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TCM809RENB713产品简介:
ICGOO电子元器件商城为您提供TCM809RENB713由Microchip设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 TCM809RENB713价格参考。MicrochipTCM809RENB713封装/规格:PMIC - 监控器, 推挽式,图腾柱 监控器 1 通道 SOT-23-3。您可以下载TCM809RENB713参考资料、Datasheet数据手册功能说明书,资料中有TCM809RENB713 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | 集成电路 (IC)半导体 |
描述 | IC RESET MONITOR 2.63V SOT23B监控电路 Microprocessor 2.63V |
产品分类 | |
品牌 | Microchip Technology |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 电源管理 IC,监控电路,Microchip Technology TCM809RENB713- |
NumberofInputsMonitored | 1 Input |
数据手册 | http://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en011355 |
产品型号 | TCM809RENB713 |
产品目录页面 | |
产品种类 | 监控电路 |
人工复位 | No Manual Reset |
供应商器件封装 | SOT-23-3 |
其它名称 | 158-2023-2 |
功率失效检测 | No |
包装 | 带卷 (TR) |
受监控电压数 | 1 |
商标 | Microchip Technology |
复位 | 低有效 |
复位超时 | 最小为 140 ms |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
封装 | Reel |
封装/外壳 | TO-236-3,SC-59,SOT-23-3 |
封装/箱体 | SOT-23B-3 |
工作温度 | -40°C ~ 85°C |
工作电源电流 | 9 uA |
工厂包装数量 | 3000 |
最大功率耗散 | 320 mW |
最大工作温度 | + 85 C |
最小工作温度 | - 40 C |
标准包装 | 3,000 |
欠电压阈值 | 2.59 V |
电压-阈值 | 2.63V |
电池备用开关 | No Backup |
电源电压-最大 | 5.5 V |
电源电压-最小 | 1 V |
监视器 | No Watchdog |
类型 | 简单复位/加电复位 |
芯片启用信号 | No Chip Enable |
被监测输入数 | 1 Input |
输出 | 推挽式,图腾柱 |
输出类型 | Active Low, Push-Pull |
过电压阈值 | 2.66 V |
重置延迟时间 | 560 ms |
阈值电压 | 2.5 V, 3 V, 3.3 V, 5 V |
TCM809/TCM810 3-Pin Microcontroller Reset Monitors Features General Description • Precision V Monitor for 2.5V, 3.0V, 3.3V, 5.0V The TCM809 and TCM810 are cost-effective system DD Nominal System Voltage Supplies supervisor circuits designed to monitor V in digital DD (cid:127) 140msec Minimum RESET Time Out Period systems and provide a reset signal to the host proces- sor, when necessary. No external components are (cid:127) RESET Output to V = 1.0V (TCM809) DD required. (cid:127) Low Supply Current, 9µA (typ.) The RESET output is typically driven active within (cid:127) V Transient Immunity DD 65µsec of V falling through the reset voltage thresh- (cid:127) Small 3-Pin SC-70 and SOT-23B Packages DD old. RESET is maintained active for a minimum of (cid:127) No External Components 140msec after V rises above the reset threshold. DD (cid:127) Push-Pull RESET Output The TCM810 has an active-high RESET output, while (cid:127) Temperature Range: the TCM809 has an active-low RESET output. The out- - Industrial, SC-70 (E): -40°C to +85°C put of the TCM809/TCM810 is valid down to VDD = 1V. Both devices are available in 3-Pin SC-70 and SOT-23B - Extended, SOT-23, SC-70 (V): -40°C to +125°C packages. Applications The TCM809/TCM810 is optimized to reject fast transient glitches on the V line. A low supply current DD (cid:127) Computers of 9µA (typ., V = 3.3V) make these devices suitable DD (cid:127) Embedded Systems for battery-powered applications. (cid:127) Battery-Powered Equipment Pin Configurations (cid:127) Critical Microcontroller Power Supply Monitoring (cid:127) Automotive SOT-23B/SC-70 Typical Application Circuit GND 1 V DD TT CC V3 VDD M8M8 3 VDD DD PICmicro® 1009 TCM809 Microcontroller TCM809 RESET / 2 2 RESET TCM810 (RESET) RESET INPUT (Active-Low) GND Note: 3-Pin SOT-23B is equivalent to GND JEDEC TO-236. 1 2004 Microchip Technology Inc. DS21661C-page 1
TCM809/TCM810 1.0 ELECTRICAL PIN FUNCTION TABLE CHARACTERISTICS NAME FUNCTION Absolute Maximum Ratings† GND Ground. Supply Voltage (VDD to GND)..........................................6.0V RESET (TCM809) RESET push-pull output RESET, RESET....................................– 0.3V to (VDD +0.3V) remains low while VDD is below the reset voltage threshold and Input Current, V .........................................................20mA DD for 240msec (140msec min.) Output Current, RESET, RESET...................................20mA after V rises above reset DD dV/dt (V ).............................................................100V/µsec DD threshold. Operating Temperature Range....................– 40°C to +125°C RESET (TCM810) RESET push-pull output Power Dissipation (T = 70°C): A remains high while V is below 3-Pin SOT-23B (derate 4mW/°C above +70°C)......320mW DD the reset voltage threshold and 3-Pin SC-70 (derate 2.17mW/°C above +70°C)......174mW for 240msec (140msec min.) Storage Temperature Range.......................– 65°C to +150°C after V rises above reset DD Maximum Junction Temperature, TJ..............................150°C threshold. † Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rating only and VDD Supply voltage (+2.5V, +3.0V, functional operation of the device at those or any other conditions +3.3V, +5.0V). above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended peri- ods may affect device reliability. ELECTRICAL CHARACTERISTICS V = Full Range, T = Operating Temperature Range, unless otherwise noted. Typical values are at T = +25°C, DD A A V = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note1). DD Parameter Sym Min Typ Max Units Test Conditions V Range 1.0 — 5.5 V T = 0°C to +70°C DD A 1.2 — 5.5 T = – 40°C to +125°C A Supply Current I — 12 30 µA TCM8xxL/M/J: V < 5.5V CC DD — 9 25 TCM8xxR/S/T/Z: V < 3.6V DD Reset Threshold (Note2) V 4.56 4.63 4.70 V TCM8xxL: T = +25°C TH A 4.50 — 4.75 T = – 40°C to +125°C A 4.31 4.38 4.45 V TCM8xxM: T = +25°C A 4.25 — 4.50 V T = – 40°C to +125°C A 3.93 4.00 4.06 V TCM809J: T = +25°C A 3.89 — 4.10 V T = – 40°C to +125°C A 3.04 3.08 3.11 V TCM8xxT: T = +25°C A 3.00 — 3.15 V T = – 40°C to +125°C A 2.89 2.93 2.96 V TCM8xxS: T = +25°C A 2.85 — 3.00 V T = – 40°C to +125°C A 2.59 2.63 2.66 V TCM8xxR: T = +25°C A 2.55 — 2.70 V T = – 40°C to +125°C A 2.28 2.32 2.35 V TCM8xxZ: T = +25°C A 2.25 — 2.38 V T = – 40°C to +125°C A Reset Threshold Tempco — 30 — ppm/°C V to Reset Delay, — 65 — µsec V = V to (V – 100mV) (Note2) DD DD TH TH Reset Active Time Out 140 320 560 msec Period Note 1: Production testing done at T = +25°C, overtemperature limits ensured by QC screen. A 2: RESET output for TCM809, RESET output for TCM810. DS21661C-page 2 2004 Microchip Technology Inc.
TCM809/TCM810 ELECTRICAL CHARACTERISTICS (CONTINUED) V = Full Range, T = Operating Temperature Range, unless otherwise noted. Typical values are at T = +25°C, DD A A V = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note1). DD Parameter Sym Min Typ Max Units Test Conditions RESET Output Voltage V — — 0.3 V TCM809R/S/T/Z: V = V min, I = 1.2mA OL DD TH SINK Low (TCM809) — — 0.4 TCM809L/M/J: V = V min, I = 3.2mA DD TH SINK — — 0.3 V > 1.0V, I = 50µA DD SINK RESET Output Voltage V 0.8 V — — V TCM809R/S/T/Z: V > V max, I = 500µA OH DD DD TH SOURCE High (TCM809) V – 1.5 — — TCM809L/M/J: V > V max, I = 800µA DD DD TH SOURCE RESET Output Voltage V — — 0.3 V TCM810R/S/T/Z:V = V max, I = 1.2mA OL DD TH SINK Low (TCM810) — — 0.4 TCM810L/M: V = V max, I = 3.2mA DD TH SINK RESET Output Voltage V 0.8 V — — V 1.8 < V < V min, I = 150µA OH DD DD TH SOURCE High (TCM810) Note 1: Production testing done at T = +25°C, overtemperature limits ensured by QC screen. A 2: RESET output for TCM809, RESET output for TCM810. 2004 Microchip Technology Inc. DS21661C-page 3
TCM809/TCM810 2.0 TYPICAL PERFORMANCE CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 18 TCM8xx/R/S/T/Z, No Load 450 16 VDD = 5V 400 14 Supply Current ( µA) 11246802 VVDDDD == 13VV Power-up Reset Timeout (µsec) 11223305050550000000 0 -40 -20 0 20 40 60 80 100 120 0 -40 -20 0 20 40 60 80 100 120 Temperature (°C) Temperature (°C) FIGURE 2-1: Supply Current vs. FIGURE 2-3: Power-up Reset Time Out Temperature. vs. Temperature. 16 1.001 TCM8xx/L/M/J, No Load 14 VDD = 5V Supply Current ( µA) 1146802 VDVDD D= =3 V1V Normalized Reset Threshold 00..9999891 2 0 0.997 -40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 Temperature (°C) Temperature (°C) FIGURE 2-2: Supply Current vs. FIGURE 2-4: Normalized Reset Temperature. Threshold vs. Temperature. DS21661C-page 4 2004 Microchip Technology Inc.
TCM809/TCM810 3.0 APPLICATIONS INFORMATION Combinations above the curve are detected as a brown-out or power-down condition. Transient immu- nity can be improved by adding a capacitor in close 3.1 V Transient Rejection DD proximity to the V pin of the TCM809/TCM810. DD The TCM809/TCM810 provides accurate V monitor- DD ing and reset timing during power-up, power-down and 3.2 RESET Signal Integrity During brown-out/sag conditions. These devices also reject Power-Down negative-going transients (glitches) on the power sup- ply line. Figure3-1 shows the maximum transient dura- The TCM809 RESET output is valid to VDD = 1.0V. tion vs. maximum negative excursion (overdrive) for Below this voltage the output becomes an "open cir- glitch rejection. Any combination of duration and over- cuit" and does not sink current. This means CMOS drive that lies under the curve will not generate a reset logic inputs to the microcontroller will be floating at an signal. undetermined voltage. Most digital systems are completely shut down well above this voltage. However, in situations where RESET must be main- V DD tained valid to V = 0V, a pull-down resistor must be DD V connected from RESET to ground to discharge stray TH capacitances and hold the output low (Figure3-2). This Overdrive resistor value, though not critical, should be chosen such that it does not appreciably load RESET under normal operation (100kΩ will be suitable for most Duration applications). Similarly, a pull-up resistor to V is DD c) 400 required for the TCM810 to ensure a valid high RESET e T = +25°C µs A for VDD below 1.0V. n ( 320 o rati V u DD D 240 nt e nsi 160 V a DD m Tr TCM8XXL/M/J (SOT-23) u 80 TCM809 m Maxi 0 T(SCOMT8-X23X)Z/R/S/T RESET 1 5 100 1000 Reset Comparator Overdrive R 1 [V - V ] (mv) GND 100kΩ TH DD 130 c) 120 µse 110 TCM8XXL/M/J (SC-70) FIGURE 3-2: The addition of R1 at the y ( 100 RESET output of the TCM809 ensures that the a Del 90 RESET output is valid to VDD = 0V. et 80 s 70 e R 60 o tD 50 TCM8XXZ/R/S/T (SC-70) D V 40 30 1 10 100 1000 Reset Comparator Overdrive (mV) [V - V ] (mv) TH DD FIGURE 3-1: Maximum Transient Duration vs. Overdrive for Glitch Rejection at +25°C. 2004 Microchip Technology Inc. DS21661C-page 5
TCM809/TCM810 3.3 Controllers and Processors With Bidirectional I/O Pins Buffered RESET Buffer To Other System Some microcontrollers have bidirectional reset pins. Components Depending on the current drive capability of the control- V ler pin, an indeterminate logic level may result if there DD is a logic conflict. This can be avoided by adding a PICmicro® 4.7kΩ resistor in series with the output of the TCM809/ TCM809 Micro- controller TCM810 (Figure3-3). If there are other components in 4.7kΩ the system that require a reset signal, they should be RESET RESET buffered so as not to load the reset line. If the other components are required to follow the reset I/O of the GND GND microcontroller, the buffer should be connected as shown with the solid line. FIGURE 3-3: Interfacing the TCM809 to a Bidirectional RESET I/O. DS21661C-page 6 2004 Microchip Technology Inc.
TCM809/TCM810 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 3-Pin SOT-23B 3-Pin SC-70 (cid:99)(cid:100)(cid:101)(cid:102) (cid:99) (cid:100) (cid:101) (cid:102) (cid:103) (cid:104) Top Side Bottom Side Part Number SOT-23/SC-70 TCM809LENB J1 TCM809MENB J2 TCM809TENB J3 TCM809SENB J4 TCM809RENB J5 TCM809JENB J6 TCM809ZENB J7 TCM809LVNB/TCM809LVLB JZ TCM809MVNB/TCM809MVLB JY TCM809TVNB/TCM809TVLB JX TCM809SVNB/TCM809SVLB JV TCM809RVNB/TCM809RVLB JU TCM809JVNB/TCM809JVLB JT TCM809ZVNB/TCM809ZVLB JS (SC-70 package only) Part Number SOT-23/SC-70 TCM810LENB K1 TCM810MENB K2 TCM810TENB K3 TCM810SENB K4 TCM810RENB K5 TCM810ZENB K6 TCM810LVNB/TCM810LVLB KZ TCM810MVNB/TCM810MVLB KY TCM810TVNB/TCM810TVLB KX TCM810SVNB/TCM810SVLB KV TCM810RVNB/TCM810RVLB KU Legend: 1 Part Number + temperature range and voltage (two-digit code) 2 Part Number + temperature range and voltage (two-digit code) 3 Lot ID number 4 Year and work week 5 Year and work week 6 Year and work week Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. 2004 Microchip Technology Inc. DS21661C-page 7
TCM809/TCM810 3-Lead Plastic Small Outline Transistor (NB) (SOT-23) E E1 2 B p1 D n p 1 α c A A2 φ A1 β L Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 3 3 Pitch p .038 0.96 Outside lead pitch (basic) p1 .076 1.92 Overall Height A .035 .040 .044 0.89 1.01 1.12 Molded Package Thickness A2 .035 .037 .040 0.88 0.95 1.02 Standoff § A1 .000 .002 .004 0.01 0.06 0.10 Overall Width E .083 .093 .104 2.10 2.37 2.64 Molded Package Width E1 .047 .051 .055 1.20 1.30 1.40 Overall Length D .110 .115 .120 2.80 2.92 3.04 Foot Length L .014 .018 .022 0.35 0.45 0.55 Foot Angle φ 0 5 10 0 5 10 Lead Thickness c .004 .006 .007 0.09 0.14 0.18 Lead Width B .015 .017 .020 0.37 0.44 0.51 Mold Draft Angle Top α 0 5 10 0 5 10 Mold Draft Angle Bottom β 0 5 10 0 5 10 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104 DS21661C-page 8 2004 Microchip Technology Inc.
TCM809/TCM810 3-Lead Plastic Small Outline Transistor (LB) (SC-70) E E1 B 2 p1 D 3 p 1 a c A A2 b L A1 Units INCHES MILLIMETERS* Dimension Limits MIN MAX MIN MAX Number of Pins 3 3 Pitch p .026 BSC. 0.65 BSC. Outside lead pitch (basic) p1 .051 BSC. 1.30 BSC. Overall Height A .031 .043 0.80 1.10 Molded Package Thickness A2 .031 .039 0.80 1.00 Standoff A1 .000 .0004 0.00 .010 Overall Width E .071 .094 1.80 2.40 Molded Package Width E1 .045 .053 1.15 1.35 Overall Length D .071 .089 1.80 2.25 Foot Length L .004 .016 0.10 0.41 Lead Thickness c .003 .010 0.08 0.25 Lead Width B .006 .016 0.15 0.40 Mold Draft Angle Top a 8˚ 12˚ 8˚ 12˚ Mold Draft Angle Bottom b 8˚ 12˚ 8˚ 12˚ *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (EIAJ) Equivalent: SC70 Drawing No. C04-104 2004 Microchip Technology Inc. DS21661C-page 9
TCM809/TCM810 4.2 Product Tape and Reel Specifications FIGURE 4-1: EMBOSSED CARRIER DIMENSIONS (8, 12, 16, AND 24 MM TAPE ONLY) Top Cover Tape A 0 W K0 B0 P TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS Carrier Cavity Dimensions Dimensions Output Reel Case Package Quantity Diameter in Outline Type W P A0 B0 K0 Units mm mm mm mm mm mm NB SOT-23 3L 8 4 3.15 2.77 1.22 3000 180 LB SC-70 3L 8 4 2.4 2.4 1.19 3000 180 FIGURE 4-2: 3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS gnikraM Device User Direction of Feed eciveD Marking W, Width Pin 1 of Carrier Tape Pin 1 P, Pitch Standard Reel Component Orientation Reverse Reel Component Orientation DS21661C-page 10 2004 Microchip Technology Inc.
TCM809/TCM810 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X X XXXXX Examples: a) TCM809LENB713: SOT-23B-3-TR, Device VDD Temperature Package Microcontroller 4.63V Reset Range Reset Monitor, Threshold -40°C to +85°C, Tape and Reel. b) TCM809LVLB713: SC-70-3-TR, Device: TCM809: Supervisor circuit with active-low RESET output Microcontroller 4.63V TCM810: Supervisor circuit with active-high RESET output Reset Monitor, -40°C to +125°C, Tape and Reel. V Reset Threshold: L = 4.63V DD c) TCM809LVNB713: SOT-23B-3-TR, M = 4.38V Microcontroller 4.63V J = 4.00V Reset Monitor, T = 3.08V -40°C to +125°C, S = 2.93V Tape and Reel. R = 2.63V Z = 2.32V a) TCM810MENB713: SOT-23B-3-TR, Microcontroller 4.38V Temperature Range: E = -40°C to +85°C Reset Monitor, V = -40°C to +125°C -40°C to +85°C, Tape and Reel. b) TCM810RVLB713: SOT-23B-3-TR, Package: NB713 = SOT-23B, 3-pin (Tape and Reel) Microcontroller 2.63V LB713 = SC-70, 3-pin (Tape and Reel) Reset Monitor, -40°C to +125°C, Tape and Reel. c) TCM810TVLB713: SC-70-3-TR, Microcontroller 4.38V Reset Monitor, -40°C to +125°C, Tape and Reel. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2004 Microchip Technology Inc. DS21661C-page 11
TCM809/TCM810 NOTES: DS21661C-page 12 2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: (cid:127) Microchip products meet the specification contained in their particular Microchip Data Sheet. (cid:127) Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. (cid:127) There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. (cid:127) Microchip is willing to work with the customer who is concerned about the integrity of their code. (cid:127) Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is intended through suggestion only The Microchip name and logo, the Microchip logo, Accuron, and may be superseded by updates. It is your responsibility to dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, ensure that your application meets with your specifications. PROMATE, PowerSmart and rfPIC are registered No representation or warranty is given and no liability is trademarks of Microchip Technology Incorporated in the assumed by Microchip Technology Incorporated with respect U.S.A. and other countries. to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, use or otherwise. Use of Microchip’s products as critical SEEVAL, SmartShunt and The Embedded Control Solutions components in life support systems is not authorized except Company are registered trademarks of Microchip Technology with express written approval by Microchip. No licenses are Incorporated in the U.S.A. conveyed, implicitly or otherwise, under any intellectual Application Maestro, dsPICDEM, dsPICDEM.net, property rights. dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, Select Mode, SmartSensor, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2004 Microchip Technology Inc. DS21661C-page 13
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