. applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without No offer to sell or license — Nothing in this document may be interpreted or limitation specifications and product descriptions, at any time and without construed as an offer to sell products that is open for acceptance or the grant, notice. This document supersedes and replaces all information supplied prior conveyance or implication of any license under any copyrights, patents or to the publication hereof. other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, Export control — This document as well as the item(s) described herein authorized or warranted to be suitable for use in life support, life-critical or may be subject to export control regulations. Export might require a prior safety-critical systems or equipment, nor in applications where failure or authorization from national authorities. TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 15 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver Quick reference data — The Quick reference data is an extract of the product for such automotive applications, use and specifications, and (b) product data given in the Limiting values and Characteristics sections of this whenever customer uses the product for automotive applications beyond document, and as such is not complete, exhaustive or legally binding. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any Non-automotive qualified products — Unless this data sheet expressly liability, damages or failed product claims resulting from customer design and states that this specific NXP Semiconductors product is automotive qualified, use of the product for automotive applications beyond NXP Semiconductors’ the product is not suitable for automotive use. It is neither qualified nor tested standard warranty and NXP Semiconductors’ product specifications. in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. 16.4 Trademarks In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer Notice: All referenced brands, product names, service names and trademarks (a) shall use the product without NXP Semiconductors’ warranty of the are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 14 March 2011 16 of 17

TDA1308 NXP Semiconductors Class-AB stereo headphone driver 18. Contents 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5 11 Application information. . . . . . . . . . . . . . . . . . . 6 12 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline. . . . . . . . . . . . . . . . . . . . . . . . . 9 14 Soldering of SMD packages . . . . . . . . . . . . . . 11 14.1 Introduction to soldering. . . . . . . . . . . . . . . . . 11 14.2 Wave and reflow soldering. . . . . . . . . . . . . . . 11 14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 11 14.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 12 15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 17 Contact information. . . . . . . . . . . . . . . . . . . . . 16 18 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 March 2011 Document identifier: TDA1308